Electroplating gold solution preparation device applied to circuit board

Abstract

The utility model belongs to electroplating gold equipment technical field discloses a kind of electroplating gold liquid preparation device applied to circuit board.Electroplating gold liquid each component storage tank will be placed respectively by different time end gold salt, accelerator, composite complexing agent, stabilizer, inhibitor, dispersing agent, conductive salt, deionized water is conveyed to electroplating gold liquid reaction chamber by electroplating gold liquid each component delivery pump, electroplating gold liquid each component flowmeter, first valve;Heater is installed in electroplating gold liquid reaction chamber inside, and the stirring speed of electroplating gold liquid stirring device is controlled by stirring motor;Stirring motor is connected with electroplating gold liquid preparation control end and operates according to the control instruction of electroplating gold liquid preparation control end;Multiple temperature measurement probes are respectively arranged on, in and under electroplating gold liquid stirring device;pH meter is installed in electroplating gold liquid reaction chamber.The utility model preparation equipment is portable, and energy consumption is low, convenient to operate.

Description

Technical Field

[0001] This utility model belongs to the technical field of electroplating gold equipment, and in particular relates to an electroplating gold solution preparation device for circuit boards. Background Technology

[0002] With the development of the electronics industry, electroplating gold technology has expanded to industrial applications, and the plating has evolved from pure gold to alloy and composite plating. The emergence of pulsed gold plating and laser gold plating technologies has improved the quality and efficiency of plating.

[0003] Environmental pollution: Waste liquid and exhaust gas generated during electroplating contain metal ions and harmful substances, which can cause environmental pollution if not properly treated. Complex process: Strict control of parameters such as temperature, current density, and electroplating time is required, making the process complex and necessitating specialized equipment and technical support. Uneven coating thickness: Uneven current distribution or complex workpiece shapes can lead to uneven coating thickness, affecting product quality and appearance. Cyanide hazards: Traditional cyanide gold plating solutions are highly harmful to the environment and human health. With increasingly stringent environmental protection requirements, there is a need to move towards cyanide-free and environmentally friendly solutions.

[0004] Based on the above analysis, the problems and defects of the existing technology are as follows: the preparation of the electroplating gold solution is complex, the preparation cost is high, the preparation equipment is bulky, the energy consumption is high, and the operation is inconvenient. Utility Model Content

[0005] To overcome the problems existing in related technologies, the present invention discloses an apparatus for preparing electroplating gold solution for circuit boards.

[0006] The technical solution is as follows: an apparatus for preparing electroplating gold solution for circuit boards, the apparatus comprising storage tanks for various components of the electroplating gold solution;

[0007] The gold salt, accelerator, complexing agent, stabilizer, inhibitor, dispersant, conductive salt, and deionized water stored in the electroplating gold solution components storage tanks at different time points are transported to the electroplating gold solution reaction chamber through the electroplating gold solution component transfer pump, the electroplating gold solution component flow meter, and the first valve.

[0008] A heater is installed inside the electroplating gold solution reaction chamber. The stirring speed of the electroplating gold solution stirring device is controlled by a stirring motor. The stirring motor is connected to the electroplating gold solution preparation control terminal and operates according to the control instructions of the electroplating gold solution preparation control terminal.

[0009] Multiple temperature measuring probes are arranged at the top, middle and bottom of the electroplating gold solution stirring device; the multiple temperature measuring probes are connected to the electroplating gold solution temperature acquisition device via wireless or wired signals, and the electroplating gold solution temperature acquisition device is connected to the electroplating gold solution preparation control terminal.

[0010] A pH meter is installed in the electroplating solution reaction chamber to monitor the pH value of the electroplating solution.

[0011] Furthermore, the frequency converter for the dosage of each component of the electroplating solution is connected to the pump for the delivery of each component of the electroplating solution and the control terminal for the preparation of the electroplating solution.

[0012] The heater is connected to the electroplating solution preparation control terminal and performs heating according to the control instructions of the electroplating solution preparation control terminal.

[0013] An electroplating solution sampling port is also provided on the outside of the electroplating solution reaction chamber.

[0014] The bottom of the electroplating gold solution reaction chamber is equipped with an electroplating gold solution leakage discharge valve; the electroplating gold solution leakage discharge valve delivers the solution to the cooling chamber through a pipeline;

[0015] The electroplating gold solution mixture flowing out of the cooling chamber is monitored for acidity and alkalinity by an electroplating gold solution component safety index monitor.

[0016] The electroplating gold solution component safety index monitor is equipped with a manual shut-off valve. The flow is directed through the outflow pipe to the electroplating gold solution outflow mixture flow meter. An online monitoring instrument for the complexing agent index is also installed on the outflow pipe.

[0017] The flow meter for the electroplating gold solution outflow mixture and the online monitoring instrument for the complexing agent index send the monitored information to the data processing terminal.

[0018] The outer wall of the electroplating gold solution reactor is made of heat insulation material, while the outflow pipes and the pipes for conveying the various components of the electroplating gold solution are made of PPR material.

[0019] Combining all the above technical solutions, the beneficial effects of this utility model are as follows:

[0020] The device of this invention has a simple manufacturing process, low manufacturing cost, lightweight equipment, low energy consumption, and convenient operation. It occupies a small area and is very easy to put into production. Attached Figure Description

[0021] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure;

[0022] Figure 1 This is a schematic diagram of an electroplating gold solution preparation device for circuit boards provided in an embodiment of this utility model;

[0023] In the diagram: 1. Sampling port for electroplating gold solution; 2. Reaction chamber for electroplating gold solution; 3. Heater; 4. Frequency converter for adjusting the dosage of each component of electroplating gold solution; 5. Pump for transferring each component of electroplating gold solution; 6. Flow meter for each component of electroplating gold solution; 7. First valve; 8. Stirring device for electroplating gold solution; 9. Temperature measuring probe; 10. Drain valve for exudate from electroplating gold solution; 11. Temperature acquisition device for electroplating gold solution; 12. Control terminal for preparation of electroplating gold solution; 13. Stirring motor; 14. Cooling chamber; 15. Safety index monitor for components of electroplating gold solution; 16. Flow meter for mixed liquid flowing out of electroplating gold solution; 17. Online monitor for index of complexing agent; 18. Data processing terminal; 19. Storage tank for each component of electroplating gold solution; 20. pH meter. Detailed Implementation

[0024] To make the above-mentioned objectives, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0025] Example 1, such as Figure 1 The electroplating gold solution preparation apparatus for circuit boards provided in this embodiment of the present invention includes:

[0026] 1. Sampling port for electroplating gold solution; 2. Reaction chamber for electroplating gold solution; 3. Heater; 4. Frequency converter for dosage of each component of electroplating gold solution; 5. Flow meter for each component of electroplating gold solution; 6. First valve; 7. Stirring device for electroplating gold solution; 8. Temperature measuring probe; 9. Drain valve for electroplating gold solution; 10. Temperature acquisition device for electroplating gold solution; 11. Preparation control terminal for electroplating gold solution; 12. Stirring motor; 13. Cooling chamber; 14. Safety index monitor for components of electroplating gold solution; 15. Flow meter for mixed liquid outflow from electroplating gold solution; 16. Online monitor for index of complexing agent; 17. Data processing terminal; 18. Storage tank for each component of electroplating gold solution; 19. pH meter; 20.

[0027] The gold salt, accelerator, complexing agent, stabilizer, inhibitor, dispersant, conductive salt, and deionized water placed at different time points in the storage tank 19 of the electroplating gold solution are transported to the electroplating gold solution reaction chamber 2 through the electroplating gold solution component transfer pump 5, the electroplating gold solution component flow meter 6, and the first valve 7.

[0028] The frequency converter 4 for the dosage of each component of the electroplating gold solution is connected to the pump 5 for each component of the electroplating gold solution and the control terminal 12 for the preparation of the electroplating gold solution. The operating frequency of the pump 5 for each component of the electroplating gold solution can be adjusted according to the actual production volume.

[0029] At different times, gold salt, accelerator, complexing agent, stabilizer, inhibitor, dispersant, conductive salt, and deionized water are delivered to the electroplating gold solution reaction chamber 2. At this time, the heater 3 and the electroplating gold solution stirring device 8 installed in the electroplating gold solution reaction chamber 2 start to stir. The stirring speed of the electroplating gold solution stirring device 8 is controlled by the stirring motor 13. The stirring motor 13 is connected to the electroplating gold solution preparation control terminal 12 and operates according to the control instructions of the electroplating gold solution preparation control terminal 12.

[0030] Heater 3 is connected to the electroplating solution preparation control terminal 12 and performs heating according to the control command of the electroplating solution preparation control terminal 12;

[0031] Multiple temperature measuring probes 9 are arranged at the top, middle and bottom of the electroplating gold solution stirring device 8. The multiple temperature measuring probes 9 are connected to the electroplating gold solution temperature acquisition device 11 via wireless or wired signals. The electroplating gold solution temperature acquisition device 11 is connected to the electroplating gold solution preparation control terminal 12 via signals. The real-time temperature of different layers of the electroplating gold solution is sent to the electroplating gold solution preparation control terminal 12 so that the electroplating gold solution preparation control terminal 12 can adjust the heating power of the heater 3.

[0032] During the operation of the electroplating gold solution stirring device 8, the circulating flow of the upper, middle and lower layers of the electroplating gold solution can be achieved by the rotary auger blades, so that the stirring temperature is consistent throughout.

[0033] A pH meter 20 is installed in the electroplating gold solution reaction chamber 2 to monitor the pH value of the electroplating gold solution. The pH value of the electroplating gold solution is sent to the electroplating gold solution preparation control terminal 12 so that the pH value of the electroplating gold solution can be adjusted by a solution of sodium hydroxide with a mass concentration of 5% and concentrated sulfuric acid with a volume concentration of 5%.

[0034] An electroplating gold solution sampling port 1 is also provided on the outside of the electroplating gold solution reaction chamber 2.

[0035] The bottom of the electroplating gold solution reaction chamber 2 is provided with an electroplating gold solution leakage discharge valve 10; the electroplating gold solution leakage discharge valve 10 is transported to the cooling chamber 14 (which can be water circulation) through a pipeline, so as to facilitate the control of the outflow temperature of the electroplating gold solution.

[0036] The electroplating gold solution mixture flowing out of the cooling chamber 14 is monitored for acidity and alkalinity by the electroplating gold solution component safety index monitor 15. If the acidity and alkalinity exceed the standard, it is further flowed to the treatment device for further adjustment of acidity and alkalinity until it meets the requirements for later application.

[0037] The electroplating solution component safety index monitor 15 is equipped with a manual shut-off valve. If the pH is suitable, the shut-off valve can be manually opened, and the solution flows through the outflow pipe to the electroplating solution outflow mixing flow meter 16. The outflow pipe is also equipped with an online monitoring instrument 17 for the complexing agent index. The electroplating solution outflow mixing flow meter 16 and the online monitoring instrument 17 send the monitored information to the data processing terminal 18. When the monitored complexing agent index meets the safety requirements, the solution flows to the electroplating solution standby pool.

[0038] In this embodiment of the invention, the outer wall of the electroplating gold solution reaction chamber 2 is a heat insulation material layer, and except for the cooling chamber 14 which is a glass material layer, the other pipes (including the outflow pipes and the pipes for conveying the components of the electroplating gold solution) are all PPR material layers.

[0039] As can be seen, the electroplating gold solution prepared by the device for preparing electroplating gold solution for circuit boards provided in this embodiment of the invention is environmentally friendly and non-toxic, with low energy consumption, uniform stirring, and good consistency. The equipment has a small footprint and is easy to implement.

[0040] Example 2, exemplarily, shows that the electroplating gold solution preparation device for circuit boards can achieve excellent electroplating gold process for circuit boards. The prepared electroplating gold solution for circuit boards has the characteristics of being cyanide-free and environmentally friendly, having a uniform and bright plating layer, being free of plating cracks, having good plating stability, and being resistant to nickel corrosion.

[0041] Nickel-gold electroplating solution: gold salt 5-11g / L, accelerator 0.3-0.9g / L, complexing agent 20-40g / L, stabilizer 30-60mg / L, inhibitor 30-90mg / L, dispersant 30-60mg / L, conductive salt 15-25g / L, balance deionized water;

[0042] pH 5.8-6.4, temperature 35-45℃, current density 0.1-4.5 A / dm³ 2 ;

[0043] pH is adjusted by a solution of 5% sodium hydroxide (by mass) and 5% concentrated sulfuric acid (by volume); the conductive salt is sodium sulfate.

[0044] The gold salt is sodium gold sulfite, the complexing agent is a combination of 6-aminopyrimidine-4-carboxylic acid and 3-aminopyridazine-4-carboxylic acid, with a concentration ratio of 1:3 when used, the accelerator is dimethylaminoethyl acrylate, the inhibitor is N-[cis-3-aminocyclohexyl]carbamate tert-butyl ester, the dispersant is 4-aminopyrazolo[3,4-d]pyrimidine, and the stabilizer is 5-aminopyrazol-3-carboxylic acid ethyl ester.

[0045] The evaluation criteria for the experimental tests are as follows:

[0046] (1) Using five substrates as test objects, uniformity test: the ratio of the extreme value to the average value of the coating thickness is within 0-5% and the bright gold nodules are good; the ratio of the extreme value to the average value is within 5-10%, the coating is bright and occasionally a few gold nodules are good; the ratio of the extreme value to the average value is within 10-15% and the color is slightly dark and obvious gold nodules are poor; the ratio of the extreme value to the average value is within 15-25% and the coating is black and there is a color difference is poor; the ratio of the extreme value to the average value is above 25% is very poor.

[0047] (2) The experimental quantity is 5 pieces. The gold surface is free of plating cracks. Dense and flat plating without cracks is good; occasional fine cracks are seen. Very small cracks can only be observed at 3000x SEM. Larger cracks can generally be seen at 1000x magnification. Cracks on the gold surface of the cylinder are more numerous and can be seen at 500x magnification. Cracks on the gold surface can be seen at 200x or less. Very poor.

[0048] (3) Stability of the gold tank: The experimental quantity is 5 tank solutions. The tanks are used normally for a period of three months. Excellent means that the solution is clear and transparent and does not change color within three months; Good means that the solution is clear within three months, but there is a little red solid precipitation on the tank wall; Poor means that the solution is slightly red within three months; Very poor means that the solution is obviously red and turbid within three months; Very bad means that the solution is severely turbid and discolored within three months.

[0049] (4) Stability of the gold tank: The experimental quantity is 5 tank solutions. The tanks are used normally for a period of one month. Excellent means that the solution is clear and transparent within one month and there is no turbidity. Good means that the solution is clear within one month, but the tank solution is slightly milky white. Poor means that the solution separates slightly within one month. Poor means that the solution separates significantly within one month. Very poor means that the solution is turbid and separates within one month, with more lumpy nickel.

[0050] (5) Nickel corrosion test: 5 pieces were tested. After the nickel-gold plating was performed normally, the surface corrosion phenomenon of nickel was observed after the gold was removed by magnification of 3000: Excellent indicates that there are no corrosion points in the nickel layer; Good indicates that there are some corrosion points occasionally; Poor indicates that there are some corrosion points; Poor indicates that there are many corrosion points; Very poor indicates that the corrosion points are relatively dense.

[0051] Application Example 1: The gold plating solution for circuit boards prepared using the apparatus for preparing gold plating solution for circuit boards includes:

[0052] Sodium gold sulfite 8 g / L, dimethylaminoethyl acrylate 0.6 g / L, 6-aminopyrimidine-4-carboxylic acid 7.5 g / L, 3-aminopyridazine-4-carboxylic acid 22.5 g / L, 5-aminopyrazole-3-carboxylic acid ethyl ester 45 mg / L, N-[cis-3-aminocyclohexyl]carbamate tert-butyl ester 60 mg / L, 4-aminopyrazolo[3,4-d]pyrimidine 450 mg / L, sodium sulfate 20 g / L, the balance being deionized water;

[0053] pH 6.2, temperature 40℃, current density 2A / dm³ 2 Time: 25 minutes;

[0054] The test results were as follows: the uniformity and brightness of the electroplated gold layer were excellent, the plating cracks were excellent, the stability was excellent, and the nickel corrosion test was excellent.

[0055] Application Example 2: The gold plating solution for circuit boards prepared using the apparatus for preparing gold plating solution for circuit boards includes:

[0056] Sodium gold sulfite 5 g / L, dimethylaminoethyl acrylate 0.3 g / L, 6-aminopyrimidine-4-carboxylic acid 10 g / L, 3-aminopyridazine-4-carboxylic acid 30 g / L, ethyl 5-aminopyrazole-3-carboxylate 30 mg / L, N-[cis-3-aminocyclohexyl]carbamate tert-butyl ester 30 mg / L, 4-aminopyrazolo[3,4-d]pyrimidine 30 mg / L, sodium sulfate 15 g / L, the balance being deionized water;

[0057] pH 6.2, temperature 40℃, current density 2A / dm³ 2 Time: 25 minutes;

[0058] The test results were as follows: the uniformity and brightness of the electroplated gold layer were excellent, the plating cracks were excellent, the stability was excellent, and the nickel corrosion test was excellent.

[0059] Application Example 3: The gold plating solution for circuit boards prepared using the apparatus for preparing gold plating solution for circuit boards includes:

[0060] Sodium gold sulfite 11 g / L, dimethylaminoethyl acrylate 0.9 g / L, 6-aminopyrimidine-4-carboxylic acid 10 g / L, 3-aminopyridazine-4-carboxylic acid 30 g / L, ethyl 5-aminopyrazole-3-carboxylate 60 mg / L, N-[cis-3-aminocyclohexyl]carbamate tert-butyl ester 90 mg / L, 4-aminopyrazolo[3,4-d]pyrimidine 30-60 mg / L, sodium sulfate 25 g / L, the balance being deionized water;

[0061] pH 6.2, temperature 40℃, current density 2A / dm³ 2 Time: 25 minutes;

[0062] The test results were as follows: the uniformity and brightness of the electroplated gold layer were excellent, the plating cracks were excellent, the stability was excellent, and the nickel corrosion test was excellent.

[0063] Application Example 4: The gold plating solution for circuit boards prepared using the apparatus for preparing gold plating solution for circuit boards includes:

[0064] Sodium gold sulfite 8 g / L, dimethylaminoethyl acrylate 0.6 g / L, 6-aminopyrimidine-4-carboxylic acid 7.5 g / L, 3-aminopyridazine-4-carboxylic acid 22.5 g / L, 5-aminopyrazole-3-carboxylic acid ethyl ester 45 mg / L, N-[cis-3-aminocyclohexyl]carbamate tert-butyl ester 60 mg / L, 4-aminopyrazolo[3,4-d]pyrimidine 450 mg / L, sodium sulfate 20 g / L, the balance being deionized water;

[0065] pH 6.2, temperature 40℃, current density 0.1A / dm³ 2 Time: 50 minutes;

[0066] The test results were as follows: the uniformity and brightness of the electroplated gold layer were excellent, the plating cracks were excellent, the stability was excellent, and the nickel corrosion test was excellent.

[0067] Application Example 5: The gold plating solution for circuit boards prepared using the apparatus for preparing gold plating solution for circuit boards includes:

[0068] Sodium gold sulfite 8 g / L, dimethylaminoethyl acrylate 0.6 g / L, 6-aminopyrimidine-4-carboxylic acid 7.5 g / L, 3-aminopyridazine-4-carboxylic acid 22.5 g / L, 5-aminopyrazole-3-carboxylic acid ethyl ester 45 mg / L, N-[cis-3-aminocyclohexyl]carbamate tert-butyl ester 60 mg / L, 4-aminopyrazolo[3,4-d]pyrimidine 450 mg / L, sodium sulfate 20 g / L, the balance being deionized water;

[0069] pH 6.2, temperature 40℃, current density 4.5 A / dm³ 2 Time: 15 minutes;

[0070] The test results were as follows: the uniformity and brightness of the electroplated gold layer were excellent, the plating cracks were excellent, the stability was excellent, and the nickel corrosion test was excellent.

[0071] Comparative Example 1.

[0072] Sodium gold sulfite 8 g / L, 6-aminopyrimidine-4-carboxylic acid 7.5 g / L, 3-aminopyridazine-4-carboxylic acid 22.5 g / L, ethyl 5-aminopyrazole-3-carboxylate 45 mg / L, N-[cis-3-aminocyclohexyl]carbamate tert-butyl ester 60 mg / L, 4-aminopyrazolo[3,4-d]pyrimidine 450 mg / L, sodium sulfate 20 g / L, balance deionized water;

[0073] pH 6.2, temperature 40℃, current density 2A / dm³ 2 Time: 25 minutes;

[0074] Compared with Application Example 1, Comparative Example 1 lacked a stabilizer, and the test results were as follows: the uniformity and brightness of the electroplated gold layer were good, the plating cracks were excellent, the stability was good, and the nickel corrosion test was good.

[0075] Comparative Example 2.

[0076] Sodium gold sulfite 8 g / L, dimethylaminoethyl acrylate 0.6 g / L, 6-aminopyrimidine-4-carboxylic acid 7.5 g / L, 3-aminopyridazine-4-carboxylic acid 22.5 g / L, 5-aminopyrazole-3-carboxylic acid ethyl ester 45 mg / L, 4-aminopyrazolo[3,4-d]pyrimidine 450 mg / L, sodium sulfate 20 g / L, the balance being deionized water;

[0077] pH 6.2, temperature 40℃, current density 2A / dm³ 2 Time: 25 minutes;

[0078] Compared with Application Example 1, Comparative Example 2 lacked inhibitors, and the test results were as follows: the uniformity and brightness of the electroplated gold layer were good, the plating cracks were good, the stability was good, and the nickel corrosion test was good.

[0079] Comparative Example 3.

[0080] Sodium gold sulfite 8 g / L, dimethylaminoethyl acrylate 0.6 g / L, 6-aminopyrimidine-4-carboxylic acid 7.5 g / L, 3-aminopyridazine-4-carboxylic acid 22.5 g / L, ethyl 5-aminopyrazole-3-carboxylate 45 mg / L, N-[cis-3-aminocyclohexyl]carbamate tert-butyl ester 60 mg / L, sodium sulfate 20 g / L, balance deionized water;

[0081] pH 6.2, temperature 40℃, current density 2A / dm³ 2 Time: 25 minutes;

[0082] Compared with Application Example 1, Comparative Example 3 lacked a dispersant, and the test results were as follows: the uniformity and brightness of the electroplated gold layer were good, the plating cracks were good, the stability was good, and the nickel corrosion test was good.

[0083] Comparative Example 4.

[0084] Sodium gold sulfite 8 g / L, dimethylaminoethyl acrylate 0.6 g / L, ethyl 5-aminopyrazole-3-carboxylate 45 mg / L, N-[cis-3-aminocyclohexyl]carbamate tert-butyl ester 60 mg / L, 4-aminopyrazolo[3,4-d]pyrimidine 450 mg / L, conductive salt 20 g / L, balance deionized water;

[0085] pH 6.2, temperature 40℃, current density 2A / dm³ 2 Time: 25 minutes;

[0086] Compared with Application Example 1, Comparative Example 4 lacked a composite complexing agent, and the test results were as follows: the uniformity and brightness of the electroplated gold layer were good, the plating cracks were good, the stability was poor, and the nickel corrosion test was poor.

[0087] It is known that the gold salt used in this invention is sodium gold sulfite; the composite complexing agent is a combination of 6-aminopyrimidine-4-carboxylic acid and 3-aminopyridazine-4-carboxylic acid, with a concentration ratio of 1:3 during use. Traditional complexing agents mainly use cyanide ions or thiosulfate ions. Cyanide ions are difficult to treat due to environmental pressures. Thiosulfate ions are commonly used as a complexing agent for sodium gold sulfite, but due to their strong reducing properties, they are easily oxidized and decomposed, making long-term stable use impossible. In contrast, this application uses heterocyclic compounds combined with amino acids as complexing agents, which not only ensures long-term stability but is also unaffected by acids and alkalis, and subsequent wastewater treatment will not produce highly toxic products.

[0088] This invention uses dimethylaminoethyl acrylate as an accelerator. Traditional gold plating solutions rarely incorporate accelerators; they often increase current density or gold ion concentration to improve plating efficiency. However, this can lead to severe blackening and corrosion of the substrate, resulting in poor adhesion of the gold plating layer. To address this issue, an accelerator is added to the plating solution. This application utilizes an accelerator to accelerate deposition at low current densities, while also significantly improving uniformity, ensuring adhesion and metallic luster of the plating layer.

[0089] This invention uses N-[cis-3-aminocyclohexyl]carbamate tert-butyl ester as an inhibitor. The inhibitor can suppress excessively rapid and large gold nucleus growth, promote continuous nucleation, and improve the distribution efficiency of current density. Traditional gold plating solution inhibitors, however, can adsorb onto the gold layer, leading to slight brittleness and hindering gold plating, especially for high-current products. The inhibitor used in this application works synergistically with the dispersant 4-aminopyrazole[3,4-d]pyrimidine. While the dispersant primarily improves current density dispersion, the inhibitor can inhibit rapid gold particle deposition in higher current areas at the edges, thus achieving balanced growth. The stabilizer is 5-aminopyrazole-3-carbamate, which improves the stability of the plating solution and extends its service life to ensure normal production.

[0090] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0091] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any modifications, equivalent substitutions and improvements made by those skilled in the art within the scope of the technology disclosed in the present utility model, within the spirit and principles of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. An apparatus for preparing electroplating gold solution for circuit boards, characterized in that, The device includes storage tanks (19) for the components of the electroplating gold solution; The gold salt, accelerator, complexing agent, stabilizer, inhibitor, dispersant, conductive salt and deionized water placed at different time points are transported to the gold plating solution reaction chamber (2) by the gold plating solution component transfer pump (5), the gold plating solution component flow meter (6) and the first valve (7). A heater (3) is installed inside the electroplating gold solution reaction chamber (2). The stirring speed of the electroplating gold solution stirring device (8) is controlled by the stirring motor (13). The stirring motor (13) is connected to the electroplating gold solution preparation control terminal (12) and operates according to the control instructions of the electroplating gold solution preparation control terminal (12). Multiple temperature measuring probes (9) are arranged at the top, middle and bottom of the electroplating gold solution stirring device (8); the multiple temperature measuring probes (9) are connected to the electroplating gold solution temperature collector (11) via wireless or wired signals, and the electroplating gold solution temperature collector (11) is connected to the electroplating gold solution preparation control terminal (12) via signal. A pH meter (20) for monitoring the pH value of the gold plating solution is installed in the gold plating solution reaction chamber (2).

2. The apparatus for preparing electroplating gold solution for circuit boards according to claim 1, characterized in that, The frequency converter (4) for the dosage of each component of the gold plating solution is connected to the pump (5) for the delivery of each component of the gold plating solution and the control terminal (12) for the preparation of the gold plating solution. The heater (3) is connected to the electroplating solution preparation control terminal (12) and performs heating according to the control command of the electroplating solution preparation control terminal (12).

3. The apparatus for preparing electroplating gold solution for circuit boards according to claim 1, characterized in that, An electroplating gold solution sampling hole (1) is also provided outside the electroplating gold solution reaction chamber (2).

4. The apparatus for preparing electroplating gold solution for circuit boards according to claim 1, characterized in that, The bottom of the electroplating gold solution reaction chamber (2) is provided with an electroplating gold solution leakage discharge valve (10); the electroplating gold solution leakage discharge valve (10) is transported to the cooling chamber (14) through a pipeline; The electroplating gold solution mixture flowing out of the cooling chamber (14) is monitored for acidity and alkalinity by the electroplating gold solution component safety index monitor (15).

5. The apparatus for preparing electroplating gold solution for circuit boards according to claim 1, characterized in that, The electroplating gold solution component safety index monitor (15) is equipped with a manual shut-off valve. It flows through the outflow pipe to the electroplating gold solution outflow mixing flow meter (16). The outflow pipe is also equipped with an online monitoring instrument for the complexing agent index (17).

6. The apparatus for preparing electroplating gold solution for circuit boards according to claim 5, characterized in that, The flow meter (16) for the electroplating gold solution outflow mixture and the online monitoring instrument (17) for the complexing agent index send the monitored information to the data processing terminal (18).

7. The apparatus for preparing electroplating gold solution for circuit boards according to claim 1, characterized in that, The outer wall of the electroplating gold solution reaction chamber (2) is a heat insulation material layer, and the outflow pipe and the conveying pipes of each component of the electroplating gold solution are made of PPR material.

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