Nozzle standby containing cleaning device

Abstract

The utility model belongs to the technical field of semiconductor equipment gluing process, concretely is a kind of nozzle standby containing cleaning device, including nozzle standby containing box, cleaning fluid conveying device, cleaning fluid conveying on-off valve, protective gas conveying device, gas flow regulating switch structure. Wherein gas flow regulating switch structure includes high-flow gas on-off valve and low-flow gas on-off valve. The utility model can control the cleaning height of cleaning fluid when equipment is processed, and nozzle can be dried and nozzle drop is inhibited, and when equipment is not processed, the air outlet of protective gas conveying passage can spray micro-flow gas to keep the internal gas of nozzle standby containing mouth positive pressure, on the one hand, inhibit nozzle standby containing mouth to evaporate to process cavity to reduce process defect, on the other hand, inhibit cleaning fluid and other micro-droplets to evaporate to nozzle to cause previous photoresist dilution, avoid first piece film thickness anomaly, effectively improve wafer processing quality.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor equipment coating process technology, specifically a nozzle standby receiving and cleaning device. Background Technology

[0002] In semiconductor equipment coating processes, the purpose of the nozzle standby position in existing technologies is to prevent crystallization inside the nozzles due to prolonged inactivity when the machine is idle. This often involves periodically cleaning the nozzles. However, some special photoresists and solvents used during cleaning have strong evaporation capabilities (such as PI and SOD), which can easily cause a large amount of liquid spray to evaporate from the nozzle standby position, contaminating the nozzle and coating chamber. This can lead to defects at the wafer center during coating. Furthermore, the strong evaporation of solvents can easily cause the solvent vapor to dilute the photoresist at the nozzle tip, resulting in a first-wafer effect and abnormally low coating thickness at the wafer pivot point. Both of these situations significantly impact wafer yield. Utility Model Content

[0003] To address the aforementioned problems, the purpose of this utility model is to provide a nozzle standby receiving and cleaning device.

[0004] The objective of this utility model is achieved through the following technical solution: A nozzle standby receiving and cleaning device includes a nozzle standby receiving box, a cleaning fluid delivery device, a cleaning fluid delivery switch valve, a protective gas delivery device, and a gas flow regulation and switching structure. The nozzle standby receiving box has a nozzle standby receiving port inside, and the axial center line of the nozzle standby receiving port is perpendicular to the horizontal plane. The nozzle standby receiving box also has at least one cleaning fluid delivery channel inside, each of which has an inlet and an outlet. The outlet of each cleaning fluid delivery channel is connected to the nozzle standby receiving port. The nozzle standby receiving box also has at least one protective gas delivery channel inside, each of which has an inlet and an outlet. The outlet of each protective gas delivery channel is connected to the nozzle standby receiving port. The outlets of all protective gas delivery channels and the outlets of all cleaning fluid delivery channels are respectively aligned with the bottom end of the nozzle extending into the nozzle standby receiving port. The height of the outlet of each protective gas delivery channel is higher than the height of the outlet of each cleaning fluid delivery channel. The cleaning fluid delivery device has a liquid input end and a liquid output end. The liquid input end of the cleaning fluid delivery device is connected to an external cleaning fluid source. The liquid output end of the cleaning fluid delivery device is connected to one end of the cleaning fluid delivery switch valve through a pipeline. The other end of the cleaning fluid delivery switch valve is connected to the inlet of all the cleaning fluid delivery channels. The protective gas delivery device has a gas input end and a gas output end. The gas input end of the protective gas delivery device is connected to an external protective gas source, and the gas output end of the protective gas delivery device is connected to the air inlets of all the protective gas delivery channels through a gas flow regulation and switching structure.

[0005] The jet nozzles of all the protective gas delivery channels are evenly arranged circumferentially along the nozzle standby receiving port.

[0006] The gas flow regulation and switching structure includes a high-flow gas switch valve and a low-flow gas switch valve. The gas output end of the protective gas delivery device is connected to one end of the high-flow gas switch valve and one end of the low-flow gas switch valve, respectively. The other end of the high-flow gas switch valve is connected to the air inlet of all the protective gas delivery channels, and the other end of the low-flow gas switch valve is connected to the air inlet of all the protective gas delivery channels.

[0007] The advantages and positive effects of this utility model are as follows: This invention can control the cleaning height of the cleaning fluid during the process and dry the nozzles and suppress nozzle dripping. When the equipment is not in operation, the jet nozzle of the protective gas delivery channel can spray a small flow of gas to maintain positive pressure inside the nozzle standby receiving port. On the one hand, it can suppress the evaporation of the nozzle standby receiving port into the process cavity to reduce process defects. On the other hand, it can suppress the evaporation of micro-droplets such as cleaning fluid into the nozzle to cause dilution of the front-end photoresist, avoid abnormal film thickness of the first wafer, and effectively improve the wafer processing quality. Attached Figure Description

[0008] Figure 1 This is a schematic diagram illustrating the overall principle of this utility model; Figure 2 This is a schematic diagram of the nozzle standby receiving box of this utility model; Figure 3 This is a schematic diagram of the nozzle standby receiving box of this utility model during cleaning; Figure 4 This is a schematic diagram of the nozzle standby receiving box of this utility model under micro-pressure protection after cleaning.

[0009] In the diagram: 1 is the nozzle standby receiving box, 101 is the nozzle standby receiving port, 102 is the cleaning fluid delivery channel, and 103 is the protective gas delivery channel; 2 is a cleaning fluid delivery device, 3 is a cleaning fluid delivery switch valve, 4 is a protective gas delivery device, 5 is a high-flow gas switch valve, and 6 is a low-flow gas switch valve; 001 is the nozzle. Detailed Implementation

[0010] The following is in conjunction with the appendix Figures 1-4 The present invention will be described in further detail.

[0011] A nozzle standby receiving cleaning device, such as Figures 1-4 As shown, this embodiment includes a nozzle standby receiving box 1, a cleaning fluid delivery device 2, a cleaning fluid delivery switch valve 3, a protective gas delivery device 4, and a gas flow regulation and switching structure.

[0012] The nozzle standby receiving box 1 has a nozzle standby receiving port 101 inside. The axial center line of the nozzle standby receiving port 101 is perpendicular to the horizontal plane. The specific shape of the nozzle standby receiving port 101 can be arbitrarily set according to the shape of the corresponding nozzle 001 and the usage requirements according to the existing technology.

[0013] The nozzle standby receiving box 1 has at least one cleaning fluid delivery channel 102 inside. Each cleaning fluid delivery channel 102 has an inlet and an outlet, and the outlet of each cleaning fluid delivery channel 102 is connected to the nozzle standby receiving port 101. The number of cleaning fluid delivery channels 102 can be arbitrarily set according to the usage requirements and existing technology. The nozzle standby receiving box 1 also has several protective gas delivery channels 103 inside. Each protective gas delivery channel 103 has an inlet and an outlet, and the outlet of each protective gas delivery channel 103 is connected to the nozzle standby receiving port 101. The outlets of all protective gas delivery channels 103 and the outlets of all cleaning fluid delivery channels 102 are respectively aligned with the bottom end of the nozzle 001 that extends into the nozzle standby receiving port 101. The height of the outlet of each protective gas delivery channel 103 is higher than the height of the outlet of each cleaning fluid delivery channel 102.

[0014] The cleaning fluid delivery device 2 has a liquid inlet and a liquid outlet. The liquid inlet of the cleaning fluid delivery device 2 is connected to an external cleaning fluid source. The liquid outlet of the cleaning fluid delivery device 2 is connected to one end of the cleaning fluid delivery switch valve 3 via a pipeline. The other end of the cleaning fluid delivery switch valve 3 is connected to the inlet of each of the cleaning fluid delivery channels 102. In this embodiment, the cleaning fluid delivery device 2 and the cleaning fluid delivery switch valve 3 are commercially available products. For example, the cleaning fluid delivery device 2 can be a liquid pump commonly used in semiconductor equipment, and the cleaning fluid delivery switch valve 3 can be a commercially available solenoid valve. The cleaning fluid delivery device 2 and the cleaning fluid delivery switch valve 3 are controlled by the control system of the corresponding semiconductor equipment. In this embodiment, the external cleaning fluid source is set using existing technology, and the corresponding cleaning fluid is selected according to the properties of the photoresist material in the process.

[0015] The protective gas delivery device 4 has a gas input end and a gas output end. The gas input end of the protective gas delivery device 4 is connected to an external protective gas source, and the gas output end of the protective gas delivery device 4 is connected to the air inlets of all protective gas delivery channels 103 through a gas flow regulation and switching structure. In this embodiment, the protective gas delivery device 4 can be a commercially available product, such as a gas pump commonly used in semiconductor equipment. The protective gas delivery device 4 is controlled by the control system of the corresponding semiconductor equipment. In this embodiment, the external protective gas source is set using existing technology, and the corresponding gas can be nitrogen, or other suitable gases can be selected as needed.

[0016] Specifically, in this embodiment, the air jets of all protective gas delivery channels 103 are uniformly arranged around the nozzle standby receiving port 101, which can uniformly blow air onto the bottom end of the nozzle 001 that extends into the nozzle standby receiving port 101, so as to ensure the drying effect of the air blowing on the nozzle 001 and effectively ensure the suppression of the evaporation of cleaning fluid and other droplets to the nozzle 001.

[0017] Specifically, in this embodiment, the gas flow regulation and switching structure includes a high-flow gas switching valve 5 and a low-flow gas switching valve 6. The gas output end of the protective gas delivery device 4 is connected to one end of the high-flow gas switching valve 5 and one end of the low-flow gas switching valve 6, respectively. The other end of the high-flow gas switching valve 5 is connected to the inlet of all protective gas delivery channels 103, and the other end of the low-flow gas switching valve 6 is connected to the inlet of all protective gas delivery channels 103. In this embodiment, the high-flow gas switching valve 5 and the low-flow gas switching valve 6 are commercially available products and are controlled by the control system of the corresponding semiconductor device. Only one of the high-flow gas switching valve 5 and the low-flow gas switching valve 6 is open at any given time to control the gas flow rate and pressure output from the protective gas delivery channel 103. In this embodiment, when the high-flow gas switch valve 5 is opened and the low-flow gas switch valve 6 is closed, the gas velocity ejected from the nozzle of the corresponding protective gas delivery channel 103 is 0.5-5 m / s; when the high-flow gas switch valve 5 is closed and the low-flow gas switch valve 6 is opened, the low-pressure gas velocity ejected from the nozzle of the corresponding protective gas delivery channel 103 is 0.01-0.5 m / s.

[0018] Working principle: During the process, the cleaning fluid delivery device 2 and the cleaning fluid delivery switch valve 3 are opened to allow the cleaning fluid delivery channel 102 to spray cleaning fluid onto the nozzle 001 for cleaning. During cleaning, the protective gas delivery device 4 is opened, the high-flow gas switch valve 5 is opened, and the low-flow gas switch valve 6 is closed, so that the protective gas ejected from the nozzle of the protective gas delivery channel 103 can suppress and control the cleaning height of the cleaning fluid. After cleaning is completed, the cleaning fluid delivery device 2 and the cleaning fluid delivery switch valve 3 are closed to ensure the cleaning fluid is properly dispensed. The air jet from the protective gas delivery channel 103 continues to spray gas, which can dry the nozzle 001 and suppress dripping from the nozzle 001. When the equipment is not in operation, the high-flow gas switch valve 5 is closed and the low-flow gas switch valve 6 is opened. The air jet from the protective gas delivery channel 103 sprays out a small flow of gas to maintain positive pressure inside the nozzle standby receiving port 101. On the one hand, this suppresses the evaporation of the nozzle standby receiving port 101 into the process cavity to reduce process defects. On the other hand, it suppresses the evaporation of micro-droplets such as cleaning fluid into the nozzle 001, which would cause dilution of the front-end photoresist and avoid abnormal thickness of the first film.

Claims

1. A nozzle standby receiving and cleaning device, characterized in that: It includes a nozzle standby housing (1), a cleaning fluid delivery device (2), a cleaning fluid delivery switch valve (3), a protective gas delivery device (4), and a gas flow regulation and switching structure; The nozzle standby receiving box (1) has a nozzle standby receiving port (101) inside, and the axial center line of the nozzle standby receiving port (101) is perpendicular to the horizontal plane. The nozzle standby receiving box (1) has at least one cleaning fluid delivery channel (102) inside, each of the cleaning fluid delivery channels (102) has an inlet and an outlet, and the outlet of each cleaning fluid delivery channel (102) is connected to the nozzle standby receiving port (101). The nozzle standby receiving box (1) also has at least one protective gas delivery channel (103) inside. Each of the protective gas delivery channels (103) has an air inlet and an air outlet. The air outlet of each protective gas delivery channel (103) is connected to the nozzle standby receiving port (101). The air outlets of all the protective gas delivery channels (103) and the liquid outlets of all the cleaning fluid delivery channels (102) are respectively corresponding to the bottom end of the nozzle (001) extending into the nozzle standby receiving port (101). The height of the air outlet of each protective gas delivery channel (103) is higher than the height of the liquid outlet of all the cleaning fluid delivery channels (102). The cleaning fluid delivery device (2) has a liquid input end and a liquid output end. The liquid input end of the cleaning fluid delivery device (2) is connected to an external cleaning fluid source. The liquid output end of the cleaning fluid delivery device (2) is connected to one end of the cleaning fluid delivery switch valve (3) through a pipeline. The other end of the cleaning fluid delivery switch valve (3) is connected to the inlet of all the cleaning fluid delivery channels (102). The protective gas delivery device (4) has a gas input end and a gas output end. The gas input end of the protective gas delivery device (4) is connected to an external protective gas source. The gas output end of the protective gas delivery device (4) is connected to the air inlet of all the protective gas delivery channels (103) through a gas flow rate adjustment and switching structure.

2. The nozzle standby receiving and cleaning device according to claim 1, characterized in that: The nozzles of all the protective gas delivery channels (103) are uniformly arranged circumferentially along the nozzle standby receiving port (101).

3. The nozzle standby receiving and cleaning device according to claim 1, characterized in that: The gas flow regulation and switching structure includes a high-flow gas switch valve (5) and a low-flow gas switch valve (6). The gas output end of the protective gas delivery device (4) is connected to one end of the high-flow gas switch valve (5) and one end of the low-flow gas switch valve (6), respectively. The other end of the high-flow gas switch valve (5) is connected to the air inlet of all the protective gas delivery channels (103), and the other end of the low-flow gas switch valve (6) is connected to the air inlet of all the protective gas delivery channels (103).

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