A miniaturized inductance sensor glue filling system

Abstract

The utility model discloses a miniaturized inductance sensor glue pouring system, and the system includes the product of waiting for pouring glue, glue injection mould, inclination positioning device, vacuum tank and high pressure oven, and glue injection mould is equipped with the glue storage groove and glue injection hole, and inclination positioning device is by base, support plate and air cylinder constitutes, and can drive the product of waiting for pouring glue and glue injection mould switches between inclination and level state, and when inclining, vacuum tank exhausts the gas in product, and when being level, glue water is injected into product by gravity and negative pressure, and after pouring glue, solidifies through high pressure oven.

Description

Technical Field

[0001] This utility model relates to sensor manufacturing technology, and in particular to a miniaturized inductive sensor potting system, which aims to solve the problems of difficult potting of miniaturized inductive sensors and residual air holes in the glue after potting, thereby improving the sensor's waterproof, dustproof, insulating and corrosion-resistant performance. Background Technology

[0002] Inductive sensors are widely used in industrial detection, automation control and other fields. To ensure their stable operation in complex environments (such as humid, dusty and vibrating environments), potting compound is usually poured into the sensor housing to achieve sealing protection (waterproof, dustproof, insulation, shockproof and corrosion-proof) of internal components.

[0003] However, existing potting techniques have significant drawbacks for miniaturized inductive sensors with small outer diameters:

[0004] Limited glue-filling channels: The outer diameter of the magnetic can coil and the outer diameter of the cable of the miniaturized sensor are close to the inner diameter of the housing, and the traditional method of "filling glue through the gap of the housing" cannot achieve effective glue injection;

[0005] Gas cannot be vented: If you try to inject glue through the small hole on the side of the shell that mates with the LED on the PCBA, the gas inside the shell cannot be quickly expelled from the tiny gaps at both ends after the glue is injected. This results in a large number of air bubbles mixed inside the glue, which seriously damages the sealing effect and fails to meet the protection requirements of waterproofing and corrosion resistance.

[0006] To address the aforementioned issues, there is currently no dedicated equipment that can simultaneously solve the dual challenges of "miniaturized sensor potting channel" and "gas venting inside the housing." There is an urgent need to design a potting system adapted to miniaturized inductive sensors.

[0007] Therefore, in view of the shortcomings of the existing technology, it is necessary to design a miniaturized inductive sensor potting system to solve the above problems. Utility Model Content

[0008] The purpose of this invention is to overcome the shortcomings of the prior art and provide a miniaturized inductive sensor potting system. Through the synergistic effect of a dedicated potting mold, a controllable tilting positioning device, and a vacuum environment, it solves the problem of potting channel adaptation for miniaturized inductive sensors; addresses the issue of residual air pores in the glue due to the inability to expel gas inside the sensor housing during the potting process; and ensures that the glue completely fills the housing, achieving reliable sealing and protection.

[0009] To achieve the above and other related objectives, the technical solution provided by this utility model is: a miniaturized inductive sensor dispensing system, comprising a product to be dispensed, a dispensing mold, a tilting positioning device, a vacuum chamber, and a high-pressure oven. The dispensing mold is fixed on the tilting positioning device, and the product to be dispensed is detachably mounted on the dispensing mold. The tilting positioning device is located in the vacuum chamber and drives the dispensing mold and the product to be dispensed from an inclined state to a horizontal state under negative pressure, so that the glue in the dispensing mold is dispensed into the product to be dispensed. The high-pressure oven is used to cure the glue in the product to be dispensed after dispensing.

[0010] The preferred technical solution is as follows: the glue injection mold has a glue storage tank and a glue injection hole, and the glue storage tank and the glue injection hole are interconnected; when the glue injection mold and the product to be glued are assembled, the glue injection hole is correspondingly matched with the glue injection port of the product to be glued.

[0011] The preferred technical solution is as follows: in the inclined state, the glue injection hole is set higher than the glue storage tank, and the glue flows to the glue storage tank under the action of gravity; in the horizontal state, the glue injection hole is set lower than the glue storage tank, and the glue flows to the glue injection hole under the action of gravity.

[0012] The preferred technical solution is as follows: the tilting positioning device consists of a base, a support plate, and a cylinder. One end of the support plate is hinged to the base, the base end of the cylinder is hinged to the base, and the telescopic end of the cylinder is hinged to the bottom side of the support plate. The support plate is used to fix the product to be glued, and the cylinder is used to drive the support plate to switch between tilted and horizontal states.

[0013] Due to the application of the above technical solution, the beneficial effects of this utility model are as follows:

[0014] Eliminating adhesive pore defects: The tilting positioning device works in conjunction with the vacuum box: When tilted, the vacuum is drawn to expel the gas inside the product to be glued; when horizontal, the glue is injected into the product by the dual action of gravity and negative pressure, avoiding gas residue and ensuring that the glue is free of pores and completely fills the product to be glued.

[0015] Enhanced protection reliability: After the adhesive is cured in a high-pressure oven, it enables the sensor to be waterproof, dustproof, insulating, shockproof, and corrosion-resistant, meeting the needs of use in complex environments. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the tilting positioning device involved in this utility model.

[0017] Figure 2 This is a schematic diagram of the product to be glued and the glue injection mold involved in this utility model in an inclined state.

[0018] Figure 3 This is a schematic diagram of the product to be glued and the glue injection mold involved in this utility model in a horizontal state. Detailed Implementation

[0019] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification.

[0020] Please see Figures 1-3 It should be noted that in the description of this utility model, the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use. These terms are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance. The terms "horizontal," "vertical," and "suspended," etc., do not indicate that the component must be absolutely horizontal or suspended, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0021] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0022] Example:

[0023] like Figures 1 to 3As shown, according to an overall technical concept of this utility model, a miniaturized inductive sensor potting system is provided, including a product to be potted 1, a potting mold 2, a tilting positioning device 3, a vacuum chamber (not shown), and a high-pressure drying oven (not shown). The potting mold 2 is fixed on the tilting positioning device 3, and the product to be potted 1 is detachably installed on the potting mold 2. The tilting positioning device 3 is located in the vacuum chamber and drives the potting mold 2 and the product to be potted 1 from a tilted state to a horizontal state under negative pressure, so that the glue in the potting mold 2 is poured into the product to be potted 1. The high-pressure drying oven is used to cure the glue in the product to be potted 1 after potting.

[0024] like Figures 1 to 3 As shown, in an exemplary embodiment of this utility model, the glue injection mold 2 has a glue storage tank 21 and a glue injection hole 22, which are interconnected; when the glue injection mold 2 and the product 1 to be glued are assembled, the glue injection hole 22 is matched with the glue injection port of the product 1 to be glued.

[0025] like Figures 1 to 3 As shown, in an exemplary embodiment of this utility model, in the inclined state, the glue injection hole 22 is set higher than the glue storage tank 21, and the glue flows to the glue storage tank 21 under the action of gravity; in the horizontal state, the glue injection hole 22 is set lower than the glue storage tank 21, and the glue flows to the glue injection hole 22 under the action of gravity.

[0026] like Figures 1 to 3 As shown, in an exemplary embodiment of this utility model, the tilt positioning device 3 consists of a base 31, a support plate 32, and a cylinder 33. One end of the support plate 32 is hinged to the base 31, the base end of the cylinder 33 is hinged to the base 31, and the telescopic end of the cylinder 33 is hinged to the bottom side of the support plate 32. The support plate 32 is used to fix the product 1 to be glued, and the cylinder 33 is used to drive the support plate 32 to switch between tilted and horizontal states.

[0027] Therefore, this utility model has the following advantages:

[0028] This utility model discloses a miniaturized inductive sensor dispensing system. The system includes a product to be dispensed, a dispensing mold, a tilting positioning device, a vacuum chamber, and a high-pressure oven. The dispensing mold has a glue storage tank and a dispensing hole. The tilting positioning device consists of a base, a support plate, and a cylinder, which can drive the product to be dispensed and the dispensing mold to switch between tilted and horizontal states. When tilted, the vacuum chamber evacuates the product to remove gas; when horizontal, the glue is injected into the product by gravity combined with negative pressure. After dispensing, the glue is cured in the high-pressure oven. This system solves the problem of dispensing miniaturized sensors, eliminates glue pores, improves protective performance, and has a high degree of automation, ensuring consistency in mass production.

[0029] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A miniaturized inductive sensor potting system, characterized in that: The device includes a product to be glued, a glue injection mold, a tilting positioning device, a vacuum chamber, and a high-pressure drying oven. The glue injection mold is fixed on the tilting positioning device, and the product to be glued is detachably mounted on the glue injection mold. The tilting positioning device is located in the vacuum chamber and drives the glue injection mold and the product to be glued from an inclined state to a horizontal state under negative pressure, so that the glue in the glue injection mold is poured into the product to be glued. The high-pressure drying oven is used to cure the glue in the product to be glued after glue injection.

2. The miniaturized inductive sensor potting system according to claim 1, characterized in that: The glue injection mold has a glue storage tank and a glue injection hole, and the glue storage tank and the glue injection hole are interconnected; when the glue injection mold and the product to be glued are assembled, the glue injection hole is matched with the glue injection port of the product to be glued.

3. The miniaturized inductive sensor potting system according to claim 2, characterized in that: In the tilted state, the glue injection hole is set higher than the glue storage tank, and the glue flows to the glue storage tank under the action of gravity; in the horizontal state, the glue injection hole is set lower than the glue storage tank, and the glue flows to the glue injection hole under the action of gravity.

4. The miniaturized inductive sensor potting system according to claim 1, characterized in that: The tilting positioning device consists of a base, a support plate, and a cylinder. One end of the support plate is hinged to the base, the base end of the cylinder is hinged to the base, and the telescopic end of the cylinder is hinged to the bottom side of the support plate. The support plate is used to fix the product to be glued, and the cylinder is used to drive the support plate to switch between tilted and horizontal states.

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