A UV curing device

Abstract

The utility model provides a kind of UV curing device, including at least one ultraviolet light source and cavity;The ultraviolet light source is located in the side of cavity;The cavity is used to accommodate at least two wafers to be cured, the angle of the plane where the ultraviolet light source is located relative to the surface of the wafer to be cured is adjustable;By basket disposable processing several multiple wafers to be cured, the curing efficiency can be improved;At the same time, at least one ultraviolet light source is arranged on the side wall of the cavity, so that the ultraviolet light source is located on the side wall of the cavity relative to the side of the several wafer curing surface, that is, the plane where the ultraviolet light source is located is perpendicular to the surface where the several wafer curing surface is located;To improve the ultraviolet curing process, improve the efficiency of curing, different from the existing ultraviolet curing device, relative to the prior art, with beneficial technical effect.

Description

Technical Field

[0001] This application relates to the field of optical technology, and in particular to a UV curing apparatus. Background Technology

[0002] Existing nitrogen-environment UV curing equipment provides a high-concentration nitrogen environment and uses UV lamps to simultaneously cure single or multiple wafers. During the curing process, the wafer loading method is relatively complex, requiring each wafer to be placed into the equipment one by one, often in a flat arrangement, resulting in low space utilization. Furthermore, existing UV curing methods are prone to uneven curing in certain areas due to limitations in the UV irradiation area. Therefore, improving existing UV curing equipment is crucial. Utility Model Content

[0003] This invention provides a UV curing device that can change the existing UV curing method and improve the curing precision.

[0004] A UV curing apparatus includes at least one ultraviolet light source and a cavity; the ultraviolet light source is located on one side of the cavity; the cavity is used to accommodate at least two wafers to be cured, and the angle of the plane where the ultraviolet light source is located relative to the surface of the wafer to be cured is adjustable.

[0005] Furthermore, the ultraviolet light source is located above several of the wafer surfaces to be cured.

[0006] In another embodiment, the ultraviolet light source is located on the sidewall of the cavity relative to the side of the wafer surfaces to be cured.

[0007] In another embodiment, at least two ultraviolet light sources are included, one of which is located above the plurality of wafer surfaces to be cured; the other ultraviolet light source is located on the sidewall of the cavity relative to the side of the plurality of wafer surfaces to be cured.

[0008] Furthermore, the plane containing the ultraviolet light source forms a certain angle with the surfaces of the wafers to be cured.

[0009] Furthermore, the plane containing the ultraviolet light source is perpendicular to the surface containing the wafer surfaces to be cured.

[0010] In some other embodiments, a plurality of wafers to be cured are stacked in a basket, which is placed in the cavity.

[0011] Furthermore, several vacuum holes are provided on any side wall of the cavity. This application provides a UV curing apparatus, including at least one ultraviolet light source and a cavity; the ultraviolet light source is located on one side of the cavity; the cavity is used to accommodate at least two wafers to be cured, and the angle of the plane where the ultraviolet light source is located relative to the surface of the wafer to be cured is adjustable; by processing multiple wafers to be cured at once using a basket, the curing efficiency can be improved; at the same time, at least one ultraviolet light source is provided on the side wall of the cavity, such that the ultraviolet light source is located on the side wall of the cavity relative to the surface of the wafers to be cured, that is, the plane where the ultraviolet light source is located is perpendicular to the surface of the wafers to be cured; thereby improving the ultraviolet curing process and increasing the curing efficiency, which is different from existing ultraviolet curing apparatuses and has beneficial technical effects compared with the prior art. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 A schematic front view of a UV curing device provided by this utility model. Figure 1 ; Figure 2 A schematic diagram of a UV curing device provided by this utility model during UV curing; Figure 3 A schematic diagram of a basket in a UV curing device provided by this utility model; Figure 4 This is a side view schematic diagram of a UV curing device provided by the present invention; Figure 5 A schematic front view of a UV curing device provided by this utility model. Figure 2 ; Figure 6 for Figure 5 Side view of the UV curing device. Detailed Implementation

[0014] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0015] A UV curing device, such as Figure 1 As shown, it includes at least one ultraviolet light source 10 and a cavity 20, with the ultraviolet light source 10 located on one side of the cavity 20; the cavity 20 is used to accommodate at least two wafers to be cured, and the angle of the plane where the ultraviolet light source 10 is located relative to the surface of the wafer to be cured is adjustable.

[0016] like Figures 1-2 As shown, the ultraviolet light source 10 is located above the cavity, and the ultraviolet light source 10 faces the wafer basket 30, providing ultraviolet irradiation to the wafer basket 30 that contains several wafers; further, as Figure 3 As shown, the wafer basket 30 can hold several wafers to be cured, and can simultaneously perform UV curing on at least two wafers.

[0017] In this application, a wafer refers to a substrate made of glass, resin, or other substrate material used to fabricate a diffractive optical waveguide. No material limitation is made in this application; any substrate that can be used to fabricate a diffractive optical waveguide can be called a wafer.

[0018] Meanwhile, the wafer to be cured is formed by uniformly coating an imprinting adhesive on the surface of the wafer through a nanoimprinting process, and then imprinting the imprinting adhesive with a patterned structure. During the imprinting curing process, the UV curing device described in this application is used.

[0019] In this application, the plane containing the ultraviolet light source 10 has an adjustable angle relative to the surface of the wafer to be cured. In one embodiment, such as Figures 1-2 As shown, the ultraviolet light source 10 is located above the wafer basket 30, meaning the plane where the ultraviolet light source 10 is located is above several wafer planes; as Figure 4 As shown, it is Figures 1-2 The side view shows that the basket 30 is located inside the cavity 20, and ultraviolet light emitted by the ultraviolet light source 10 above cures several wafers to be cured in the basket 30.

[0020] The ultraviolet light source 10 is planar, and the plane on which it is located is the plane of the location of the ultraviolet light source 10. Alternatively, the ultraviolet light source 10 is a collection of several point light sources, and the plane on which the ultraviolet light source is located is formed by the collection of point light sources.

[0021] Furthermore, in another embodiment, such as Figure 5 As shown, and in combination Figure 2 ,based on Figure 2As shown, when the cavity 20 and the ultraviolet light source 10 are rotated 90° as a whole, that is, the plane where the ultraviolet light source 10 is located is adjusted to 90° relative to the surface of the wafer to be cured, which is equivalent to the UV curing device rotating from a vertical state to a horizontal state, the basket 30 is always vertically set inside the cavity 20, and the ultraviolet light source 10 is located on the side of several wafers to be cured. In this way, it can be applied to the curing of more different types of wafers, especially for the simultaneous curing of multiple wafers, which can improve the curing efficiency. Compared with the one-piece curing of the prior art, this application can simultaneously cure several wafers or cure one wafer, which has better economic benefits than the prior art.

[0022] In more detail, such as Figure 5 and Figure 6 As shown, in this embodiment, the ultraviolet light source 10 is located on the side of the basket 30. The curing of different wafers is achieved by emitting ultraviolet light from the side. In this way, each wafer located at different heights can receive the same irradiation intensity, compared to... Figure 4 In the embodiments described above, the curing effect is better.

[0023] certainly, Figure 4 and Figure 6 All of the embodiments described herein are within the scope of protection claimed in this application, and all of them can effectively achieve simultaneous curing of multiple wafers to be cured, thereby improving curing efficiency.

[0024] Regardless of Figures 1-3 , Figure 4 The illustrated embodiment, or Figure 5 In the illustrated embodiment, during the curing process, based on an array of wafers to be cured, the planes of the wafers to be cured always face upwards to prevent the imprinting adhesive from flowing. Therefore, in this application, the angle between the plane of the ultraviolet light source 10 and the face of the wafer to be cured is adjustable, and the face of the wafer to be cured always faces upwards.

[0025] Of course, in some other embodiments, such as those for Figures 1-3 , Figure 4 The illustrated embodiment, or Figures 5-6 In the illustrated embodiment, at least two ultraviolet light sources 10 are disposed within the cavity 20, and the at least two ultraviolet light sources 10 are respectively disposed on a plurality of wafer surfaces to be cured (e.g., Figure 4 (as in the embodiments), or located on the sides of several wafer surfaces to be cured (e.g. Figure 5 In this embodiment, by controlling each ultraviolet light source 10 in different time periods, the curing process of imprinted adhesive on several wafer surfaces to be cured can be achieved. In this embodiment, the curing efficiency can be further improved and the curing time shortened.

[0026] In one embodiment, such as Figure 4 , Figure 6 As shown, the ultraviolet light source 10 is located on the side of the wafer 301, that is, the ultraviolet light source 10 is located on the side wall.

[0027] The plane containing the ultraviolet light source 10 forms a certain angle with the surfaces of several wafers 301 to be cured.

[0028] The included angle ranges from 0° to 180°.

[0029] In another embodiment, the plane containing the ultraviolet light source 10 is perpendicular to the surface of the plurality of wafers 301 to be cured. That is, the plane containing the ultraviolet light source 10 forms a 90° angle with the surface of the plurality of wafers 301 to be cured.

[0030] like Figure 3 , Figure 4 , Figure 6 As shown, several wafers 301 to be cured are stacked in a basket 30, which is placed in the cavity 20. The basket 30 can accommodate several wafers 301 to be cured. All wafers 301 to be cured are placed inside the basket 30, and the basket is placed into the cavity 20 using a handle on top of the basket 30. By using the basket method, the curing process of the imprinted adhesive on the surfaces of multiple wafers can be achieved simultaneously, improving curing efficiency.

[0031] Combination Figure 1 As shown, several vacuum holes (not shown in the figure) are provided on any side wall of the cavity 20. Nitrogen gas is filled into the cavity 20 through the vacuum holes to provide a vacuum or nitrogen curing environment.

[0032] Meanwhile, several function keys are provided on the side wall of the cavity.

[0033] Combination Figure 1 , Figures 4-6 Switching points, circuit breakers, on / off valves, and opening windows can be installed on the outside of the cavity 20 as needed, and corresponding protective covers can be installed. This is easy to implement. In this application, the functional modules set according to functional needs are set by those skilled in the art according to their needs. The relevant structures are not shown in the figure, but those skilled in the art can make structural designs based on this.

[0034] This application provides a UV curing apparatus, including at least one ultraviolet light source and a cavity; the ultraviolet light source is located on one side of the cavity; the cavity is used to accommodate at least two wafers to be cured, and the angle of the plane where the ultraviolet light source is located relative to the surface of the wafer to be cured is adjustable; by processing multiple wafers to be cured at once using a basket, the curing efficiency can be improved; at the same time, at least one ultraviolet light source is provided on the side wall of the cavity, such that the ultraviolet light source is located on the side wall of the cavity relative to the surface of the wafers to be cured, that is, the plane where the ultraviolet light source is located is perpendicular to the surface of the wafers to be cured; thereby improving the ultraviolet curing process and increasing the curing efficiency, which is different from existing ultraviolet curing apparatuses and has beneficial technical effects compared with the prior art.

[0035] The specific embodiments described above do not constitute a limitation on the scope of protection of this utility model. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. A UV curing apparatus comprising at least one ultraviolet light source and a cavity; the ultraviolet light source being located on one side of the cavity; the cavity being used to accommodate at least two wafers to be cured, wherein the angle of the plane containing the ultraviolet light source relative to the surface of the wafer to be cured is adjustable.

2. The UV curing apparatus according to claim 1, characterized in that, The ultraviolet light source is located above several of the wafer surfaces to be cured.

3. The UV curing apparatus according to claim 1, characterized in that, The ultraviolet light source is located on the sidewall of the cavity relative to the side of the surface of the wafer to be cured.

4. The UV curing apparatus according to claim 1, characterized in that, It includes at least two ultraviolet light sources, one of which is located above the plurality of wafer surfaces to be cured; the other of which is located on the sidewall of the cavity relative to the side of the plurality of wafer surfaces to be cured.

5. The UV curing apparatus according to claim 3, characterized in that, The plane containing the ultraviolet light source forms a certain angle with the surfaces of the wafers to be cured.

6. The UV curing apparatus according to claim 5, characterized in that, The plane containing the ultraviolet light source is perpendicular to the surface containing the wafer surfaces to be cured.

7. A UV curing apparatus according to claim 5, characterized in that, Several wafers to be cured are stacked in a basket, which is placed in the cavity, and the basket ensures that the surface of the wafer to be cured is always vertically upward during the curing process.

8. A UV curing apparatus according to claim 5, characterized in that, Several vacuum holes are provided on any side wall of the cavity.

9. A UV curing apparatus according to claim 8, characterized in that, Several function keys are provided on the side wall of the cavity.

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