Inert gas protected semiconductor ball mill jar

Abstract

The application discloses an inert gas-protected semiconductor ball mill grinding tank, which comprises a grinding tank body, a supporting frame is arranged on the lower side of the grinding tank body, the grinding tank body comprises an outer protection tank, a protection cavity is arranged in the inner portion of the outer protection tank, the protection cavity is separated from a grinding cavity of the outer protection tank, and inert gas is stored in the protection cavity; a cover is bolted and arranged on the upper side of the grinding tank body; an inert gas storage box is arranged on the outer side of the grinding tank body; a monitoring module is further arranged on the side of the grinding tank body, away from a gas treatment mechanism, so as to monitor oxygen, moisture and pressure in the grinding tank body; and a discharge port is arranged on the lower end of the grinding tank body. The application has at least the following beneficial effects: inert gas can be continuously or on demand supplemented into the grinding cavity during the grinding process through the inert gas storage cavity and the gas inlet system arranged on the outer side of the grinding tank, oxygen and moisture can be effectively isolated, and the semiconductor material can be prevented from being oxidized or dampened during the grinding process.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing technology, and more specifically to a semiconductor ball mill grinding jar protected by inert gas. Background Technology

[0002] Ball milling is a common mechanical processing technique used in semiconductor material manufacturing to pulverize materials to the micron or nanometer scale to meet the particle size and uniformity requirements of specific applications. However, semiconductor materials (such as silicon, gallium arsenide, and gallium nitride) are extremely sensitive to the atmospheric environment and are prone to reacting with oxygen or moisture in the air during the milling process, leading to oxidation, moisture absorption, or contamination of the material surface, which in turn affects their electrical properties and the stability of subsequent processes.

[0003] Currently, common protection methods include performing ball milling operations in a glove box or pre-filling the grinding jar with inert gas. However, the former has high equipment costs, low operating efficiency, and is not easy to integrate with large ball milling equipment; the latter makes it difficult to continuously monitor and dynamically adjust the atmosphere during the grinding process, resulting in incomplete protection and serious gas waste. Existing grinding jars are prone to clogging due to powder accumulation during discharge, affecting discharge efficiency and process continuity.

[0004] Therefore, there is an urgent need for a semiconductor ball mill grinding jar that can monitor and automatically maintain an inert atmosphere in real time during the grinding process, while also having an efficient material discharge function, in order to improve process stability, material utilization and ease of operation. Utility Model Content

[0005] Therefore, this application provides an inert gas protected semiconductor ball milling jar to solve the problems existing in the prior art.

[0006] To achieve the above objectives, this application provides the following technical solution:

[0007] An inert gas protected semiconductor ball milling jar, comprising:

[0008] A grinding jar, wherein a support frame is installed on the lower side of the grinding jar;

[0009] The grinding tank includes an outer protective tank, and a protective cavity is provided inside the outer protective tank. The protective cavity is separated from the grinding cavity of the outer protective tank, and an inert gas is stored in the protective cavity.

[0010] The upper opening of the grinding tank is bolted with a cover.

[0011] An inert gas storage tank is installed on the outside of the grinding tank. An air inlet pipe is installed on the outside of the inert gas storage tank. The air inlet pipe is connected to the exhaust end of an external air pump. The air inlet end of the air pump is connected to the inert gas storage tank. A connecting ring pipe is connected to the inside of the inert gas storage tank. Several exhaust pipes are connected to the inside of the connecting ring pipe. The exhaust end of the exhaust pipe is located inside the grinding chamber of the grinding tank.

[0012] A monitoring module is also installed on the side of the grinding tank away from the gas processing mechanism to monitor the oxygen, moisture and pressure inside the grinding tank;

[0013] The lower end of the grinding tank is equipped with a discharge port.

[0014] Optionally, a gas processing mechanism is provided on the upper side of the inert gas storage tank, which is also located outside the grinding tank. The gas processing mechanism filters the gas discharged from the grinding tank.

[0015] Optionally, the gas handling mechanism includes an installation box, an oxygen desiccant plate is installed inside the installation box, and a dehumidifier plate installed inside the installation box is provided on the lower side of the oxygen desiccant plate.

[0016] Optionally, the mounting box is connected to the grinding chamber inside the grinding tank via a first solenoid valve, wherein the first solenoid valve is normally closed.

[0017] Optionally, the monitoring module includes a display module, and an integrated monitoring probe is electrically connected to the side of the display module facing the grinding tank. The end of the integrated monitoring probe is located inside the grinding chamber of the grinding tank.

[0018] Optionally, a fan, also installed in the mounting box, is provided on the lower side of the dehumidification plate.

[0019] Optionally, the exhaust pipe has an "L"-shaped outlet, and the exhaust pipe outlet faces downwards.

[0020] Optionally, a second solenoid valve is also installed on the outer side of the discharge port located inside the protective cavity.

[0021] Compared with the prior art, this application has at least the following beneficial effects:

[0022] 1. By setting an inert gas storage chamber and an air intake system on the outside of the grinding jar, inert gas can be continuously or as needed to be added to the grinding chamber during the grinding process, effectively isolating oxygen and moisture and preventing semiconductor materials from oxidizing or getting damp during the grinding process.

[0023] 2. Integrated oxygen, moisture and pressure sensors monitor the atmosphere in the grinding chamber in real time. Once an abnormal atmosphere is detected, the system automatically starts the air pump and exhaust valve to achieve dynamic replenishment of inert gas and waste gas treatment, thereby improving the accuracy and reliability of process control.

[0024] 3. The exhaust pipe is designed in an "L" shape with the air outlet facing downwards, which can blow away the powder at the bottom during discharge to prevent accumulation; at the same time, an auxiliary air intake structure is set at the discharge port to further prevent material blockage, ensure smooth discharge, and improve production efficiency. Attached Figure Description

[0025] To more intuitively illustrate the prior art and this application, exemplary drawings are provided below. It should be understood that the specific shapes and structures shown in the drawings should not generally be regarded as limiting conditions for implementing this application; for example, based on the technical concept disclosed in this application and the exemplary drawings, those skilled in the art are able to easily make conventional adjustments or further optimizations to the addition / reduction / classification, specific shapes, positional relationships, connection methods, size ratios, etc. of certain units (components).

[0026] Figure 1 A schematic diagram of the overall structure of a semiconductor ball mill grinding jar protected by inert gas provided in this application;

[0027] Figure 2 A schematic diagram of the overall structure of an inert gas protected semiconductor ball mill jar provided in this application from another perspective;

[0028] Figure 3 This is a schematic cross-sectional view of an inert gas protected semiconductor ball mill grinding jar provided in this application.

[0029] Explanation of reference numerals in the attached figures:

[0030] 1. Grinding tank; 101. Outer protective tank; 102. Protective cavity; 2. Cover; 3. Support frame; 4. Gas handling mechanism; 401. Mounting box; 402. Deoxygenating plate; 403. Dehumidifying plate; 404. Fan; 405. First solenoid valve; 5. Inert gas storage tank; 6. Inlet pipe; 7. Monitoring module; 701. Display module; 702. Integrated monitoring probe; 8. Discharge port; 9. Connecting ring pipe; 10. Exhaust pipe; 11. Second solenoid valve. Detailed Implementation

[0031] The present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0032] This utility model provides an inert gas protected semiconductor ball milling jar, including a grinding jar body 1. The grinding jar body 1, together with grinding balls not yet placed in the grinding jar body 1, performs grinding on semiconductor materials. Other power structures are used to achieve the ball milling process. This is a conventional technology and will not be described in detail.

[0033] A support frame 3 is installed on the lower side of the grinding tank 1;

[0034] The grinding tank 1 includes an outer protective tank 101, and a protective cavity 102 is provided inside the outer protective tank 101. The protective cavity 102 is separated from the grinding cavity of the outer protective tank 101, and an inert gas is stored in the protective cavity 102.

[0035] A cover 2 is bolted to the upper opening of the grinding tank 1 to seal the upper opening of the grinding tank 1;

[0036] An inert gas storage tank 5 is installed on the outside of the grinding tank 1. An air inlet pipe 6 is installed on the outside of the inert gas storage tank 5. The air inlet pipe 6 is connected to the exhaust end of an external air pump. The air inlet end of the air pump is connected to the inert gas storage tank, so that the air pump can discharge inert gas into the inert gas storage tank 5. A connecting ring pipe 9 is connected to the inside of the inert gas storage tank 5. Several exhaust pipes 10 are connected to the inside of the connecting ring pipe 9. The exhaust end of the exhaust pipe 10 is located in the grinding chamber of the grinding tank 1, so that inert gas can enter the grinding chamber of the grinding tank 1 to achieve atmosphere protection.

[0037] An inert gas storage tank 5 is provided on the upper side, which is also located outside the grinding tank 1, to discharge and filter the gas discharged from the grinding tank 1.

[0038] Specifically, the gas handling mechanism 4 includes an installation box 401, an oxygen desiccant plate 402 is installed inside the installation box 401, and a dehumidifying plate 403 installed inside the installation box 401 is provided on the lower side of the oxygen desiccant plate 402. The oxygen desiccant plate 402 is a honeycomb oxygen desiccant, mainly using an active metal catalyst, and the dehumidifying plate 403 is a molecular sieve.

[0039] The mounting box 401 is connected to the grinding chamber inside the grinding tank 1 through the first solenoid valve 405, and the first solenoid valve 405 is normally closed.

[0040] A monitoring module 7 is also installed on the side of the grinding tank 1 away from the gas handling mechanism 4 to monitor the oxygen, moisture and pressure inside the grinding tank 1. The monitoring module 7 includes a display module 701. An integrated monitoring probe 702 is electrically connected to the side of the display module 701 facing the grinding tank 1. The end of the integrated monitoring probe 702 is located inside the grinding chamber of the grinding tank 1. The integrated monitoring probe 702 is an integration of multiple probes.

[0041] Specifically, during the grinding process, the display module 701 uses the integrated monitoring probe 702 to continuously read the data from the oxygen, moisture, and pressure sensors. When the oxygen or moisture concentration is detected to exceed the preset safety threshold, the control circuit will simultaneously open the exhaust pipe 10, the first solenoid valve 405, and the external air pump to release inert gas to replenish the pressure. At the same time, the airflow is discharged through the gas processing mechanism 4.

[0042] A fan 404, which is also installed in the mounting box 401, is also provided on the lower side of the dehumidification plate 403. It actively discharges the gas in the mounting box 401 to the outside, reducing the possibility that the gas in the mounting box 401 will be injected into the grinding chamber in the grinding tank 1 when the first solenoid valve 405 is opened.

[0043] The lower end of the grinding tank 1 is equipped with a discharge port 8, which can discharge the ground powder in the grinding chamber of the grinding tank 1 without opening the cover 2;

[0044] The exhaust pipe 10 has an "L" shaped outlet and the outlet of the exhaust pipe 10 is opened downward. By opening the exhaust pipe 10, the powder at the bottom of the grinding tank 1 can be blown away, making it easier to discharge the material.

[0045] A second solenoid valve 11 is also installed on the outer side of the discharge port 8 inside the protective cavity 102. When the external air pump is started, the second solenoid valve 11 can be used to discharge inert gas from the discharge port 8 into the grinding chamber inside the grinding tank 1. At the same time, during the introduction process, the semiconductor material accumulated in the discharge port 8 can be blown out to ensure that it can be ball-milled.

[0046] The technical features of the above embodiments can be combined in any way (as long as there is no contradiction in the combination of these technical features). For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described; these embodiments not explicitly written should also be considered to be within the scope of this specification.

Claims

1. A semiconductor ball milling jar protected by inert gas, characterized in that, include: A grinding tank (1) is provided with a support frame (3) installed on its lower side; The grinding tank (1) includes an outer protective tank (101), and a protective cavity (102) is provided inside the outer protective tank (101). The protective cavity (102) is separated from the grinding cavity of the outer protective tank (101), and an inert gas is stored in the protective cavity (102). The upper opening of the grinding tank (1) is bolted with a cover (2); An inert gas storage tank (5) is installed on the outside of the grinding tank (1). An air inlet pipe (6) is installed on the outside of the inert gas storage tank (5). The air inlet pipe (6) is connected to the exhaust end of an external air pump. The air inlet end of the air pump is connected to the inert gas storage tank. A connecting ring pipe (9) is connected to the inside of the inert gas storage tank (5). Several exhaust pipes (10) are connected to the inside of the connecting ring pipe (9). The exhaust end of the exhaust pipe (10) is located inside the grinding chamber of the grinding tank (1). A monitoring module (7) is also installed on the side of the grinding tank (1) away from the gas processing mechanism (4) to monitor the oxygen, moisture and pressure inside the grinding tank (1); The lower end of the grinding tank (1) is equipped with a discharge port (8).

2. The semiconductor ball milling jar with inert gas protection according to claim 1, characterized in that, The inert gas storage tank (5) is equipped with a gas processing mechanism (4) located on the outside of the grinding tank (1), which filters the gas discharged from the grinding tank (1).

3. The semiconductor ball milling jar with inert gas protection according to claim 2, characterized in that, The gas handling mechanism (4) includes a mounting box (401), a deoxygenation plate (402) is installed inside the mounting box (401), and a dehumidification plate (403) installed inside the mounting box (401) is provided on the lower side of the deoxygenation plate (402).

4. The semiconductor ball milling jar with inert gas protection according to claim 3, characterized in that, The mounting box (401) is connected to the grinding chamber inside the grinding tank (1) through the first solenoid valve (405), and the first solenoid valve (405) is normally closed.

5. The semiconductor ball milling jar under inert gas protection according to claim 1, characterized in that, The monitoring module (7) includes a display module (701), which is electrically connected to an integrated monitoring probe (702) on the side of the display module (701) facing the grinding tank (1). The end of the integrated monitoring probe (702) is located inside the grinding chamber of the grinding tank (1).

6. The semiconductor ball milling jar under inert gas protection according to claim 3, characterized in that, A fan (404) is also installed in the mounting box (401) on the lower side of the dehumidification plate (403).

7. The semiconductor ball milling jar under inert gas protection according to claim 1, characterized in that, The exhaust pipe (10) has an "L" shaped outlet, and the exhaust pipe (10) has an outlet facing downwards.

8. The semiconductor ball milling jar with inert gas protection according to claim 1, characterized in that, The discharge port (8) is located on the outside of the protective cavity (102) and a second solenoid valve (11) is also installed.

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