Heating disc assembly, stirring cup assembly and food processor

Abstract

The present disclosure relates to a heating disc assembly, a stirring cup assembly and a food processor. The heating disc assembly comprises a disc body, a composite heat conduction layer, a heating element and a temperature controller. The disc body comprises a food material contact surface. The composite heat conduction layer is arranged on the side of the disc body away from the food material contact surface, and the composite heat conduction layer comprises at least a first heat conduction layer and a second heat conduction layer arranged in a stack, and the heat conduction coefficient of the second heat conduction layer is smaller than that of the first heat conduction layer. The heating element is fixed to the side of the first heat conduction layer away from the second heat conduction layer. The temperature controller is located on the same side as the heating element. The second heat conduction layer is provided with a protruding portion penetrating the first heat conduction layer, and the temperature controller is in abutment with the protruding portion. The present application establishes a precise temperature measurement path from the second heat conduction layer to the temperature controller by means of the protruding portion penetrating the first heat conduction layer and the direct abutment of the temperature controller. This structure enables the temperature controller to more sensitively perceive the temperature of the disc body, thereby more accurately perceiving the temperature of the food material contact surface, and preventing the temperature controller from misjudging and causing the early jump problem.

Description

Technical Field

[0001] This disclosure relates to the field of food processing technology, and in particular to a heating plate assembly, a mixing cup assembly, and a food processor. Background Technology

[0002] To improve heating uniformity, current food processors often use composite plates as heat-conducting plates. This structure typically includes a low-thermal-conductivity metal layer above the heating element to diffuse the vertical heat laterally. However, this low-conductivity layer hinders the rapid transfer of heat to the upper cooking zone, causing heat to accumulate at the bottom layer where the heating element is located. This results in abnormal heating in the area near the thermostat, which is installed on the same side of the bottom layer. This causes the thermostat to prematurely trip before the overall temperature of the plate reaches the set value—a problem known as "early tripping"—severely affecting temperature control accuracy and cooking results. Utility Model Content

[0003] This disclosure provides a heating plate assembly, a mixing cup assembly, and a food processor to address the shortcomings of related technologies.

[0004] According to a first aspect of the present disclosure, a heating plate assembly is provided, comprising: The plate, including the surface where the food comes into contact with it. A composite heat-conducting layer is disposed on the side of the plate body opposite to the food contact surface. The composite heat-conducting layer includes at least a first heat-conducting layer and a second heat-conducting layer stacked together. The thermal conductivity of the second heat-conducting layer is less than that of the first heat-conducting layer. A heating element, wherein the heating element is fixed to the side of the first heat-conducting layer opposite to the second heat-conducting layer; and A thermostat, wherein the thermostat and the heating element are located on the same side; The second heat-conducting layer has a protrusion that penetrates the first heat-conducting layer, and the thermostat abuts against the protrusion. Thus, by creating a protrusion through the first heat-conducting layer and having the thermostat directly contact it, a precise temperature measurement path is constructed from the second heat-conducting layer to the thermostat. This structure allows the thermostat to more sensitively sense the temperature of the pan, thereby more accurately sensing the temperature of the food contact surface, preventing premature tripping due to thermostat misjudgment, and improving temperature control accuracy.

[0005] Optionally, the side of the second heat-conducting layer facing the disk is flat, and the thickness of the protrusion is greater than the thickness of other parts of the second heat-conducting layer. This allows heat to be transferred to the temperature controller with minimal thermal resistance and maximum speed, significantly improving the response speed and detection accuracy of temperature control. Simultaneously, the large contact surface with the disk enables better heat transfer.

[0006] Optionally, the composite thermally conductive layer further includes a third thermally conductive layer, with the second thermally conductive layer located between the first and third thermally conductive layers. The protrusion has a cavity formed on the side of the second thermally conductive layer facing the third thermally conductive layer, and the third thermally conductive layer has a boss that mates with the cavity. Thus, by adding a third thermally conductive layer, heat transferred laterally through the second thermally conductive layer can be quickly transferred towards the disk via the third thermally conductive layer. Furthermore, the tight fit between the boss and the cavity limits the positioning of the third and second thermally conductive layers, while simultaneously creating a larger effective contact area between them, further improving heat transfer efficiency and facilitating accurate temperature measurement.

[0007] Optionally, the first thermally conductive layer has a groove on the side facing the second thermally conductive layer; the second and third thermally conductive layers are disposed within the groove. Thus, the groove provides a precise mounting position for the second and third thermally conductive layers. This not only effectively prevents lateral misalignment of the thermally conductive layers during assembly and use, ensuring structural stability and reliability, but also makes the overall encapsulation of the composite thermally conductive layer more compact, reducing the thickness of the composite thermally conductive layer.

[0008] Optionally, the first heat-conducting layer is made of aluminum or copper; the second heat-conducting layer is made of stainless steel; and the third heat-conducting layer is made of aluminum or copper. The first heat-conducting layer, with its high thermal conductivity, quickly absorbs and transfers heat generated by the heating element to the second heat-conducting layer. The second heat-conducting layer, with its low thermal conductivity, allows for more thorough lateral heat transfer, achieving uniform temperature distribution. The third heat-conducting layer, in direct contact with the food, utilizes its high thermal conductivity to ultimately and rapidly transfer the heat from the second heat-conducting layer evenly, ensuring excellent heating performance.

[0009] Optionally, the horizontal distance between the heating element and the protrusion is 'a', where 'a' satisfies 3mm ≤ a ≤ 20mm. This avoids both situations where the heating element is too close to the temperature controller and affects the temperature sensing result, or where the distance is too far, thus achieving fast, stable, and precise temperature control.

[0010] Optionally, the temperature controller includes a temperature-sensing area that contacts the protrusion, and the protrusion includes a detection surface whose area is greater than or equal to the area of ​​the temperature-sensing area. In this way, the entire sensing area of ​​the temperature controller can sense the temperature of the second heat-conducting layer. This avoids the "localized temperature measurement" problem caused by insufficient contact area and improves the detection accuracy of the temperature controller.

[0011] Optionally, a temperature sensor is also included. The composite thermally conductive layer has mounting holes, through which the temperature sensor passes to contact the disc body. Thus, the temperature sensor and the temperature controller form a dual detection system, jointly improving the accuracy and reliability of temperature detection.

[0012] Optionally, the protrusion extends beyond the first heat-conducting layer. In this way, the temperature controller can directly sense the temperature of the second heat-conducting layer, effectively isolating thermal interference from the first heat-conducting layer and improving the detection accuracy of the temperature controller.

[0013] Optionally, the protrusion extends 0.2mm-1mm beyond the first thermally conductive layer. This ensures that the protrusion can effectively and without loss establish a tight thermal connection with the temperature controller, thus guaranteeing temperature measurement accuracy while avoiding affecting heating efficiency.

[0014] According to a second aspect of the present disclosure, a stirring cup assembly is provided, including the heating plate assembly, the stirring cup, and the stirring blade assembly described in the first aspect. The heating plate assembly is located at the bottom of the stirring cup, and the stirring blade assembly is disposed inside the stirring cup. This improves the detection accuracy and heating uniformity of the stirring cup assembly.

[0015] According to a third aspect of the present disclosure, a food processor is provided, including a main unit and the blending cup assembly described in the second aspect. The main unit includes a motor that drives the blending blade assembly to rotate. This improves the detection accuracy and heating uniformity of the food processor.

[0016] The technical solutions provided in the embodiments may include the following beneficial effects: As can be seen from the above embodiments, this application constructs a precise temperature measurement path from the second heat-conducting layer directly to the temperature controller by creating a protrusion that penetrates the first heat-conducting layer and allows the temperature controller to directly contact it. This structure enables the temperature controller to more sensitively sense the temperature of the pan, thereby more accurately sensing the temperature of the food contact surface and preventing premature tripping caused by misjudgment.

[0017] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0018] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0019] Figure 1 This is a cross-sectional view of a heating plate assembly and a stirring blade assembly according to an exemplary embodiment.

[0020] Figure 2This is a cross-sectional view of a heating plate assembly according to an exemplary embodiment.

[0021] Figure 3 This is a bottom view of a heating plate assembly according to an exemplary embodiment.

[0022] Figure 4 This is a top view of a heating plate assembly according to an exemplary embodiment.

[0023] Figure 5 This is a cross-sectional view of a composite thermally conductive layer according to an exemplary embodiment.

[0024] Figure 6 This is a cross-sectional view of a composite thermally conductive layer according to another exemplary embodiment.

[0025] Figure 7 This is a cross-sectional view of a heating plate assembly according to an exemplary embodiment.

[0026] Figure 8 This is an exploded view of a stirring cup assembly according to an exemplary embodiment.

[0027] Figure 9 This is an exploded view of a heating plate assembly and a stirring blade assembly according to an exemplary embodiment.

[0028] Figure 10 This is an exploded view of the heating plate assembly and the plate body according to an exemplary embodiment.

[0029] Figure 11 This is a cross-sectional view of a stirring cup assembly according to an exemplary embodiment.

[0030] Figure 12 This is a front view of a food processor shown according to an exemplary embodiment. Detailed Implementation

[0031] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0032] The terminology used in this disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The singular forms “a,” “the,” and “the” as used in this disclosure and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.

[0033] It should be understood that although the terms first, second, third, etc., may be used in this disclosure to describe various information, such information should not be limited to these terms. These terms are used only to distinguish information of the same type from one another. For example, without departing from the scope of this disclosure, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to determination."

[0034] Reference Figures 1-4 As shown, this application discloses a heating plate assembly 100, which includes a plate body 207, a composite heat-conducting layer 10, a heating element 20, and a temperature controller 30. The plate body 207 includes a food contact surface 217. The composite heat-conducting layer 10 is disposed on the side of the plate body 207 opposite to the food contact surface 217, and the composite heat-conducting layer 10 includes at least a first heat-conducting layer 11 and a second heat-conducting layer 12 stacked together, wherein the thermal conductivity of the second heat-conducting layer 12 is less than that of the first heat-conducting layer 11. The heating element 20 is fixed to the side of the first heat-conducting layer 11 opposite to the second heat-conducting layer 12. The temperature controller 30 is located on the same side as the heating element 20.

[0035] The second heat-conducting layer 12 has a protrusion 121 that penetrates the first heat-conducting layer 11, and the thermostat 30 abuts against the protrusion 121. Since the thermal conductivity of the second heat-conducting layer 12 is less than that of the first heat-conducting layer 11, the heat generated by the heating element 20 is slowed down by the second heat-conducting layer 12, so that the heat can be uniformly distributed in the second heat-conducting layer 12. Therefore, when the thermostat 30 abuts against the second heat-conducting layer 12, the temperature sensed by the thermostat 30 is closer to the temperature of the upper surface of the composite heat-conducting layer 10, making the sensed temperature closer to the temperature of the plate 207. This allows for accurate sensing of the temperature of the food contact surface 217, preventing premature tripping due to misjudgment by the thermostat 30 and improving the accuracy of temperature control.

[0036] In one embodiment, the side of the second heat-conducting layer 12 facing the disk 207 is flat, and the thickness of the protrusion 121 is greater than the thickness of other parts of the second heat-conducting layer 12. This allows heat to be transferred to the temperature controller 30 with minimal thermal resistance and maximum speed, significantly improving the response speed and detection accuracy of the temperature controller 30. Simultaneously, the large contact surface with the disk 207 enables better heat transfer.

[0037] In one embodiment, such as Figure 5 As shown, the composite heat-conducting layer 10 includes a first heat-conducting layer 11 and a second heat-conducting layer 12. The first heat-conducting layer 11 has a through hole 111, and the second heat-conducting layer 12 has a protrusion 121 that passes through the through hole 111. The protrusion 121 protrudes from the first heat-conducting layer 11, and the thermostat 30 abuts against the protrusion 121.

[0038] In another embodiment, refer to Figure 6 As shown, the composite thermally conductive layer 10 includes a first thermally conductive layer 11, a second thermally conductive layer 12, and a third thermally conductive layer 13, with the second thermally conductive layer 12 located between the first thermally conductive layer 11 and the third thermally conductive layer 13. A protrusion 121 forms a cavity 122 on the side of the second thermally conductive layer 12 facing the third thermally conductive layer, and the third thermally conductive layer 13 has a boss 131 that mates with the cavity 122. Thus, by adding a third thermally conductive layer 13, the heat laterally transferred via the second thermally conductive layer 12 can be rapidly transferred to the disk body 207 via the third thermally conductive layer 13.

[0039] Furthermore, the close fit between the boss 131 and the cavity 122 can limit the third heat-conducting layer 13 and the second heat-conducting layer 12, while forming a larger effective contact area between the third heat-conducting layer 13 and the second heat-conducting layer 12, which further improves the heat transfer efficiency and is conducive to accurate temperature measurement.

[0040] Furthermore, by providing a recess 122 at the corresponding position of the protrusion 121, the second heat-conducting layer 12 can maintain a thickness that is basically consistent with the overall thickness in the area containing the protrusion 121 and the recess 122, thus achieving a uniform thickness design. This design ensures that heat can be uniformly diffused laterally in the second heat-conducting layer 12, avoiding local thermal resistance differences and heat accumulation caused by abrupt changes in thickness, and improving the uniformity of heating.

[0041] In one embodiment, the thermal conductivity of the third thermally conductive layer 13 is greater than that of the second thermally conductive layer 12, and the thermal conductivity of the third thermally conductive layer 13 is the same as that of the first thermally conductive layer 11. In another embodiment, the thermal conductivity of the first thermally conductive layer 11 is greater than that of the second thermally conductive layer 12, and the thermal conductivity of the third thermally conductive layer 13 is greater than that of the first thermally conductive layer 11.

[0042] In one embodiment, the first thermally conductive layer 11, the second thermally conductive layer 12, and the third thermally conductive layer 13 are fixedly connected by welding. In another embodiment, the first thermally conductive layer 11, the second thermally conductive layer 12, and the third thermally conductive layer 13 are fixedly connected by die-casting. In yet another embodiment, the first thermally conductive layer 11, the second thermally conductive layer 12, and the third thermally conductive layer 13 are fixedly connected by rivets or other connectors.

[0043] Specifically, the first heat-conducting layer 11 is made of aluminum or copper; the second heat-conducting layer 12 is made of stainless steel; and the third heat-conducting layer 13 is made of aluminum or copper. Thus, the first heat-conducting layer 11, with its high thermal conductivity, quickly absorbs and transfers the heat generated by the heating element 20 to the second heat-conducting layer 12. The second heat-conducting layer 12, with its low thermal conductivity, allows for more thorough lateral heat transfer, achieving uniform temperature distribution. The third heat-conducting layer 13, in direct contact with the food, utilizes its high thermal conductivity to ultimately and rapidly transfer the heat from the second heat-conducting layer 12, ensuring excellent heating performance.

[0044] Reference Figure 6 As shown, a groove 112 is provided on the side of the first thermally conductive layer 11 facing the second thermally conductive layer 12. The second thermally conductive layer 12 and the third thermally conductive layer 13 are disposed within the groove 112. In this way, the groove 112 provides a precise mounting position for the second thermally conductive layer 12 and the third thermally conductive layer 13. This not only effectively prevents lateral misalignment of the thermally conductive layers during assembly and use, ensuring the stability and reliability of the structure, but also makes the overall encapsulation of the composite thermally conductive layer 10 more compact and reduces the thickness of the composite thermally conductive layer 10.

[0045] In one embodiment, the heating element 20 is a heating tube; in another embodiment, the heating element 20 is a resistance heating wire.

[0046] Reference Figure 7 As shown, the horizontal distance between the heating element 20 and the protrusion 121 is 'a', and the distance 'a' satisfies 3mm ≤ a ≤ 20mm. This avoids the heating element 20 affecting the temperature sensing result of the temperature controller 30 due to the distance between them being too close, thus achieving stable and precise temperature control.

[0047] In some embodiments, the horizontal distance between the heating element 20 and the protrusion 121 is 3mm, 5mm, 10mm, 15mm or 20mm, or any value between any two adjacent elements.

[0048] The thermostat 30 includes a temperature sensing area that contacts the protrusion 121. The protrusion 121 includes a detection surface 1211. In one embodiment (not shown in the figure), the area of ​​the detection surface 1211 is greater than or equal to the area of ​​the temperature sensing area. Thus, the entire sensing area of ​​the thermostat 30 can sense the temperature of the second heat-conducting layer 12. This avoids localized temperature measurement problems caused by insufficient contact area and improves the detection accuracy of the thermostat 30. The detection surface 1211 mentioned here refers to the mounting surface of the protrusion 121 that faces away from the first heat-conducting layer 11 and is used to mount the thermostat 30, i.e., the mounting surface... Figure 2 The raised portion 121 indicated in the figure is the plane that contacts the thermostat 30.

[0049] Reference Figure 6As shown, the protrusion 121 protrudes from the first heat-conducting layer 11. In this way, the temperature controller 30 can directly sense the temperature of the second heat-conducting layer 12, effectively isolating the thermal interference of the first heat-conducting layer 11 and improving the detection accuracy of the temperature controller 30.

[0050] In one embodiment, the protrusion 121 extends beyond the first heat-conducting layer 11 by a distance b, where the distance b satisfies 0.2mm ≤ b ≤ 1mm. This ensures that the protrusion 121 can effectively and without loss establish a tight thermal connection with the temperature controller 30, guaranteeing both temperature measurement accuracy and avoiding any impact on heating efficiency.

[0051] In some embodiments, the distance by which the protrusion 121 protrudes from the first thermally conductive layer 11 is 0.2 mm, 0.4 mm, 0.5 mm, 0.7 mm, or 1 mm, or any value between any two adjacent of the above.

[0052] Reference Figure 4 and Figure 9 As shown, the heating plate assembly 100 also includes a temperature sensor 40. The composite thermally conductive layer 10 has mounting holes 14, through which the temperature sensor 40 passes to contact the plate body 207. Thus, the temperature sensor 40 and the temperature controller 30 constitute a dual detection system, jointly improving the accuracy and reliability of temperature detection.

[0053] Specifically, during normal operation, the temperature sensor 40 directly detects the temperature of the liquid inside the cup, enabling precise control of the cooking program. When an abnormal temperature rise is detected (such as dry burning due to lack of water), the system automatically switches to a mode where the thermostat 30 monitors the composite heat-conducting layer 10 for overheating. If the temperature exceeds the safety threshold, the power is immediately cut off, forming a dual protection mechanism to effectively prevent dry burning accidents and ensure safe use.

[0054] Reference Figures 8-11 As shown, this application also discloses a mixing cup assembly, which includes a heating plate assembly 100, a mixing cup 200 and a mixing blade assembly 300. The heating plate assembly 100 is located at the bottom of the mixing cup 200, and the mixing blade assembly 300 is disposed inside the mixing cup 200.

[0055] The mixing cup 200 includes a cup body 202, a lid assembly 201 rotatably covering the top of the cup body 202, a handle assembly 203 detachably mounted on the side wall of the cup body 202, a cup holder 204 fixed to the bottom of the cup body 202, and a bottom cover 205 fixed to the bottom of the cup holder 204. In this embodiment, a coupler 206 is provided inside the cup holder 204.

[0056] The heating plate assembly 100 is sealed to the bottom of the cup body 202 by the heating plate sealing ring 101, and the stirring blade assembly 300 is disposed inside the cup body 202. In this embodiment, the stirring blade assembly 300 is assembled with the heating plate assembly 100.

[0057] Reference Figure 11 and Figure 12 As shown, this application also discloses a food processor, which includes a main unit 400 and a blending cup assembly. The main unit 400 includes a motor 401, which drives the blending blade assembly 300 to rotate via a clutch 301. In another embodiment, the motor 401 can also directly drive the blending blade assembly 300 to rotate, so as to blend and pulverize the ingredients in the blending cup 200. The food processor can be a blender, juicer, high-speed blender, stir-fry machine, soy milk maker, meat grinder, etc.

[0058] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0059] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A heating plate assembly, characterized in that, It includes: The plate, including the surface where the food comes into contact with it. A composite heat-conducting layer is disposed on the side of the plate body opposite to the food contact surface. The composite heat-conducting layer includes at least a first heat-conducting layer and a second heat-conducting layer stacked together. The thermal conductivity of the second heat-conducting layer is less than that of the first heat-conducting layer. A heating element, wherein the heating element is fixed to the side of the first heat-conducting layer that is opposite to the second heat-conducting layer; and A thermostat, wherein the thermostat and the heating element are located on the same side; The second heat-conducting layer has a protrusion that penetrates the first heat-conducting layer, and the temperature controller abuts against the protrusion.

2. The heating plate assembly according to claim 1, characterized in that, The side of the second heat-conducting layer facing the disk is flat, and the thickness of the protrusion is greater than the thickness of other parts of the second heat-conducting layer.

3. The heating plate assembly according to claim 1, characterized in that, The composite thermal conductive layer further includes a third thermal conductive layer. The second thermal conductive layer is located between the first thermal conductive layer and the third thermal conductive layer. The protrusion has a cavity on the side of the second thermal conductive layer facing the third thermal conductive layer. The third thermal conductive layer has a boss that mates with the cavity.

4. The heating plate assembly according to claim 3, characterized in that, The first thermally conductive layer has a groove on one side facing the second thermally conductive layer; the second thermally conductive layer and the third thermally conductive layer are disposed in the groove; And / or, The first thermally conductive layer is made of aluminum or copper; the second thermally conductive layer is made of stainless steel; and the third thermally conductive layer is made of aluminum or copper.

5. The heating plate assembly according to claim 1, characterized in that, The distance between the heating element and the protrusion in the horizontal direction is a, and the distance a satisfies 3mm≤a≤20mm.

6. The heating plate assembly according to any one of claims 1-5, characterized in that, The temperature controller includes a temperature measuring area that contacts the protrusion, the protrusion includes a detection surface, the area of ​​the detection surface is greater than or equal to the area of ​​the temperature measuring area; and / or, the heating plate assembly further includes a temperature sensor, the composite thermal conductive layer is provided with a mounting hole, and the temperature sensor passes through the mounting hole to contact the plate body.

7. The heating plate assembly according to any one of claims 1-5, The protrusion extends beyond the first thermally conductive layer.

8. The heating plate assembly according to claim 7, characterized in that, The protrusion extends 0.2mm-1mm beyond the first thermally conductive layer.

9. A stirring cup assembly, characterized in that, The invention includes the heating plate assembly, stirring cup, and stirring blade assembly as described in any one of claims 1 to 8, wherein the heating plate assembly is located at the bottom of the stirring cup, and the stirring blade assembly is disposed inside the stirring cup.

10. A food processor, characterized in that, The device includes a main unit and the stirring cup assembly as described in claim 9, wherein the main unit includes a motor that drives the stirring blade assembly to rotate.

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