A high-brightness LED package device

Abstract

The utility model discloses a high -intensity's LED packaging device relates to LED packaging device technical field. High -intensity's LED packaging device includes luminous unit and the reflection layer of covering in luminous unit side department, and luminous unit contains LED flip chip, light guide portion, red fluorescent film layer and green fluorescent film layer, and light guide portion sets up in LED flip chip lateral light emitting surface, and red fluorescent film layer sets up in the normal light emitting surface and extends to the top of light guide portion, and green fluorescent film layer covers on red fluorescent film layer. Through light guide portion scattering lateral light to reflection layer, the light of convergence of normal light is reflected and goes out, has solved the problem of low utilization rate of traditional device lateral light, has improved overall light extraction efficiency and brightness significantly. The size cooperation of fluorescent film layer, thickness control and fluorescent powder doped design, guarantee the light emitting uniformity, avoid the light spot defect. The support structure design reduces the cost, simplifies the process, is applicable to general lighting, plant lighting etc. scene.

Description

Technical Field

[0001] This utility model relates to the field of LED packaging device technology, and more specifically, to a high-brightness LED packaging device. Background Technology

[0002] With the continuous development of LED chip manufacturing processes, flip chips, due to their superior thermal conductivity compared to traditional chips, have gradually gained widespread application and entered the market in the lighting field. However, due to the fundamental differences in the design structure of flip chips compared to conventional chips, their light emission characteristics exhibit a unique distribution, with approximately 80% of the light emission coming from the front and about 20% from the side. In current general lighting and plant lighting applications, related lighting equipment mainly utilizes only the front light emission portion of the flip chip, failing to effectively utilize the 20% side light emission, resulting in a low utilization rate of side light emission. This incomplete utilization of the light emission resources of flip chips significantly limits the improvement of luminous efficacy in lighting devices using flip chip packaging, creating a significant technical obstacle and making it difficult to further meet the actual needs of the lighting industry for high-efficiency devices. Utility Model Content

[0003] In view of the shortcomings of the existing technology, this utility model provides a high-brightness LED packaging device.

[0004] This utility model discloses a high-brightness LED packaging device, including a light-emitting unit and a reflective layer, wherein the reflective layer covers the side of the light-emitting unit; wherein the light-emitting unit includes an LED flip chip, a light guide, a red fluorescent film layer and a green fluorescent film layer, the light guide is disposed on the side light-emitting surface of the LED flip chip, the red fluorescent film layer is disposed on the front light-emitting surface of the LED flip chip and extends to the top of the light guide, and the green fluorescent film layer is disposed on the red fluorescent film layer.

[0005] According to one embodiment of the present invention, the top of the light guide portion is flush with the forward emitting surface of the LED flip chip, the bottom of the light guide portion is connected to the electrode surface of the LED flip chip, and the side of the light guide portion is provided with a refractive surface. According to one embodiment of the present invention, the refractive surface is an arc-shaped surface that arches towards the lateral light-emitting surface of the LED flip chip.

[0006] According to one embodiment of the present invention, the light guide part is made of transparent silicone.

[0007] According to one embodiment of the present invention, the edge of the red fluorescent film layer extends beyond the forward emitting surface of the light-emitting chip, and the edge of the red fluorescent film layer does not extend beyond the edge of the light guide portion.

[0008] According to one embodiment of the present invention, the edge of the green fluorescent film extends beyond the edge of the red fluorescent film layer.

[0009] According to one embodiment of the present invention, the thickness of both the red fluorescent film layer and the green fluorescent film layer is no greater than 50 μm.

[0010] According to one embodiment of the present invention, the reflective layer is made of a mixture of white silicone and reflective particles.

[0011] According to one embodiment of the present invention, the reflective particles are titanium dioxide particles or zirconium oxide particles.

[0012] According to one embodiment of the present invention, the top of the reflective layer is flush with the top of the red fluorescent film layer, the side of the reflective layer is flush with the side of the green fluorescent film layer, and the bottom of the reflective layer is flush with the electrode surface of the LED flip chip.

[0013] Compared with the prior art, the high-brightness LED packaging device of this utility model has the following advantages: First, this high-brightness LED packaged device achieves efficient recycling of lateral light emission from LED flip chips through the coordinated layout of the light-emitting unit and reflective layer, along with the precise setting of the light guide, red phosphor film layer, and green phosphor film layer. This effectively solves the technical pain point of low lateral light emission utilization in traditional packaged devices, significantly improving the overall light output rate and brightness of the device. At the same time, the structure of the red phosphor film layer extending to the top of the light guide and the green phosphor film layer covering the red phosphor film layer ensures the integrity of light conversion and the uniformity of light emission, further optimizing the lighting effect.

[0014] Secondly, the light guide section, through precise connection with the forward emitting surface and electrode surface of the LED flip chip, and the design of the side arc refractive surface, can efficiently scatter the light emitted from the side emitting surface to the reflective layer, providing reliable structural support for the recovery of side-emitting light; while the selection of transparent silicone material ensures low loss in the light transmission process, and together with the structural design, further improves the accuracy and effectiveness of light scattering.

[0015] Furthermore, the matching edge dimensions of the red and green fluorescent film layers and the thickness control of no more than 50 μm ensure sufficient fluorescence conversion while avoiding light attenuation caused by excessive film thickness. At the same time, it ensures the stability of the structural connection between various components and prevents light leakage or incomplete conversion. The design of doping the red and green fluorescent film layers with red phosphor and green phosphor respectively ensures that the phosphor is evenly distributed within the film layer, effectively avoiding the light spot problem caused by uneven phosphor dispersion in traditional methods, and significantly improving the uniformity of light emission and illumination quality of the device.

[0016] In addition, the reflective layer is made of a mixture of white silicone and reflective particles, and the reflective particles are selected from titanium dioxide particles or zirconium oxide particles, which have excellent reflective properties and can efficiently reflect the lateral light scattered by the light guide to the upper surface of the device, further improving the lateral light extraction rate. At the same time, the flush design of the reflective layer with the red fluorescent film layer, the green fluorescent film layer and the LED flip chip electrode surface realizes the closure of the optical path and the compactness of the structure, reduces the loss of light during the propagation process, and ensures the maximization of light extraction efficiency.

[0017] Furthermore, the high-brightness LED packaging device of this application adopts a supportless structure design, which effectively reduces material and assembly costs without sacrificing luminous performance. At the same time, it simplifies the packaging process, shortens the production cycle, and improves the efficiency and yield of mass production. It balances technological advancement and market economy, making it widely applicable in various scenarios such as general lighting and plant lighting. It is especially suitable for mass production applications with high brightness requirements and cost sensitivity. Attached Figure Description

[0018] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 This is a cross-sectional view of the high-brightness LED packaging device in the embodiment.

[0019] Explanation of reference numerals in the attached figures: 100. Light-emitting unit; 110. LED flip chip; 111. Front light-emitting surface; 112. Side light-emitting surface; 113. Electrode surface; 120. Light guide; 121. Refractive surface; 130. Red fluorescent film layer; 140. Green fluorescent film layer; 200. Reflective layer. Detailed Implementation

[0020] The following illustrations disclose several embodiments of the present invention. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit the present invention. That is, in some embodiments of the present invention, these practical details are not essential. In addition, for the sake of simplicity, some conventional structures and components will be shown in the illustrations in a simple schematic manner.

[0021] Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0022] This embodiment provides a high-brightness LED packaging device, the core purpose of which is to solve the problem of low lateral light emission utilization of existing LED flip chips, while simultaneously optimizing costs.

[0023] See Figure 1 The high-brightness LED package device mainly includes a light-emitting unit 100 and a reflective layer 200. The components are connected in a reasonable position to form a complete light-emitting structure. The reflective layer 200 covers the side of the light-emitting unit 100 and improves the overall light output efficiency through the synergistic effect of light guiding and reflection.

[0024] Specifically, the light-emitting unit 100 comprises an LED flip chip 110, a light guide 120, a red phosphor film layer 130, and a green phosphor film layer 140. The LED flip chip 110 has a forward-emitting surface 111, a side-emitting surface 112, and an electrode surface 113, and emits blue light. To achieve the recycling of the side-emitting light, the light guide 120 is correspondingly disposed on the side-emitting surface 112 of the LED flip chip 110. This light guide 120 is made of transparent silicone material and has a trapezoidal cross-section. The top of the light guide 120 is flush with the forward light-emitting surface 111 of the LED flip chip 110, and the bottom of the light guide 120 is connected to the electrode surface 113 of the LED flip chip 110. The side of the light guide 120 is also provided with an arc-shaped surface that arches towards the side light-emitting surface 112 of the LED flip chip 110. This refractive surface 121 can effectively scatter the blue light emitted by the side light-emitting surface 112 of the LED flip chip 110, so that the scattered light is accurately directed to the reflective layer 200 covering the outside.

[0025] Furthermore, a red fluorescent film layer 130 is bonded and covered on the forward emitting surface 111 of the LED flip chip 110 by an adhesive. The red fluorescent film layer 130 also extends to cover a portion of the top of the light guide portion 120, with its edge extending beyond the forward emitting surface 111 of the LED but not beyond the edge of the light guide portion 120. A green fluorescent film layer 140 is bonded and completely covered on the red fluorescent film layer 130 by an adhesive, with its edge extending beyond the edge of the red fluorescent film layer 130. The red fluorescent film layer 130 is doped with red phosphor, and the green fluorescent film layer 140 is doped with green phosphor. By doping the film layers, the phosphor is evenly distributed within the corresponding film layers, thereby ensuring the uniformity of light emission from the device and effectively avoiding the light spot problem caused by uneven phosphor dispersion in traditional methods. At the same time, the thickness of both the red fluorescent film layer 130 and the green fluorescent film layer 140 is controlled to be no more than 50 μm. This layered design ensures both sufficient fluorescence conversion and the stability of the structural connection between each film layer and the light guide 120 and the LED flip chip 110, avoiding problems such as light leakage or incomplete conversion.

[0026] Furthermore, the reflective layer 200 is made of a mixture of white silicone and reflective particles, wherein the reflective particles are titanium dioxide particles or zirconium oxide particles. To ensure optical path closure and structural compactness, the top of the reflective layer 200 is flush with the top of the red fluorescent film layer 130, the side of the reflective layer 200 is flush with the side of the green fluorescent film layer 140, and the bottom of the reflective layer 200 is flush with the electrode surface 113 of the LED flip chip 110, achieving full coverage of the light-emitting unit 100 through precise dimensional matching.

[0027] The working principle of this high-brightness LED packaged device is as follows: Blue light emitted from the forward-emitting surface 111 of the LED flip chip 110 directly enters the red phosphor layer 130. After partial conversion by the red phosphor, the light penetrates to the green phosphor layer 140 and interacts with the green phosphor, ultimately forming mixed white light that is emitted from the upper surface of the green phosphor layer 140. Meanwhile, blue light emitted from the side-emitting surface 112 of the LED flip chip 110 first travels to the arc-shaped refractive surface 121 of the light guide 120. After being scattered by the refractive surface 121, it enters the outer reflective layer 200. Inside the reflective layer 200, the light undergoes multiple reflections with titanium dioxide or zirconium oxide particles, and is finally guided to the upper surface where it merges with the forward-converted light before being emitted. Through effective optical path design, the originally low lateral light extraction efficiency of the LED flip chip 110 is significantly improved, thereby increasing the overall light extraction efficiency of the entire LED flip chip 110 and achieving a substantial and quantifiable improvement in the overall brightness of the high-brightness LED packaged device.

[0028] In summary, this high-brightness LED package device, through the innovative collaborative design of the light guide and reflective layer, specifically addresses the obstacle to improving luminous efficiency in existing LED flip-chip packages caused by the ineffective utilization of lateral light emission. It successfully achieves efficient recovery and forward convergence of lateral light emission, significantly improving the overall light emission efficiency compared to traditional structures. Furthermore, the phosphor-doped film design of this high-brightness LED package device structurally ensures uniform light emission, avoids light spot defects, and improves lighting quality. The supportless structure design achieves both cost optimization and simplified manufacturing processes without sacrificing performance, balancing technological advancement with market economy. With its comprehensive characteristics of good luminous uniformity, high light emission efficiency, low manufacturing cost, and simple process, this high-brightness LED package device can better meet the application needs of various scenarios such as general lighting and plant lighting for high-efficiency, high-quality, and cost-effective LED devices, and is particularly suitable for mass production applications with high brightness requirements and cost sensitivity.

[0029] The above description is merely an embodiment of this utility model and is not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of this utility model should be included within the scope of the claims of this utility model.

Claims

1. A high-brightness LED packaging device, characterized in that, The device includes a light-emitting unit and a reflective layer, wherein the reflective layer covers the side of the light-emitting unit; wherein the light-emitting unit includes an LED flip chip, a light guide, a red fluorescent film layer and a green fluorescent film layer, the light guide is disposed on the side light-emitting surface of the LED flip chip, the red fluorescent film layer is disposed on the front light-emitting surface of the LED flip chip and extends to the top of the light guide, and the green fluorescent film layer is disposed on the red fluorescent film layer.

2. The high-brightness LED packaging device according to claim 1, characterized in that, The top of the light guide is flush with the forward light-emitting surface of the LED flip chip, the bottom of the light guide is connected to the electrode surface of the LED flip chip, and the side of the light guide is provided with a refractive surface.

3. The high-brightness LED packaging device according to claim 2, characterized in that, The refractive surface is an arc-shaped surface that arches towards the lateral light-emitting surface of the LED flip chip.

4. The high-brightness LED packaging device according to claim 1, characterized in that, The light guide is made of transparent silicone.

5. The high-brightness LED packaging device according to claim 1, characterized in that, The edge of the red fluorescent film extends beyond the forward emitting surface of the light-emitting chip, but the edge of the red fluorescent film does not extend beyond the edge of the light guide portion.

6. The high-brightness LED packaging device according to claim 1, characterized in that, The edge of the green fluorescent film extends beyond the edge of the red fluorescent film layer.

7. The high-brightness LED packaging device according to claim 1, characterized in that, The thickness of both the red fluorescent film and the green fluorescent film is no greater than 50 μm.

8. The high-brightness LED packaging device according to claim 1, characterized in that, The reflective layer is made of a mixture of white silicone and reflective particles.

9. The high-brightness LED packaging device according to claim 8, characterized in that, The reflective particles are titanium dioxide particles or zirconium oxide particles.

10. The high-brightness LED packaging device according to claim 1, characterized in that, The top of the reflective layer is flush with the top of the red fluorescent film layer, the side of the reflective layer is flush with the side of the green fluorescent film layer, and the bottom of the reflective layer is flush with the electrode surface of the LED flip chip.

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