Semiconductor encapsulation glue dispensing device

Abstract

The utility model discloses a semiconductor encapsulation colloid point gum device, including the case, be provided with workstation on the case, be provided with stand and positioning assembly on the workstation, install first linear motor on the stand, the slide table fixed connection second linear motor of first linear motor, install the point gum subassembly on the slide table of second linear motor, positioning assembly includes negative pressure adsorption platform, negative pressure adsorption platform is by third linear motor, first motor and second motor drive, first linear motor and second linear motor each other vertical setting. The utility model point gum subassembly place's drive assembly includes first linear motor and second linear motor, the rest drive assembly sets up at the positioning assembly of semiconductor material, reduce the total mass of point gum subassembly, light weight point gum head, light weight design reduces the transmission of drive assembly vibration, acceleration and deceleration delay greatly shortens, in this way to reduce inertia, improve motion accuracy greatly.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, specifically to a semiconductor packaging colloid dispensing device. Background Technology

[0002] Semiconductor packaging is a crucial post-processing step in chip manufacturing, bearing the heavy responsibility of transforming bare integrated circuit (IC) chips into usable devices. It is not only a physical protective "shell" but also a key bridge for achieving electrical connections, thermal management, and system integration. In semiconductor packaging, adhesive dispensing devices are primarily used to precisely coat or dispense encapsulating colloids such as epoxy resin, silicone, and UV adhesives onto designated locations on the chip, substrate, or packaging structure.

[0003] The drive components of a dispensing device are mostly concentrated in the dispensing head. As the only or main moving part, the dispensing head bears the weight of the drive system and is responsible for all displacements, which greatly increases the total mass. The inertial effect brought about by the large mass will directly lead to a decrease in motion accuracy. Utility Model Content

[0004] The purpose of this invention is to provide a semiconductor packaging colloid dispensing device to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor packaging colloid dispensing device, comprising a chassis, a worktable on the chassis, a support frame and a positioning assembly on the worktable, a first linear motor mounted on the support frame, a second linear motor fixedly connected to the slide of the first linear motor, a dispensing assembly mounted on the slide of the second linear motor, and the positioning assembly comprising a negative pressure adsorption stage driven by a third linear motor, a first motor and a second motor, wherein the first linear motor and the second linear motor are arranged perpendicularly to each other.

[0006] The lower end face of the negative pressure adsorption stage is provided with a vacuum hose, which is connected to a vacuum pump assembly.

[0007] The upper surface of the negative pressure adsorption stage is provided with a negative pressure adsorption tube.

[0008] The negative pressure adsorption tubes are provided in three sets, and the three sets of negative pressure adsorption tubes are evenly distributed at intervals along the circumference of the negative pressure adsorption platform.

[0009] The slide of the third linear motor is fixedly connected to the first mounting bracket.

[0010] The first motor is mounted on the first mounting bracket, and the first motor and the first mounting bracket are fixedly connected by bolts.

[0011] The output shaft of the first motor is fixedly connected to the second mounting bracket.

[0012] The second mounting bracket is configured as an L-shaped structure, and the second motor is mounted on the second mounting bracket.

[0013] The output shaft of the second motor is fixedly connected to the negative pressure adsorption platform.

[0014] Compared with the prior art, the beneficial effects of this utility model are: The driving components of the dispensing assembly of this utility model include a first linear motor and a second linear motor, and the remaining driving components are set at the positioning components of the semiconductor material. This reduces the total mass of the dispensing assembly, makes the dispensing head lightweight, and reduces the transmission of vibration of the driving components. The acceleration and deceleration delays are greatly shortened, thereby reducing inertia and significantly improving motion accuracy.

[0015] This invention uses a first motor and a second motor to dynamically adjust the angle of the semiconductor material. For dispensing operations on curved surfaces, it can keep the glue dot perpendicular to the surface of the semiconductor material, allowing the dispensing head to perform dispensing operations in the optimal posture and improving dispensing quality. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of one side view of the structure of this utility model; Figure 2 This is a schematic diagram of the structure from another side view of the present invention; Figure 3 This is a top view of the positioning component of this utility model. Figure 4 This is a bottom view of the positioning component of this utility model.

[0017] In the diagram: 1. Chassis; 2. Workbench; 3. Stand; 4. First linear motor; 5. Second linear motor; 6. Dispensing assembly; 7. Positioning assembly; 71. Negative pressure adsorption stage; 72. Third linear motor; 73. First electric motor; 74. Second electric motor; 75. First mounting bracket; 76. Second mounting bracket; 77. Vacuum hose; 78. Negative pressure adsorption tube. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] Please see Figure 1-4This utility model provides a technical solution: a semiconductor packaging colloid dispensing device, including a chassis 1, a worktable 2 on the chassis 1, a support frame 3 and a positioning component 7 on the worktable 2, a first linear motor 4 mounted on the support frame 3, a second linear motor 5 fixedly connected to the slide of the first linear motor 4, a dispensing component 6 mounted on the slide of the second linear motor 5, and the positioning component 7 including a negative pressure adsorption stage 71, which is driven by a third linear motor 72, a first motor 73 and a second motor 74, with the first linear motor 4 and the second linear motor 5 arranged perpendicularly to each other.

[0020] The first linear motor 4 drives the dispensing assembly 6 at the end to move along the X-axis, allowing for flexible adjustment of the position of the dispensing assembly 6 in the X-axis direction. The second linear motor 5 drives the dispensing assembly 6 at the end to move along the Z-axis, allowing for flexible adjustment of the position of the dispensing assembly 6 in the Z-axis direction.

[0021] The negative pressure adsorption stage 71 at the end is moved along the Y-axis by the third linear motor 72, and the position of the negative pressure adsorption stage 71 in the Y-axis direction can be flexibly adjusted. The negative pressure adsorption stage 71 is driven to rotate around the Z-axis by the first motor 73, and the negative pressure adsorption stage 71 is driven to rotate around the X-axis by the second motor 74. The semiconductor material to be dispensed is placed on the negative pressure adsorption stage 71, and the negative pressure adsorption stage 71 adsorbs and fixes the semiconductor material. The position of the semiconductor material in the Y-axis direction is flexibly adjusted by the third linear motor 72, and the angle of the semiconductor material is flexibly adjusted by the first motor 73 and the second motor 74.

[0022] The driving components at the dispensing assembly 6 include a first linear motor 4 and a second linear motor 5. The remaining driving components are located at the positioning assembly 7 of the semiconductor material. This reduces the total mass of the dispensing assembly 6, making the dispensing head lighter. The lightweight design reduces the transmission of vibrations from the driving components and significantly shortens acceleration and deceleration delays, thereby reducing inertia and greatly improving motion accuracy.

[0023] By dynamically adjusting the angle of the semiconductor material using the first motor 73 and the second motor 74, the adhesive dots can be kept perpendicular to the surface of the semiconductor material for dispensing operations on curved surfaces, allowing the dispensing head to perform dispensing operations in the optimal posture and improving dispensing quality.

[0024] The lower end face of the negative pressure adsorption stage 71 is provided with a vacuum hose 77, which is connected to the vacuum pump assembly.

[0025] The negative pressure adsorption stage 71 has a vacuum chamber inside. The vacuum hose 77 is led out from the lower end face of the negative pressure adsorption stage 71 to avoid interfering with the movement of the dispensing head. After the vacuum pump assembly is started, the air in the vacuum chamber of the negative pressure adsorption stage 71 is drawn out through the vacuum hose 77 to make the pressure in the chamber lower than the atmospheric pressure. When the semiconductor material is placed on the stage, the semiconductor material is fixed by negative pressure adsorption.

[0026] The upper end face of the negative pressure adsorption stage 71 is provided with a negative pressure adsorption tube 78.

[0027] The negative pressure adsorption tube 78 is provided in three sets. The three sets of negative pressure adsorption tubes 78 are evenly distributed along the circumference of the negative pressure adsorption platform 71, and the three sets of negative pressure adsorption tubes 78 form the platform of the negative pressure adsorption platform 71.

[0028] The slide of the third linear motor 72 is fixedly connected to the first mounting bracket 75.

[0029] The first motor 73 is mounted on the first mounting bracket 75 and the first motor 73 and the first mounting bracket 75 are fixedly connected by bolts. The connection method is simple and the installation and removal of the first motor 73 are convenient. The third linear motor 72 drives the first mounting bracket 75 to move, and the first mounting bracket 75 drives the first motor 73 to move synchronously.

[0030] The output shaft of the first motor 73 is fixedly connected to the second mounting bracket 76.

[0031] The second mounting bracket 76 is configured as an L-shaped structure, and the second motor 74 is mounted on the second mounting bracket 76. The first motor 73 drives the second mounting bracket 76 to move, and the second mounting bracket 76 drives the second motor 74 to move synchronously.

[0032] The output shaft of the second motor 74 is fixedly connected to the negative pressure adsorption platform 71, and the second motor 74 drives the negative pressure adsorption platform 71 at one end to rotate.

[0033] Working principle: During use, three sets of negative pressure adsorption tubes 78 form the platform of the negative pressure adsorption stage 71. After the vacuum pump assembly is started, the air in the vacuum chamber of the negative pressure adsorption stage 71 is drawn out through the vacuum hose 77, so that the pressure in the chamber is lower than atmospheric pressure. When the semiconductor material is placed on the platform, the semiconductor material is fixed by negative pressure adsorption. The first linear motor 4 drives the dispensing assembly 6 at the end to move along the X-axis direction, and the position of the dispensing assembly 6 in the X-axis direction can be flexibly adjusted. The second linear motor 5 drives the dispensing assembly 6 at the end to move along the Z-axis direction, and the position of the dispensing assembly 6 in the Z-axis direction can be flexibly adjusted. The dispensing assembly 6 receives the glue delivered by the glue supply system and precisely releases the glue according to the instructions of the motion control system. At the same time, the third linear motor 72 flexibly adjusts the position of the semiconductor material in the Y-axis direction, and the first motor 73 and the second motor 74 flexibly adjust the angle of the semiconductor material to realize automatic glue dispensing operation.

[0034] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor encapsulant dispensing device, comprising a chassis (1), characterized in that: The chassis (1) is provided with a workbench (2), the workbench (2) is provided with a stand (3) and a positioning component (7), the stand (3) is provided with a first linear motor (4), the slide of the first linear motor (4) is fixedly connected to a second linear motor (5), the slide of the second linear motor (5) is provided with a dotting component (6), the positioning component (7) includes a negative pressure adsorption platform (71), the negative pressure adsorption platform (71) is driven by a third linear motor (72), a first motor (73) and a second motor (74), the first linear motor (4) and the second linear motor (5) are arranged perpendicular to each other.

2. The semiconductor encapsulant dispensing device according to claim 1, characterized in that: The lower end face of the negative pressure adsorption stage (71) is provided with a vacuum hose (77), which is connected to a vacuum pump assembly.

3. The semiconductor encapsulant dispensing device according to claim 1, characterized in that: The upper surface of the negative pressure adsorption stage (71) is provided with a negative pressure adsorption tube (78).

4. The semiconductor encapsulant dispensing device according to claim 3, characterized in that: The negative pressure adsorption tubes (78) are provided in three sets, and the three sets of negative pressure adsorption tubes (78) are evenly distributed at intervals along the circumference of the negative pressure adsorption platform (71).

5. A semiconductor encapsulant dispensing device according to claim 1, characterized in that: The slide of the third linear motor (72) is fixedly connected to the first mounting bracket (75).

6. The semiconductor encapsulant dispensing device according to claim 5, characterized in that: The first motor (73) is mounted on the first mounting bracket (75), and the first motor (73) and the first mounting bracket (75) are fixedly connected by bolts.

7. A semiconductor encapsulant dispensing device according to claim 1, characterized in that: The output shaft of the first motor (73) is fixedly connected to the second mounting bracket (76).

8. A semiconductor encapsulant dispensing device according to claim 7, characterized in that: The second mounting bracket (76) is configured as an L-shaped structure, and the second motor (74) is mounted on the second mounting bracket (76).

9. A semiconductor encapsulant dispensing device according to claim 1, characterized in that: The output shaft of the second motor (74) is fixedly connected to the negative pressure adsorption stage (71).

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