Towing device for semiconductor tile heating apparatus

Abstract

The utility model belongs to the technical field of traction device, concretely relates to semiconductor patch heating device is with traction device, including two symmetries support seat, one support seat's outer wall is installed servo motor, two support seat between rotatory connection has the rotating shaft, the surface of rotating shaft is installed two symmetries frame, the bottom of frame is connected with support foot, the inner wall rotation of frame is connected with the roller, the surface fixed connection of rotating shaft has synchronous wheel, the surface bushing of synchronous wheel has synchronous belt, synchronous belt is connected with the synchronous connection wheel of roller connection axle end part is connected. The utility model discloses the cooperation between mounting block, mounting column, rotating block, deviation rectification wheel, pneumatic slide rail, fixed block, butt -joint column and connecting column, thereby the semiconductor patch placed on the frame is rectified conveniently, thereby guaranteeing the accuracy of semiconductor patch traction, the use reliability of traction device is improved.

Description

Technical Field

[0001] This utility model belongs to the field of traction device technology, specifically relating to a traction device for a semiconductor chip heating device. Background Technology

[0002] Traction devices are equipment or systems that utilize mechanical principles to achieve position adjustment, force transmission, or state change by applying external force to specific parts of the human body or object. They are widely used in many fields such as medicine, transportation, and industry.

[0003] In the semiconductor chip mounting process, the semiconductor chip needs to be heated, which requires the use of a heating device. Then, when the heating device is in use, a traction device is used to feed the semiconductor chip into the heating device. However, the existing traction device lacks a correction mechanism. When there is a deviation in the initial placement position of the semiconductor chip, the deviation will continue to accumulate and expand as the traction process progresses, eventually leading to a decrease in traction and greatly reducing the usability of the traction device. Utility Model Content

[0004] The purpose of this utility model is to provide a traction device for a semiconductor chip heating device, which aims to solve the problem that existing traction devices lack a correction mechanism during use. When there is a deviation in the initial placement position of the semiconductor chip, the deviation will continue to accumulate and expand as the traction process progresses, eventually leading to a decrease in traction, thus greatly reducing the usability of the traction device.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a traction device for a semiconductor chip heating apparatus, comprising two symmetrical support seats, a servo motor mounted on the outer wall of one of the support seats, a rotating shaft rotatably connected between the two support seats, two symmetrical frames mounted on the surface of the rotating shaft, support feet connected to the bottom end of the frames, rollers rotatably connected to the inner wall of the frames, a synchronous pulley fixedly connected to the surface of the rotating shaft, a synchronous belt sleeved on the surface of the synchronous pulley, the synchronous belt connected to a synchronous connecting pulley at the end of the roller connecting shaft, a reducer connected to the output shaft of the servo motor, a support block connected to the bottom end of the reducer, a mounting block connected to the top end of the frames, a mounting column rotatably connected inside the mounting block via a bearing, a rotating block fixedly connected to the surface of the mounting column, a correction wheel rotatably connected inside the rotating block, a pneumatic slide rail connected to the outer wall of the mounting block, a fixing block mounted on the outer wall of the sliding component of the pneumatic slide rail, a connecting column through the fixing block, and a connecting column fixedly connected to the surface of the connecting column.

[0006] As a preferred traction device for the semiconductor chip heating apparatus of this utility model, the correction wheel can be rotatably connected to the mounting block through a rotating block and a mounting column, and the inner wall of the mounting block has an opening for the correction wheel to move.

[0007] As a preferred traction device for the semiconductor chip heating apparatus of this utility model, the connecting column is installed at an incline on one side of the rotating block.

[0008] As a preferred traction device for the semiconductor chip heating device of this utility model, the docking column can form a linear reciprocating motion with the mounting block through a pneumatic slide rail and a fixing block.

[0009] As a preferred traction device for the semiconductor chip heating apparatus of this utility model, the connecting column can be linked with the pneumatic slide rail through the docking column and the fixing block.

[0010] As a preferred traction device for the semiconductor chip heating apparatus of this utility model, a first rectangular block is connected to the top of one frame, and a second rectangular block is connected to the top of the other frame. A threaded rod is rotatably connected inside the first rectangular block through a bearing, and a threaded sleeve is threadedly connected to the surface of the threaded rod. A guide rod is installed inside the second rectangular block, and a guide sleeve is sleeved on the surface of the guide rod. A support plate is connected between the threaded sleeve and the guide sleeve, and a buffer pad is installed at the bottom end of the support plate by bolts.

[0011] As a preferred traction device for the semiconductor chip heating apparatus of this utility model, the support plate can form a threaded lifting connection with the first rectangular block and the second rectangular block through a threaded rod, a threaded sleeve, a guide rod, and a guide sleeve.

[0012] Compared with the prior art, the beneficial effects of this utility model are: Through the cooperation of the mounting block, mounting column, rotating block, correction wheel, pneumatic slide rail, fixed block, docking column, and connecting column, when the pneumatic slide rail is connected to the air source for startup, the sliding component of the pneumatic slide rail drives the fixed block to move. The movement of the fixed block drives the docking column to move synchronously. Subsequently, the docking column drives the connecting column to move synchronously. Then, the connecting column drives the rotating block to start rotating. At this time, the rotating block rotates inside the mounting block through the mounting column. Subsequently, the rotation of the rotating block drives the correction wheel to swing, thereby facilitating the correction of the semiconductor chips placed on the rack, ensuring the accuracy of semiconductor chip traction, and improving the reliability of the traction device.

[0013] Through the cooperation between the first rectangular block, the second rectangular block, the threaded rod, the threaded sleeve, the guide rod, the guide sleeve, the support plate, and the buffer pad, the operator rotates the threaded rod to start rotating. Then, the threaded sleeve moves along the thread on the surface of the threaded rod. Next, the threaded sleeve drives the support plate to move, and the support plate drives the guide sleeve to move along the surface of the guide rod. Subsequently, the support plate descends, causing the buffer pad to adhere to the semiconductor patch placed on the frame, thereby preventing the semiconductor patch from tilting and affecting the normal traction efficiency. Attached Figure Description

[0014] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the three-dimensional semiconductor patch placement structure of this utility model; Figure 2 This is a three-dimensional structural diagram of the present invention; Figure 3 This is a cross-sectional view of the mounting block structure of this utility model; Figure 4 This utility model Figure 2 A magnified structural diagram at point A in the diagram.

[0015] In the diagram: 1. Support base; 2. Servo motor; 3. Rotating shaft; 4. Frame; 5. Support foot; 6. Roller; 7. Synchronous pulley; 8. Synchronous belt; 9. Reducer; 10. Support block; 11. Mounting block; 12. Mounting column; 13. Rotating block; 14. Correcting wheel; 15. Pneumatic slide rail; 16. Fixing block; 17. Connecting column; 18. Connecting column; 19. First rectangular block; 20. Second rectangular block; 21. Threaded rod; 22. Threaded sleeve; 23. Guide rod; 24. Guide sleeve; 25. Support plate; 26. Buffer pad. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] Please see Figures 1-4This utility model provides the following technical solution: a traction device for a semiconductor chip heating apparatus, comprising two symmetrical support bases 1, a servo motor 2 mounted on the outer wall of one support base 1, a rotating shaft 3 rotatably connected between the two support bases 1, two symmetrical frames 4 mounted on the surface of the rotating shaft 3, support feet 5 connected to the bottom end of the frames 4, rollers 6 rotatably connected to the inner wall of the frames 4, a synchronous pulley 7 fixedly connected to the surface of the rotating shaft 3, a synchronous belt 8 sleeved on the surface of the synchronous pulley 7, and the synchronous belt 8 connected to the synchronous connecting pulley at the end of the connecting shaft of the roller 6. The output shaft of the servo motor 2 is connected to a reducer 9. The bottom end of the reducer 9 is connected to a support block 10. The top end of the frame 4 is connected to a mounting block 11. The inside of the mounting block 11 is rotatably connected to a mounting column 12 via a bearing. The surface of the mounting column 12 is fixedly connected to a rotating block 13. The inside of the rotating block 13 is rotatably connected to a correction wheel 14. The outer wall of the mounting block 11 is connected to a pneumatic slide rail 15. The outer wall of the sliding component of the pneumatic slide rail 15 is fitted with a fixing block 16. The inside of the fixing block 16 is connected to a connecting column 17. The surface of the connecting column 17 is fixedly connected to a connecting column 18.

[0018] In practical use, the traction device consists of a support base 1, a servo motor 2, a rotating shaft 3, a frame 4, support feet 5, rollers 6, synchronous pulleys 7, synchronous belts 8, a reducer 9, and a support block 10. In actual use, the semiconductor patch is placed on the frame 4 and then pushed between rollers 6 and the correction wheel 14. Then, the servo motor 2 is connected to the power supply and started. At this time, the output shaft of the servo motor 2 rotates in cooperation with the reducer 9. At the same time, the reducer 9 is connected to the rotating shaft 3, and the reducer 9 drives the rotating shaft 3 to rotate. Then, the rotation of the rotating shaft 3 drives the synchronous pulley 7 to rotate. Subsequently, the synchronous pulley 7 drives the synchronous belt 8 to start rotating, and the synchronous belt 8 drives the rollers 6 to start rotating. The rotation of the rollers 6 drives the semiconductor patch forward, allowing it to move between the rollers 6 and the correction wheel 14, thereby traction and feeding the semiconductor patch into the heating device for processing.

[0019] Preferably, the alignment wheel 14 is rotatably connected to the mounting block 11 via the rotating block 13 and the mounting column 12. The inner wall of the mounting block 11 has an opening for the alignment wheel 14 to move. The connecting column 18 is installed at an angle on one side of the rotating block 13. The docking column 17 can reciprocate linearly with the mounting block 11 via the pneumatic slide rail 15 and the fixing block 16. The connecting column 18 can be linked to the pneumatic slide rail 15 via the docking column 17 and the fixing block 16.

[0020] In practical use, when the pneumatic slide rail 15 is connected to the air source and started, its sliding component will drive the fixed block 16 to move. The movement of the fixed block 16 will synchronously drive the docking column 17 to move. At this time, the docking column 17 will further drive the connecting column 18 to move synchronously. Then, the connecting column 18 will push the rotating block 13 to rotate. At the same time, the rotation of the rotating block 13 will drive the correction wheel 14 to swing. Then, the rotating block 13 will drive the mounting column 12 to rotate inside the mounting block 11. Since the mounting column 12 is fixed inside the mounting block 11 by bearings, this ensures the stable connection and rotation of the mounting column 12, and further ensures the stable connection of the rotating block 13 and the correction wheel 14 installed on the rotating block 13. Thus, the swing of the correction wheel 14 can correct the semiconductor patch on the frame 4, ensure the accuracy of semiconductor patch traction, and improve the reliability of the traction device.

[0021] It is worth noting that the swing range of the correction wheel 14 is 1-3mm.

[0022] Preferably, a first rectangular block 19 is connected to the top of one frame 4, and a second rectangular block 20 is connected to the top of the other frame 4. A threaded rod 21 is rotatably connected inside the first rectangular block 19 via a bearing. A threaded sleeve 22 is threadedly connected to the surface of the threaded rod 21. A guide rod 23 is installed inside the second rectangular block 20. A guide sleeve 24 is fitted onto the surface of the guide rod 23. A support plate 25 connects between the threaded sleeve 22 and the guide sleeve 24. A buffer pad 26 is bolted to the bottom end of the support plate 25. The support plate 25 can form a threaded lifting connection with the first rectangular block 19 and the second rectangular block 20 via the threaded rod 21, threaded sleeve 22, guide rod 23, and guide sleeve 24.

[0023] In practical use, when the threaded sleeve 22 starts to move as the threaded rod 21 rotates, the threaded sleeve 22 will drive the support plate 25 to rotate together. Then, the support plate 25 will drive the guide sleeve 24 to move along the surface of the guide rod 23. In this way, the guide rod 23 and the guide sleeve 24 prevent the threaded sleeve 22 from rotating together with the threaded rod 21. At this time, the descent of the support plate 25 will cause the buffer pad 26 to adhere to the semiconductor patch placed on the frame 4. Then, it will prevent the semiconductor patch from tilting up and affecting the normal traction efficiency. Furthermore, the buffer pad 26 is made of rubber. The elasticity of the buffer pad 26 reduces the excessive compression caused by the direct contact between the support plate 25 and the semiconductor patch, thereby ensuring the safety of the semiconductor patch.

[0024] Working principle: The semiconductor chip is placed on the frame 4, then pushed between the roller 6 and the guide roller 14. The operator then rotates the threaded rod 21, causing the threaded sleeve 22 to move along the threaded surface of the threaded rod 21. The threaded sleeve 22 then moves the support plate 25. Subsequently, the support plate 25 synchronously moves the guide sleeve 24 along the surface of the guide rod 23. Finally, the support plate 25 descends, causing the buffer pad 26 to adhere to the semiconductor chip, preventing it from tilting and ensuring traction efficiency. Next, the servo motor 2 is powered on and starts, its output shaft rotating in conjunction with the reducer 9. The reducer 9 is then connected to the rotating shaft 3, causing the rotating shaft 3 to rotate. The rotating shaft 3 then drives the synchronous pulley 7 to rotate. The synchronous pulley 7 further drives the synchronous belt 8 to rotate. Following this, the synchronous belt 8... The belt 8 drives the roller 6 to rotate. When the roller 6 rotates, it pushes the semiconductor patch forward, causing it to move between the roller 6 and the correction wheel 14. If the semiconductor patch needs to be corrected, the operator connects the air source to start the pneumatic slide rail 15. The sliding part of the pneumatic slide rail 15 drives the fixed block 16 to move. Then, the fixed block 16 synchronously drives the docking column 17 to move. Next, the docking column 17 drives the connecting column 18 to move. Subsequently, the connecting column 18 pushes the rotating block 13 to start rotating. The rotating block 13 rotates inside the mounting block 11 through the mounting column 12. The rotation of the rotating block 13 drives the correction wheel 14 to swing, thereby correcting the semiconductor patch on the frame 4, ensuring the accuracy of traction and the reliability of the device. Finally, the semiconductor patch is pulled and sent into the heating device for processing.

[0025] Finally, it should be noted that the above are merely preferred embodiments of this utility model and are not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A traction device for a semiconductor surface mount heating apparatus, comprising two symmetrical support bases (1), characterized in that: A servo motor (2) is mounted on the outer wall of one of the support bases (1), and a rotating shaft (3) is rotatably connected between the two support bases (1). Two symmetrical frames (4) are mounted on the surface of the rotating shaft (3). Support feet (5) are connected to the bottom end of the frames (4). Rollers (6) are rotatably connected to the inner wall of the frames (4). A synchronous wheel (7) is fixedly connected to the surface of the rotating shaft (3). A synchronous belt (8) is sleeved on the surface of the synchronous wheel (7). The synchronous belt (8) is connected to the synchronous connecting wheel at the end of the connecting shaft of the roller (6). A reducer (9) is connected to the output shaft of the servo motor (2). A support block (10) is connected to the bottom end of the reducer (9). The top of the frame (4) is connected to a mounting block (11). The mounting block (11) is rotatably connected to a mounting column (12) via a bearing. A rotating block (13) is fixedly connected to the surface of the mounting column (12). A correction wheel (14) is rotatably connected inside the rotating block (13). A pneumatic slide rail (15) is connected to the outer wall of the mounting block (11). A fixing block (16) is installed on the outer wall of the sliding component of the pneumatic slide rail (15). A docking column (17) is connected through the inside of the fixing block (16). A connecting column (18) is fixedly connected to the surface of the docking column (17).

2. The traction device for the semiconductor chip heating apparatus according to claim 1, characterized in that: The correction wheel (14) can be rotatably connected to the mounting block (11) through the rotating block (13) and the mounting column (12). The inner wall of the mounting block (11) has an opening for the correction wheel (14) to move.

3. The traction device for the semiconductor chip heating apparatus according to claim 1, characterized in that: The connecting column (18) is installed at an angle on one side of the rotating block (13).

4. The traction device for the semiconductor chip heating apparatus according to claim 1, characterized in that: The docking column (17) can reciprocate linearly with the mounting block (11) via the pneumatic slide rail (15) and the fixing block (16).

5. The traction device for the semiconductor chip heating apparatus according to claim 1, characterized in that: The connecting column (18) can be linked with the pneumatic slide rail (15) through the docking column (17) and the fixing block (16).

6. The traction device for the semiconductor chip heating apparatus according to claim 1, characterized in that: A first rectangular block (19) is connected to the top of one of the frames (4), and a second rectangular block (20) is connected to the top of the other frame (4). A threaded rod (21) is rotatably connected inside the first rectangular block (19) via a bearing. A threaded sleeve (22) is threadedly connected to the surface of the threaded rod (21). A guide rod (23) is installed inside the second rectangular block (20). A guide sleeve (24) is sleeved on the surface of the guide rod (23). A support plate (25) is connected between the threaded sleeve (22) and the guide sleeve (24). A buffer pad (26) is installed at the bottom end of the support plate (25) via bolts.

7. The traction device for the semiconductor chip heating apparatus according to claim 6, characterized in that: The support plate (25) can form a threaded lifting connection with the first rectangular block (19) and the second rectangular block (20) through the threaded rod (21), threaded sleeve (22), guide rod (23) and guide sleeve (24).

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