Suspension particle cleaning system and semiconductor apparatus

Abstract

The utility model provides a kind of suspended particle cleaning system and semiconductor equipment, suspended particle cleaning system is used to remove suspended particle in the main cavity of semiconductor equipment, including cleaning cavity, chargeable disc, driving device, charging structure, purging device and controller, this suspended particle cleaning system utilizes electrostatic field active adsorption, can effectively remove suspended particle in the main cavity of semiconductor equipment that traditional filtration and artificial wiping are difficult to handle, entire cleaning process does not need artificial intervention, can be integrated into the production tempo of equipment, automatically executed in batch gap, greatly improve equipment utilization rate, and need not open equipment cavity, avoid secondary pollution caused by artificial intervention.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing technology, and more specifically, it relates to a suspended particle cleaning system and semiconductor equipment. Background Technology

[0002] In high-precision manufacturing fields such as semiconductors and flat panel displays, the cleanliness of the internal environment of production equipment is a key factor directly affecting product yield. These machines, such as the coating and developing machines (TRACK) in integrated circuit manufacturing, contain a large number of micron-sized suspended particles generated by mechanical movement and chemical volatilization within their process chambers. Once these particles deposit on wafers or substrates, they can cause pattern defects, leading to product performance failure or even scrapping. Therefore, achieving efficient and automated cleaning of suspended particles within the equipment chambers is crucial for ensuring continuous production, improving product yield, and reducing operating costs.

[0003] Currently, the cleaning and maintenance of the cavities in this type of equipment mainly relies on two methods. The first is passive filtration, which involves filtering the air supplied to the cavity using a high-efficiency filter to reduce the intrusion of external particles. The second is periodic manual intervention, which involves maintenance personnel entering the cavity during equipment downtime to manually wipe and clean it using tools.

[0004] However, the aforementioned existing technologies have the following obvious limitations: passive filtration cannot remove particles generated inside the equipment itself, and the filters cannot achieve 100% filtration, allowing fine particles to still enter and accumulate. Secondly, manual cleaning methods are inefficient, not only increasing machine downtime and affecting the overall utilization rate of the equipment, but also exhibiting highly unstable cleaning results, failing to effectively remove tiny particles that are difficult to see with the naked eye, or even liquid droplets formed by vapor condensation. Utility Model Content

[0005] This invention provides a suspended particle cleaning system and a semiconductor device, which can effectively clean suspended particles inside the device cavity.

[0006] The technical solution adopted by this utility model to solve its technical problem is as follows: The first aspect of this utility model provides a suspended particle cleaning system for removing suspended particles from the main cavity of a semiconductor device, comprising: The cleaning chamber is located inside the main cavity of the semiconductor device or is connected to the main cavity of the semiconductor device; A rechargeable disk is movably disposed in the cleaning chamber, the rechargeable disk having at least two adsorption areas that can be independently applied with charges of different polarities; A driving device is used to drive the rechargeable disk to move within the main cavity of the semiconductor device; A charging structure, electrically connected to the rechargeable disk, is used to selectively apply positive or negative charges to the adsorption area of ​​the rechargeable disk; A purging device for spraying airflow into the rechargeable disk located within the cleaning chamber; The controller is communicatively connected to the drive device, the charging structure, and the purging device, and is used to control the charging structure to charge the rechargeable disk, control the drive device to move the charged rechargeable disk within the main cavity of the semiconductor device to adsorb suspended particles, and control the operation of the purging device.

[0007] In one embodiment, the adsorption region includes a first region and a second region, which are isolated from each other by an insulating region; the charging structure includes a plurality of charging contacts, which are electrically connected to the first region and the second region respectively to achieve independent charging.

[0008] In one embodiment, the rechargeable disk includes an upper structure and a lower structure stacked together, wherein the outer ring of the upper structure is an insulating element, and the lower structure is an insulating element.

[0009] In one embodiment, the outer contour of the rechargeable disk is circular.

[0010] In one embodiment, the suspended particle cleaning system further includes a voltage sensor for detecting the potential of each adsorption area of ​​the rechargeable disk; the controller is communicatively connected to the voltage sensor, and the controller controls the charging process of the charging structure based on the potential signal fed back by the voltage sensor.

[0011] In one embodiment, the charging structure includes a first set of switches and a second set of switches; when the first set of switches is closed, a positive charge is applied to the first region and a negative charge is applied to the second region; when the second set of switches is closed, a negative charge is applied to the first region and a positive charge is applied to the second region.

[0012] In one embodiment, the controller is communicatively connected to the main controller of the semiconductor device's main cavity, and the controller is used to receive a cleaning trigger signal from the main controller.

[0013] In one embodiment, the cleaning chamber is provided with an openable and closable chamber door; the controller is electrically connected to the chamber door, and the controller is used to open the chamber door before the rechargeable disk enters the semiconductor device chamber to perform adsorption, and to close the chamber door after the rechargeable disk returns to the cleaning chamber.

[0014] In one embodiment, the cleaning chamber is connected to an exhaust system, and the purging device is a high-purity purging valve.

[0015] The second aspect of this utility model provides a semiconductor device, including a main cavity, wherein a suspended particle cleaning system is provided in the main cavity, and the suspended particle cleaning system is as described above.

[0016] The floating particle cleaning system provided by this utility model is used to remove suspended particles in the main cavity of a semiconductor device. It includes a cleaning cavity, a rechargeable disk, a drive device, a charging structure, a blowing device, and a controller. The cleaning cavity is disposed inside or connected to the main cavity of the semiconductor device. The rechargeable disk is movably disposed in the cleaning cavity and has at least two adsorption areas that can be independently charged with different polarities. The drive device is used to move the rechargeable disk within the main cavity of the semiconductor device. The charging structure is electrically connected to the rechargeable disk and is used to selectively apply positive or negative charges to the adsorption areas of the rechargeable disk. The blowing device is used to spray airflow onto the rechargeable disk located within the cleaning cavity. The controller is communicatively connected to the drive device, the charging structure, and the blowing device, and is used to control the charging structure to charge the rechargeable disk, control the drive device to move the charged rechargeable disk within the main cavity of the semiconductor device to adsorb suspended particles, and control the operation of the blowing device. This suspended particulate cleaning system utilizes electrostatic field for active adsorption, effectively removing suspended particles that are difficult to handle with traditional filtration and manual wiping. The entire cleaning process requires no manual intervention, avoiding secondary pollution caused by human intervention. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the suspended particle cleaning system provided in an embodiment of the present invention; Figure 2 A schematic diagram of the drive device for the suspended particle cleaning system provided in this embodiment of the utility model; Figure 3 A schematic diagram showing the polarity of the internal particles and the polarity of the rechargeable disk adsorption area of ​​the semiconductor device main cavity before, during and after cleaning, as provided in this embodiment of the utility model. Figure 4 A top view of the rechargeable disk of the suspended particle cleaning system provided in an embodiment of this utility model; Figure 5 A side view of the rechargeable disk of the suspended particle cleaning system provided in an embodiment of this utility model.

[0019] The following are the labeling elements in the figure: 1-Cleaning chamber; 2-Rechargeable disk; 3-Drive device; 4-Charging structure; 5-Blowing device; 6-Controller; 21-Adsorption area; 22-Upper structure; 23-Lower structure; 211-Second area; 212-Second area. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0021] In the description of this utility model, it should be understood that the terms "comprising" and "having" as used herein, and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.

[0022] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. It should be understood that the term "and / or" as used herein is merely a description of the relationship between related objects, indicating that three relationships may exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. In the description of this utility model, unless otherwise stated, "multiple" means two or more.

[0024] Currently, the cleaning and maintenance of semiconductor equipment cavities mainly relies on two methods: passive filtration, which uses high-efficiency filters to filter the air supplied to the cavity to reduce the intrusion of external particles; and periodic manual intervention, where maintenance personnel manually wipe and clean the interior of the cavity using tools during equipment downtime. However, the above-mentioned existing technologies have the following obvious limitations: passive filtration cannot remove particles generated within the equipment itself, and filters cannot achieve 100% filtration, allowing fine particles to still enter and accumulate. Furthermore, manual cleaning is inefficient, increasing machine downtime and affecting overall equipment utilization, and the cleaning effect is extremely unstable, failing to effectively remove microparticles that are difficult to see with the naked eye, or even liquid droplets formed by vapor condensation. This application addresses these problems by providing a suspended particle cleaning system and semiconductor equipment.

[0025] The suspended particle cleaning system and semiconductor equipment provided by this utility model will be described in detail below with reference to specific embodiments.

[0026] Figure 1 This is a schematic diagram of the suspended particle cleaning system provided in an embodiment of the present invention. Figure 2 Please refer to the structural schematic diagram of the drive device of the suspended particle cleaning system provided in this embodiment of the utility model. Figure 1 , Figure 2 The first aspect of this utility model provides a suspended particle cleaning system for removing suspended particles from the main cavity of a semiconductor device. The suspended particle cleaning system includes a cleaning cavity 1, a rechargeable disk 2, a driving device 3, a charging structure 4, a blowing device 5, and a controller 6. The cleaning cavity 1 is disposed inside or connected to the main cavity of the semiconductor device. The rechargeable disk 2 is movably disposed in the cleaning cavity 1, and the rechargeable disk 2 has at least two adsorption areas 21 that can be independently charged with different polarities. The driving device 3 is used to drive the rechargeable disk 2 to move within the device cavity. The charging structure 4 is electrically connected to the rechargeable disk 2 and is used to charge the rechargeable disk 2. The adsorption region 21 is selectively charged with positive or negative charge; the purging device 5 is used to spray airflow onto the rechargeable disk 2 located in the cleaning chamber 1; the controller 6 is communicatively connected to the drive device 3, the charging structure 4 and the purging device 5, and the controller 6 is configured to: control the charging structure 4 to charge the rechargeable disk 2 so that different adsorption regions carry different polarity charges; control the drive device 3 to drive the charged rechargeable disk 2 to move in the main cavity of the semiconductor device to adsorb suspended particles; after adsorption is completed, control the charging structure 4 to apply a reverse charge to the rechargeable disk 2 and make the purging device 5 work to remove the particles adsorbed on the rechargeable disk 2.

[0027] In this embodiment, the cleaning chamber 1 is fixedly installed inside or on the side wall of the main chamber of a semiconductor device (such as a coating and developing machine), and communicates with the main chamber through an opening. Its internal space is sufficient to accommodate the rechargeable disk 2 and provide space for charging, purging and other operations. The chamber material is usually stainless steel or anodized aluminum alloy to ensure cleanliness and corrosion resistance.

[0028] In this embodiment, the rechargeable disk 2 is the core component for particle adsorption, and its body is made of insulating material (such as high-purity ceramic, Teflon, etc.). At least two conductive areas are provided on the disk surface, such as copper or aluminum electrodes formed by etching or embedding processes. These areas are electrically isolated from each other, constituting the adsorption area. Exemplarily, the adsorption area 21 includes a first area and a second area, which are isolated from each other by an insulating region. The charging structure 4 includes multiple charging contacts, which are electrically connected to the first and second areas respectively to achieve independent charging.

[0029] The drive device 3 in this embodiment can be the original robotic arm used for transferring wafers, or it can be a small, independent robotic arm specially configured for this system. Its function is to accurately remove the rechargeable disk 2 from the cleaning chamber 1, move it in the main chamber along a predetermined path, and finally send it back to the cleaning chamber 1.

[0030] For example, the charging structure 4 of this embodiment includes a power supply, a control circuit, and charging contacts disposed in the cleaning cavity 1. The positions of these contacts correspond one-to-one with the adsorption areas on the rechargeable disk 2. When the disk returns to the fixed position of the cleaning cavity 1, the contacts reliably contact the adsorption areas, thereby applying charge to the adsorption areas.

[0031] For example, the purging device 5 in this embodiment is a high-purity purging valve connected to ultra-clean dry air. The valve is installed on the top or side of the cleaning chamber 1, and its nozzle is aligned with the position of the rechargeable disk 2 to spray extremely clean dry air.

[0032] The controller 6 in this embodiment typically consists of a programmable logic controller or an industrial computer. It is connected to the drive unit 3, the charging structure 4, the purging device 5, and other optional sensors via communication lines to execute preset control logic.

[0033] Figure 3 For illustration of the polarity of particulate matter and the polarity of the rechargeable disk adsorption area inside the main cavity of the semiconductor device before, during, and after cleaning, as provided in this embodiment of the utility model, please refer to the diagram. Figure 1-3The working principle of the suspended particle cleaning system in this embodiment is based on the principle of electrostatic adsorption and charge neutralization. Its automated workflow is as follows: Initialization and charging: The controller 6 first issues a command to activate the charging structure 4, applying positive and negative charges to different adsorption areas of the rechargeable disk 2 through the charging contacts. For example, the first area is positively charged, and the second area is negatively charged. Motion adsorption: After charging is completed, the controller 6 commands the drive device 3 to operate. The drive device 3 grabs the charged rechargeable disk 2, sends it into the main cavity, and moves it along a predetermined trajectory. Since the suspended particles (such as dust and chemical droplets) in the main cavity usually carry a certain charge or are uncharged, when they encounter the strongly electrostatically charged rechargeable disk 2, they are attracted by the opposite charge or are firmly adsorbed onto its surface through inductive charging. Positively charged areas adsorb negatively charged particles, and negatively charged areas adsorb positively charged particles. Return and desorption: After the adsorption process is completed, the drive device 3 sends the rechargeable disk 2, which is full of particles, back to the cleaning cavity 1. Subsequently, the controller 6 controls the charging structure 4 to apply a reverse charge to the rechargeable disk 2. That is, the previously positively charged first area is changed to a negative charge, and the previously negatively charged second area is changed to a positive charge. This transforms the electrostatic attraction between the adsorption area and the adsorbed particles into an electrostatic repulsion, causing the particles to detach from the disk surface. Purge and discharge: Simultaneously or after applying the reverse charge, the controller 6 opens the high-purity purge valve. The high-purity purge valve airflow is sprayed onto the surface of the rechargeable disk 2, blowing up the detached particles, which are then discharged from the equipment through the exhaust system connected to the cleaning chamber 1, completing a full cleaning cycle.

[0034] This suspended particle cleaning system utilizes electrostatic field for active adsorption, effectively removing micron-sized suspended particles that are difficult to handle with traditional filtration and manual wiping. The entire cleaning process requires no manual intervention and can be integrated into the equipment's production process, automatically executing between batches, greatly improving equipment utilization. Moreover, the cleaning process does not require opening the equipment cavity, avoiding secondary pollution and production interruptions caused by manual intervention, and ensuring continuous and stable production processes.

[0035] Figure 4 For a schematic diagram of the rechargeable disk of the suspended particle cleaning system provided in this embodiment of the utility model, please refer to 1- Figure 4In this embodiment, the adsorption region 21 includes a first region 211 and a second region 212, which are isolated by an insulating region. The charging structure 4 includes multiple charging contacts 41, which are electrically connected to the first region 211 and the second region 212 respectively to achieve independent charging. Exemplarily, in the manufacturing of the rechargeable disk 2, two metal electrodes (such as copper sheets) are embedded in an insulating substrate with a gap in between to form an insulating region. Two sets of spring probes are positioned correspondingly within the cleaning cavity 1 as charging contacts 41. When the disk is returned to its original position, the two sets of probes reliably contact the two electrodes respectively. The combination structure of the rechargeable disk 2 and the charging structure 4 in this embodiment is simple and reliable, achieving independent and precise control of charge, ensuring the simultaneous existence of positive and negative electric fields, and expanding the types of particles that can be adsorbed.

[0036] Figure 5 A side view of the rechargeable disk of the suspended particle cleaning system provided in this embodiment of the present invention, please refer to 4 and Figure 5 Preferably, the rechargeable disk 2 includes a stacked upper structure 22 and a lower structure 23. The outer ring of the upper structure 22 is an insulating component, and the lower structure 23 is also an insulating component. In this embodiment, the rechargeable disk moves at high speed within the main cavity of the semiconductor device, coming very close to, or even occasionally slightly touching, the inner wall of the cavity or other metal components. If the edge of the disk or the lower layer is conductive, contact with the grounded cavity will cause a high-voltage short circuit to ground. The arc discharge during the short circuit will vaporize local metal, generating metal particulate contaminants and causing secondary pollution. In this embodiment, the lower structure 23 of the rechargeable disk 2 is an insulating component, ensuring that a direct electrical short circuit does not occur when the rechargeable disk 2 approaches or contacts the bottom of the cavity or other surfaces. The upper layer of the rechargeable disk 2 is an adsorption surface, including a charged first region 211 and a charged second region 212. The outer ring is the part of the disk most likely to scrape against the side wall of the cavity. Setting the outer ring as an insulating material forms an insulating buffer zone, effectively avoiding the risk of direct contact between the charged area and the cavity even if scraping occurs. The rechargeable disk 2 in this embodiment greatly improves the electrical safety and reliability of the system operation, and fundamentally eliminates the risk of short circuit failure and the generation of new pollution sources caused by physical contact.

[0037] Preferably, the rechargeable disk 2 has a circular outer contour. The end gripper of the wafer transfer robot is specifically designed for grasping and moving circular wafers. In this embodiment, the rechargeable disk 2 is also designed to be circular, allowing the wafer transfer robot to move the rechargeable disk 2 directly, eliminating the need to design, install, and calibrate a dedicated, complex gripping mechanism for the cleaning system. This greatly simplifies the system structure and reduces hardware costs and installation complexity. When the robot arm drives the rechargeable disk 2 at high speed within the cavity filled with process gas, the circular contour effectively reduces the generation of air turbulence and eddies. Sharp edges easily generate eddies, which can stir up and stir up particles that have already settled at the bottom of the cavity or on components, causing "secondary pollution." The circular shape of the rechargeable disk 2 ensures stable airflow during movement.

[0038] In one specific embodiment, the suspended particle cleaning system further includes a voltage sensor 42 for detecting the potential of each adsorption area of ​​the rechargeable disk 2; the controller 6 is communicatively connected to the voltage sensor 42 and is configured to control the charging of the charging structure 4 based on the potential signal fed back by the voltage sensor 42. Further, the controller 6 is configured to: control charging until the potential of the adsorption area 21 reaches a preset value before adsorbing particles; and control charging until the potential of the adsorption area 21 returns to zero after particle removal. In this embodiment, the voltage sensor 42 monitors the potential of the adsorption area 21 in real time during charging. When a preset voltage value sufficient to generate adsorption force is reached, the controller 6 commands charging to stop and begins adsorption. During post-cleaning reset, the voltage sensor 42 confirms that the potential has returned to zero, ensuring that the rechargeable disk 2 is not charged, preparing for the next operation. This suspended particle cleaning system avoids the risk of insufficient adsorption force due to undercharging or breakdown caused by overcharging, improving the system's reliability.

[0039] In one specific embodiment, the charging structure 4 includes a first set of switches and a second set of switches. When the first set of switches is closed, the first region 211 is applied with a positive charge, and the second region 212 is applied with a negative charge. When the second set of switches is closed, the first region 211 is applied with a negative charge, and the second region 212 is applied with a positive charge. The charging structure 4 in this embodiment includes a first set of switches and a second set of switches, and the switching of charge polarity is achieved through the combination of switches. For example, please refer to [link to example]. Figure 1Two sets of relays or solid-state switches are used in the circuit: a first set of switches (A1, A2) and a second set of switches (B1, B2). Switch A1 of the first set connects the positive terminal of the power supply to the first region 211, and switch A2 connects the negative terminal to the second region 212. Switch B1 of the second set connects the negative terminal of the power supply to the first region 211, and switch B2 connects the positive terminal to the second region 212. The controller 6 reverses the charge polarity of the first region 211 and the second region 212 by controlling the on / off state of these two sets of switches. This embodiment provides a simple, low-cost, and reliable polarity switching circuit scheme.

[0040] Furthermore, the controller 6 is communicatively connected to the main controller of the main cavity, and the controller 6 is configured to receive a cleaning trigger signal from the main controller. For example, the controller 6 of this system is connected to the main PLC of the coating and developing machine via an industrial bus such as Ethernet or RS485. This embodiment achieves system-level linkage. The main controller can send a cleaning trigger signal after each batch of wafers is processed, or based on the machine status (such as a particle sensor alarm), making the cleaning process an automated part of the entire manufacturing process and achieving intelligent management.

[0041] Furthermore, the cleaning chamber is connected to an exhaust system, the purging device 5 is a high-purity purging valve, and the cleaning chamber 1 is equipped with an openable and closable chamber door. The controller 6 is configured to open the chamber door before the rechargeable disk 2 enters the equipment chamber to perform adsorption, and to close the chamber door after the rechargeable disk 2 returns to the cleaning chamber 1. In this embodiment, the cleaning chamber 1 of the suspended particle cleaning system is connected to an exhaust system, the purging device 5 is a high-purity purging valve, and it is equipped with an openable and closable chamber door. The chamber door can be a pneumatic or electric gate, which opens when the rechargeable disk 2 enters or exits and closes when purging is performed in the cleaning chamber 1, forming a sealed space. The sealed space can ensure that the high concentration of particles generated during purging is effectively guided to the exhaust system and completely discharged, thoroughly preventing secondary pollution of the high-purity purging valve caused by particles escaping back to the main chamber, and ensuring the cleanliness of the purging medium itself.

[0042] A second aspect of this utility model provides a semiconductor device, including a main cavity, wherein a suspended particle cleaning system is provided in the main cavity, and the suspended particle cleaning system is as described above.

[0043] For example, a floating particle cleaning system includes: a cleaning chamber, which is located inside or connected to the main cavity of a semiconductor device; A rechargeable disk is movably disposed in the cleaning chamber, the rechargeable disk having at least two adsorption areas that can be independently applied with charges of different polarities; A driving device is used to drive the rechargeable disk to move within the main cavity of the semiconductor device; A charging structure, electrically connected to the rechargeable disk, is used to selectively apply positive or negative charges to the adsorption area of ​​the rechargeable disk; A purging device for spraying airflow into the rechargeable disk located within the cleaning chamber; The controller is communicatively connected to the drive device, the charging structure, and the purging device, and is used to control the charging structure to charge the rechargeable disk, control the drive device to move the charged rechargeable disk within the main cavity of the semiconductor device to adsorb suspended particles, and control the operation of the purging device.

[0044] This semiconductor equipment's suspended particle cleaning system utilizes electrostatic field adsorption to effectively remove micron-sized suspended particles that are difficult to handle with traditional filtration and manual wiping within the main cavity of the semiconductor equipment. The entire cleaning process requires no manual intervention and can be integrated into the equipment's production process, automatically executing between batches, greatly improving equipment utilization. Moreover, the cleaning process does not require opening the equipment cavity, avoiding secondary contamination and production interruptions caused by manual intervention, and improving product yield.

[0045] In the above description, the terms "an embodiment," "some embodiments," "example," "specific example," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0046] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A suspended particle cleaning system for removing suspended particles from the main cavity of a semiconductor device, characterized in that, include: The cleaning chamber is located inside the main cavity of the semiconductor device or is connected to the main cavity of the semiconductor device; A rechargeable disk is movably disposed in the cleaning chamber, the rechargeable disk having at least two adsorption areas that can be independently applied with charges of different polarities; A driving device is used to drive the rechargeable disk to move within the main cavity of the semiconductor device; A charging structure, electrically connected to the rechargeable disk, is used to selectively apply positive or negative charges to the adsorption region of the rechargeable disk; A purging device for spraying airflow into the rechargeable disk located within the cleaning chamber; The controller is communicatively connected to the drive device, the charging structure, and the purging device, and is used to control the charging structure to charge the rechargeable disk, control the drive device to move the charged rechargeable disk within the main cavity of the semiconductor device to adsorb suspended particles, and control the operation of the purging device.

2. The suspended particulate cleaning system according to claim 1, characterized in that: The adsorption area includes a first area and a second area, which are isolated from each other by an insulating region; the charging structure includes a plurality of charging contacts, which are electrically connected to the first area and the second area respectively to achieve independent charging.

3. The suspended particulate cleaning system according to claim 1, characterized in that: The rechargeable disk includes an upper structure and a lower structure stacked together, wherein the outer ring of the upper structure is an insulating component, and the lower structure is an insulating component.

4. The suspended particulate cleaning system according to claim 1, characterized in that: The rechargeable disk has a circular outer contour.

5. The suspended particulate cleaning system according to claim 1, characterized in that: The suspended particle cleaning system also includes a voltage sensor for detecting the potential of each adsorption area of ​​the rechargeable disk; the controller is communicatively connected to the voltage sensor, and the controller controls the charging process of the charging structure based on the potential signal fed back by the voltage sensor.

6. The suspended particulate cleaning system according to claim 2, characterized in that: The charging structure includes a first set of switches and a second set of switches; when the first set of switches is closed, the first region is applied with a positive charge and the second region is applied with a negative charge; when the second set of switches is closed, the first region is applied with a negative charge and the second region is applied with a positive charge.

7. The suspended particulate cleaning system according to claim 1, characterized in that: The controller is communicatively connected to the main controller of the main cavity of the semiconductor device, and the controller is used to receive cleaning trigger signals from the main controller.

8. The suspended particulate cleaning system according to claim 1, characterized in that: The cleaning chamber is equipped with an openable and closable chamber door; the controller is electrically connected to the chamber door, and the controller is used to open the chamber door before the rechargeable disk enters the semiconductor device chamber to perform adsorption, and to close the chamber door after the rechargeable disk returns to the cleaning chamber.

9. The suspended particulate cleaning system according to any one of claims 1-8, characterized in that: The cleaning chamber is connected to an exhaust system, and the purging device is a high-purity purging valve.

10. A semiconductor device, characterized in that: It includes a main cavity, and a suspended particle cleaning system is provided in the main cavity, wherein the suspended particle cleaning system is the suspended particle cleaning system according to any one of claims 1-9.

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