A multi-channel tin ball placement device

Abstract

The utility model discloses a kind of multi-channel tin ball ball-planting device, for solving the technical problem of low ball-planting efficiency of existing tin ball ball-planting device. The inlet end of the plurality of feeding channels of the utility model is communicated with feeding channel, the outlet end of the plurality of feeding channels is communicated with the plurality of discharge channels respectively one by one;The first position of the plurality of first control air passages and the plurality of feeding channels are communicated respectively one by one, the outlet end of the plurality of feeding channels and the plurality of second control air passages are communicated respectively one by one;The plurality of second control air passages are communicated with vacuum channel and ventilation channel, and multiple second control valves are used for controlling the on-off of the plurality of second control air passages and vacuum channel and ventilation channel respectively;The plurality of first control air passages are communicated with vacuum channel and ventilation channel, and multiple first control valves are used for controlling the on-off of the plurality of first control air passages and vacuum channel and ventilation channel respectively.

Description

Technical Field

[0001] This utility model relates to the field of solder ball planting technology, and in particular to a multi-channel solder ball planting device. Background Technology

[0002] Ball Grid Array (BGA) is a surface mount technology for integrated circuits, typically used to permanently mount chips such as microprocessors. Currently, the BGA process utilizes equipment such as solder ball placement devices and reflow ovens. First, the BGA chip is fixed onto the fixture of the solder ball placement device. Then, a layer of solder paste is applied to the chip surface to fix the solder balls during the placement process and to act as a flux during soldering. Next, the solder ball placement device implants the solder balls one by one into the corresponding positions on the chip substrate. Finally, the BGA chip with solder balls is removed and placed into a reflow oven for high-temperature soldering.

[0003] Existing solder ball placement devices can only place a single solder ball onto a designated location on a chip substrate or other electronic component at a time. When the electronic component needs to be placed at multiple designated locations, the solder ball placement device needs to repeat the operation multiple times, which seriously affects the placement efficiency.

[0004] Therefore, finding a technical solution that can solve the above-mentioned technical problems has become an important research topic for those skilled in the art. Utility Model Content

[0005] This utility model discloses a multi-channel solder ball planting device to solve the technical problem of low ball planting efficiency in existing solder ball planting devices.

[0006] This utility model provides a multi-channel solder ball placement device, including a feeding assembly, an upper base and a lower base, wherein a connecting plate is provided between the upper base and the lower base;

[0007] The upper base is provided with a feeding channel, a vacuum channel, and a ventilation channel;

[0008] The lower base is provided with nozzles for multiple discharge ports and multiple discharge channels that are connected to each of the multiple discharge ports.

[0009] The connecting plate is provided with multiple feeding channels, multiple first control air channels and multiple second control air channels. The feeding end of each of the multiple feeding channels is connected to the feeding channel, and the discharging end of each of the multiple feeding channels is connected to the discharging channel.

[0010] Each of the first control air passages is connected to a first position of each of the multiple feeding channels, wherein the first position is close to the discharge end of the feeding channel; each of the second control air passages is connected to the discharge end of each of the multiple feeding channels.

[0011] The feeding assembly is used to drive the solder balls in the feeding channel to move toward the discharge end of the feeding channel;

[0012] The upper base is provided with a plurality of first control valves and a plurality of second control valves;

[0013] Multiple second control air channels are connected to the vacuum channel and the ventilation channel, and multiple second control valves are respectively used to control the connection and disconnection between the multiple second control air channels and the vacuum channel, and to control the connection and disconnection between the multiple second control air channels and the ventilation channel.

[0014] Multiple first control air channels are connected to the vacuum channel and the ventilation channel, and multiple first control valves are used to control the connection and disconnection between the multiple first control air channels and the vacuum channel, and to control the connection and disconnection between the multiple first control air channels and the ventilation channel.

[0015] Optionally, the feeding assembly includes a third control valve and multiple air blowing channels;

[0016] Multiple air blowing channels are disposed on the connecting plate and are connected to the feeding ends of multiple feeding channels one by one. All multiple air blowing channels are connected to the ventilation channel. The third control valve is disposed on the upper base and is used to control the connection and disconnection between the ventilation channel and the multiple air blowing channels.

[0017] Optionally, it also includes a barometric pressure detection component;

[0018] The air pressure detection component includes a detection channel and an air pressure sensor;

[0019] The detection channel is located on the upper base, with one end of the detection channel connected to the discharge end of the feeding channel and the other end of the detection channel connected to the air pressure sensor.

[0020] Optionally, the feeding channel is provided with an optical channel;

[0021] The axis of the optical channel is perpendicular to the axis of the feed channel;

[0022] A first photoelectric sensor is provided at one end of the optical channel, and a second photoelectric sensor is provided at the other end of the optical channel. The light emitted by the first photoelectric sensor can pass through the optical channel and be received by the second photoelectric sensor.

[0023] Optionally, the connecting plate is recessed inward to form a ball storage trough, the ball storage trough is correspondingly arranged with the discharge end of the feeding channel, and the feeding ends of the multiple feeding channels are located inside the ball storage trough.

[0024] Optionally, the upper base is provided with multiple first connecting air passages and multiple second connecting air passages;

[0025] The second ends of the multiple first connecting air channels are connected to the multiple first control air channels one by one. The first ends of the multiple first connecting air channels are connected to the vacuum channel and the ventilation channel. Furthermore, the first control valve is used to control the connection and disconnection between the vacuum channel and the first connecting air channels and to control the connection and disconnection between the ventilation channel and the first connecting air channels.

[0026] The second ends of the multiple second connecting air passages are connected to the multiple second control air passages one by one. The second ends of the multiple second connecting air passages are connected to the vacuum passage and the ventilation passage. The second control valve is used to control the connection and disconnection between the vacuum passage and the second connecting air passage and to control the connection and disconnection between the ventilation passage and the second connecting air passage.

[0027] Optionally, the width of the first control air passage gradually narrows towards the discharge end of the feeding channel;

[0028] The width of the second control air passage gradually narrows towards the discharge end of the feeding channel.

[0029] Optionally, the nozzle has multiple injection channels inside, the first end of each injection channel is connected to a plurality of discharge channels, and the second end of each injection channel passes through the nozzle to form a plurality of discharge ports.

[0030] Optionally, the feed end of the feed channel is exposed on the upper base to form a feed inlet.

[0031] Optionally, the number of the first control valve, the second control valve, the feeding channel, the first control air passage, the second control air passage, the discharge channel, and the discharge port are all the same.

[0032] Compared with the prior art, the present invention has the following beneficial effects:

[0033] In the multi-channel solder ball loading device of this utility model, the solder balls enter the feeding end of the feeding channel through the feeding channel. The feeding component drives multiple solder balls to move along multiple feeding channels respectively. By controlling the first control valve and the second control valve, the vacuum and nitrogen switching of the first control air channel and the second control air channel are completed. When solder ball placement begins, both the first and second control valves are de-energized. Both the first and second control air channels are connected to the vacuum channel. Taking a single channel as an example, the first solder ball is vacuum-adsorbed at the first position of the feeding channel. Then, the first control valve is energized, and the first control air channel is connected to the ventilation channel. Nitrogen gas is blown out of the first control air channel to blow the solder ball to the discharge end of the feeding channel. The solder ball is vacuum-adsorbed at the discharge end. Then, the first control valve is de-energized, and the first control air channel is connected to the vacuum channel again. At this time, the second solder ball is vacuum-adsorbed at the first position. Next, the second control valve is energized, and the second control air channel is connected to the ventilation channel. Nitrogen gas is blown out of the second control air channel to blow the first solder ball to the discharge channel, and then it is ejected from the nozzle to the designated position of the electronic component. The above cycle is performed simultaneously in multiple channels, and multiple solder balls can be synchronously ejected from the nozzle to multiple designated positions of the electronic component, thereby completing the solder ball placement process.

[0034] In the above design, multiple solder balls can be continuously and orderly ejected from the nozzle to multiple designated positions of the electronic component, greatly improving the solder ball placement efficiency. Attached Figure Description

[0035] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0036] Figure 1 This is a schematic diagram of the structure of a multi-channel solder ball planting device provided by this utility model;

[0037] Figure 2 A schematic diagram of the bottom structure of the upper base of a multi-channel solder ball planting device provided by this utility model;

[0038] Figure 3 A schematic diagram of the connecting plate of a multi-channel solder ball planting device provided by this utility model;

[0039] Figure 4 A structural perspective view of the connecting plate of a multi-channel solder ball planting device provided by this utility model;

[0040] Figure 5A schematic diagram of the top structure of the lower base of a multi-channel solder ball planting device provided by this utility model;

[0041] Figure 6 A schematic diagram of the bottom structure of the lower base of a multi-channel solder ball planting device provided by this utility model;

[0042] Illustration: Upper base 1; Connecting plate 2; Lower base 3; Nozzle 4; Discharge port 401; First control valve 5; Second control valve 6; Feeding channel 7; Feed port 701; Vacuum connector 8; Nitrogen connector 9; Third control valve 10; First photoelectric sensor 11; Second photoelectric sensor 12; First connecting air channel 13; Second connecting air channel 14; Ball storage tank 15; Air blowing channel 16; Feeding channel 17; Feeding end of feeding channel 17a; First position of feeding channel 17b; First control air channel 18; Second control air channel 19; Discharge channel 20. Detailed Implementation

[0043] This utility model discloses a multi-channel solder ball planting device to solve the technical problem of low ball planting efficiency in existing solder ball planting devices.

[0044] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0045] Please see Figures 1 to 6 The present invention provides a multi-channel solder ball placement device, including a feeding assembly, an upper base 1 and a lower base 3, wherein a connecting plate 2 is provided between the upper base 1 and the lower base 3;

[0046] The upper base 1 is provided with a feeding channel 7, a vacuum channel, and a ventilation channel;

[0047] The lower base 3 is provided with nozzles 4 of multiple discharge ports 401 and multiple discharge channels 20 that are connected to each of the multiple discharge ports 401.

[0048] The connecting plate 2 is provided with multiple feeding channels 17, multiple first control air channels 18 and multiple second control air channels 19. The feeding end of each of the multiple feeding channels 17 is connected to the feeding channel 7, and the discharging end of each of the multiple feeding channels 17 is connected to each of the multiple discharging channels 20.

[0049] Multiple first control air passages 18 are connected to first positions of multiple feeding channels 17, wherein the first positions are close to the discharge end of the feeding channel 17; multiple second control air passages 19 are connected to the discharge ends of multiple feeding channels 17, respectively.

[0050] The feeding assembly is used to drive the solder balls in the feeding channel 17 to move toward the discharge end of the feeding channel 17;

[0051] The upper base 1 is provided with a plurality of first control valves 5 and a plurality of second control valves 6;

[0052] Multiple second control air passages 19 are connected to the vacuum passage and the ventilation passage, and multiple second control valves 6 are respectively used to control the connection and disconnection between the multiple second control air passages 19 and the vacuum passage, and to control the connection and disconnection between the multiple second control air passages 19 and the ventilation passage.

[0053] Multiple first control air channels 18 are connected to the vacuum channel and the ventilation channel, and multiple first control valves 5 are respectively used to control the connection and disconnection between the multiple first control air channels 18 and the vacuum channel and to control the connection and disconnection between the multiple first control air channels 18 and the ventilation channel.

[0054] It should be noted that in this embodiment, the number of the first control valve 5, the second control valve 6, the feeding channel 17, the first control air channel 18, the second control air channel 19, the discharge channel 20, and the discharge port 401 are all the same. Furthermore, this embodiment does not limit the number of the above-mentioned parts, and designers can select an appropriate number according to actual needs.

[0055] In addition, the aforementioned vacuum channel is connected to a vacuum connector 8 for connection to a vacuum generator, and the aforementioned ventilation channel is connected to a nitrogen connector 9 for connection to a nitrogen source.

[0056] In the multi-channel solder ball loading device of this embodiment, the solder balls enter the feeding end of the feeding channel 17 through the feeding channel 7. The feeding component drives multiple solder balls to move along multiple feeding channels 17 respectively. By controlling the first control valve 5 and the second control valve 6, the vacuum and nitrogen switching of the first control air channel 18 and the second control air channel 19 are completed. When the solder ball placement begins, both the first control valve 5 and the second control valve 6 are de-energized. Both the first control air passage 18 and the second control air passage 19 are connected to the vacuum passage. Taking a single channel as an example, the first solder ball is vacuum-adsorbed at the first position of the feeding channel 17. Then, the first control valve 5 is energized, and the first control air passage 18 is connected to the ventilation passage. The first control air passage 18 blows out nitrogen gas to blow the solder ball to the discharge end of the feeding channel 17. The solder ball is vacuum-adsorbed at the discharge end. Then, the first control valve 5 is de-energized, and the first control air passage 18 is connected to the vacuum passage again. At this time, the second solder ball is vacuum-adsorbed at the first position. Then, the second control valve 6 is energized, and the second control air passage 19 is connected to the ventilation passage. The second control air passage 19 blows out nitrogen gas to blow the first solder ball to the discharge channel 20, and then it is sprayed from the nozzle 4 to the designated position of the electronic component. The above cycle is performed simultaneously in multiple channels, and multiple solder balls can be synchronously sprayed from the nozzle 4 to multiple designated positions of the electronic component, thereby completing the solder ball placement process.

[0057] In the above design, multiple solder balls can be continuously and orderly ejected from nozzle 4 to multiple designated positions of electronic components, greatly improving the efficiency of solder ball placement.

[0058] Furthermore, the feeding assembly in this embodiment includes a third control valve 10 and multiple air blowing channels 16;

[0059] Multiple air blowing channels 16 are disposed on the connecting plate 2 and are connected to the feeding ends of multiple feeding channels 17 respectively. All multiple air blowing channels 16 are connected to the ventilation channel. The third control valve 10 is disposed on the upper base 1 and is used to control the connection and disconnection between the ventilation channel and the multiple air blowing channels 16.

[0060] It should be noted that, through the above design, the solder balls enter the feeding end of multiple feeding channels 17 through the feeding channel 7. The third control valve 10 is energized to connect the ventilation channel with multiple air blowing channels 16. The air blowing channels 16 blow out nitrogen gas to drive the solder balls on the multiple feeding channels 17 to move simultaneously toward the discharge end of the feeding channels 17.

[0061] Furthermore, the multi-channel solder ball planting device in this embodiment also includes a gas pressure detection component;

[0062] The air pressure detection component includes a detection channel and an air pressure sensor;

[0063] The detection channel is located on the upper base 1, and one end of the detection channel is connected to the discharge end of the feeding channel 17, while the other end of the detection channel is connected to the air pressure sensor.

[0064] With the above design, production personnel can use the air pressure value fed back by the air pressure sensor to determine whether the solder balls are vacuum-adsorbed at the discharge end of the feeding channel 17, thereby detecting whether the solder ball placement device is in normal working condition.

[0065] Furthermore, in this embodiment, the feeding channel 7 is provided with an optical channel;

[0066] The axis of the optical channel is perpendicular to the axis of the feed channel 7;

[0067] A first photoelectric sensor 11 is provided at one end of the optical channel, and a second photoelectric sensor 12 is provided at the other end of the optical channel. The light emitted by the first photoelectric sensor 11 can pass through the optical channel and be received by the second photoelectric sensor 12.

[0068] It should be noted that, through the above design, when there is a certain number of solder balls in the feeding channel 7, the solder balls will block the light channel, so that the light emitted by the first photoelectric sensor 11 cannot be received by the second photoelectric sensor 12, thereby allowing the production personnel to know that the number of solder balls in the feeding channel 7 is at a normal level.

[0069] When the number of solder balls in the feeding channel 7 is insufficient, the light channel is not blocked by the solder balls. At this time, the light emitted by the first photoelectric sensor 11 can be received by the second photoelectric sensor 12, so that the production personnel know that the number of solder balls in the feeding channel 7 is insufficient, and then notify the production personnel to add solder balls to the feeding channel 7 in time.

[0070] Furthermore, in this embodiment, the connecting plate 2 is recessed to form a ball storage trough 15, which is correspondingly arranged with the discharge end of the feeding channel 7, and the feeding ends of the multiple feeding channels 17 are located inside the ball storage trough 15.

[0071] It should be noted that, through the above design, multiple solder balls falling from the feeding channel 7 are first stored in the ball storage tank 15, and then driven by the feeding component, the multiple solder balls enter multiple feeding channels 17 from the ball storage tank 15 respectively.

[0072] Furthermore, in this embodiment, the upper base 1 is provided with multiple first connecting air passages 13 and multiple second connecting air passages 14;

[0073] The second ends of multiple first connecting air channels 13 are connected to multiple first control air channels 18 one by one. The first ends of multiple first connecting air channels 13 are connected to the vacuum channel and the ventilation channel. Furthermore, the first control valve 5 is used to control the opening and closing of the vacuum channel and the first connecting air channel 13 and to control the opening and closing of the ventilation channel and the first connecting air channel 13.

[0074] The second ends of multiple second connecting air passages 14 are connected to multiple second control air passages 19 one by one. The second ends of multiple second connecting air passages 14 are connected to the vacuum passage and the ventilation passage. The second control valve 6 is used to control the opening and closing of the vacuum passage and the second connecting air passage 14 and to control the opening and closing of the ventilation passage and the second connecting air passage 14.

[0075] It should be noted that, through the above design, when the first control valve 5 is de-energized, the vacuum channel is connected to multiple first connecting gas channels 13 through multiple first control valves 5 to achieve connection with multiple first control gas channels 18.

[0076] When the first control valve 5 is energized, the ventilation channel is connected to multiple first control air passages 18 through multiple first control valves 55 to achieve connection with multiple first control air passages 18.

[0077] In addition, when the second control valve 6 is de-energized, the vacuum channel is connected to multiple second connecting gas channels 14 through multiple second control valves 6 to achieve connection with multiple second control gas channels 19;

[0078] When the second control valve 6 is energized, the ventilation channel is connected to multiple second control air passages 19 through multiple second control valves 6 to achieve connection with multiple second control air passages 19.

[0079] Furthermore, in this embodiment, the width of the first control air passage 18 gradually narrows towards the discharge end of the feeding channel 17;

[0080] The width of the second control air passage 19 gradually narrows towards the discharge end of the feeding passage 17.

[0081] It should be noted that the above design can ensure the vacuum strength and air blowing strength at the first position of the feeding channel 17 and at the discharge end.

[0082] Furthermore, in this embodiment, the nozzle 4 has multiple injection channels inside, the first end of each injection channel is connected to the multiple discharge channels 20, and the second end of each injection channel penetrates the nozzle 4 to form multiple discharge ports 401.

[0083] It should be noted that the above design ensures that nozzle 4 can output multiple solder balls simultaneously to meet the solder ball placement requirements of multiple designated positions of electronic components.

[0084] Furthermore, in this embodiment, the feed end of the feed channel 7 is exposed outside the upper base 1 to form a feed inlet 701.

[0085] It should be noted that, in order to prevent dust and other impurities from entering the device, the aforementioned feed inlet 701 can be fitted with a sealing cover.

[0086] Furthermore, in this embodiment, the width of the feeding channel 17 is matched with the diameter of the solder ball to ensure that each position of the feeding channel 17 can only accommodate one solder ball, thereby ensuring that the solder balls will not accumulate and block, and thus ensuring the orderly ejection of the solder balls.

[0087] Furthermore, for the purpose of facilitating automated control, the first control valve 5, the second control valve 6, and the third control valve 10 in this embodiment can be selected as solenoid valves.

[0088] The above provides a detailed description of a multi-channel solder ball planting device provided by this utility model. For those skilled in the art, based on the ideas of the embodiments of this utility model, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A multi-channel solder ball mounting device, characterized in that, It includes a feeding assembly, an upper base (1) and a lower base (3), wherein a connecting plate (2) is provided between the upper base (1) and the lower base (3). The upper base (1) is provided with a feeding channel (7), a vacuum channel, and a ventilation channel; The lower base (3) is provided with a nozzle (4) with multiple discharge ports (401) and multiple discharge channels (20) that are connected to the multiple discharge ports (401) one by one. The connecting plate (2) is provided with multiple feeding channels (17), multiple first control air channels (18) and multiple second control air channels (19). The feeding end of each of the multiple feeding channels (17) is connected to the feeding channel (7), and the discharging end of each of the multiple feeding channels (17) is connected to the discharging channel (20) one by one. Multiple first control air passages (18) are connected to the first positions of multiple feeding channels (17) one by one, wherein the first positions are close to the discharge end of the feeding channel (17); multiple second control air passages (19) are connected to the discharge ends of multiple feeding channels (17) one by one. The feeding assembly is used to drive the solder balls in the feeding channel (17) to move toward the discharge end of the feeding channel (17); The upper base (1) is provided with a plurality of first control valves (5) and a plurality of second control valves (6); Multiple second control air passages (19) are connected to the vacuum passage and the ventilation passage, and multiple second control valves (6) are used to control the connection and disconnection between the multiple second control air passages (19) and the vacuum passage, and to control the connection and disconnection between the multiple second control air passages (19) and the ventilation passage; Multiple first control air channels (18) are connected to the vacuum channel and the ventilation channel. Multiple first control valves (5) are used to control the connection and disconnection between the multiple first control air channels (18) and the vacuum channel and to control the connection and disconnection between the multiple first control air channels (18) and the ventilation channel.

2. The multi-channel solder ball mounting device according to claim 1, characterized in that, The feeding assembly includes a third control valve (10) and multiple air blowing channels (16); Multiple air blowing channels (16) are provided on the connecting plate (2) and are connected to the feed ends of multiple feeding channels (17) respectively. Multiple air blowing channels (16) are all connected to the ventilation channel. The third control valve (10) is provided on the upper base (1) and the third control valve (10) is used to control the opening and closing of the ventilation channel and the multiple air blowing channels (16).

3. The multi-channel solder ball mounting device according to claim 1, characterized in that, It also includes a barometric pressure detection component; The air pressure detection component includes a detection channel and an air pressure sensor; The detection channel is located on the upper base (1), and one end of the detection channel is connected to the discharge end of the feeding channel (17), while the other end of the detection channel is connected to the air pressure sensor.

4. The multi-channel solder ball mounting device according to claim 1, characterized in that, The feeding channel (7) is equipped with a light channel; The axis of the optical channel is perpendicular to the axis of the feed channel (7); A first photoelectric sensor (11) is provided at one end of the optical channel, and a second photoelectric sensor (12) is provided at the other end of the optical channel. The light emitted by the first photoelectric sensor (11) can pass through the optical channel and be received by the second photoelectric sensor (12).

5. The multi-channel solder ball mounting device according to claim 1, characterized in that, The connecting plate (2) is recessed inward to form a ball storage trough (15). The ball storage trough (15) is correspondingly set with the discharge end of the feeding channel (7). The feeding ends of the multiple feeding channels (17) are located inside the ball storage trough (15).

6. The multi-channel solder ball mounting device according to claim 1, characterized in that, The upper base (1) is provided with multiple first connecting air passages (13) and multiple second connecting air passages (14); The second ends of the multiple first connecting air channels (13) are connected to the multiple first control air channels (18) one by one. The first ends of the multiple first connecting air channels (13) are connected to the vacuum channel and the ventilation channel. The first control valve (5) is used to control the opening and closing of the vacuum channel and the first connecting air channel (13) and to control the opening and closing of the ventilation channel and the first connecting air channel (13). The second ends of the multiple second connecting air passages (14) are connected to the multiple second control air passages (19) one by one. The second ends of the multiple second connecting air passages (14) are connected to the vacuum passage and the ventilation passage. The second control valve (6) is used to control the opening and closing of the vacuum passage and the second connecting air passage (14) and to control the opening and closing of the ventilation passage and the second connecting air passage (14).

7. The multi-channel solder ball mounting device according to claim 1, characterized in that, The width of the first control air passage (18) gradually narrows towards the discharge end of the feeding passage (17); The width of the second control air passage (19) gradually narrows towards the discharge end of the feeding passage (17).

8. The multi-channel solder ball mounting device according to claim 1, characterized in that, The nozzle (4) has multiple injection channels inside. The first end of each injection channel is connected to the discharge channel (20) one by one. The second end of each injection channel passes through the nozzle (4) to form multiple discharge ports (401).

9. The multi-channel solder ball mounting device according to claim 1, characterized in that, The feed end of the feed channel (7) is exposed on the upper base (1) to form a feed inlet (701).

10. The multi-channel solder ball mounting device according to claim 1, characterized in that, The number of the first control valve (5), the second control valve (6), the feeding channel (17), the first control air channel (18), the second control air channel (19), the discharge channel (20), and the discharge port (401) are all the same.

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