A backlight light emitting diode package structure

Abstract

The application relates to the technical field of LED backlight heat dissipation, in particular to a backlight light-emitting diode packaging structure which comprises a support assembly, a heat conduction unit, a fluorescent coating and a heat dissipation expansion piece. The support assembly is composed of a metal substrate and a fence layer, and a concave cavity is arranged in the middle of the substrate; the heat conduction unit is embedded in the inside of the substrate and comprises a heat conduction column and a filling layer, and the heat conduction column extends to an external heat dissipation structure; the heat dissipation expansion piece is arranged on the outside of the substrate and comprises a plurality of heat dissipation fins. The application significantly improves the heat dissipation efficiency, reduces heat accumulation, improves the stability and service life of the LED backlight and is suitable for high-power LED application scenarios by optimizing the heat conduction path, adopting high-heat-conduction materials and enhancing the heat dissipation design.

Description

Technical Field

[0001] This application relates to the field of semiconductor lighting and display technology, and more specifically, to a backlight light-emitting diode packaging structure. Background Technology

[0002] With the rapid development of LED backlight technology, integrated packaging structures have gradually become a research hotspot in the LED packaging field due to their advantages in heat dissipation, improved luminous efficiency, and structural simplification. However, existing LED packaging structures still have some shortcomings in thermal management, optical design, and overall integration, which affect the overall performance and application effect of LED backlights.

[0003] A search revealed an integrated LED backlight packaging structure with publication number CN209418496U, published on September 20, 2019. However, its practical applications exhibit certain limitations in heat dissipation performance. For instance, the material of the heat-conducting pillars is not clearly specified; if there is poor contact between the heat-conducting pillars and the support interface, high interfacial thermal resistance will result, affecting the overall heat dissipation effect. Furthermore, its heat collection cavity is designed as a closed cavity; if not filled with a high thermal conductivity medium, the low thermal conductivity of the air inside the cavity will significantly hinder effective heat conduction, leading to a decrease in heat dissipation efficiency. The silicone barrier layer is mainly used for light blocking, but the silicone itself has poor thermal conductivity, which may hinder side heat dissipation to some extent, further limiting the diversity of heat dissipation paths.

[0004] The existence of the above problems indicates that there is still room for improvement in the heat dissipation performance of existing technologies, especially in the optimization of heat conduction paths, material selection, and heat dissipation structure design, in order to improve the overall performance and reliability of LED backlights. Utility Model Content

[0005] The purpose of this application is to provide a backlight LED packaging structure that solves the problem of insufficient heat dissipation performance in the prior art by improving the heat conduction path, optimizing material selection and enhancing heat dissipation design, thereby improving the stability and lifespan of the LED backlight.

[0006] To achieve the above objectives, this application provides a backlight light-emitting diode packaging structure, comprising: The support assembly, wherein: The support assembly includes a base plate and a fence layer. The base plate is made of metal and is formed by die casting. The fence layer is disposed on both sides of the base plate and is fixedly connected by adhesive. A cavity is formed on the substrate; Mounting holes are provided on both sides of the bottom of the substrate, and the mounting holes are used to fix the packaging structure to an external device; A heat-conducting unit is embedded inside the substrate and communicates with the cavity; A fluorescent coating is applied to the inner wall of the cavity and formed by a spraying process. A heat dissipation extension component is disposed on the outer side of the substrate.

[0007] The support unit is located in a cavity and has multiple LED chips on it. The surface of the LED chips is also covered with a fluorescent coating.

[0008] Preferably, the heat-conducting unit includes heat-conducting pillars and a filling layer, wherein a plurality of heat-conducting pillars penetrate the substrate and extend to the outside, and the filling layer is located in the cavity and contacts the plurality of heat-conducting pillars.

[0009] Preferably, the heat-conducting pillar is made of copper and is connected to the substrate by reflow soldering, and the filling layer is made of graphene gasket and is fixed in the cavity by compression assembly.

[0010] Preferably, the fluorescent coating is made of silicone material doped with aluminum nitride particles, and the silicone material is coated with a uniform thickness on the inner wall of the cavity by a spraying process.

[0011] Preferably, the heat dissipation extension includes a plurality of heat dissipation fins, which are uniformly distributed along the length direction of both sides of the substrate.

[0012] Preferably, the heat dissipation extension further includes a thermally conductive interface material, which is disposed between the substrate and the heat dissipation fins and formed by a coating process.

[0013] Preferably, a heat pipe structure is provided on the top of the plurality of heat-conducting pillars, the heat pipe structure is connected to the heat-conducting pillars by welding, and the other end of the heat pipe structure extends to the outside of the substrate.

[0014] Preferably, the fence layer is embedded with multiple heat-conducting particles, which are made of boron nitride or aluminum oxide and are bonded to the fence layer through a mixing process.

[0015] Preferably, a metal foil layer is disposed on the bottom of the substrate, the metal foil layer is bonded to the substrate by a lamination process, and the thickness of the metal foil layer is 0.1-0.3 mm.

[0016] Preferably, the support assembly further includes an insulating layer, which is disposed on the surface of the substrate and formed by a spraying process, and the thickness of the insulating layer is 0.05-0.1 mm.

[0017] Through the above technical solution, this utility model discloses a backlight LED packaging structure. By embedding a heat-conducting unit inside the substrate and filling the cavity with a high thermal conductivity material, the efficiency of heat conduction from the LED chip to the outside is improved. Simultaneously, by embedding heat-conducting particles in the enclosure layer and adding heat dissipation extension components, the heat dissipation capacity of the packaging structure is further enhanced. Furthermore, the optimized design of the fluorescent coating reduces heat accumulation, thereby improving the overall performance of the LED backlight. This utility model has a compact structure and significant heat dissipation effect, making it suitable for high-power LED backlight applications. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the specific embodiments of this disclosure or the prior art, the accompanying drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. The illustrative embodiments of this application and their descriptions are used to explain this application and do not constitute an improper limitation of this application.

[0019] Figure 1 This is a schematic diagram of the first three-dimensional structure of the present invention; Figure 2 This is a schematic diagram of the second three-dimensional structure of the present invention; Figure 3 This is a schematic diagram of a first partial three-dimensional structure of the present invention; Figure 4 This is a schematic diagram of a second partial three-dimensional structure of the present invention; Figure 5 This is a three-dimensional structural diagram of the substrate in this utility model; Figure 6 This is a three-dimensional structural diagram of the fence layer and heat-conducting particles in this utility model.

[0020] Icons: 1. Support assembly; 2. Substrate; 3. Enclosure layer; 4. Cavity; 5. Thermal conductive unit; 6. Thermal conductive pillar; 7. Filler layer; 8. Fluorescent coating; 9. Heat dissipation extension; 10. Heat dissipation fins; 11. Thermal interface material; 12. Heat pipe structure; 13. Thermal conductive particles; 14. Metal foil layer; 15. Insulating layer; 16. Mounting hole; 17. Support unit; 18. LED chip. Detailed Implementation

[0021] This invention provides a backlight LED packaging structure, and the specific embodiments of this invention will be described in detail below with reference to the accompanying drawings. Figure 1 and Figure 2This is a schematic diagram of the overall structure of the present invention, showing the main components of the packaging structure, including the support assembly 1, the heat-conducting unit 5, the fluorescent coating 8, and the heat dissipation extension 9. Figure 2 , Figure 3 and Figure 4 The detailed diagram of the support assembly 1 shows the substrate 2, the fence layer 3, the cavity 4, and the heat-conducting pillar 6 and the filling layer 7 embedded inside the substrate 2. Figure 3 The diagram shows the structural details of the heat dissipation extension component 9, illustrating the distribution of the heat dissipation fins 10 and the thermal interface material 11. Figure 4 This is a partial enlarged view of the heat-conducting unit 5, which shows in detail the connection between the heat-conducting column 6 and the heat pipe structure 12.

[0022] The support assembly 1 consists of a substrate 2 and a barrier layer 3. The substrate 2 is made of metal and formed by die casting, and its shape is rectangular. A cavity 4 is formed in the middle of the substrate 2 to accommodate the LED chip 18, ensuring that the support unit 17 and the LED chip 18 can be stably installed therein. The barrier layer 3 is located on both sides of the substrate 2 and is fixedly connected to the upper surface of the substrate 2 with adhesive. Multiple thermally conductive particles 13 are embedded inside the barrier layer 3. The thermally conductive particles 13 are made of boron nitride or aluminum oxide and are combined with the barrier layer 3 through a mixing process to improve the thermal conductivity of the barrier layer 3. A metal foil layer 14 is provided at the bottom of the substrate 2. The metal foil layer 14 is bonded to the substrate 2 through a lamination process to enhance the overall thermal conductivity of the substrate 2. Mounting holes 16 are also formed on both sides of the bottom of the substrate 2 for fixing the packaging structure to external devices.

[0023] A heat-conducting unit 5 is embedded inside the substrate 2 and communicates with the cavity 4. The heat-conducting unit 5 includes a heat-conducting pillar 6 and a filling layer 7. The heat-conducting pillar 6 penetrates the substrate 2 and extends to the external heat dissipation structure 14. It is made of copper and is connected to the substrate 2 by a reflow soldering process. A heat pipe structure 12 is provided on the top of the heat-conducting pillar 6. The heat pipe structure 12 is connected to the heat-conducting pillar 6 by welding. The other end of the heat pipe structure 12 extends to the outside of the substrate 2, thereby achieving efficient heat conduction from the LED chip 18 to the outside. The filling layer 7 is located in the cavity 4 and contacts the heat-conducting pillar 6. It is made of graphene and is fixed in the cavity 4 by compression assembly. The high thermal conductivity of the filling layer 7 enables it to quickly absorb the heat generated by the LED chip 18 and transfer it to the heat-conducting pillar 6.

[0024] A fluorescent coating 8 is formed on the inner wall of the cavity 4 through a spraying process. The coating is made of silicone material doped with aluminum nitride particles, with a thickness of 0.1 mm and particle sizes ranging from 10 to 20 micrometers. The LED chip 18 is also covered with the fluorescent coating 8. The spraying process uses a spray gun to uniformly spray the silicone material onto the inner wall of the cavity 4 and the surface of the LED chip 18, forming a coating of uniform thickness. The function of the fluorescent coating 8 is to convert the blue light emitted by the LED chip 18 into white light, and the doped aluminum nitride particles further improve the thermal conductivity of the coating.

[0025] A heat dissipation extension component 9 is disposed on the outer side of the substrate 2 and fixedly connected by bolts. The heat dissipation extension component 9 includes multiple heat dissipation fins 10, which are uniformly distributed along the length of the substrate 2. The heat dissipation fins 10 are made of aluminum alloy and their surface is anodized to improve corrosion resistance. The heat dissipation extension component 9 also includes a thermally conductive interface material 11, which is disposed between the substrate 2 and the heat dissipation fins 10. The thermally conductive interface material 11 is made of thermally conductive silicone grease and formed through a coating process. The function of the thermally conductive interface material 11 is to fill the tiny gaps between the substrate 2 and the heat dissipation fins 10, thereby improving heat conduction efficiency.

[0026] The support assembly 1 also includes an insulating layer 15, which is formed on the surface of the substrate 2 by a spray coating process. The insulating layer 15 is made of epoxy resin and has a thickness of 0.05 mm to 0.1 mm. The insulating layer 15 serves to prevent short circuits between the substrate 2 and external circuits, while also protecting the surface of the substrate 2 from corrosion. A metal foil layer 14 is disposed on the bottom of the substrate 2. The metal foil layer 14 is bonded to the substrate 2 by a lamination process to enhance the overall thermal conductivity of the substrate 2. The metal foil layer 14 is made of copper foil, and its surface is nickel-plated to improve its oxidation resistance.

[0027] In practical applications, the packaging structure of this utility model operates through the following steps: First, the carrier unit 17 and the LED chip 18 are installed in the cavity 4 and connected to the external circuit via wires. When the LED chip 18 is powered on and emits light, it generates a large amount of heat, which is transferred to the heat-conducting pillar 6 through the filling layer 7. The heat pipe structure 12 inside the heat-conducting pillar 6 quickly conducts the heat to the external heat dissipation structure 14, thereby achieving efficient heat dissipation. At the same time, the heat-conducting particles 13 in the fence layer 3 can absorb some of the heat and disperse it to other areas of the substrate 2, thereby reducing the local temperature. The heat dissipation fins 10 in the heat dissipation extension 9 dissipate heat to the surrounding environment through natural convection or forced air cooling, while the thermal interface material 11 ensures that the thermal resistance between the substrate 2 and the heat dissipation fins 10 is minimized.

[0028] The packaging structure of this invention is suitable for high-power LED backlight applications, such as backlight modules for LCD displays, automotive headlights, and stage lighting equipment. Through the above design, this invention achieves efficient heat conduction from the LED chip 18 to the outside, and by optimizing material selection and structural design, significantly improves the heat dissipation performance and stability of the packaging structure.

[0029] To enable those skilled in the art to fully understand and implement this utility model, the following supplementary explanation of the specific implementation principle of this utility model is provided in conjunction with a specific application scenario.

[0030] In the backlight module of a liquid crystal display (LCD), this packaging structure is used in the heat dissipation design of a high-power LED light source. First, the bracket assembly 1 is fixed to the backplate of the LCD through mounting holes 16, ensuring a tight fit between the substrate 2 and the backplate. Then, the carrier unit 17 and the LED chip 18 are installed in the cavity 4 and connected to an external driving circuit via wires. When the LED chip 18 is powered on, the heat it generates is first transferred to the filling layer 7. Since the filling layer 7 uses graphene pad material, its high thermal conductivity allows it to quickly absorb heat and conduct it to the heat pipe structure 12 through the heat-conducting pillars 6. The heat pipe structure 12 efficiently transfers heat to the external heat dissipation structure 14 through the phase change process of the internal working fluid, thereby achieving rapid heat transfer from the LED chip 18 to the external environment.

[0031] Meanwhile, the thermally conductive particles 13 in the enclosure layer 3 play an important role in auxiliary heat dissipation. The thermally conductive particles 13 are made of boron nitride or aluminum oxide, which have high thermal conductivity and can disperse some of the heat to other areas of the substrate 2, avoiding localized overheating. The metal foil layer 14 at the bottom of the substrate 2 further enhances the overall thermal conductivity, ensuring that heat can be evenly distributed within the substrate 2.

[0032] The design of the heat dissipation extension component 9 further enhances the heat dissipation effect. The heat dissipation fins 10 are evenly distributed along the length of the substrate 2, and their surfaces are anodized, which not only improves corrosion resistance but also increases surface area to enhance heat dissipation. A thermally conductive interface material 11, made of thermally conductive silicone grease and only 0.1 mm thick, is disposed between the substrate 2 and the heat dissipation fins 10. This material effectively fills the tiny gaps between them, reducing contact thermal resistance and improving heat conduction efficiency. Furthermore, a metal casing 12 surrounds the outside of the substrate 2, and its inner wall is coated with a silicon carbide thermally conductive coating, further enhancing the overall heat dissipation capacity. Through natural convection or forced air cooling, the heat dissipation fins 10 dissipate heat to the surrounding environment, ensuring stable operation of the package structure under high power conditions.

[0033] The fluorescent coating 8 also plays a crucial role in practical applications. Its silicone material, doped with aluminum nitride particles, not only converts the blue light emitted by the LED chip 18 into white light, but also reduces heat buildup due to the high thermal conductivity of the aluminum nitride particles.

[0034] An insulating layer 15 covers the surface of the substrate 2. Its epoxy resin material prevents short circuits between the substrate 2 and external circuits, while protecting the surface of the substrate 2 from corrosion. This design ensures the reliability of the packaging structure in complex operating environments.

[0035] By combining the above steps and principles, this packaging structure achieves efficient heat conduction from the LED chip 18 to the external environment. Its optimized material selection and structural design significantly improve heat dissipation performance, enabling the packaging structure to be widely used in high-power LED backlight applications such as LCD backlight modules, automotive headlights, and stage lighting equipment. This invention not only solves the problem of insufficient heat dissipation performance in existing technologies but also improves overall stability through a compact structural design, providing reliable technical support for the application of high-power LED light sources.

[0036] All content not described in detail in this specification is prior art known to those skilled in the art, and the model parameters of each component are not specifically limited; conventional equipment can be used. Details not mentioned in this technical solution are prior art and are therefore not shown in the figures, and will not be elaborated upon here.

[0037] The above description is merely a preferred embodiment of this utility model and is not intended to limit this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A backlight light-emitting diode packaging structure, characterized in that, include: Support assembly (1), wherein: The bracket assembly (1) includes a base plate (2) and a fence layer (3). The base plate (2) is made of metal and formed by die casting. The fence layer (3) is disposed on both sides of the base plate (2) and fixedly connected. A cavity (4) is formed on the substrate (2); Mounting holes (16) are provided on both sides of the bottom of the substrate (2). A heat-conducting unit (5) is embedded inside the substrate (2) and communicates with the cavity (4); A fluorescent coating (8) is applied to the inner wall of the cavity (4); Heat dissipation extension (9) is disposed on the outside of the substrate (2); The carrier unit (17) is located in the cavity (4) and has multiple LED chips (18) on it. The surface of the LED chips (18) is also covered with a fluorescent coating (8).

2. The backlight LED packaging structure according to claim 1, characterized in that, The heat-conducting unit (5) includes heat-conducting pillars (6) and a filling layer (7). The multiple heat-conducting pillars (6) penetrate the substrate (2) and extend to the outside. The filling layer (7) is located in the cavity (4) and contacts the multiple heat-conducting pillars (6).

3. The backlight LED packaging structure according to claim 2, characterized in that, The heat-conducting pillar (6) is made of copper and is connected to the substrate (2) by reflow soldering. The filling layer (7) is made of graphene gasket and is fixed in the cavity (4) by compression assembly.

4. The backlight light-emitting diode packaging structure according to claim 1, characterized in that, The fluorescent coating (8) is made of silicone material doped with aluminum nitride particles.

5. The backlight light-emitting diode packaging structure according to claim 1, characterized in that, The heat dissipation extension (9) includes a plurality of heat dissipation fins (10), which are uniformly distributed along the length direction of both sides of the substrate (2).

6. The backlight light-emitting diode packaging structure according to claim 5, characterized in that, The heat dissipation extension (9) also includes a thermal interface material (11), which is disposed between the substrate (2) and the heat dissipation fins (10).

7. The backlight light-emitting diode packaging structure according to claim 2, characterized in that, A heat pipe structure (12) is provided on the top of the plurality of heat-conducting pillars (6), and the other end of the heat pipe structure (12) extends to the outside of the substrate (2).

8. The backlight light-emitting diode packaging structure according to claim 1, characterized in that, The fence layer (3) is embedded with multiple heat-conducting particles (13), which are made of boron nitride or aluminum oxide and are combined with the fence layer (3) through a mixing process.

9. The backlight light-emitting diode packaging structure according to claim 1, characterized in that, A metal foil layer (14) is provided on the bottom of the substrate (2), and the metal foil layer (14) is bonded to the substrate (2) by a lamination process.

10. The backlight light-emitting diode packaging structure according to claim 1, characterized in that, The support assembly (1) further includes an insulating layer (15) disposed on the surface of the substrate (2).

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