Dispensing module with glue barrel cooling function and dispensing device

Abstract

The glue dispensing module with glue bucket cooling function comprises an eddy current refrigeration pipe, a glue bucket and a cooling module; the cooling module comprises a containing cavity, an air inlet B1 and an air outlet B2; a cooling gas passage is arranged between the inner wall of the containing cavity and the glue bucket; the eddy current refrigeration pipe comprises an air inlet A1, a warm air outlet A2 and a cooling gas outlet A3; the cooling gas outlet A3 is communicated with the air inlet B1; the air inlet A1 is used for being communicated with an external compressed air source; in a working state, compressed air enters the eddy current refrigeration pipe, the eddy current refrigeration pipe outputs refrigeration air at the cooling gas outlet A3, the refrigeration air passes through the cooling gas passage and is discharged through the air outlet B2, and the cooling gas maintains the temperature of the glue bucket to a low temperature state. The glue dispensing module with glue bucket cooling function solves the problem that the curing of EC glue at normal temperature is poor and the flow is poor, thereby affecting product yield by controlling the temperature of the EC glue during glue dispensing.

Description

Technical Field

[0001] This application belongs to the field of electronic module manufacturing and processing technology, specifically relating to a dispensing module with glue tank cooling function and a control method. Background Technology

[0002] Electronic paper modules are now widely used in supermarket price tags, e-books, mobile phones, and other electronic devices. With increasing market demand and the growing maturity of automated equipment, the EC (electrode sealing) edge-sealing process for electronic paper modules is being replaced by fully automated EC dispensing equipment. EC adhesive needs to be stored at -40℃, at which point it is neither solid nor fluid. EC adhesive achieves its optimal fluidity at a specific temperature, making it ideal for use on the equipment. The existing EC dispensing process is as follows: Remove the EC glue from the -40℃ freezer and allow it to warm up at room temperature for about 45 minutes until it reaches a temperature of about 5-15℃. The warming temperature may vary depending on the type of EC glue. The operator installs the warmed EC adhesive into the fully automatic EC dispensing equipment and begins the dispensing operation. To maintain dispensing effectiveness and yield, dispensing operations need to be completed within 30-45 minutes. If this time is exceeded, the temperature of the EC adhesive rises, the adhesive gradually solidifies, and its fluidity deteriorates. This results in insufficient adhesive, air bubbles, and other serious issues that affect dispensing yield. On-site equipment frequently requires line replacement and malfunctions, and EC adhesive usage exceeding the time limit often occurs, leading to product quality abnormalities and EC adhesive waste. Summary of the Invention

[0003] This application proposes a dispensing module with a glue tank cooling function for use in EC dispensing equipment. By controlling the temperature during EC dispensing, it solves the problem of EC curing at room temperature, resulting in poor flow and affecting product yield.

[0004] A dispensing module with a glue bucket cooling function includes a vortex cooling tube, a glue bucket, and a cooling module. The cooling module includes a receiving cavity, an air inlet B1, and an exhaust port B2. The receiving cavity is used to receive the glue bucket, and a cooling air channel is included between the inner wall of the receiving cavity and the glue bucket. The vortex cooling tube includes an air inlet A1, a warm air exhaust port A2, and a cooling air exhaust port A3. The cooling air exhaust port A3 is connected to the air inlet B1. The air inlet A1 is used to connect to an external compressed air source. In operation, compressed air enters the vortex cooling tube, and the vortex cooling tube outputs cooled air at the cooling air exhaust port A3. The cooled air is discharged through the cooling air channel and exits through the exhaust port B2, thus maintaining the temperature of the glue bucket at a low temperature.

[0005] Yes, the aforementioned glue buckets are used to store EC glue.

[0006] It is possible that the temperature of the aforementioned cooling air is higher than 5 degrees and lower than 15 degrees.

[0007] It may also include an insulation shell, which covers the cooling module.

[0008] It may also include a pressure regulating valve, which includes an air inlet C1 and an exhaust port C2; the exhaust port C2 is connected to the air inlet A1 of the vortex refrigeration pipe, and the air inlet C1 is connected to an external compressed air source.

[0009] It can also include a control module. The aforementioned pressure regulating valve is an electrically controlled pressure regulating valve, and the control module is electrically connected to the aforementioned pressure regulating valve.

[0010] It may also include a temperature sensor, and the control module is electrically connected to the temperature sensor.

[0011] A control method for a dispensing module with a glue tank cooling function, used to control the aforementioned dispensing module with a glue tank cooling function, including... Step A10: Take out the glue bucket, add the above-mentioned dispensing module with glue bucket cooling function, and start time counting TA; Step B10: Obtain the temperature Temp_B from the temperature sensor mentioned above; if the temperature Temp_B is lower than the set value SET_B, proceed to step C10; if the temperature is higher than the set value SET_B, proceed to step E10. Step C10: Open the pressure regulating valve to introduce low-pressure air into the receiving cavity for a certain period of time; Step D10: After waiting for time T_SET, the temperature Temp_C is obtained from the temperature sensor mentioned above; if the temperature is less than the set value SET_B, proceed to step B10. Step E10: Working state, open the above pressure regulating valve to introduce high-pressure air into the receiving cavity so that the temperature is lower than the set value SET_B; Step F10: If the count TA is greater than the glue setting value SET_C, issue an alarm and end the use of the glue bucket. If the count TA is less than the glue setting value SET_C, proceed to step E10.

[0012] The above setting SET_B is higher than 5 degrees and lower than 15 degrees; the above setting SET_C is higher than 90 minutes and lower than 120 minutes.

[0013] One of the beneficial effects of the technical solution in this application is that compressed air is an easily available resource, the eddy current refrigeration tube is a purely mechanical structure, simple and reliable, and the use of the eddy current refrigeration tube as a refrigeration source ensures reliable performance, simple maintenance, and controllable overall cost.

[0014] One of the beneficial effects of the technical solution in this application is that by adding a heat-insulating cotton cover to the EC glue bucket, the cold air caused by the air vortex cooling pipe is connected to the inside of the cover. The cold air circulates inside the protective cover, thereby keeping the EC glue inside the cover at a certain low temperature, thus preserving its fluidity in the best state.

[0015] One of the beneficial effects of the technical solution in this application is that, under the control of the pressure regulating valve, the eddy current cooling tube can output an appropriate temperature for cooling the dispensing module with glue bucket cooling function.

[0016] One of the beneficial effects of the technical solution in this application is that by controlling the temperature recovery and thawing through a program, and by controlling the flow rate of compressed air, the thawing temperature can be increased.

[0017] One of the beneficial effects of the technical solution in this application is that by using the apparatus and method of this application, the fluidity of the colloid is maintained, product quality is guaranteed, and the service life of the colloid is extended.

[0018] One of the beneficial effects of the technical solution in this application is that by increasing the device of this application, maintaining the fluidity of the colloid, ensuring product quality and extending the service life of the colloid, improving quality while saving materials, thereby achieving cost reduction and efficiency improvement. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the principle of eddy current cooling tubes; Figure 2 This is a schematic diagram of the principle of Example 1; Figure 3 This is a schematic diagram of the principle of Example 2; Figure 4 This is a schematic diagram of the principle of Example 3; Figure 5 This is a structural schematic diagram of Example 4; Figure 6 This is a flowchart of method embodiment 1. Detailed Implementation

[0020] The embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0021] It should be noted that the following description of preferred embodiments of this application does not constitute any limitation on this application. The description of preferred embodiments is merely an illustration of the general principles of this application. The embodiments described in this application are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0022] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the equipment or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," and technical features numbered with Arabic numerals 1, 2, 3, etc., and designations such as "A" and "B," are used for descriptive purposes only, for ease of explanation, and do not represent a temporal or spatial order; they should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first," "second," and numbered with Arabic numerals 1, 2, 3, etc., may explicitly or implicitly include one or more of that feature. In the description of this application, "several" means two or more, unless otherwise expressly and specifically defined.

[0023] like Figure 1 A schematic diagram of the principle of eddy current cooling tubes.

[0024] The eddy current refrigeration tube includes a compressed air inlet 0110, a hot air outlet 0120, and a cold air outlet 0130. Compressed air is input at the compressed air inlet, hot air is discharged at the hot air outlet, and cold air is obtained at the cold air outlet. The cold air can be used as a cold source. Compressed air is an easily available resource in the production site. The eddy current refrigeration tube has a purely mechanical structure, which is simple and reliable. Using the eddy current refrigeration tube as a refrigeration source ensures reliable performance, simple maintenance, and controllable overall cost.

[0025] like Figure 2 The schematic diagram of Example 1.

[0026] like Figure 2A dispensing module with a glue bucket cooling function includes a vortex cooling tube 0210, a glue bucket 0220, and a cooling module 0230. The cooling module includes a receiving cavity 0231, an air inlet B1, and an exhaust port B2. The receiving cavity is used to hold the glue bucket, and a cooling air channel 0232 is included between the inner wall of the receiving cavity and the glue bucket. The vortex cooling tube includes an air inlet A1, a warm air exhaust port A2, and a cooling air exhaust port A3. The cooling air exhaust port A3 is connected to the air inlet B1. The air inlet A1 is used to connect to an external compressed air source. In operation, compressed air enters the vortex cooling tube, and the vortex cooling tube outputs cooled air at the cooling air exhaust port A3. The cooled air is discharged through the cooling air channel and exits from the exhaust port B2, maintaining the temperature of the glue bucket at a low temperature. A dispensing head 0250 extends out from the cooling module.

[0027] An air vortex cooling tube is installed on the equipment. This device utilizes the air vortex tube cooling principle, which is based on the separation of heat and cold generated by high-speed airflow through a special structure. The cooling effect is achieved by using the cold airflow. The amount of cold air can be controlled by the compressed air flow rate, thereby achieving the functions of cooling and temperature control.

[0028] Yes, the aforementioned glue buckets are used to store EC glue.

[0029] It is possible that the temperature of the aforementioned cooling air is higher than 5 degrees and lower than 15 degrees.

[0030] like Figure 3 The schematic diagram of Example 2.

[0031] Example 2 adds a pressure regulating valve to Example 1. The pressure regulating valve includes an air inlet C1 and an exhaust port C2. The exhaust port C2 is connected to the air inlet A1 of the vortex refrigeration pipe, and the air inlet C1 is connected to an external compressed air source.

[0032] Example 2 adds a control module to Example 1. The pressure regulating valve is an electrically controlled regulating valve, and the control module is electrically connected to the pressure regulating valve.

[0033] Example 2 adds a temperature sensor 0310 to Example 1, and the control module is electrically connected to the temperature sensor.

[0034] like Figure 4 The schematic diagram of Example 3.

[0035] Example 3 adds an insulation shell 0410 to Example 2, and the insulation shell covers the cooling module.

[0036] Alternatively, an insulating cotton cover can be added to the EC glue container, and the cold air caused by the air vortex cooling pipe can be connected to the cover. The cold air circulates inside the protective cover, thereby keeping the EC glue inside the cover at a certain low temperature, thus preserving its fluidity at its best.

[0037] like Figure 5 The structural diagram of Example 4.

[0038] like Figure 5 The dispensing module 0550 with glue bucket cooling function is enlarged and placed on the left side. The exterior of the dispensing module 0550 with glue bucket cooling function includes an insulation shell 0510, and the glue bucket push rod 0520 is exposed outside the insulation shell 0510.

[0039] like Figure 5 Under the control of the pressure regulating valve 0530, the eddy current cooling tube 0540 can output an appropriate temperature for cooling the dispensing module with glue bucket cooling function. Of course, the pressure regulating valve can also be omitted, and the amount of compressed air input can be adjusted manually.

[0040] like Figure 6 The flowchart of method embodiment 1 is shown.

[0041] A control method for a dispensing module with a glue tank cooling function, wherein the dispensing module with the glue tank cooling function includes: Step A10: Take out the glue bucket, add the above-mentioned dispensing module with glue bucket cooling function, and start time counting TA; Step B10: Obtain the temperature Temp_B from the temperature sensor mentioned above; if the temperature Temp_B is lower than the set value SET_B, proceed to step C10; if the temperature is higher than the set value SET_B, proceed to step E10. Step C10: Open the pressure regulating valve to introduce low-pressure air into the receiving cavity for a certain period of time; Step D10: After waiting for time T_SET, the temperature Temp_C is obtained from the temperature sensor mentioned above; if the temperature is less than the set value SET_B, proceed to step B10. Step E10: Working state, open the above pressure regulating valve and introduce high-pressure air into the cavity so that the temperature is lower than the set value SET_B; Step F10: If the count TA is greater than the glue setting value SET_C, issue an alarm and end the use of the glue bucket. If the count TA is less than the glue setting value SET_C, proceed to step E10.

[0042] The above setting SET_B is higher than 5 degrees and lower than 15 degrees; the above setting SET_C is higher than 90 minutes and lower than 120 minutes.

[0043] The technical problem to be addressed is how to extend the flow time required for effective operation of EC colloids in EC dispensing equipment.

[0044] Remove the EC adhesive from the -40℃ freezer and allow it to warm up at room temperature for about 45 minutes, or add it to the equipment and use a program to control the warming process until the temperature is around 5-15℃. The warming temperature varies depending on the type of EC adhesive. The fully automatic EC dispensing equipment, after the EC adhesive has been warmed up, begins the dispensing operation. To maintain dispensing effectiveness and yield, dispensing operations need to be completed within 30-45 minutes. If this time is exceeded, the temperature of the EC adhesive rises, the adhesive gradually solidifies, and its fluidity deteriorates. This results in insufficient adhesive, air bubbles, and other serious issues that affect dispensing yield. On-site equipment frequently requires line replacement and malfunctions, and EC adhesive usage exceeding the time limit often occurs, leading to product quality abnormalities and EC adhesive waste.

[0045] Previously, when EC colloids were exposed to room temperature, their fluidity would decrease and they would become unusable in a short time. This meant that once the EC colloids left the refrigerator during processing, they had to be used up quickly, which was very inconvenient and wasteful.

[0046] Due to frequent equipment replacements and malfunctions on-site, EC adhesive usage timeouts occur frequently, resulting in product quality abnormalities and EC adhesive waste. By employing the apparatus and method of this application, the flowability of the colloid is maintained, product quality is guaranteed, and the shelf life of the colloid is extended. Adding the apparatus of this application maintains the flowability of the colloid, guarantees product quality, extends the shelf life of the colloid, improves quality while saving materials, thereby achieving cost reduction and efficiency improvement.

[0047] like Figures 1 to 6 As shown, the above description is only an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of the application specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A dispensing module with a glue tank cooling function, characterized in that: Includes eddy current cooling tubes, glue tanks, and cooling modules; The cooling module includes a receiving cavity, an air inlet B1, and an exhaust outlet B2; the receiving cavity is used to receive the glue bucket, and a cooling air passage is included between the inner wall of the receiving cavity and the glue bucket; The vortex refrigeration tube includes an air inlet A1, a heating exhaust outlet A2, and a cooling exhaust outlet A3; The cooling gas exhaust port A3 is connected to the air inlet B1; The air inlet A1 is used to connect to an external compressed air source; In operation, compressed air enters the vortex cooling tube, and the vortex cooling tube outputs cooling air at the cooling air exhaust port A3. The cooling air passes through the cooling air passage and is discharged from the exhaust port B2. The cooling air maintains the temperature of the rubber bucket at a low temperature.

2. The dispensing module with glue tank cooling function according to claim 1, characterized in that, The glue drum is used to hold EC glue.

3. The dispensing module with glue tank cooling function according to claim 2, characterized in that, The temperature of the cooling gas is higher than 5 degrees and lower than 15 degrees.

4. The dispensing module with glue tank cooling function according to claim 1 or 2, characterized in that, It also includes an insulation housing that covers the cooling module.

5. The dispensing module with glue tank cooling function according to claim 1 or 2, characterized in that, It also includes a pressure regulating valve, which includes an air inlet C1 and an exhaust port C2; the exhaust port C2 is connected to the air inlet A1 of the vortex refrigeration pipe, and the air inlet C1 is connected to an external compressed air source.

6. The dispensing module with glue tank cooling function according to claim 5, characterized in that, It also includes a control module, wherein the pressure regulating valve is an electrically controlled regulating valve, and the control module is electrically connected to the pressure regulating valve.

7. The dispensing module with glue tank cooling function according to claim 6, characterized in that, It also includes a temperature sensor, and the control module is electrically connected to the temperature sensor.

8. A dispensing device, characterized in that, The dispensing module with a glue tank cooling function as described in any one of claims 1 to 7.

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