A packaging structure of a patch-type dual-channel driving circuit

Abstract

The application provides a packaging structure of a patch type double-channel drive circuit, which comprises a ceramic base, a metal wall, a chip carrier and an external lead electrode, characterized in that the ceramic base is a stepped structure, and the ceramic base is an Al2O3 multilayer ceramic material; the metal wall on the first step is integrally connected with the ceramic base through a ceramic sintering process, and nine internal electrode pads are arranged on the second step; the chip carrier on the third step is integrally connected with the ceramic base through a ceramic sintering process; the external lead electrode is welded and fixed at the bottom of the ceramic base, and a part sealing frame is arranged at one end. The thermal conductivity of the ceramic material is significantly higher than that of the plastic packaging material, so that the heat generated by the chip can be efficiently conducted to the external environment, and through internal structure optimization, a lighter and smaller packaging shape is realized. Secondly, the loss of high-frequency signals in the ceramic material is lower, and the loss of the finished device can be reduced through the design.

Description

Technical Field

[0001] This application relates to the field of microelectronic device packaging technology, and in particular to a surface-mount dual-channel driving circuit packaging structure. Background Technology

[0002] Existing plastic SOP-8 and DFN4×4-8 packages, due to the poor thermal conductivity of the plastic material itself, cannot provide better heat dissipation performance and require built-in heat sinks and thermal channels. However, under the condition of optimizing thermal conductivity, the built-in heat sinks and channels lead to an increase in the size and weight of the plastic-encapsulated device. Secondly, plastic-encapsulated products have poor resistance to environmental stress and lower reliability. Currently, the microelectronics packaging field is developing towards lighter and smaller products, while also achieving domestic substitution in high-end fields such as military, aerospace electronics, medical, and automotive power modules. The market demands high reliability and lighter, smaller package structures for these products.

[0003] This application comprehensively considers the product's internal circuit structure, product reliability, and typical application scenarios such as military and aerospace electronics to design the packaging structure. In terms of other performance aspects, this application utilizes the structural characteristics of ceramic materials to achieve better mechanical strength, hermeticity, and environmental stress resistance. This provides higher reliability while meeting the requirements of device miniaturization, size reduction, and increased power density. Summary of the Invention

[0004] The technical problem this application aims to solve is: to address the shortcomings of molded devices, such as large size, high loss, and low environmental stress resistance, by providing a surface-mount ceramic structure package suitable for encapsulation. The technical solution of this application is: A surface-mount dual-channel drive circuit packaging structure consists of a ceramic substrate, a metal wall, a chip carrier, and external lead electrodes.

[0005] The aforementioned ceramic base has a stepped structure and is made of Al2O3 multilayer ceramic material. The metal wall on the first step is integrally connected to the ceramic base through a ceramic sintering process. Nine internal electrode pads are provided on the second step. The chip carrier on the third step is integrally connected to the ceramic base through a ceramic sintering process. An external lead electrode is welded and fixed to the bottom of the ceramic base, and a component sealing frame is provided at one end.

[0006] The aforementioned metal wall and ceramic base are integrally connected through a ceramic sintering process to form a cavity.

[0007] The aforementioned internal electrode pads have a Ni-Au structure and a metal coating on their surface.

[0008] The ceramic base is welded and fixed to the bottom with an external lead electrode, and a metal coating is applied to the surface.

[0009] The aforementioned inner electrode pads are bonding areas and are connected to the outer lead electrodes through tungsten paste metal vias.

[0010] The chip carrier surface is coated with a metal coating.

[0011] The surface of the sealing frame of the above-mentioned parts is coated with a metal coating.

[0012] The beneficial effects of this application are: while minimizing product size, it provides higher mechanical strength, environmental stress resistance and power density, broadens the packaging categories for this type of driver, and can be applied to environments with high reliability requirements, thus opening up the high-end product market for this type of product. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the cross-sectional structure of the internal cavity of this application.

[0014] Figure 2 This is a top view of the structure of this application.

[0015] Figure 3 This is a schematic diagram of the structure from below in this application.

[0016] Explanation of reference numerals in the attached figures: In the diagram: 1 is the external lead electrode, 2 is the external lead electrode, 3 is the external lead electrode, 4 is the external lead electrode, 5 is the external lead electrode, 6 is the external lead electrode, 7 is the external lead electrode, 8 is the external lead electrode, 9 is the metal wall, 10 is the ceramic substrate, 11 is the internal electrode pad, 21 is the internal electrode pad, 31 is the internal electrode pad, 32 is the internal electrode pad, 41 is the internal electrode pad, 51 is the internal electrode pad, 61 is the internal electrode pad, 71 is the internal electrode pad, 81 is the internal electrode pad, 101 is the third step, 102 is the second step, 103 is the chip carrier, and 104 is the component sealing frame. Detailed Implementation

[0017] Regarding the packaging structure of the aforementioned surface-mount dual-channel drive circuit, the following embodiments are proposed: like Figures 1 to 3 As shown, this application provides a surface-mount dual-channel driver circuit package structure, including: It consists of a ceramic substrate 10, a metal wall 9, a chip carrier 101, and external lead electrodes 1, 2, 3, 4, 5, 6, 7, and 8. Preferably, the ceramic substrate 10 and the metal wall 9 form a housing of the encapsulation structure, and the housing dimensions are 6.00mm × 5.00mm × 2.15mm.

[0018] The aforementioned ceramic base 10 has a stepped structure and is made of Al2O3 multilayer ceramic material. A metal wall 9 on the first step is fixedly connected to the ceramic base 10 via a sintering process. Nine internal electrode pads 11, 21, 31, 32, 41, 51, 61, 71, and 81 are provided on the second step 102. A chip carrier 103 on the third step 101 is fixedly connected to the ceramic base 10 via a sintering process. External lead electrodes 1, 2, 3, 4, 5, 6, 7, and 8 are welded and fixed to the bottom of the ceramic base 10. Preferably, the external lead electrodes 1, 2, 3, 4, 5, 6, 7, and 8 are all 1.42mm × 0.60mm in size, with a spacing of 1.27mm. The chip carrier 103 is fixedly connected to the center of the third step 101. A component sealing frame is provided at one end of the bottom of the ceramic base 10, which has no electrical characteristics.

[0019] The aforementioned metal wall 9 is fixedly connected to the ceramic base 10 through a sintering process to form a cavity. Preferably, the internal dimensions of the cavity are 4.40mm × 3.40mm × 0.60mm.

[0020] The aforementioned internal electrode pads 11, 21, 31, 32, 41, 51, 61, 71, and 81 are Ni-Au structures with a metal coating on their surface. These nine internal electrode pads 11, 21, 31, 32, 41, 51, 61, 71, and 81 are the wire bonding areas for interconnecting the chip and the casing.

[0021] The ceramic base 10 has external lead electrodes 1, 2, 3, 4, 5, 6, 7, and 8 welded and fixed to its bottom, and a metal coating is applied to its surface.

[0022] The aforementioned inner electrode pads 11, 21, 31, 32, 41, 51, 61, 71, and 81 are bonding areas and are connected to the outer lead electrodes 1, 2, 3, 4, 5, 6, 7, and 8 through tungsten paste metal vias. Preferably, the interconnection relationship between the aforementioned inner electrode pads and the outer lead electrodes is as follows: (1)-(11), (2)-(21), (3)-(31)-(32), (4)-(41), (5)-(51), (6)-(61), (7)-(71), and (8)-(81).

[0023] The aforementioned metal wall 9 is made of Kovar 4J29 alloy.

[0024] The chip carrier 103 is made of WCu15 alloy material with a metal coating on its surface. The chip carrier 103 has no electrical properties. Preferably, the chip carrier 103 has dimensions of 1.70mm × 1.50mm × 0.20mm.

[0025] The surface of the sealing frame 104 of the above-mentioned parts is provided with a metal coating.

[0026] Preferably, the ceramic base 10 is made of 95% Al2O3 multilayer ceramic, and the metal wall 9 is Kovar ring (4J29 alloy); the thermal expansion coefficients of the two are matched to ensure the airtightness of the parts, with an air leakage rate ≤1×10-3Pa·cm3 / s.

[0027] Preferably, the metallized coatings are all multi-layered metal materials with coating thicknesses of: Ni: 2.5–11.4 μm, Au: 1.3–5.7 μm.

Claims

1. A surface-mount dual-channel driving circuit packaging structure, characterized in that, The structure includes: a ceramic substrate (10), a metal wall (9), a chip carrier (103), and external lead electrodes (1, 2, 3, 4, 5, 6, 7, 8). The ceramic substrate (10) has a stepped structure and is made of Al2O3 multilayer ceramic material. The metal wall (9) on the first step is integrally connected to the ceramic substrate (10) through a ceramic sintering process. Nine internal electrode pads (11, 21, 31, 32, 41, 51, 61, 71, 81) are provided on the second step (102). The chip carrier (103) on the third step (101) is integrally connected to the ceramic substrate (10) through a ceramic sintering process. External lead electrodes (1, 2, 3, 4, 5, 6, 7, 8) are welded and fixed at the bottom of the ceramic substrate (10).

2. The package structure of a surface-mount dual-channel driving circuit according to claim 1, characterized in that, The metal wall (9) and the ceramic base (10) are integrally connected by a ceramic sintering process to form a cavity.

3. The package structure of a surface-mount dual-channel driving circuit according to claim 1, characterized in that, The inner electrode pads (11, 21, 31, 32, 41, 51, 61, 71, 81) are Ni-Au composite metal structures with a gold surface.

4. The packaging structure of a surface-mount dual-channel driving circuit according to claim 1, characterized in that, The ceramic base (10) has external lead electrodes (1, 2, 3, 4, 5, 6, 7, 8) welded and fixed at the bottom, and a metal coating is provided on the surface.

5. The package structure of a surface-mount dual-channel driving circuit according to claim 3, characterized in that, The inner electrode pads (11, 21, 31, 32, 41, 51, 61, 71, 81) are bonding areas and are connected to the outer lead electrodes (1, 2, 3, 4, 5, 6, 7, 8) through tungsten paste metal vias.

6. The package structure of a surface-mount dual-channel driving circuit according to claim 1, characterized in that, A metal coating is provided on the surface of the chip carrier (103).

7. The package structure of a surface-mount dual-channel driving circuit according to claim 1, characterized in that, A component sealing frame (104) is provided at one end of the bottom of the ceramic base (10).

8. The package structure of a surface-mount dual-channel driving circuit according to claim 7, characterized in that, The surface of the component sealing frame (104) is coated with a metal coating.

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