A rotating centering device for solar silicon wafers

Abstract

The application relates to the technical field of solar silicon wafer processing, and particularly discloses a rotating centering device for a solar silicon wafer, which comprises a rack, a rotating assembly installed on the rack, a mounting rack connected with the output end of the rotating assembly, a transfer basket installed on the mounting rack and used for supporting the solar silicon wafer, and a clamping and centering assembly installed on the mounting rack; after a solar silicon wafer with glue applied on two parallel sides is placed on the transfer basket, the clamping and centering assembly clamps two sides of the solar silicon wafer without glue, thereby centering the solar silicon wafer; then the rotating assembly drives the transfer basket to rotate by 90 degrees through the mounting rack; and the device can effectively reduce the labor intensity and improve the glue application efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of solar silicon wafer processing technology, and specifically relates to a rotating centering device for solar silicon wafers. Background Technology

[0002] In the manufacturing process of solar silicon wafers, it is usually necessary to coat the edges of the wafers with adhesive to protect them and improve their encapsulation performance. Currently, after using a robotic arm to coat the two long sides of the solar silicon wafer with adhesive, the robotic arm blocks one side of the wafer after completing the coating operation, and the robotic arm itself cannot drive the wafer to rotate, making it impossible to directly coat the short sides of the wafer with adhesive.

[0003] To address this issue, existing technologies typically employ manual intervention. Specifically, after the robotic arm completes the coating on the long side, it must first release its grip on the solar silicon wafer. Then, a person manually rotates the wafer 90° to expose the short side. Finally, the robotic arm re-grabs the rotated wafer to apply adhesive to the short side. This process not only increases the intensity of manual labor but also significantly reduces the efficiency of the entire adhesive coating process due to human intervention, making it difficult to meet the efficiency and automation requirements of modern production lines.

[0004] Therefore, the existing technology needs improvement and development. It should be noted that the information disclosed in this section is only for understanding the background of the present invention, and therefore may include information that does not constitute prior art. Utility Model Content

[0005] The purpose of this application is to provide a rotating alignment device for solar silicon wafers that can effectively reduce labor intensity and improve adhesive coating efficiency.

[0006] This application provides a rotational alignment device for solar silicon wafers, comprising: frame; Rotating assembly, mounted on the frame; Mounting bracket, connected to the output end of the rotating component; Transfer baskets, installed on the mounting frame, are used to support solar silicon wafers; Clamp the centering assembly and install it on the mounting bracket; After the solar silicon wafer with adhesive applied to its two parallel sides is placed on the transfer basket, the centering assembly aligns the solar silicon wafer by simultaneously clamping the two sides of the solar silicon wafer that are not coated with adhesive. Then the rotating assembly drives the transfer basket to rotate 90° via the mounting bracket.

[0007] This application provides a rotating alignment device for solar silicon wafers. By introducing a rotating component, a mounting frame, a transfer basket, and a clamping alignment component, it achieves automated alignment and rotation of solar silicon wafers during the adhesive coating process. Therefore, this application can replace manual alignment and rotation with automated alignment and rotation, thereby effectively reducing labor intensity and improving adhesive coating efficiency.

[0008] Furthermore, the clamping and centering assembly includes a synchronous drive assembly, a synchronous transmission mechanism, and two alignment push plates. The two alignment push plates are movably mounted on the mounting frame and symmetrically arranged on both sides of the transfer basket. The synchronous drive assembly is mounted on the mounting frame, and the output end of the synchronous drive assembly is connected to the two alignment push plates through the synchronous transmission mechanism to drive the two alignment push plates to move synchronously in a mirror image.

[0009] Furthermore, both alignment push plates are hinged to the mounting bracket, and the synchronous drive assembly is used to drive the two alignment push plates to swing synchronously in mirror direction or away from the transfer basket via a synchronous transmission structure.

[0010] Furthermore, the synchronous transmission mechanism includes a first helical gear, a second helical gear, a first synchronous pulley group, a second synchronous pulley group, a first synchronous belt, and a second synchronous belt. The first and second helical gears mesh and are both rotatably mounted on the mounting bracket. The output end of the synchronous drive component is connected to either the first or second helical gear. All synchronous pulleys in the first synchronous pulley group are connected via the first synchronous belt. One synchronous pulley in the first synchronous pulley group is connected to the first helical gear, and another synchronous pulley in the first synchronous pulley group is connected to one of the alignment push plates. All synchronous pulleys in the second synchronous pulley group are connected via the second synchronous belt. One synchronous pulley in the second synchronous pulley group is connected to the second helical gear, and another synchronous pulley in the second synchronous pulley group is connected to another alignment push plate.

[0011] Furthermore, the alignment push plate includes a swing arm and a push plate body. The swing arm is hinged to the mounting bracket, and the push plate body is slidably mounted on the swing arm. An elastic element is provided between the push plate body and the swing arm.

[0012] When the synchronous drive component drives the swing arm to swing and the push plate body moves toward the transfer basket to clamp the solar silicon wafer, the push plate body slides slightly relative to the swing arm within a certain range. The elastic element absorbs part of the clamping force. Therefore, this technical solution can effectively avoid damage to the solar silicon wafer due to excessive local stress.

[0013] Furthermore, the elastic element includes a spring.

[0014] Furthermore, the transfer basket includes four rectangular arrays of pillars, each pillar having silicon wafer support teeth. The four silicon wafer support teeth at the same height are used to support one solar silicon wafer.

[0015] Furthermore, the silicon wafer support tooth includes a connecting part and a protrusion. The connecting part is connected to the post, and the top surface height of the protrusion is greater than the top surface height of the connecting part.

[0016] Since the top surface height of the protrusion is greater than that of the connecting part, this technical solution can ensure that the protrusion only contacts the area of ​​the solar silicon wafer that is not coated with adhesive. This effectively avoids damage or contamination of the adhesive coating layer caused by contact between the silicon wafer support teeth and the area of ​​the solar silicon wafer that has been coated with adhesive. In other words, this technical solution can effectively improve the quality and reliability of adhesive coating, thereby effectively improving the overall production yield and product performance of solar silicon wafers.

[0017] Furthermore, the two columns near the drive end of the clamping and centering assembly are offset from the two columns away from the drive end of the clamping and centering assembly.

[0018] Furthermore, each column is equipped with multiple spaced silicon wafer support teeth.

[0019] As can be seen from the above, the rotating centering device for solar silicon wafers provided by this utility model realizes the automated centering and rotation of solar silicon wafers during the adhesive coating process by introducing a rotating component, a mounting frame, a transfer basket and a clamping centering component. Therefore, this application can use automated centering and rotation to replace manual centering and rotation, thereby effectively reducing labor intensity and improving adhesive coating efficiency. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of a rotating alignment device for solar silicon wafers provided in an embodiment of this application.

[0021] Figure 2 This is a schematic diagram of the structure of the rotating assembly, mounting bracket, transfer basket, and clamping centering assembly provided in the embodiments of this application.

[0022] Figure 3 This is a schematic diagram of the clamping and centering assembly provided in an embodiment of this application.

[0023] Figure 4 This is a schematic diagram of the alignment push plate provided in an embodiment of this application.

[0024] Figure 5 for Figure 4 A magnified structural diagram of point A in the diagram.

[0025] Figure 6 This is a schematic diagram of the structure of the transfer flower basket provided in an embodiment of this application.

[0026] Figure 7 for Figure 6 A magnified structural diagram of point B in the diagram.

[0027] Labeling Explanation: 1. Frame; 2. Rotating Assembly; 3. Mounting Frame; 4. Transfer Basket; 41. Column; 42. Silicon Wafer Support Tooth; 421. Connecting Part; 422. Protrusion; 5. Clamping and Centering Assembly; 51. Synchronous Drive Assembly; 52. Synchronous Transmission Mechanism; 521. First Helical Gear; 522. Second Helical Gear; 523. First Synchronous Pulley Set; 524. Second Synchronous Pulley Set; 525. First Synchronous Belt; 526. Second Synchronous Belt; 53. Alignment Push Plate; 531. Swing Arm; 532. Push Plate Body; 6. Elastic Element. Detailed Implementation

[0028] The embodiments of this utility model are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0029] The following disclosure provides many different embodiments or examples for implementing various structures of the present invention. To simplify the disclosure, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or reference letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0030] like Figures 1-7 As shown, this application provides a rotating alignment device for solar silicon wafers, comprising: Rack 1; Rotating component 2 is mounted on frame 1; Mounting bracket 3 is connected to the output end of rotating component 2; Transfer basket 4, installed on mounting frame 3, is used to support solar silicon wafers; Clamping and centering component 5 is installed on mounting bracket 3; After the solar silicon wafer with adhesive applied to its two parallel sides is placed on the transfer basket 4, the clamping and centering component 5 centers the solar silicon wafer by simultaneously clamping the two sides of the solar silicon wafer that are not coated with adhesive. Then, the rotating component 2 drives the transfer basket 4 to rotate 90° through the mounting bracket 3.

[0031] The rotating alignment device for solar silicon wafers provided in this application automates the alignment and rotation of solar silicon wafers, effectively solving the problems of low efficiency and high labor intensity caused by manual alignment and rotation. This significantly improves the automation level and production efficiency of adhesive coating for solar silicon wafers. Specifically, alignment refers to ensuring that the center of the solar silicon wafer placed on the transfer basket 4 is coaxial with the center of the transfer basket 4. This embodiment ensures the accuracy of the robotic arm's gripping by aligning the solar silicon wafer, thus ensuring the accuracy of subsequent adhesive coating. Rotating 90° means rotating the solar silicon wafer a quarter turn from its initial position so that the uncoated side is not obstructed by the robotic arm, allowing the uncoated side of the solar silicon wafer to be coated with adhesive.

[0032] The rotating alignment device for solar silicon wafers provided in this embodiment mainly consists of a frame 1, a first rotating component 2, a mounting frame 3, a transfer basket 4, and a clamping alignment component 5. The frame 1 in this embodiment serves as the supporting structure for the entire device. The frame 1 is preferably constructed from high-strength metal materials (such as steel or aluminum alloy) welded or bolted together to ensure the stability and rigidity of the rotating alignment device during operation. The bottom of the frame 1 is preferably equipped with leveling pads or casters to facilitate the installation, leveling, and movement of the rotating alignment device. The rotating component 2 in this embodiment drives the mounting frame 3 to rotate, thereby rotating the transfer basket 4 on the mounting frame 3. The rotating component 2 can be a drive unit consisting of a servo motor and a reducer, with its output shaft connected to the mounting frame 3 via a coupling. The mounting frame 3 in this embodiment is the base supporting the transfer basket 4 and the clamping alignment component 5. The mounting frame 3 can be connected to the output end of the rotating component 2 using bolt fixing, key connection, or tapered sleeve connection to ensure sufficient torque is transmitted during rotation. The transfer basket 4 in this embodiment is used to support solar silicon wafers. The transfer basket 4 can be designed with multiple support teeth to provide multi-point support for the solar silicon wafers. The clamping and centering assembly 5 in this embodiment is used to precisely center the solar silicon wafers placed on the transfer basket 4. The clamping and centering assembly 5 can consist of two symmetrically arranged clamping mechanisms. The two clamping mechanisms move synchronously to center the solar silicon wafers by simultaneously clamping the two sides of the solar silicon wafers that are not coated with adhesive.

[0033] The working principle of the rotating alignment device for solar silicon wafers in this embodiment is as follows: First, after adhesive is applied to the two parallel sides of the solar silicon wafer, the wafer is placed on the transfer basket 4 by a robotic arm, with the un-adhesive-coated sides of the wafer facing the clamping alignment assembly 5. Next, the clamping alignment assembly 5 is activated, precisely aligning the solar silicon wafer by synchronously clamping the un-adhesive-coated sides. Specifically, the two clamping mechanisms or push plates of the clamping alignment assembly 5 move inward synchronously until they contact the sides of the solar silicon wafer and apply appropriate clamping force, thereby positioning the solar silicon wafer at the center of the transfer basket 4. The synchronous clamping mechanism of the clamping alignment assembly 5 ensures precise alignment of the solar silicon wafer, providing a stable foundation for subsequent adhesive application. After alignment, the clamping alignment assembly 5 remains clamped to secure the solar silicon wafer. Subsequently, the rotating component 2 drives the transfer basket 4, along with the solar silicon wafer on it, to rotate synchronously by 90° via the mounting frame 3. This exposes the uncoated sides of the solar silicon wafer after it is gripped (i.e., the uncoated sides are not obstructed by the robotic arm), allowing for the application of adhesive to these sides. After rotation, the clamping and centering component 5 releases its grip on the solar silicon wafer, enabling the robotic arm to easily remove it. The entire process achieves automated centering and rotation of the solar silicon wafer without manual intervention.

[0034] This application provides a rotating alignment device for solar silicon wafers. By introducing a rotating component 2, a mounting frame 3, a transfer basket 4, and a clamping alignment component 5, the device achieves automated alignment and rotation of solar silicon wafers during the adhesive coating process. Therefore, this application can replace manual alignment and rotation with automated alignment and rotation, thereby effectively reducing labor intensity and improving adhesive coating efficiency.

[0035] In some preferred embodiments, the clamping and centering assembly 5 includes a synchronous drive assembly 51, a synchronous transmission mechanism 52, and two alignment push plates 53. The two alignment push plates 53 are movably mounted on the mounting frame 3 and symmetrically arranged on both sides of the transfer basket 4. The synchronous drive assembly 51 is mounted on the mounting frame 3, and its output end is connected to the two alignment push plates 53 via the synchronous transmission mechanism 52 to drive the two alignment push plates 53 to move synchronously and mirror-like. In this embodiment, the synchronous drive assembly 51 can be understood as a component that provides the power required for clamping and centering. The synchronous transmission mechanism 52 in this embodiment refers to a mechanical structure that precisely transmits the power of the synchronous drive assembly 51 to the two alignment push plates 53, enabling the two alignment push plates 53 to move synchronously. In this embodiment, the two alignment push plates 53 are components that directly contact the solar silicon wafers and apply clamping force. These two alignment push plates 53 are symmetrically arranged on both sides of the transfer basket 4 to simultaneously clamp the solar silicon wafers placed on the transfer basket 4 from both sides.

[0036] In some preferred embodiments, the synchronous drive assembly 51 can be an existing stepper motor or servo motor. Two alignment push plates 53 are slidably mounted on the mounting bracket 3. The synchronous transmission mechanism 52 can consist of a main gear, two driven gears, and a synchronous belt. The synchronous drive assembly 51 drives one main gear, which is connected to the two driven gears via the synchronous belt. Each driven gear is connected to an alignment push plate 53 to ensure that the two alignment push plates 53 can move at the same speed and displacement under drive. After the solar silicon wafer is placed on the transfer basket 4, the synchronous drive assembly 51 is activated, driving the two alignment push plates 53 to slide synchronously from both sides of the solar silicon wafer towards it via the synchronous transmission mechanism 52 until the solar silicon wafer is clamped and aligned.

[0037] In some preferred embodiments, both alignment push plates 53 are hinged to the mounting frame 3, and the synchronous drive assembly 51 is used to drive the two alignment push plates 53 to swing synchronously toward or away from the transfer basket 4 via a synchronous transmission structure. In this embodiment, the two alignment push plates 53 are rotatably mounted on the mounting frame 3, meaning that the alignment push plates 53 rotate around a fixed axis rather than simply translating linearly. This rotatable mounting method allows the alignment push plates 53 to swing closer to or away from the transfer basket 4. The synchronous swing toward or away from the transfer basket 4 in this embodiment refers to the two alignment push plates 53, driven by the synchronous drive assembly 51, synchronously moving closer to or away from the centerline of the transfer basket 4 with the same angular velocity and direction, thereby achieving precise clamping or release of the solar silicon wafer.

[0038] In some preferred embodiments, the synchronous transmission mechanism 52 includes a first helical gear 521, a second helical gear 522, a first synchronous pulley set 523, a second synchronous pulley set 524, a first synchronous belt 525, and a second synchronous belt 526. The first helical gear 521 and the second helical gear 522 mesh and are both rotatably mounted on the mounting bracket 3. The output end of the synchronous drive assembly 51 is connected to the first helical gear 521 or the second helical gear 522. All synchronous pulleys in the first synchronous pulley set 523 are connected through the first synchronous belt 525. One synchronous pulley in the first synchronous pulley set 523 is connected to the first helical gear 521. Another synchronous pulley in the first synchronous pulley set 523 is connected to one of the alignment push plates 53. All synchronous pulleys in the second synchronous pulley set 524 are connected through the second synchronous belt 526. One synchronous pulley in the second synchronous pulley set 524 is connected to the second helical gear 522. Another synchronous pulley in the second synchronous pulley set 524 is connected to another alignment push plate 53. In this embodiment, the first helical gear 521 and the second helical gear 522 are designed to mesh with each other. Since the output end of the synchronous drive component 51 in this embodiment is connected to either the first helical gear 521 or the second helical gear 522, this embodiment is equivalent to splitting the rotational motion of the synchronous drive component 51 and transmitting it to two independent transmission paths, while ensuring the initial synchronization of the two paths. The meshing of the first helical gear 521 and the second helical gear 522 helps to achieve smooth power transmission and can withstand large loads. The first synchronous pulley set 523 and the second synchronous pulley set 524 are each composed of multiple synchronous pulleys. These synchronous pulleys are connected by their respective synchronous belts. Synchronous belt drives have advantages such as precise transmission ratio, no slippage, low noise, and convenient maintenance, and are particularly suitable for occasions requiring precise synchronization. One synchronous pulley in the first synchronous pulley set 523 is connected to the first helical gear 521 and is responsible for receiving power from the first helical gear 521; the other synchronous pulley is connected to one of the alignment push plates 53 and transmits power to the alignment push plate 53, causing it to oscillate. Similarly, one of the synchronizer pulleys in the second synchronizer pulley set 524 is connected to the second helical gear 522 and receives power from the second helical gear 522; the other synchronizer pulley is connected to another alignment push plate 53 and transmits power to the alignment push plate 53 to make it swing.

[0039] This embodiment effectively splits a single drive source into two synchronous drive paths by first transmitting the output power of the synchronous drive assembly 51 to a pair of meshing helical gears (first helical gear 521 and second helical gear 522). Due to the meshing characteristics of the first helical gear 521 and the second helical gear 522, these two gears can rotate synchronously with a precise transmission ratio. Subsequently, these two synchronous rotational movements are precisely transmitted to the two alignment push plates 53 through the first synchronous pulley set 523 and the second synchronous pulley set 524, and their respective synchronous belts. The synchronous belt drive mechanism ensures that the two alignment push plates 53 maintain strict synchronicity during the power transmission from the helical gears to the alignment push plates 53, avoiding alignment deviations caused by transmission errors or slippage. This split-synchronous transmission mechanism enables the two alignment push plates 53 to maintain a highly consistent motion trajectory and speed when swinging towards or away from the central basket 4, thereby ensuring precise alignment of the solar silicon wafers.

[0040] In some preferred embodiments, the alignment pusher 53 includes a swing arm 531 and a pusher body 532. The swing arm 531 is hinged to the mounting frame 3, and the pusher body 532 is slidably mounted on the swing arm 531. An elastic element 6 is provided between the pusher body 532 and the swing arm 531. In this embodiment, the swing arm 531 is the main structure that realizes the swing function of the alignment pusher 53. This swing is rotatably mounted on the mounting frame 3. In this embodiment, the pusher body 532 is the part that directly contacts the solar silicon wafer. The pusher body 532 is slidably mounted on the swing arm 531, that is, the pusher body 532 has a certain degree of freedom of movement relative to the swing arm 531. In this embodiment, the elastic element 6 is disposed between the pusher body 532 and the swing arm 531. The elastic element 6 is preferably disposed between the back side of the pusher body 532 (the side that does not contact the solar silicon wafer) and the swing arm 531. The function of the elastic element 6 is to provide a buffer when the pusher body 532 contacts the solar silicon wafer and to accommodate possible size or positional deviations of the solar silicon wafer. This embodiment effectively solves the problems that may be caused by rigid clamping by decomposing the alignment push plate 53 into a swing arm 531 and a push plate body 532 and introducing an elastic element 6 between the two. Specifically, when the synchronous drive assembly 51 drives the swing arm 531 to swing and the push plate body 532 moves toward the transfer basket 4 to clamp the solar silicon wafer, the push plate body 532 slides slightly relative to the swing arm 531 within a certain range. The elastic element 6 absorbs part of the clamping force. Therefore, this embodiment can effectively avoid the situation where the solar silicon wafer is damaged due to excessive local stress.

[0041] In some preferred embodiments, the elastic element 6 includes a spring. The spring in this embodiment is a common mechanical elastic element 6 that stores and releases energy through deformation to provide elastic force. Specifically, the spring in this embodiment does not deform when the pusher body 532 is not in contact with the solar silicon wafer, and is compressed when the swing arm 531 swings to bring the pusher body 532 closer to and in contact with the solar silicon wafer.

[0042] In some preferred embodiments, the transfer basket 4 includes four pillars 41, each pillar 41 having a silicon wafer support tooth 42. The four silicon wafer support teeth 42 at the same height are used to support one solar silicon wafer. The transfer basket 4 in this embodiment is designed to have four pillars 41, which are preferably arranged in a rectangular array to form a stable support structure. Each pillar 41 is provided with a silicon wafer support tooth 42. When the solar silicon wafer is placed on the transfer basket 4, the four silicon wafer support teeth 42 at the same height will work together to support the solar silicon wafer. That is, this embodiment is equivalent to using four support points to support the solar silicon wafer, so as to ensure the stability and positioning accuracy of the silicon wafer in the horizontal direction. This embodiment designs the transfer basket 4 to include four pillars 41 and provides silicon wafer support teeth 42 on each pillar 41, so that the solar silicon wafers can be stably supported. Therefore, this embodiment can effectively prevent the solar silicon wafers from shaking, shifting or falling during subsequent clamping and centering and the rotation of the transfer basket 4 by the rotating component 2, thereby effectively improving the accuracy and reliability of the centering and rotation operations.

[0043] In some preferred embodiments, the wafer support tooth 42 includes a connecting portion 421 and a protrusion 422. The connecting portion 421 is connected to the column 41, and the top surface height of the protrusion 422 is greater than the top surface height of the connecting portion 421. In this embodiment, the connecting portion 421 is the part that connects the wafer support tooth 42 to the column 41, and this connecting portion 421 is used to securely fix the wafer support tooth 42 to the column 41. In this embodiment, the protrusion 422 is the part of the wafer support tooth 42 that actually contacts the solar silicon wafer and provides support. Because the top surface height of the protrusion 422 in this embodiment is set to be greater than the top surface height of the connecting portion 421, that is, when the solar silicon wafer is placed on the wafer support tooth 42, only the protrusion 422 will contact the solar silicon wafer. Therefore, this embodiment can precisely control the contact area between the wafer support tooth 42 and the solar silicon wafer through this height difference design.

[0044] This embodiment achieves precise support for the solar silicon wafer by designing the silicon wafer support teeth 42 to have a connecting portion 421 and a protrusion 422, and by making the top surface height of the protrusion 422 greater than the top surface height of the connecting portion 421. Specifically, when the solar silicon wafer is placed on the transfer basket 4, since the top surface height of the protrusion 422 is greater than the top surface height of the connecting portion 421, only the protrusion 422 can contact the solar silicon wafer. Since the areas on the solar silicon wafer that are coated with adhesive and those that are not coated with adhesive are predetermined, this embodiment ensures that the protrusion 422 only contacts the areas on the solar silicon wafer that are not coated with adhesive by setting the position of the protrusion 422 accordingly based on the predetermined areas. This effectively avoids damage or contamination of the adhesive coating layer caused by contact between the silicon wafer support teeth 42 and the areas on the solar silicon wafer that are coated with adhesive. In other words, this embodiment can effectively improve the quality and reliability of adhesive coating, thereby effectively improving the overall production yield and product performance of the solar silicon wafer.

[0045] In some preferred embodiments, the two posts 41 near the driving end of the clamping and centering assembly 5 are misaligned with the two posts 41 away from the driving end of the clamping and centering assembly 5. This misalignment means that the two posts 41 near the driving end of the clamping and centering assembly 5 are not directly opposite the two posts 41 away from the driving end of the clamping and centering assembly 5.

[0046] In some preferred embodiments, each column 41 is provided with a plurality of spaced-apart silicon wafer support teeth 42. Because each column 41 in this embodiment is provided with a plurality of spaced-apart silicon wafer support teeth 42, the transfer basket 4 of this embodiment can simultaneously support multiple solar silicon wafers; that is, this embodiment can rotate and center multiple solar silicon wafers at once. The spaced-apart arrangement in this embodiment means that the silicon wafer support teeth 42 on the same column 41 maintain a certain distance from each other in the vertical direction, ensuring that each solar silicon wafer can be placed independently and avoiding mutual contact and potential damage.

[0047] As can be seen from the above, the rotating centering device for solar silicon wafers provided by this utility model achieves automated centering and rotation of solar silicon wafers during the adhesive coating process by introducing a rotating component 2, a mounting frame 3, a transfer basket 4, and a clamping centering component 5. Therefore, this application can replace manual centering and rotation with automated centering and rotation, thereby effectively reducing labor intensity and improving adhesive coating efficiency.

[0048] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0049] The above descriptions are merely some embodiments of this utility model. For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of this utility model, and all such modifications and improvements fall within the protection scope of this utility model.

Claims

1. A rotating alignment device for solar silicon wafers, characterized in that, The rotating centering device for solar silicon wafers includes: frame; A rotating assembly is mounted on the frame; The mounting bracket is connected to the output end of the rotating assembly; A transfer basket, installed on the mounting frame, is used to support solar silicon wafers; The clamping and centering assembly is mounted on the mounting bracket; After the solar silicon wafer with adhesive applied to its two parallel sides is placed on the transfer basket, the clamping and centering assembly centers the solar silicon wafer by simultaneously clamping the two sides of the solar silicon wafer that are not coated with adhesive. Then, the rotating assembly drives the transfer basket to rotate 90° through the mounting frame.

2. The rotating alignment device for solar silicon wafers according to claim 1, characterized in that, The clamping and centering assembly includes a synchronous drive assembly, a synchronous transmission mechanism, and two alignment push plates. The two alignment push plates are movably mounted on the mounting frame and symmetrically arranged on both sides of the transfer basket. The synchronous drive assembly is mounted on the mounting frame, and the output end of the synchronous drive assembly is connected to the two alignment push plates through the synchronous transmission mechanism to drive the two alignment push plates to move synchronously in a mirror image.

3. The rotating alignment device for solar silicon wafers according to claim 2, characterized in that, Both alignment push plates are hinged to the mounting bracket, and the synchronous drive assembly is used to drive the two alignment push plates to swing synchronously in a mirror image toward or away from the transfer basket through the synchronous transmission mechanism.

4. The rotating alignment device for solar silicon wafers according to claim 3, characterized in that, The synchronous transmission mechanism includes a first helical gear, a second helical gear, a first synchronous pulley group, a second synchronous pulley group, a first synchronous belt, and a second synchronous belt. The first and second helical gears mesh and are both rotatably mounted on the mounting bracket. The output end of the synchronous drive component is connected to either the first or second helical gear. All synchronous pulleys in the first synchronous pulley group are connected via the first synchronous belt. One synchronous pulley in the first synchronous pulley group is connected to the first helical gear, and another synchronous pulley in the first synchronous pulley group is connected to one of the alignment push plates. All synchronous pulleys in the second synchronous pulley group are connected via the second synchronous belt. One synchronous pulley in the second synchronous pulley group is connected to the second helical gear, and another synchronous pulley in the second synchronous pulley group is connected to another alignment push plate.

5. The rotating alignment device for solar silicon wafers according to claim 3, characterized in that, The alignment pusher includes a swing arm and a pusher body. The swing arm is hinged to the mounting bracket, and the pusher body is slidably mounted on the swing arm. An elastic element is provided between the pusher body and the swing arm.

6. The rotating alignment device for solar silicon wafers according to claim 5, characterized in that, The elastic element includes a spring.

7. The rotating alignment device for solar silicon wafers according to claim 1, characterized in that, The transfer basket includes four rectangular arrays of pillars, each pillar having silicon wafer support teeth. The four silicon wafer support teeth at the same height are used to support one solar silicon wafer.

8. The rotating alignment device for solar silicon wafers according to claim 7, characterized in that, The silicon wafer support tooth includes a connecting part and a protrusion. The connecting part is connected to the column, and the top surface height of the protrusion is greater than the top surface height of the connecting part.

9. The rotating alignment device for solar silicon wafers according to claim 7, characterized in that, The two columns near the drive end of the clamping and centering assembly are offset from the two columns away from the drive end of the clamping and centering assembly.

10. The rotating alignment device for solar silicon wafers according to claim 7, characterized in that, Each of the columns is provided with multiple spaced silicon wafer support teeth.

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