Wafer chuck structure

Abstract

The utility model discloses a wafer clamp jaw structure, including both side plates, the support pole of horizontal connection between both side plates, the clamp of horizontal connection between both side plates and located support pole below. The clamp includes two material is PTFE's clamp jaw pole. Two clamp jaw poles all have the multiple card slots for clamping the wafer on axial. One clamp jaw pole connects and is established at the lower end of both side plates, and another clamp jaw pole is located the upper side of former and is connected with both side plates respectively. The clamp can have the buffer when contacting with the wafer, and it is not easy to produce the hidden crack and the fragment, simultaneously adopts two clamp jaw poles, and the wafer is the point contact, and the contact area is less, reduces the pollution probability, has the function of super clean transmission.

Description

Technical Field

[0001] This utility model belongs to semiconductor slotted equipment, specifically relating to a wafer clamping structure. Background Technology

[0002] In semiconductor process equipment, Figure 1 The diagram shows a conventional wafer gripping and releasing tool (Chuck, hereinafter referred to as gripper), which includes two side plates 1, a support rod 2 laterally connected between the two side plates 1, and a clamp 4 also connected between the two side plates 1 and located below the support rod 2. A robot drives the gripper to move the wafer, then places the wafer into the required process tank and releases it into the corresponding limiting plate within the tank for cleaning. The processing accuracy of this tool directly affects the accuracy and stability of its matching with the limiting plate within the tank.

[0003] Currently, the commonly used 12-inch wafer gripper structures on the market are made of PEEK or quartz, with different materials selected depending on the chemical composition. This presents several challenges: firstly, the material cost is high; secondly, the processing is difficult. Furthermore, both quartz and PEEK are inherently hard, making them prone to microcracks and fragmentation during wafer gripping. Additionally, the use of quartz, due to its inherent properties, makes it susceptible to breakage during transportation and maintenance, further increasing costs.

[0004] In the semiconductor manufacturing industry, the grippers of semiconductor tank equipment must be selected with spare parts made of corresponding materials for different types of solutions. For example, for solutions such as hydrofluoric acid (HF) that corrode quartz, grippers made of PEEK material are required; while for solutions such as H2SO4, grippers made of quartz material are required.

[0005] This directly results in a wide variety of gripper spare parts, increasing the difficulty and cost of spare parts management. Furthermore, quartz gripper spare parts are prone to damage during routine maintenance, further increasing the complexity and economic investment in equipment operation and maintenance.

[0006] In addition, the slot 41 in the fixture 4 for gripping the wafer is a continuous arc-shaped slot, and the contact with the wafer is a line contact, which makes it easier to contaminate the periphery of the wafer. Utility Model Content

[0007] The technical problem to be solved by this utility model is to provide a wafer gripper structure that can provide buffering when in contact with the wafer, making it less likely to generate microcracks and fragments, and has a small contact area with the wafer, thus providing ultra-clean transport function.

[0008] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0009] A wafer gripper structure includes two side plates, a support rod laterally connected between the two side plates, and a clamping device laterally connected between the two side plates and located below the support rod. The clamping device includes a pair of gripper bars, both made of PTFE. Each gripper bar has multiple identical annular slots axially formed on it for gripping wafers. One gripper bar is connected to the lower end of the two side plates, and the other gripper bar is located above and outside the first gripper bar and connected to the two side plates.

[0010] The main body of the side panel is made of aluminum alloy, and there are PFA plates on both sides to cover the main body.

[0011] The PFA plate is covered by welding.

[0012] The main body of the support rod is made of aluminum alloy and is covered with a PFA sleeve.

[0013] The support rod has two parts, arranged vertically.

[0014] The side plate is fixed to the support rod and the gripper rod by screws.

[0015] This invention discloses a wafer gripper structure. The gripper bars are made of relatively soft PTFE, which provides cushioning when in contact with the wafer, reducing the likelihood of microcracks and fragments. The use of two gripper bars ensures point contact with the wafer, minimizing the contact area and reducing the probability of contamination, thus enabling ultra-clean transport. The side plates and support rods are made of aluminum alloy, offering high strength, resistance to deformation, and structural stability. Furthermore, the use of PFA-coated material provides acid and alkali resistance, making it less susceptible to corrosion. Attached Figure Description

[0016] The utility model will now be described in detail with reference to the accompanying drawings and specific embodiments:

[0017] Figure 1 A three-dimensional schematic diagram of a wafer gripping and releasing tool in the prior art;

[0018] Figure 2 This is a three-dimensional schematic diagram of the wafer gripper structure of this utility model;

[0019] Figure 3 This is an exploded view of the wafer gripper structure of this utility model;

[0020] Figure 4 This is a schematic diagram showing the state of the wafer being gripped by the two symmetrical wafer gripper structures of this utility model. Detailed Implementation

[0021] This utility model provides a wafer clamping structure as follows: Figures 2-3As shown, the device includes two side plates 1, a support rod 2 laterally connected between the two side plates 1, and a clamp laterally connected between the two side plates 1 and located below the support rod 2. Unlike existing technologies, this clamp includes a pair of PTFE gripper bars 3. Both gripper bars 3 have multiple identical annular slots 41 axially spaced at equal intervals for gripping wafers. One gripper bar 3 is connected to the lower end of the two side plates 1, and the other gripper bar 3 is located above and outside the first gripper bar 3 and connected to the two side plates 1. The slots 41 of the two gripper bars 3 correspond one-to-one, forming a wafer gripping groove in pairs. Because PTFE is relatively soft and self-lubricating, it provides cushioning when the clamp contacts the wafer, effectively preventing friction between different materials and reducing the likelihood of microcracks and wafer breakage. Furthermore, the use of two gripper bars 3, such as... Figure 4 As shown, the bottom of the annular slot 41 is in point contact with the outer edge of the wafer 10, and its contact area with the wafer is significantly reduced, which can ensure the cleanliness between products, reduce the probability of contamination, and has the function of ultra-clean transmission.

[0022] The main body of side panel 1 is made of high-strength aluminum alloy, and both sides have PFA plates 5 that cover the main body. The PFA plates 5 can be connected and covered by welding or other methods.

[0023] There are two support rods 2, arranged one above the other. The main body of the support rod 2 is also made of high-strength aluminum alloy, and the outer layer is covered with PFA sleeve 6.

[0024] The side plate 1 and the support rod 2, as well as the side plate 1 and the gripper rod 3, can be connected and fixed by fasteners such as screws 7.

[0025] In summary, the wafer gripper structure of this invention, with its side plate 1 and support rod 2 made of high-strength aluminum alloy and its outer layer treated with PFA, possesses advantages such as high strength, resistance to deformation, and greater structural stability. It achieves excellent acid and alkali resistance while maintaining strength, making it less susceptible to corrosion. The clamping part uses PTFE material, which has low friction, non-adhesion, and reduces particulate contamination, ensuring product cleanliness. The improved gripper possesses core functions such as non-destructive gripping, ultra-clean transfer, and high-speed precise positioning, meeting the stringent requirements of semiconductor manufacturing.

[0026] Because its exterior is made of both PTFE and PFA materials, it not only meets the requirements of the grippers for acid and alkali resistance, but also has good cleanliness and ease of processing. This material selection breaks the traditional limitation that grippers need to be made of different materials depending on the type of liquid, allowing a single device to use grippers of the same material and specifications. This effectively simplifies spare parts management, significantly improves the versatility of the grippers, and reduces losses and costs during equipment maintenance and transportation.

[0027] The internal structure utilizes high-strength aluminum alloy, fundamentally ensuring the mechanical strength of the gripper structure itself. Compared to traditional structures, the improved grippers exhibit significant enhancements in load-bearing capacity and deformation resistance, demonstrating greater adaptability to various working conditions and maintaining stable performance across diverse semiconductor manufacturing processes.

[0028] In addition, the material's easy processing properties enable the product to have high-precision positioning performance, and the material's chemical resistance gives the grippers excellent acid and alkali resistance. There is no need to change the material for different types of chemicals, which greatly improves the versatility of the accessories.

[0029] However, those skilled in the art should recognize that the above embodiments are only used to illustrate the present utility model and are not intended to limit the present utility model. Any changes or modifications to the above embodiments within the scope of the essential spirit of the present utility model will fall within the scope of the claims of the present utility model.

Claims

1. A wafer clamping structure, comprising two side plates, a support rod laterally connected between the two side plates, and a clamp laterally connected between the two side plates and located below the support rod, characterized in that: The fixture includes a pair of gripper bars, both made of PTFE. Each gripper bar has multiple identical annular slots axially formed on it for gripping the wafer. One gripper bar is connected to the lower end of the two side plates, and the other gripper bar is located above and outside the first gripper bar and connected to the two side plates.

2. The wafer gripper structure according to claim 1, characterized in that: The main body of the side panel is made of aluminum alloy, and there are PFA plates on both sides to cover the main body.

3. The wafer gripper structure according to claim 2, characterized in that: The PFA plate is covered by welding.

4. The wafer gripper structure according to claim 1, characterized in that: The main body of the support rod is made of aluminum alloy and is covered with a PFA sleeve.

5. A wafer gripper structure according to claim 1, characterized in that: The support rod has two parts, arranged vertically.

6. A wafer gripper structure according to claim 1 or 5, characterized in that: The side plate is fixed to the support rod and the gripper rod by screws.

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