Chip liquid cooling heat dissipation system capable of preventing leakage detection

Abstract

The utility model relates to chip heat dissipation technical field discloses a chip liquid cooling heat dissipation system of anti -leakage detection. Chip liquid cooling heat dissipation system of anti -leakage detection of this includes the substrate and installs the chip on the substrate, and the liquid cooling heat dissipation board is detachably installed on the substrate, and the liquid cooling heat dissipation board includes the upper casing and lower casing of mutual sealing connection, and the cooling cavity for the cooling liquid flow is formed between the upper casing and lower casing, the top of upper casing is equipped with the water inlet and water outlet of the cooling cavity, and the circumferential edge of lower casing is equipped with the fender, and the overflow groove is formed between the upper casing and fender, and the outside of fender is equipped with at least one detection probe, and the end of detection probe is communicated with overflow groove. Through detection probe monitoring whether the overflow groove exists microdrop or liquid, and signal transmission to the backstage carries out the alarm, so that the operating personnel can repair or replace in the first time, prevent the cooling liquid to cause the damage to the chip and the periphery electronic component.

Description

Technical Field

[0001] This utility model relates to the field of chip heat dissipation technology, specifically a chip liquid cooling heat dissipation system for leak detection. Background Technology

[0002] As chip integration and power continue to increase, the heat generated during operation also increases dramatically. If heat cannot be dissipated in time, the chip temperature will rise, affecting its performance and stability. The chip heat dissipation process includes heat conduction and convection. The chip transfers the heat generated inside to the heat sink through a heat-conducting medium, and then dissipates the heat through convection and radiation.

[0003] Liquid cooling offers higher thermal conductivity and lower noise levels, and has been widely adopted. Most existing liquid cooling technologies involve encapsulating a liquid cooling plate on the chip for heat dissipation. The structure of the liquid cooling plate mainly consists of upper and lower shells welded together to form a cavity, where coolant circulates to achieve heat exchange with the chip. However, over prolonged operation, liquid cooling plates may leak at the weld joints due to material aging, corrosion, or mechanical vibration fatigue. Traditional liquid cooling plates cannot automatically detect leaks; if these leaks are not detected and repaired promptly, the leaked coolant will damage the chip and surrounding electronic components.

[0004] Therefore, there is an urgent need for a leak-proof chip liquid cooling system to solve the above problems. Utility Model Content

[0005] Based on the above, the purpose of this utility model is to provide a leak-proof liquid cooling system for chips, so as to solve the problem that leakage of liquid cooling plates in the prior art can easily damage chips and surrounding electronic components.

[0006] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0007] This utility model provides a leak-proof chip liquid cooling system, including a substrate and a chip mounted on the substrate. A liquid cooling plate is detachably mounted on the substrate, and the chip is located at the bottom of the liquid cooling plate. The liquid cooling plate includes an upper shell and a lower shell that are sealed to each other, and a cooling cavity for coolant flow is formed between the upper shell and the lower shell.

[0008] The top of the upper housing is provided with an inlet and an outlet that penetrate the cooling chamber;

[0009] The lower housing has a baffle along its circumferential edge, and an overflow groove is formed between the upper housing and the baffle. At least one detection probe is installed on the outer side of the baffle, and the end of the detection probe is connected to the overflow groove.

[0010] As an optional technical solution for a chip liquid cooling heat dissipation system for leak detection, the detection probe is provided with four probes, which are respectively installed in the middle of the four sides of the lower housing.

[0011] As an optional technical solution for a chip liquid cooling heat dissipation system for leak detection, the side of the baffle is provided with a mounting hole that penetrates the overflow groove. The mounting hole has a large hole structure near the outer side of the baffle and a small hole structure near the inner side of the baffle. The detection probe is installed in the large hole.

[0012] As an optional technical solution for a chip liquid cooling heat dissipation system for leak detection, the top of the enclosure is provided with a locking hole that passes through the large hole of the mounting hole, and the detection probe is pressed and fixed by a screw installed in the locking hole.

[0013] As an optional technical solution for a chip liquid cooling heat dissipation system for leak detection, the lower housing is provided with multiple sets of heat dissipation fins at intervals on the end face of the upper housing. Each set of heat dissipation fins consists of several heat dissipation fins, and a flow channel is formed between every two heat dissipation fins.

[0014] As an optional technical solution for a chip liquid cooling heat dissipation system for leak detection, the bottom of the upper housing is provided with multiple isolation strips, and a receiving groove for cooperating with the heat dissipation fins is formed between every two isolation strips.

[0015] As an optional technical solution for a chip liquid cooling heat dissipation system for leak detection, each set of heat dissipation fins and the lower housing are provided with a boss, and the bottom of the isolation strip is welded to the lower housing.

[0016] As an optional technical solution for a chip liquid cooling heat dissipation system for leak detection, the substrate is provided with a support frame surrounding the chip, and the support frame and the substrate are fixedly connected by screws.

[0017] As an optional technical solution for a chip liquid cooling heat dissipation system for leak prevention detection, the liquid cooling heat dissipation plate is provided with multiple through holes, which pass through the upper shell and the lower shell in sequence. The supporting frame is provided with multiple screw holes, which are located on the same axis. Screws are inserted into the through holes to fix the liquid cooling heat dissipation plate on the supporting frame.

[0018] As an optional technical solution for a chip liquid cooling heat dissipation system for leak detection, the bottom of the supporting frame and the lower housing are respectively provided with coaxial positioning holes, and positioning pins are installed in the positioning holes on the supporting frame.

[0019] The beneficial effects of this utility model are as follows:

[0020] This invention provides a leak-proof chip liquid cooling system, which includes a substrate and a chip mounted on the substrate. A liquid cooling plate is detachably mounted on the substrate, and the chip is located at the bottom of the liquid cooling plate. The liquid cooling plate includes an upper shell and a lower shell that are sealed to each other, forming a cooling cavity for coolant flow between the upper shell and the lower shell. The top of the upper shell is provided with an inlet and an outlet that penetrate the cooling cavity. The circumferential edge of the lower shell is provided with a baffle, and an overflow groove is formed between the upper shell and the baffle. At least one detection probe is installed on the outer side of the baffle, and the end of the detection probe is connected to the overflow groove.

[0021] In the above structure, by setting a baffle on the circumferential edge of the lower housing and an overflow groove formed between the baffle and the upper housing, when coolant leaks at the welded connection between the upper and lower housings, the leaked coolant will flow into the overflow groove. The baffle can block the leaked coolant. When the detection probe detects droplets or liquid in the overflow groove, it will transmit a signal to the background to issue an alarm, so that the operators can carry out maintenance or replacement as soon as possible, effectively preventing coolant from flowing onto the substrate and damaging the chip and surrounding electronic components. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure of the chip liquid cooling heat dissipation system for leak detection in this embodiment of the present invention;

[0023] Figure 2 This is an exploded view of the chip liquid cooling heat dissipation system for leak detection in an embodiment of this utility model;

[0024] Figure 3 This is a cross-sectional schematic diagram of the chip liquid cooling heat dissipation system for leak detection in an embodiment of this utility model;

[0025] Figure 4 This is a bottom view of the upper shell in an embodiment of the present invention;

[0026] Figure 5 This is a schematic diagram of the overall structure of the lower shell in an embodiment of this utility model;

[0027] Figure 6 This is a schematic diagram of the supporting frame in an embodiment of the present utility model.

[0028] In the picture:

[0029] 1. Liquid cooling heat sink; 10. Upper casing; 101. Water inlet; 102. Water outlet; 103. Isolation strip; 104. Receiving tank;

[0030] 11. Lower housing; 110. Baffle; 111. Overflow groove; 112. Heat dissipation fins; 113. Boss;

[0031] 12. Mounting hole; 120. Locking hole; 13. Detection probe; 14. Through hole; 15. Screw;

[0032] 2. Substrate; 20. Chip;

[0033] 3. Support frame; 30. Screw hole; 31. Positioning hole; 32. Positioning pin. Detailed Implementation

[0034] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0035] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0036] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0037] In the description of this embodiment, terms such as "upper," "lower," "left," and "right" are based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of description and simplification of operation, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0038] In the description of this utility model, unless otherwise stated, "a plurality of" means two or more. Furthermore, the terms "first" and "second" are used merely for descriptive distinction and have no specific meaning.

[0039] like Figure 1-6 As shown, this utility model provides a leak-proof chip liquid cooling system. The leak-proof chip liquid cooling system includes a substrate 2 and a chip 20 mounted on the substrate 2. A liquid cooling plate 1 is detachably mounted on the substrate 2. The chip 20 is located at the bottom of the liquid cooling plate 1. The liquid cooling plate 1 includes an upper shell 10 and a lower shell 11 that are sealed to each other. A cooling cavity for coolant flow is formed between the upper shell 10 and the lower shell 11. The top of the upper shell 10 is provided with an inlet 101 and an outlet 102 that penetrate the cooling cavity. A baffle 110 is provided on the circumferential edge of the lower shell 11. An overflow groove 111 is formed between the upper shell 10 and the baffle 110. At least one detection probe 13 is mounted on the outer side of the baffle. The end of the detection probe 13 is connected to the overflow groove 111.

[0040] This utility model provides a chip liquid cooling heat dissipation system with leak detection. By setting a baffle 110 on the circumferential edge of the lower housing 11 and an overflow groove 111 formed between the baffle 110 and the upper housing 10, when coolant leaks at the welded connection between the upper housing 10 and the lower housing 11, the leaked coolant will flow into the overflow groove 111. The baffle 110 can block the leaked coolant. When the detection probe 13 detects the presence of droplets or liquid in the overflow groove 111, it will transmit a signal to the background to issue an alarm, so that the operators can carry out maintenance or replacement in time, effectively preventing coolant from flowing onto the substrate 2 and damaging the chip 20 and surrounding electronic components.

[0041] Specifically, such as Figures 1 to 3As shown, the area of ​​the lower housing 11 is larger than that of the upper housing 10. After the upper housing 10 and the lower housing 11 are welded and sealed together, a retaining wall surrounds the periphery of the upper housing 10 and forms an overflow groove 111 between them. Furthermore, the bottom of the overflow groove 111 is set lower, that is, the bottom of the overflow groove 111 is lower than the upper end face of the lower housing 11. This makes the depth of the overflow groove 111 further increased, which can hold more coolant and further improve the detection effect of the detection probe, enabling the detection probe to accurately detect whether there is leakage in the overflow groove 111. When there are micro-droplets of liquid or a mirror-like phenomenon caused by the coolant in the overflow tank 111, the detection probe will trigger a signal to the background to issue an alarm, reminding the operator that there is a coolant leak in the liquid cooling heat sink 1, preventing the coolant from leaking continuously and overflowing onto the substrate 2, which could damage the chip 20 and surrounding electronic components. On the other hand, the operator can also regularly check whether there is a coolant leak in the liquid cooling heat sink 111 by visually inspecting whether there is a leak in the coolant, further improving the protection of the chip 20 and surrounding electronic components.

[0042] Furthermore, four detection probes 13 are provided, and the four detection probes 13 are respectively installed in the middle of the four sides of the lower housing 11. That is, every two detection probes 13 are set opposite each other in the middle of two different sides. With this structure, when a small amount of coolant leaks into the overflow groove 111, no matter which direction the coolant flows into the overflow groove 111, the detection probe 13 can detect the risk of leakage, instead of waiting for the coolant to fill the overflow groove 111 on all sides before monitoring can be carried out.

[0043] Specifically, such as Figure 5As shown, the side of the baffle has a mounting hole 12 that penetrates the overflow groove 111. The mounting hole 12 has a large hole structure near the outer side of the baffle and a small hole structure near the inner side of the baffle. The detection probe 13 is installed in the large hole, and its end is connected to the overflow groove 111 through the small hole. The top of the baffle has a locking hole 120 that penetrates the large hole of the mounting hole 12. By setting a screw 15 in the locking hole 120, the detection probe 13 can be pressed and fixed. This structure facilitates the installation and removal of the detection probe 13. When installing the detection probe 13, the end of the detection probe 13 is inserted into the mounting hole 12. Since the mounting hole 12 is located in the baffle, the detection probe 13 is installed in the large hole of the baffle. The inner side of the enclosure has a small hole structure. Therefore, a retaining ring will be formed at the inclined section between the large hole and the small hole of the mounting hole 12. When the detection probe 13 is inserted into the mounting hole 12, the retaining ring can limit the maximum stroke of the detection probe 13. The detection probe 13 can be accurately pre-installed by simply inserting it all the way in. Then, the screw 15 is tightened from the locking hole 120 downwards. The free end of the screw 15 will press against the detection probe 13, so that the detection probe 13 can be fixed in the mounting hole 12 to complete the installation. When it is necessary to remove the detection probe 13, simply loosen the screw 15 to remove the detection probe 13. The installation and removal work is very simple and convenient.

[0044] Furthermore, multiple sets of heat dissipation fins 112 are spaced apart on the end face of the lower housing 11 near the upper housing 10. Each set of heat dissipation fins 112 consists of several heat dissipation fins 112, and a flow channel is formed between every two heat dissipation fins 112. The two ends of the flow channel between the heat dissipation fins 112 are respectively oriented towards the inlet 101 and the outlet 102. Thus, a linear coolant flow channel is formed between the inlet 101, the flow channel, and the outlet 102, reducing its resistance and improving the heat exchange efficiency of the coolant to the heat dissipation fins 112. The arrangement of the heat dissipation fins 112 allows the heat transferred from the chip 20 to the bottom of the lower housing 11 to be further rapidly diffused, improving the heat dissipation effect on the chip 20.

[0045] Furthermore, such as Figure 4 and Figure 5As shown, each set of heat dissipation fins 112 and the lower housing 11 are provided with a boss 113, that is, the heat dissipation fins 112 are set on the upper end face of the boss 113. The bottom of the upper housing 10 is provided with multiple isolation strips 103. Between every two isolation strips 103, a receiving groove 104 is formed for accommodating the heat dissipation fins 112. One end of the isolation strip 103 is a closed connection end with the enclosure of the upper housing 10, and the other end is an open end with a certain distance between it and the enclosure of the upper housing 10. The closed ends and open ends of the multiple isolation strips 103 and the enclosure of the upper housing 10 are staggered. Therefore, when the upper housing 10 and the lower housing 11 are closed and sealed, each set of heat dissipation fins 112 will be placed... Within the corresponding receiving groove 104, the contact surfaces of the isolation strip 103 and the lower housing 11 are welded together, specifically by brazing. This creates a curved channel between the multiple heat dissipation fins 112. To improve the heat exchange efficiency of the chip 20, the two ends of one of the isolation strips 103 can be closed and connected to the enclosure of the upper housing 10. Two sets of water inlets 101 and two sets of water outlets 102 are provided on the upper end face of the upper housing 10. This divides the cooling cavity between the upper housing 10 and the lower housing 11 into two independent liquid cooling channels, shortening the flow distance and residence time of the coolant in the cooling cavity, and further improving the heat exchange efficiency of the chip 20.

[0046] In this embodiment, as Figure 2 and Figure 6 As shown, a supporting frame 3 surrounds the chip 20 on the substrate 2. The liquid cooling heat sink 1 is mounted on the supporting frame 3, and the bottom surface of the lower housing 11 abuts against the end face of the chip 20 for heat exchange. To facilitate the later maintenance and replacement of the liquid cooling heat sink 1, the liquid cooling heat sink 1, the supporting frame 3, and the substrate 2 are detachably connected by a threaded locking method. Specifically, the liquid cooling heat sink 1 has multiple through holes 14, which pass through the upper housing 10 and the lower housing 11 in sequence. The supporting frame 3 has multiple screw holes 30, and the through holes 14 and screw holes 30 are located on the same... A screw 15 is inserted through the through hole 14 to fix the liquid cooling heat sink 1 to the support frame 3. The support frame 3 is also provided with multiple through holes 14. The support frame 3 is fixed to the base plate 2 by screws through the through holes 14. Under the above structure, the liquid cooling heat sink 1, the support frame 3 and the base plate 2 form a detachable fixed installation connection. When the liquid cooling heat sink 1 has a problem of coolant leakage, it is convenient for operators to disassemble, repair and replace it, reducing the disassembly time of the liquid cooling heat sink 1 and further preventing the leaked coolant from overflowing to the base plate 2.

[0047] Specifically, the end of the through hole 14 on the support frame 3 is provided with a countersunk hole. The diameter or shape of the countersunk hole matches the diameter or shape of the nut on the screw installed in the through hole 14, so that after the screw is tightened, the nut can be placed in the countersunk hole, and the top of the nut is flush with or lower than the end face of the support frame 3, so that the bottom surface of the lower housing 11 can be completely attached to the end face of the support frame 3, ensuring the installation accuracy between the liquid cooling heat sink 1 and the support frame 3.

[0048] Furthermore, such as Figure 6 As shown, the bottom of the supporting frame 3 and the lower housing 11 are respectively provided with coaxial positioning holes 31. The positioning holes 31 on the supporting frame 3 are aligned with the screw holes 30 on the same straight line, and a positioning pin 32 is installed in the positioning hole 31. The upper part of the positioning pin 32 extends outward. When the liquid cooling heat sink 1 is installed with the supporting frame 3, the positioning pin 32 can be inserted into the positioning hole 31 of the lower housing 11 to complete the pre-positioning installation between the liquid cooling heat sink 1 and the supporting frame 3. In particular, the through hole 14 on the liquid cooling heat sink 1 can be accurately aligned with the screw hole 30 on the supporting frame 3, which improves the installation efficiency of the liquid cooling heat sink 1.

[0049] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some changes or modifications to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes, and modifications made to the above embodiments based on the present utility model without departing from the scope of the present utility model shall fall within the scope of the present utility model.

Claims

1. A leak-proof chip liquid cooling system, comprising a substrate and a chip mounted on the substrate, wherein a liquid cooling plate is detachably mounted on the substrate, and the chip is located at the bottom of the liquid cooling plate, characterized in that, The liquid cooling heat sink includes an upper shell and a lower shell that are sealed to each other, and a cooling cavity for the flow of coolant is formed between the upper shell and the lower shell; The top of the upper housing is provided with an inlet and an outlet that penetrate the cooling chamber; The lower housing has a baffle along its circumferential edge, and an overflow groove is formed between the upper housing and the baffle. At least one detection probe is installed on the outer side of the baffle, and the end of the detection probe is connected to the overflow groove.

2. The chip liquid cooling heat dissipation system for leak detection according to claim 1, characterized in that, The detection probe is provided in four parts, and the four detection probes are respectively installed in the middle of the four sides of the lower housing.

3. The chip liquid cooling heat dissipation system for leak detection according to claim 2, characterized in that, The side of the baffle is provided with a mounting hole that passes through the overflow groove. The mounting hole has a large hole structure near the outer side of the baffle and a small hole structure near the inner side of the baffle. The detection probe is installed in the large hole.

4. The chip liquid cooling heat dissipation system for leak detection according to claim 3, characterized in that, The top of the enclosure is provided with a locking hole that passes through the large hole of the mounting hole. The detection probe is pressed and fixed by a screw installed in the locking hole.

5. A chip liquid cooling heat dissipation system for leak detection according to claim 4, characterized in that, The lower housing has multiple sets of heat dissipation fins spaced apart on the end face of the upper housing. Each set of heat dissipation fins consists of several heat dissipation fins, and a flow channel is formed between every two heat dissipation fins.

6. The chip liquid cooling heat dissipation system for leak detection according to claim 5, characterized in that, The bottom of the upper housing is provided with multiple isolation strips, and a receiving groove for accommodating the heat dissipation fins is formed between every two isolation strips.

7. A chip liquid cooling heat dissipation system for leak detection according to claim 6, characterized in that, Each set of heat dissipation fins and the lower housing are provided with a boss, and the bottom of the isolation strip is welded to the lower housing.

8. The chip liquid cooling heat dissipation system for leak detection according to claim 7, characterized in that, The substrate has a supporting frame surrounding the chip, and the supporting frame and the substrate are fixedly connected by screws.

9. A chip liquid cooling heat dissipation system for leak detection according to claim 8, characterized in that, The liquid cooling heat sink plate is provided with multiple through holes, which pass through the upper shell and the lower shell in sequence. The supporting frame is provided with multiple screw holes, which are located on the same axis. Screws are inserted through the through holes to fix the liquid cooling heat sink plate on the supporting frame.

10. A chip liquid cooling heat dissipation system for leak detection according to claim 9, characterized in that, The bottom of the supporting frame and the lower housing are respectively provided with coaxial positioning holes, and positioning pins are installed in the positioning holes on the supporting frame.

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