Wafer temperature measuring device

Abstract

The utility model relates to wafer temperature measurement technical field, concretely relates to a wafer temperature measurement device, including positioning assembly and push mechanism, the positioning assembly includes the jacking cylinder and is connected to the carrier of jacking cylinder output end, be equipped with a plurality of limit cylinder on the carrier, the output end of limit cylinder is equipped with the limit board, be equipped with and the limit slot of base plate adaptation on the limit board, limit cylinder is used for driving limit board to move to carry out the limit to base plate, the push mechanism includes push cylinder and is connected to the push frame of push cylinder output end, the push frame has placed the temperature measurement spare, the temperature measurement spare includes the plug and temperature measurement probe, push cylinder is used for driving the push frame to drive temperature measurement probe and inserts into the temperature measurement hole on the base plate. Through the setting of limit cylinder and limit board, position base plate. When temperature measurement, the position of base plate is not easy to change, is convenient for temperature measurement probe and inserts into the temperature measurement hole on the base plate, to make temperature measurement efficiency improve.

Description

Technical Field

[0001] This utility model relates to the field of wafer temperature measurement technology, and specifically to a wafer temperature measurement device. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon crystal seeds, and then slowly pulled out to form a cylindrical single-crystal silicon wafer. After grinding, polishing, and slicing, the silicon crystal rod is formed into a silicon wafer.

[0003] Wafers need to be molded onto a substrate, and temperature measurement is required before molding. Existing technologies typically use temperature measuring devices to measure the wafer's temperature. These devices include a temperature measuring element and a pushing mechanism. The temperature measuring element includes a connector and a temperature probe connected to the front end of the connector. The substrate has a temperature measuring hole that communicates with the wafer. During temperature measurement, the pushing mechanism inserts the temperature probe into the measuring hole. However, existing temperature measuring devices lack substrate positioning, making it easy for the substrate to shift and hindering probe insertion into the measuring hole, thus reducing measurement efficiency. Utility Model Content

[0004] The technical solution adopted by this utility model to solve its technical problem is: to provide a wafer temperature measuring device, comprising:

[0005] The positioning component includes a lifting cylinder and a carrier connected to the output end of the lifting cylinder. The carrier is provided with a plurality of limiting cylinders. The output end of the limiting cylinder is provided with a limiting plate. The limiting plate is provided with a limiting groove adapted to the substrate. The limiting cylinder is used to drive the limiting plate to move to limit the substrate. The lifting cylinder is used to drive the substrate to rise and fall.

[0006] The pushing mechanism includes a pushing cylinder and a pushing frame connected to the output end of the pushing cylinder. A temperature measuring element is placed on the pushing frame. The temperature measuring element includes a plug and a temperature measuring probe. The pushing cylinder is used to drive the pushing frame to drive the temperature measuring probe to be inserted into the temperature measuring hole on the substrate.

[0007] Furthermore, the carrier is also equipped with an adjusting cylinder, the output end of which is provided with a frame body one, the frame body one being connected to a frame body two for supporting the limiting cylinder, and the adjusting cylinder being used to drive the frame body two to move the limiting plate.

[0008] Furthermore, the first frame is provided with a sliding groove, and the carrier is provided with a positioning column. When the adjusting cylinder pushes the second frame to move, the positioning column is slidably positioned in the sliding groove.

[0009] Furthermore, the pusher frame is equipped with a pusher cylinder, and the output end of the pusher cylinder is equipped with a pusher plate. The pusher cylinder is used to drive the pusher plate to push the plug and move the temperature probe.

[0010] Furthermore, the push plate is provided with a limiting block one, the push frame is provided with an adjustment groove, the adjustment groove is provided with a compression spring and a limiting block two, the two ends of the compression spring are respectively connected to the limiting block one and the limiting block two, when the push plate pushes the plug to move, the limiting block one pushes the compression spring to compress.

[0011] Furthermore, the limiting groove is an L-shaped groove.

[0012] The beneficial effects of this invention are: by setting up a limiting cylinder and a limiting plate, the substrate is positioned. During temperature measurement, the position of the substrate is not easily changed, making it easier for the temperature probe to be inserted into the temperature measuring hole on the substrate, thereby improving the temperature measurement efficiency. Attached Figure Description

[0013] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0014] In the picture: Figure 1 An overall structural diagram of a wafer temperature measuring device provided by this utility model;

[0015] Figure 2 for Figure 1 Enlarged view of point A in the middle;

[0016] Figure 3 for Figure 1 Enlarged view at point B in the middle;

[0017] Figure 4 for Figure 1 The overall structural diagram of the wafer temperature measurement device shown is viewed from another angle.

[0018] Figure 5 for Figure 1 A three-dimensional structural diagram of the part shown;

[0019] Figure 6 for Figure 1 A three-dimensional structural diagram of the part shown;

[0020] Figure 7 for Figure 6 Exploded view of the structure shown.

[0021] Explanation of reference numerals in the attached drawings: 100, wafer temperature measuring device; 11, lifting cylinder; 12, carrier; 121, positioning post; 13, limiting cylinder; 14, limiting plate; 141, limiting groove; 15, adjusting cylinder; 16, frame one; 161, sliding groove; 17, frame two; 20, pushing mechanism; 21, pushing cylinder; 22, pushing frame; 221, adjusting groove; 222, compression spring; 223, limiting block two; 23, pushing cylinder; 231, pushing plate; 232, limiting block one; 30, plug; 31, temperature probe; 201, wafer; 202, substrate; 201, temperature measuring hole. Detailed Implementation

[0022] To make the technical problem to be solved, the technical solution, and the beneficial effects of this utility model clearer, the present utility model will now be described in detail with reference to the accompanying drawings. This drawing is a simplified schematic diagram, illustrating only the basic aspects of the present utility model, and therefore only shows the components relevant to the present utility model. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0023] Please refer to Figure 1 , Figure 2 and Figure 4 This utility model provides a wafer temperature measuring device 100, including a positioning component and a pushing mechanism 20. The positioning component includes a lifting cylinder 11 and a carrier 12 connected to the output end of the lifting cylinder 11. The carrier 12 is provided with a plurality of limiting cylinders 13. The output end of the limiting cylinder 13 is provided with a limiting plate 14. The limiting plate 14 is provided with a limiting groove 141 adapted to the substrate 202. The limiting cylinder 13 is used to drive the limiting plate 14 to move to limit the substrate 202. The lifting cylinder 11 is used to drive the substrate 202 to rise and fall to correspond to the temperature measuring element.

[0024] Specifically, the limiting groove 141 is an L-shaped groove. In this embodiment, there are two or four limiting cylinders 13. When there are two limiting cylinders 13, they are located at the two sharp corners along the diagonal of the substrate 202. When there are four limiting cylinders 13, they are located at the four sharp corners of the substrate 202. Two adjusting cylinders 15 are arranged in pairs about the central axis of the substrate 202's length direction. The adjusting cylinders 15 drive the limiting plate 14 to move, thereby adjusting the distance between the limiting plate 14 and the substrate 202, so that the position of the limiting plate 14 can adapt to substrates 202 of different sizes.

[0025] To avoid interference with the process of inserting the temperature probe 31 into the temperature measuring hole 201, two limiting cylinders 13 are respectively set on the two sides of the base plate 202 where there is no temperature measuring hole 201.

[0026] The substrate 202 is positioned by the limiting cylinder 13 and the limiting plate 14. During temperature measurement, the position of the substrate 202 is not easily changed, which facilitates the insertion of the temperature probe 31 into the temperature measuring hole 201 on the substrate 202, thereby improving the temperature measurement efficiency.

[0027] Please refer to Figure 5 The carrier 12 is also equipped with an adjusting cylinder 15. The output end of the adjusting cylinder 15 is equipped with a frame 16. The frame 16 is connected to a frame 2 17 for supporting the limiting cylinder 13. The adjusting cylinder 15 is used to drive the frame 2 17 to move the limiting plate 14.

[0028] Please refer to Figure 3 Specifically, the frame 16 is provided with a sliding groove 161, and the carrier 12 is provided with a positioning post 121. When the adjusting cylinder 15 pushes the frame 22 body 17 to move, the positioning post 121 is slidably positioned in the sliding groove 161. Through the cooperation of the positioning post 121 and the sliding groove 161, the positions of the frame 16 and the frame 27 relative to the carrier 12 are positioned, thereby further limiting the base plate 202.

[0029] Please refer to Figure 6 The pushing mechanism 20 includes a pushing cylinder 21 and a pushing frame 22 connected to the output end of the pushing cylinder 21. A temperature measuring element is placed on the pushing frame 22. The temperature measuring element includes a plug 30 and a temperature measuring probe 31 connected to the front end of the plug 30. The pushing cylinder 21 is used to drive the pushing frame 22 to drive the temperature measuring probe 31 to insert into the temperature measuring hole 201 on the substrate 202. Specifically, the temperature measuring probe 31 in this embodiment is a thermocouple probe. The temperature measuring probe 31 is electrically connected to an external PLC controller through the plug 30. The pushing frame 22 is provided with a through groove (not shown in the figure) for the wires (not shown in the figure) connecting the plug 30 and the PLC controller to pass through the through groove.

[0030] Please refer to Figure 6 and Figure 7 The pusher frame 22 is equipped with a pusher cylinder 23, and the output end of the pusher cylinder 23 is equipped with a pusher plate 231. The pusher cylinder 23 is used to drive the pusher plate 231 to push the plug 30 and move the temperature probe 31. The pusher cylinder 23 facilitates further adjustment of the position of the temperature probe 31 relative to the substrate 202.

[0031] Please refer to Figure 6 and Figure 7The push plate 231 is equipped with a limiting block 232, and the push frame 22 is equipped with an adjustment groove 221. A compression spring 222 and a limiting block 223 are located within the adjustment groove 221. The two ends of the compression spring 222 are connected to the limiting block 232 and the limiting block 223, respectively. When the push plate 231 pushes the plug 30 to move, the limiting block 232 compresses the compression spring 222. Through the arrangement of the compression spring 222 and the limiting blocks 232 and 223, when the push plate 231 pushes the plug 30 to move, the compression spring 222 is compressed, exerting a reverse elastic force on the push plate 231. This reduces the possibility of damage to the substrate 202 due to excessive force from the push plate 231.

Claims

1. A wafer temperature measuring device, characterized in that, include: The positioning component includes a lifting cylinder and a carrier connected to the output end of the lifting cylinder. The carrier is provided with a plurality of limiting cylinders. The output end of the limiting cylinder is provided with a limiting plate. The limiting plate is provided with a limiting groove adapted to the substrate. The limiting cylinder is used to drive the limiting plate to move to limit the substrate. The lifting cylinder is used to drive the substrate to rise and fall. The pushing mechanism includes a pushing cylinder and a pushing frame connected to the output end of the pushing cylinder. A temperature measuring element is placed on the pushing frame. The temperature measuring element includes a plug and a temperature measuring probe. The pushing cylinder is used to drive the pushing frame to drive the temperature measuring probe to be inserted into the temperature measuring hole on the substrate.

2. The wafer temperature measuring device according to claim 1, characterized in that: The carrier is also equipped with an adjusting cylinder. The output end of the adjusting cylinder is equipped with a frame body one. The frame body one is connected to a frame body two for supporting the limiting cylinder. The adjusting cylinder is used to drive the frame body two to move the limiting plate.

3. The wafer temperature measuring device according to claim 2, characterized in that: The first frame is provided with a sliding groove, and the carrier is provided with a positioning column. When the adjusting cylinder pushes the second frame to move, the positioning column is slidably set in the sliding groove.

4. The wafer temperature measuring device according to claim 1, characterized in that: The pusher frame is equipped with a pusher cylinder, and the output end of the pusher cylinder is equipped with a pusher plate. The pusher cylinder is used to drive the pusher plate to push the plug and move the temperature probe.

5. The wafer temperature measuring device according to claim 4, characterized in that: The push plate is provided with a limiting block one, and the push frame is provided with an adjustment groove. The adjustment groove is provided with a compression spring and a limiting block two. The two ends of the compression spring are respectively connected to the limiting block one and the limiting block two. When the push plate pushes the plug to move, the limiting block one pushes the compression spring to compress.

6. The wafer temperature measuring device according to claim 1, characterized in that: The limiting groove is an L-shaped groove.

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