Dispensing head with selectable dispensing area

Abstract

The utility model discloses a kind of dispensing head of selectable dispensing area, it is related to the field of semiconductor packaging, comprising: glue feeding pipe, glue distribution block and two dispensing blocks, glue feeding pipe is set in the top of glue distribution block, two dispensing blocks are respectively set in the bottom of glue distribution block;Several dispensing holes that are penetrated through dispensing block from top to bottom are provided on dispensing block, dispensing block is provided with dispensing tube at the bottom of each dispensing hole;The top of several dispensing holes is provided with plug;When the utility model is used, the application is installed on dispensing machine, glue feeding pipe is connected with glue supply structure;Solder is transported into the dispensing hole on two dispensing blocks by glue distribution runner, and the dispensing area on chip or lead frame is dispensed by dispensing tube;And for the problem that different products involve different dispensing areas, plug at corresponding dispensing hole can be removed, so that specific dispensing tube can carry out dispensing work, different use requirements are realized.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, specifically to a dispensing head with selectable dispensing area. Background Technology

[0002] Semiconductor power devices have been widely used in new energy vehicles, home appliances and industrial control. As the requirements for product performance become higher and higher, higher requirements are also placed on the product packaging structure.

[0003] Traditional semiconductor packaging uses dispensing heads with fixed numbers, areas, and sizes of dispensing holes. This structure is simple and the technology is relatively mature. However, when packaging different chip sizes, the dispensing area is different, requiring the dispensing head to be customized and replaced, which increases enterprise costs and affects production efficiency.

[0004] In view of this, there is an urgent need for a dispensing head that allows for selection of the dispensing area. Summary of the Invention

[0005] To address the problems existing in the prior art, this utility model solves the problem using the following technical structure.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: A dispensing head with selectable dispensing area includes: a dispensing tube, a dispensing block, and two dispensing blocks, wherein the dispensing tube is disposed on the top of the dispensing block, and the two dispensing blocks are respectively disposed on the bottom of the dispensing block; The dispensing block is provided with a plurality of dispensing holes that run from top to bottom through the dispensing block, and a dispensing tube is provided at the bottom of each dispensing hole. The dispensing block is provided with a dispensing channel. The inlet of the dispensing channel is connected to the glue inlet pipe, and the outlet of the dispensing channel is connected to a plurality of dispensing holes on the two dispensing blocks. A plug is provided at the top of each of the aforementioned dispensing holes.

[0007] The dispensing holes on the same dispensing block are distributed in a rectangular array.

[0008] A glue-splitting block is provided between the glue dispensing block and the glue separating block. The glue-splitting block is provided with a plurality of glue-splitting holes that run from top to bottom through the glue-splitting block. All of the glue-splitting holes are connected to the outlet of the glue separating channel. The dispensing holes are respectively connected to the uniform dispensing holes.

[0009] The plurality of the uniform dispensing holes are arranged in parallel, and the plurality of dispensing holes in the same column are connected to the same uniform dispensing hole.

[0010] The dispensing channel is inverted Y-shaped.

[0011] The bottom of the dispensing block is provided with limit blocks on both sides of several dispensing tubes.

[0012] The height of the limiting block is lower than that of the dispensing hole.

[0013] The dispensing block is rectangular in shape.

[0014] The glue-separating blocks are rectangular in shape.

[0015] The homogenized block is rectangular in shape.

[0016] The dispensing block, the dividing block, and the evenly dispensing block are fixed by bolts.

[0017] The above-described structure of this utility model can achieve the following beneficial effects: In use, this application is installed on a dispensing machine, and the dispensing tube is connected to the dispensing structure. Solder is delivered to the dispensing holes on the two dispensing blocks through the dispensing channel. The dispensing tube is used to dispense the area to be dispensed on the chip or lead frame. In addition, for different products with different dispensing areas, the plugs at the corresponding dispensing holes can be removed so that a specific dispensing tube can perform dispensing work, thus adapting to different usage needs. By replacing the glue dispensing blocks with different thicknesses and adjusting the dispensing height (so that the two dispensing blocks are at different heights), different dispensing needs can be met; the dispensing tubes on the two dispensing blocks can simultaneously dispense glue onto the chip and lead frame without having to perform two operations, thus improving dispensing efficiency. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of this embodiment; Figure 2 This is a schematic diagram of the structure at the bottom of the adhesive block in this embodiment; Figure 3 This is a schematic diagram of the structure of the top of the adhesive block in this embodiment; Figure 4 This is a schematic diagram of the structure of the homogenizing block in this embodiment; Figure 5 This is a schematic diagram of a dispensing block with another dispensing channel structure in this embodiment; Figure 6 This is a cross-sectional view of a dispensing block with another dispensing channel structure in this embodiment; In the diagram: 1. Inlet tube; 2. Glue distribution block; 3. Glue dispensing block; 31. Glue dispensing hole; 4. Glue dispensing tube; 5. Plug; 6. Glue spreading block; 61. Glue spreading hole; 7. Limiting block. Detailed Implementation

[0019] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0020] It should be noted that the terms "comprising" and "having" and any variations thereof in the specification, claims and accompanying drawings of this utility model are intended to cover non-exclusive inclusion. For example, a process, method, apparatus, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such processes, methods, products or devices.

[0021] The following is in conjunction with the appendix Figures 1-6 This application will be described in further detail.

[0022] refer to Figures 1-3 The dispensing head shown includes: a dispensing tube 1, a dispensing block 2, and two dispensing blocks 3. The dispensing tube 1 is located at the top of the dispensing block 2, and the two dispensing blocks 3 are located at the bottom of the dispensing block 2. The dispensing block 3 is provided with several dispensing holes 31 that run from top to bottom through the dispensing block 3. A dispensing tube 4 is provided at the bottom of each dispensing hole 31 of the dispensing block 3. The dispensing tube 4 can be fixed to the dispensing block 3 by a clip sheath. The dispensing block 2 is provided with a dispensing channel. The inlet of the dispensing channel is connected to the glue inlet pipe 1, and the outlet of the dispensing channel is connected to several dispensing holes 31 on the two dispensing blocks 3. A plug 5 is provided at the top of each of the several dispensing holes 31.

[0023] Based on the above structure, in use, this application is installed on a dispensing machine, and the glue inlet tube 1 is connected to the glue supply structure; the solder is transported through the glue distribution channel to the glue dispensing holes 31 on the two glue dispensing blocks 3, and the glue is dispensed to the area to be glued on the chip through the glue dispensing tube 4; and to address the issue of different glue dispensing areas for different chips, the plugs 5 at the corresponding glue dispensing holes 31 can be removed so that a specific glue dispensing tube 4 can perform glue dispensing work, thereby adapting to different usage requirements.

[0024] like Figure 2 and Figure 3 As shown, several dispensing holes 31 on the same dispensing block 3 are distributed in a rectangular array to adapt to more diverse application scenarios.

[0025] like Figure 1 and Figure 4 As shown, a uniform adhesive block 6 is provided between the dispensing block 3 and the separating adhesive block 2. The uniform adhesive block 6 is provided with a plurality of uniform adhesive holes 61 extending from top to bottom through the uniform adhesive block 6. The plurality of uniform adhesive holes 61 are all connected to the outlet of the separating adhesive channel. A plurality of dispensing holes 31 are respectively connected to the plurality of uniform adhesive holes 61. In this embodiment, the plurality of uniform adhesive holes 61 are preferably arranged in parallel, and the plurality of dispensing holes 31 in the same column are connected to the same uniform adhesive hole 61. In this way, the adhesive material from the separating adhesive channel is diverted into the plurality of uniform adhesive holes 61, and then supplied to the plurality of dispensing holes 31 in the same column through the uniform adhesive holes 61, so as to achieve more uniform entry of the adhesive material into the plurality of dispensing holes 31.

[0026] Further optimization involves the glue distribution channel preferably being inverted Y-shaped to better achieve glue distribution; additionally, the glue distribution channel can also be inverted U-shaped (e.g., Figure 5 and Figure 6 As shown in the figure, that is, a groove 21 is provided on the top of the glue distribution block 2, and two glue channels 22 are provided at the bottom of the groove 21. The two glue channels 22 are respectively connected to several glue distribution holes 61 on the two glue distribution blocks 6.

[0027] like Figure 1 and Figure 2 As shown, the bottom of the dispensing block 3 is provided with limit blocks 7 on both sides of several dispensing tubes 4. In actual use, the height of the bottom of the limit block 7 is lower than the height of the bottom of the dispensing tube 4. The height difference between the two is greater than the chip thickness or solder thickness or the sum of chip thickness and solder thickness. This prevents damage to the dispensing hole 31 and dispensing tube 4 due to improper operation during dispensing, and also protects the chip from being crushed.

[0028] Further optimization involves making the dispensing block 2, the applicator block 3, and the uniform applicator block 6 rectangular to facilitate assembly; and fixing the dispensing block 3, the dispensing block 2, and the uniform applicator block 6 with multiple bolts to facilitate disassembly, assembly, maintenance, and repair.

[0029] In summary, this application can adapt to different dispensing needs by replacing the glue-spreading blocks 6 with those of different thicknesses and adjusting the dispensing height (so that the two glue-spreading blocks 3 are at different heights); the dispensing tubes 4 on the two glue-spreading blocks 3 can simultaneously dispense glue onto the chip and the lead frame without having to perform two operations, thus improving dispensing efficiency.

[0030] The above are merely preferred embodiments of this application, and the present invention is not limited to the above embodiments. It is understood that other improvements and variations that can be directly derived or conceived by those skilled in the art without departing from the spirit and concept of the present invention should be considered to be included within the protection scope of the present invention.

Claims

1. A dispensing head with selectable dispensing area, characterized in that, include: The glue inlet tube (1), the glue distribution block (2), and two glue dispensing blocks (3) are provided. The glue inlet tube (1) is located on the top of the glue distribution block (2), and the two glue dispensing blocks (3) are located on the bottom of the glue distribution block (2). The dispensing block (3) is provided with a plurality of dispensing holes (31) that run from top to bottom through the dispensing block (3), and a dispensing tube (4) is provided at the bottom of each dispensing hole (31). The dispensing block (2) is provided with a dispensing channel. The inlet of the dispensing channel is connected to the glue inlet pipe (1), and the outlet of the dispensing channel is connected to a plurality of glue dispensing holes (31) on the two dispensing blocks (3). A plug (5) is provided on the top of several of the dispensing holes (31).

2. The dispensing head with selectable dispensing area according to claim 1, characterized in that: Several dispensing holes (31) on the same dispensing block (3) are distributed in a rectangular array.

3. The dispensing head with selectable dispensing area according to claim 2, characterized in that: A glue-splitting block (6) is provided between the glue dispensing block (3) and the glue separating block (2). The glue-splitting block (6) is provided with a plurality of glue-splitting holes (61) that run from top to bottom through the glue-splitting block (6). The plurality of glue-splitting holes (61) are all connected to the outlet of the glue separating channel. The dispensing holes (31) are respectively connected to the uniform dispensing holes (61).

4. The dispensing head with selectable dispensing area according to claim 3, characterized in that: A plurality of the uniform adhesive holes (61) are arranged in parallel, and a plurality of the dispensing holes (31) in the same column are connected to the same uniform adhesive hole (61).

5. The dispensing head with selectable dispensing area according to claim 1, characterized in that: The dispensing channel is inverted Y-shaped.

6. The dispensing head with selectable dispensing area according to claim 1, characterized in that: The bottom of the dispensing block (3) is provided with limit blocks (7) on both sides of several dispensing tubes (4).

7. The dispensing head with selectable dispensing area according to claim 3, characterized in that: The dispensing block (3) is rectangular.

8. The dispensing head with selectable dispensing area according to claim 7, characterized in that: The glue block (2) is rectangular.

9. The dispensing head with selectable dispensing area according to claim 8, characterized in that: The homogenized block (6) is rectangular.

10. The dispensing head with selectable dispensing area according to claim 9, characterized in that: The dispensing block (3), the dividing block (2), and the evenly dispensing block (6) are fixed by bolts.

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