Mixing equipment for preparing epoxy resin pouring sealant

Abstract

The utility model discloses a kind of mixing equipment of preparation epoxy resin pouring sealant, belong to epoxy resin glue preparation technical field, including mixing tank, the top of the mixing tank is equipped with top cover, the spiral thread is equipped in the inner wall of the mixing tank;In the utility model, when filling epoxy resin and curing agent, the flow rate of liquid can be reduced by buffer tank, and when flowing out from liquid outlet pipe, due to the horizontal placement of the end of liquid outlet pipe, and close to receiving tray, so as to further reduce the impact force when liquid flows out, and thus effectively avoid the generation of bubbles when liquid is injected into mixing box due to large impact, so as to ensure the quality of pouring sealant, and the inlet of two liquid outlet pipes can be shielded to different degrees by partition, so that the epoxy resin and curing agent in the two buffer tanks can enter the mixing box in a certain proportion, so that it is beneficial to mix the two evenly when stirring.

Description

Technical Field

[0001] This utility model belongs to the field of epoxy resin adhesive preparation technology, and in particular relates to a mixing device for preparing epoxy resin potting compound. Background Technology

[0002] Epoxy resin potting compound is a two-component material made by mixing epoxy resin and a curing agent. After mixing, the two react chemically to form a strong solid structure, which can be used to protect components in the electronic and electrical fields. At the same time, because it encapsulates electronic components inside, it can prevent moisture, dust and other substances from entering the interior of the epoxy resin potting compound and coming into contact with the electronic components, thereby achieving protection of the components.

[0003] When mixing epoxy resin and curing agent, both need to be added to a mixing tank. However, during the filling process, the liquid is directly added through a pipeline, which causes a certain impact when the liquid flows down, which can easily lead to the formation of air bubbles. This can affect the quality of the potting compound. In order to solve the above problems, there is an urgent need for a mixing equipment for preparing epoxy resin potting compound. Utility Model Content

[0004] The purpose of this invention is to provide a mixing device for preparing epoxy resin potting compound in order to solve the problem that the liquid falls directly during the addition of epoxy resin and curing agent, which easily leads to the generation of air bubbles.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a mixing device for preparing epoxy resin potting compound, comprising a mixing tank, the top of which is provided with a top cover, and the inner wall of which is provided with spiral patterns; a dispensing assembly, which is installed on the top surface of the top cover; and a mixing assembly, which is installed inside the mixing tank; The filling assembly includes a buffer tank, an inlet pipe installed at the top of the buffer tank, a connecting box installed on one side of the buffer tank, an outlet pipe installed on one side of the connecting box, a partition slidably installed on the connecting box through a groove inside, a limit seat installed at the top of the partition, a pin slidably installed on the limit seat through a groove inside, and a spring installed on one side of the pin.

[0006] As a further description of the above technical solution: The outlet pipe is connected to the buffer box through a connecting box. The partition is located on one side of the outlet pipe inlet and can block the outlet pipe inlet.

[0007] As a further description of the above technical solution: The pin is slidably connected to the partition through a groove on the top surface of the partition, and the pin is slidably connected to the buffer box through a groove on one side of the buffer box.

[0008] As a further description of the above technical solution: The liquid outlet pipe passes through the top cover, and the outer wall of the liquid outlet pipe is fixedly connected to the top cover. The bottom end of the buffer tank is fixedly connected to the top cover.

[0009] As a further description of the above technical solution: The hybrid assembly includes a motor, the output end of which is fitted with a mounting rod, and one end of a helical rod is fitted onto the outer wall of the mounting rod.

[0010] As a further description of the above technical solution: The bottom end of the mounting rod is fitted with a mixing slurry, the outer wall of the mounting rod is fitted with a receiving tray, and the outer wall of the receiving tray is fitted with a distributing trough.

[0011] As a further description of the above technical solution: The material distribution trough is inclined, and the other end of the material distribution trough is in contact with the inner wall of the mixing tank, and a notch is provided at one end of the material distribution trough.

[0012] As a further description of the above technical solution: The mounting rod is rotatably connected to the top cover through a through hole inside the top cover, and one end of the motor is fixedly connected to the top cover.

[0013] In summary, due to the adoption of the above technical solution, the beneficial effects of this utility model are: 1. In this utility model, when adding epoxy resin and curing agent, the flow rate of the liquid can be reduced by using a buffer tank. At the same time, since the end of the liquid outlet is placed horizontally and close to the receiving tray, the impact force of the liquid flow can be further reduced. This effectively avoids the generation of air bubbles caused by the large impact when the liquid is injected into the mixing tank, thus ensuring the quality of the potting compound. Furthermore, the inlets of the two liquid outlets can be blocked to different degrees by the partition, so that the epoxy resin and curing agent in the two buffer tanks can enter the mixing tank in a certain proportion, which is beneficial for the uniform mixing of the two during stirring.

[0014] 2. In this utility model, during stirring, the liquid flows from the receiving tray to the distributing trough and then flows down the inner wall of the mixing tank from the other end of the distributing trough. This avoids the liquid falling directly into the mixing tank and causing air bubbles. Furthermore, the presence of the spiral pattern allows the liquid to flow along the spiral pattern, further reducing the impact when the liquid on the inner wall merges with the liquid surface. At the same time, since the distributing trough rotates with the receiving tray, the liquid can flow down the inner wall of the mixing tank evenly, thereby improving the mixing efficiency. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of a mixing device for preparing epoxy resin potting compound.

[0016] Figure 2 This is an exploded three-dimensional structural diagram of a mixing device for preparing epoxy resin potting compound.

[0017] Figure 3 This is an exploded three-dimensional structural diagram of the mixing components in a mixing device for preparing epoxy resin potting compound.

[0018] Figure 4 This is an exploded three-dimensional structural diagram of the filling component in a mixing device for preparing epoxy resin potting compound.

[0019] Legend: 1. Mixing tank; 2. Top cover; 3. Filling assembly; 301. Inlet pipe; 302. Buffer tank; 303. Pin; 304. Spring; 305. Limit seat; 306. Partition plate; 307. Connecting box; 308. Outlet pipe; 4. Mixing assembly; 401. Motor; 402. Receiving tray; 403. Distributing trough; 404. Mounting rod; 405. Screw rod; 406. Mixing slurry; 5. Spiral pattern. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0021] In its specific implementation, such as Figures 1-4 This utility model provides a technical solution: a mixing device for preparing epoxy resin potting compound, including a mixing tank 1, a top cover 2 at the top of the mixing tank 1, and spiral patterns 5 on the inner wall of the mixing tank 1; a filling component 3, which is installed on the top surface of the top cover 2; and a mixing component 4, which is installed inside the mixing tank 1. The filling component 3 includes a buffer tank 302, with an inlet pipe 301 installed at the top of the buffer tank 302. A connecting box 307 is installed on one side of the buffer tank 302, and an outlet pipe 308 is installed on one side of the connecting box 307. A partition 306 is slidably installed on the connecting box 307 through a groove. A limit seat 305 is installed at the top of the partition 306, and a pin 303 is slidably installed on the limit seat 305 through a groove. A spring 304 is installed on one side of the pin 303. The outlet pipe 308 is connected via a connecting... The receiving box 307 is connected to the buffer box 302. The partition 306 is located on one side of the inlet of the outlet pipe 308 and can block the inlet of the outlet pipe 308. The pin 303 is slidably connected to the partition 306 through the groove opened on the top surface of the partition 306. The pin 303 is slidably connected to the buffer box 302 through the groove opened on one side of the buffer box 302. The outlet pipe 308 passes through the top cover 2 and is fixedly connected to the top cover 2. The bottom end of the buffer box 302 is fixedly connected to the top cover 2.

[0022] Specifically, during the filling process, the pipeline is connected to the inlet pipe 301, allowing the epoxy resin or curing agent to enter the buffer tank 302 from the inlet pipe 301 and pass through the connecting box 307 into the outlet pipe 308 for discharge. Since the end of the outlet pipe 308 is horizontally placed and the distance between it and the receiving tray 402 is small, the impact of the liquid falling onto the receiving tray 402 is reduced, thereby reducing the generation of air bubbles. Furthermore, by pulling the pin 303 and moving the baffle 306, the baffle 306 can block the inlet of the outlet pipe 308 to varying degrees, thereby adjusting the flow rate of epoxy resin and curing agent in the two buffer tanks 302 so that they enter the mixing tank 1 in a certain proportion. like Figure 3 As shown, the mixing component 4 includes a motor 401, an installation rod 404 is installed at the output end of the motor 401, one end of a spiral rod 405 is installed on the outer wall of the installation rod 404, a mixing slurry 406 is installed at the bottom end of the installation rod 404, a receiving tray 402 is installed on the outer wall of the installation rod 404, a distributing trough 403 is installed on the outer wall of the receiving tray 402, the distributing trough 403 is inclined, and the other end of the distributing trough 403 contacts the inner wall of the mixing tank 1, and one end of the distributing trough 403 is provided with a notch. The installation rod 404 is rotatably connected to the top cover 2 through a through hole opened in the top cover 2, and one end of the motor 401 is fixedly connected to the top cover 2. Specifically, during mixing, epoxy resin and curing agent flow from the outlet pipe 308 onto the surface of the receiving tray 402. Simultaneously, the motor 401 drives the mounting rod 404 to rotate, thereby driving the mixing slurry 406 and the screw rod 405 to stir inside the mixing tank 1. The mounting rod 404 can also drive the receiving tray 402 to rotate, and the liquid in the receiving tray 402 can flow out through the distribution trough 403 and flow along the inner wall of the mixing tank 1. Thus, when the receiving tray 402 rotates, the distribution trough 403 can rotate, causing the liquid to flow from different positions. At the same time, since the mixing tank 1 is provided with spiral patterns 5, the liquid can descend along the spiral patterns 5.

[0023] Working principle: During filling, the pipeline is connected to the inlet pipe 301, allowing epoxy resin or curing agent to enter the buffer tank 302 from the inlet pipe 301, pass through the connecting box 307, and exit into the outlet pipe 308. The baffle 306 can be moved by pulling the pin 303, causing it to block the inlet of the outlet pipe 308 to varying degrees. As the epoxy resin and curing agent flow from the outlet pipe 308 onto the surface of the receiving tray 402, they are simultaneously discharged via an electric current... The machine 401 drives the mounting rod 404 to rotate, which in turn drives the mixing slurry 406 and the screw rod 405 to stir inside the mixing tank 1. The mounting rod 404 can also drive the receiving tray 402 to rotate, and the liquid in the receiving tray 402 can flow out through the distribution trough 403 and flow along the inner wall of the mixing tank 1. When the receiving tray 402 rotates, the distribution trough 403 can rotate. At the same time, since the mixing tank 1 is provided with spiral patterns 5, the liquid can descend along the spiral patterns 5.

[0024] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., changes in the size, dimensions, structure, shape, and proportions of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of the invention. The order or sequence of any process or method steps may be changed or rearranged according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structurally equivalent but also equivalent in structure. Other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments without departing from the scope of the invention. Therefore, the present invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0025] Furthermore, in order to provide a concise description of exemplary embodiments, not all features of actual embodiments (i.e., those features that are not relevant to the currently considered best mode for carrying out the invention, or those features that are not relevant to implementing the invention) may be omitted.

[0026] It should be understood that numerous specific implementation decisions can be made during the development of any practical implementation, such as in any engineering or design project. Such development efforts may be complex and time-consuming, but for those skilled in the art who benefit from this disclosure, the development effort will be a routine work of design, manufacturing, and production without requiring much experimentation.

[0027] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A mixing apparatus for preparing epoxy resin potting compound, characterized in that, include: A mixing tank (1) is provided with a top cover (2) at the top and a spiral pattern (5) on the inner wall of the mixing tank (1). A filling assembly (3) is mounted on the top surface of the top cover (2); A mixing component (4) is installed inside a mixing tank (1); The filling component (3) includes a buffer tank (302), an inlet pipe (301) is installed at the top of the buffer tank (302), a connecting box (307) is installed on one side of the buffer tank (302), an outlet pipe (308) is installed on one side of the connecting box (307), a partition (306) is slidably installed on the connecting box (307) through a groove opened inside, a limit seat (305) is installed at the top of the partition (306), a pin (303) is slidably installed on the limit seat (305) through a groove opened inside, and a spring (304) is installed on one side of the pin (303).

2. The mixing equipment for preparing epoxy resin potting compound according to claim 1, characterized in that, The outlet pipe (308) is connected to the buffer box (302) through the connecting box (307). The partition (306) is located on one side of the inlet of the outlet pipe (308) and the partition (306) can block the inlet of the outlet pipe (308).

3. The mixing equipment for preparing epoxy resin potting compound according to claim 2, characterized in that, The pin (303) is slidably connected to the partition (306) through a groove on the top surface of the partition (306), and the pin (303) is slidably connected to the buffer box (302) through a groove on one side of the buffer box (302).

4. The mixing equipment for preparing epoxy resin potting compound according to claim 3, characterized in that, The liquid outlet pipe (308) passes through the top cover (2), and the outer wall of the liquid outlet pipe (308) is fixedly connected to the top cover (2). The bottom end of the buffer box (302) is fixedly connected to the top cover (2).

5. The mixing equipment for preparing epoxy resin potting compound according to claim 1, characterized in that, The hybrid component (4) includes a motor (401), the output end of which is equipped with a mounting rod (404), and the outer wall of the mounting rod (404) is equipped with one end of a spiral rod (405).

6. The mixing equipment for preparing epoxy resin potting compound according to claim 5, characterized in that, The bottom end of the mounting rod (404) is equipped with a mixing slurry (406), the outer wall of the mounting rod (404) is equipped with a receiving tray (402), and the outer wall of the receiving tray (402) is equipped with a distributing trough (403).

7. The mixing equipment for preparing epoxy resin potting compound according to claim 6, characterized in that, The material distribution trough (403) is inclined, and the other end of the material distribution trough (403) is in contact with the inner wall of the mixing tank (1), and a notch is provided at one end of the material distribution trough (403).

8. The mixing equipment for preparing epoxy resin potting compound according to claim 6, characterized in that, The mounting rod (404) is rotatably connected to the top cover (2) through a through hole in the top cover (2), and one end of the motor (401) is fixedly connected to the top cover (2).

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