A cooling device for infrared laser detection

Abstract

The utility model discloses a cooling device for infrared laser detection, including heat conduction platform, the heat conduction platform can pass through mid -wave infrared, the heat conduction platform is used to bear PCB board chip and conducts the heat energy of PCB board chip, still fixed with cooling device on the heat conduction platform, the cooling device is used for the heat conduction cooling of heat conduction platform, the cooling device includes refrigeration piece. The utility model utilizes heat conduction platform to cool down for PCB board chip, utilizes the heat conduction effect and conduction the temperature of heat conduction platform to cooling device, and the heat conduction platform is cooled down through cooling device, this makes PCB board chip and cooling device separate, can stabilize the surface temperature of PCB board chip, has provided new cooling mode and has solved the problem that PCB board chip is easily contaminated and scratched and temperature detection is not accurate in prior art because of the observation need switching cooling water pipe and PCB board chip position.

Description

Technical Field

[0001] This utility model relates to the field of detection devices, specifically a cooling device for infrared laser detection. Background Technology

[0002] PCB chip failure analysis technology is mainly limited to chip cooling methods. Existing technologies mainly achieve chip heat dissipation and cooling by directly contacting and fixing the chip with water cooling pipes or by directly immersing the chip surface with condensate. During the observation process, the observation area is switched by continuously moving the chip position. However, this technique is prone to local temperature changes in the chip, which can damage the analysis benchmark.

[0003] Since the water-cooling pipe is directly in contact with and fixed to the chip, moving the chip can easily lead to temperature observation deviations. Furthermore, the operation is cumbersome and can easily cause the chip to become contaminated or scratched. Therefore, there is an urgent need for a cooling device that can both dissipate heat efficiently and facilitate observation. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies by providing a cooling device for infrared laser detection, offering a new cooling method, and solving the problems of cumbersome operation and easy damage and contamination in existing technologies.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a cooling device for infrared laser detection, comprising a heat-conducting platform, the heat-conducting platform being able to transmit mid-wave infrared light, the heat-conducting platform being used to support PCB board chips and conduct heat energy of the PCB board chips, a cooling device being fixed on the heat-conducting platform, the cooling device being used to cool the heat-conducting platform through heat conduction, the cooling device comprising a cooling chip.

[0006] In one alternative embodiment, the cooling chip is a TEC cooling chip, and the cooling device further includes a water-cooled pipe, which is in close contact with one side of the TEC cooling chip, and the other side of the TEC cooling chip is in contact with the heat-conducting platform.

[0007] In one alternative embodiment, the cooling device further includes a bracket, which is fixedly connected to the heat-conducting platform, and the water-cooling pipe is fixed to the bracket.

[0008] In one alternative embodiment, the water-cooled pipe is a water-cooled copper pipe, the bracket is fixed to the heat-conducting platform by bolts, the water-cooled copper pipe is fixed in the bracket, and the TEC cooling chip is located above the water-cooled copper pipe.

[0009] In one alternative embodiment, at least four TEC cooling elements are provided.

[0010] In one optional embodiment, the heat-conducting platform further includes a PCB bracket disposed on the heat-conducting platform, the PCB bracket being used to fix PCB board chips; the PCB bracket is fixed to the heat-conducting platform.

[0011] In one alternative embodiment, the heat-conducting platform is a platform made of corundum.

[0012] In one alternative embodiment, the heat-conducting platform is a platform made of industrial sapphire or diamond.

[0013] In one alternative embodiment, a temperature sensor is provided on the heat-conducting platform for detecting the temperature of the heat-conducting platform.

[0014] In one alternative embodiment, the cooling device is located below the heat-conducting platform, and at least one cooling device is provided.

[0015] Compared with the prior art, this utility model provides a cooling device for infrared laser detection, which has the following beneficial effects: This invention utilizes a heat-conducting platform to cool the PCB chip. The heat from the platform is transferred to a cooling device via thermal conduction, which then cools the platform. This separation of the PCB chip from the cooling device stabilizes its surface temperature, providing a novel cooling method that solves the problems of PCB chip contamination and scratches, and inaccurate temperature detection caused by switching the cooling water pipe and PCB chip positions during observation in existing technologies. Furthermore, the heat-conducting platform's ability to transmit mid-wave infrared light enables hotspot detection and capture, a benefit not achievable in existing technologies. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the cooling device used for infrared laser detection in this utility model.

[0017] Figure 2 This is a schematic diagram of the cooling device in this utility model.

[0018] Reference numerals: 1. Cooling device; 2. PCB board chip; 3. PCB board; 4. PCB support; 5. Heat conduction platform; 6. Temperature sensor; 7. TEC cooling chip; 8. Support; 9. Water cooling pipe. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figure 1 and Figure 2 As shown, the present invention provides a cooling device for infrared laser detection, including a heat-conducting platform 5, which is used to support the PCB chip 2 and conduct the heat energy of the PCB chip 2.

[0021] In some embodiments, the heat-conducting platform 5 is a platform made of corundum, which is capable of transmitting mid-infrared light (referring to laser beams in the mid-infrared band of 3-5 micrometers, which have the characteristic of being sensitive to the thermal radiation of high-temperature targets), facilitating infrared laser detection. The corundum is α-alumina, the most stable phase of all alumina, and has good thermal conductivity. Preferably, the heat-conducting platform 5 is a platform made of industrial sapphire (mainly composed of alumina) or diamond. In other embodiments, a heat-conducting platform 5 that is capable of transmitting mid-infrared light and has thermal conductivity can also be used. The surface of the PCB chip 2 can directly contact the heat-conducting platform 5. Due to the high thermal conductivity of sapphire, it can effectively dissipate heat in high-temperature environments, and the heat generated by the PCB chip 2 is transferred to the surface of the heat-conducting platform 5, thereby achieving heat conduction.

[0022] In addition, the ingenious aspect of this utility model is that, due to the characteristic that the heat-conducting platform 5 can transmit mid-wave infrared light, the structure of which is different from that of traditional cooling devices, this utility model has the function of hot spot detection and capture. Existing devices cannot perform hot spot detection and capture, which is a beneficial effect that does not exist in the prior art.

[0023] The heat-conducting platform 5 includes a cooling device 1, which is located below the heat-conducting platform 5, and at least one cooling device 1 is provided. Figure 1 As shown, a cooling device 1 is provided on each of the two sides of the heat-conducting platform 5. In other embodiments, a cooling device 1 may be provided at each of the four corners of the heat-conducting platform 5.

[0024] The cooling device 1 is used to cool the heat-conducting platform 5, and the cooling device 1 is fixedly connected to the heat-conducting platform 5. The cooling device 1 in this invention differs from the cooling water pipes in the prior art. In this invention, the heat-conducting platform 5 is used to cool the PCB chip 2, and then the cooling device 1 is used to cool the heat-conducting platform, thus separating the PCB chip 2 from the cooling device 1. This structural approach can stabilize the surface temperature of the PCB chip 2.

[0025] The cooling device 1 includes a water-cooled pipe 9 and a TEC cooling plate 7. The water-cooled pipe 9 is in close contact with one side of the TEC cooling plate 7, and the other side of the TEC cooling plate 7 is in contact with the heat-conducting platform 5. In some embodiments, at least four TEC cooling plates 7 are provided. For example, two, three, or other non-fixed numbers are provided on each of the left and right sides of the heat-conducting platform 5.

[0026] In some embodiments, the water-cooling pipe 9 is a water-cooled copper pipe; in other embodiments, the water-cooling pipe 9 may also be a heat-conducting pipe of other materials.

[0027] As shown in the figure Figure 1 and Figure 2 As shown, the cooling device also includes a bracket 8, which is fixedly connected to the heat-conducting platform 5, and the water-cooling pipe 9 is fixed to the bracket 8. The bracket 8 is fixed to the heat-conducting platform 5 by bolts, the water-cooling pipe 9 is fixed in the bracket 8, and the TEC cooling chip 7 is located above the water-cooling pipe 9.

[0028] The heat conduction platform 5 is equipped with a temperature sensor 6, which is used to detect the temperature of the heat conduction platform 5, so as to better control the cooling device 1 to cool down the heat conduction platform 5.

[0029] For example, the TEC cooling chip 7 is controlled by a controller. The controller cools the heat conduction platform 5 based on the temperature data fed back by the temperature sensor 6, and then dissipates heat from the TEC cooling chip 7 through the water cooling pipe 9, thereby achieving the purpose of cooling the PCB board chip 2.

[0030] Furthermore, the heat conduction platform also includes a PCB bracket 4 disposed on the heat conduction platform 5. The PCB bracket 4 is used to fix the PCB board 3, the PCB board chip 2 is placed in the PCB board 3, and the PCB board chip 2 is attached to the heat conduction platform 5 to facilitate heat conduction of the PCB board chip 2.

[0031] As described above, the surface of the PCB chip 2 of this invention is in direct contact with the heat-conducting platform 5. The PCB chip 2 can be fixed to the heat-conducting platform 5 with screws and the PCB bracket 4. Four or more TEC cooling chips 7 are connected to the bottom of the heat-conducting platform 5. The water-cooling pipe 9 and the TEC cooling chips 7 are fixed to the bottom (or top) of the heat-conducting platform 5 by the bracket 8. The temperature sensor 6 is installed on the heat-conducting platform 5. The heat generated by the PCB chip 2 is transferred to the heat-conducting platform 5. The temperature data of the heat-conducting platform 5 fed back by the temperature sensor 6 can be used to control the TEC cooling chips 7 to perform cooling. The water-cooling pipe 9 then dissipates heat from the TEC cooling chips 7, thereby achieving the function of cooling the chip 2.

[0032] This invention utilizes a separate heat-conducting platform, separating the PCB chip 2 from the cooling device 1. The heat-conducting platform 5 cools the PCB chip 2, and then the cooling device 1 cools the heat-conducting platform 5, providing a new cooling and observation method. This solves the problems in existing technologies where switching the position of the cooling water pipe and the PCB chip 2 during observation leads to easy contamination and scratches on the PCB chip, as well as inaccurate temperature detection. The operation process is simplified when observing the PCB chip, eliminating the need to move the water-cooling pipe. The heat-conducting platform 5 provides effective cooling for the PCB chip, and there is no interference from the cooling water pipe during the cooling process. Furthermore, the heat-conducting platform has the characteristic of transmitting mid-wave infrared light, enabling this invention to detect and capture hotspots—a beneficial effect that cannot be achieved in existing technologies.

[0033] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A cooling device for infrared laser detection, characterized in that... It includes a heat-conducting platform that can transmit mid-wave infrared light. The heat-conducting platform is used to support PCB board chips and conduct heat energy from the PCB board chips. A cooling device is also fixed on the heat-conducting platform. The cooling device is used to cool the heat-conducting platform through heat conduction. The cooling device includes a cooling chip.

2. The cooling device for infrared laser detection according to claim 1, characterized in that... The cooling chip is a TEC cooling chip, and the cooling device also includes a water-cooled pipe. The water-cooled pipe is in close contact with one side of the TEC cooling chip, and the other side of the TEC cooling chip is in contact with the heat-conducting platform.

3. The cooling device for infrared laser detection according to claim 2, characterized in that... The cooling device also includes a bracket, which is fixedly connected to the heat-conducting platform, and the water-cooling pipe is fixed on the bracket.

4. The cooling device for infrared laser detection according to claim 3, characterized in that... The water-cooled pipe is a water-cooled copper pipe. The bracket is fixed to the heat-conducting platform by bolts. The water-cooled copper pipe is fixed in the bracket, and the TEC cooling chip is located above the water-cooled copper pipe.

5. The cooling device for infrared laser detection according to claim 2, characterized in that... The TEC cooling element is provided with at least four elements.

6. The cooling device for infrared laser detection according to claim 1, characterized in that... The heat-conducting platform also includes a PCB bracket disposed on the heat-conducting platform, the PCB bracket being used to fix the PCB board chip; the PCB bracket is fixed on the heat-conducting platform.

7. The cooling device for infrared laser detection according to claim 1, characterized in that... The heat-conducting platform is made of corundum.

8. The cooling device for infrared laser detection according to claim 7, characterized in that... The heat-conducting platform is made of industrial sapphire or diamond.

9. The cooling device for infrared laser detection according to claim 1, characterized in that... A temperature sensor is provided on the heat-conducting platform to detect the temperature of the heat-conducting platform.

10. The cooling device for infrared laser detection according to claim 1, characterized in that... The cooling device is located below the heat-conducting platform, and at least one cooling device is provided.

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