Integrated circuit component super-clean cleaning device

Abstract

The utility model belongs to the technical field of cleaning device, especially related to integrated circuit component superclean cleaning device, include: cleaning machine body and cleaning pool, the cleaning pool fixed mounting is in the inside of cleaning machine body, the top of cleaning pool is provided with the containing basket, the inside of sinking pool is provided with the filter vat, the inside fixed mounting of sinking pool has the water pump, the inside fixed mounting of filter case has the filter tow, the one end of conveying pipe is away from water pump and is connected with one side of filter case fixedly, through the cooperation between sinking pool, filter vat, filter case and water pump, through sinking pool to the cleaning liquid below the cleaning pool bottom is drained, makes the cleaning liquid that the cleaning pool bottom is mixed with the impurity flows into the inside of sinking pool, through water pump as power source, intercepts the impurity in filter tow and the inside of filter vat, thereby keeps the cleanness of cleaning liquid in the inside of cleaning pool, improves the cleaning effect to integrated circuit component.

Description

Technical Field

[0001] This utility model belongs to the technical field of cleaning devices, and particularly relates to an ultra-clean cleaning device for integrated circuit components. Background Technology

[0002] Integrated circuit (IC) components (such as wafers, chips, packaging substrates, lead frames, etc.) are prone to adsorbing photoresist residues, metal ions, particulate contaminants, organic impurities, etc. during the entire manufacturing, packaging, and testing process. These contaminants can directly lead to problems such as chip short circuits, reduced yield, and reliability failures. Ultra-clean cleaning equipment for IC components is a key device used to remove various contaminants from the wafer surface during IC manufacturing to ensure chip yield and performance. Through precisely controlled physical, chemical, or composite cleaning technologies, it achieves ultra-clean, low-damage, and highly uniform purification of IC component surfaces, providing a clean surface that meets requirements for subsequent key processes such as photolithography, etching, bonding, and packaging, thus ensuring the performance, yield, and long-term stability of integrated circuits. Ultra-clean cleaning equipment for IC components mainly includes semiconductor ultrasonic cleaners, single-wafer cleaners, and semiconductor packaging plasma cleaners.

[0003] Currently, when using ultrasonic cleaners to clean integrated circuit components, the majority of methods involve placing the integrated circuit components inside a cleaning frame, and then placing both the frame and the components into a cleaning tank. While this method effectively cleans the components, after removing surface-adhering impurities, these impurities remain suspended within the cleaning solution. When the integrated circuit components are removed from the cleaning tank, these impurities adhere to their surfaces, reducing the overall cleaning effectiveness. Therefore, we propose an ultra-clean cleaning device for integrated circuit components. Utility Model Content

[0004] The purpose of this invention is to provide an ultra-clean cleaning device for integrated circuit components to solve the problems mentioned in the background art.

[0005] In view of this, the present invention provides an ultra-clean cleaning device for integrated circuit components, comprising: a cleaning machine body and a cleaning tank, wherein the cleaning tank is fixedly installed inside the cleaning machine body, a receiving basket is provided above the cleaning tank, a guide nozzle is fixedly connected to one side of the cleaning tank, a sinking tank is fixedly connected to the end of the guide nozzle away from the cleaning tank, a filter barrel is provided inside the sinking tank, a water pump is fixedly installed inside the sinking tank, and a delivery pipe is fixedly connected to the output end of the water pump; A guide plate is fixedly connected to the inner wall of the cleaning tank, a filter box is fixedly installed on one side of the cleaning tank, filter cotton is fixedly installed inside the filter box, and the end of the delivery pipe away from the water pump is fixedly connected to one side of the filter box.

[0006] In this technical solution, the cleaning solution is filtered by the filter cotton inside the filter barrel and filter box, and impurities are intercepted inside the filter cotton and filter barrel. The cleaning solution is kept clean by continuous circulation.

[0007] In the above technical solution, a support frame is further fixedly installed on the outer surface of the cleaning machine body, and the inner wall of the support frame is in contact with the outer surface of the conveying pipe.

[0008] In this technical solution, it is used to maintain the stability of the delivery pipe.

[0009] In the above technical solution, a slot is further provided on the inner side of the sedimentation tank, and the filter bucket is located inside the slot. A handle is fixedly installed on the top of the filter bucket.

[0010] In this technical solution, it is easy to remove the filter bucket from the sedimentation tank.

[0011] In the above technical solution, furthermore, the number of the guide plates is multiple, and the multiple guide plates are arranged in an array at equal intervals.

[0012] In this technical solution, the probability of impurities at the bottom of the cleaning tank floating upwards is reduced.

[0013] In the above technical solution, two supports are fixedly installed on the top of the cleaning machine body, and the two supports are symmetrical. The inner walls of the two supports are rotatably connected to a rotating shaft, and the opposite ends of the two rotating shafts are fixedly connected to a four-legged bracket.

[0014] In this technical solution, support is provided for the basket.

[0015] In the above technical solution, four support rods are fixedly connected to the inner wall of the tripod, and connecting feet are fixedly connected to the outer surface of the container basket. The end of the connecting foot away from the container basket is hinged to the outer surface of the support rod.

[0016] In this technical solution, the angle of the container basket can be adjusted.

[0017] In the above technical solution, a motor is further fixedly installed on one side of one of the brackets, and the output shaft of the motor is fixedly connected to one end of one of the rotating shafts.

[0018] In this technical solution, power is provided to move the container basket.

[0019] The beneficial effects of this utility model are: 1. This ultra-clean cleaning device for integrated circuit components, through the cooperation of a settling tank, a filter barrel, a filter box, and a water pump, guides the cleaning fluid from the bottom of the cleaning tank through the settling tank, allowing the cleaning fluid containing impurities at the bottom of the cleaning tank to flow into the interior of the settling tank. The water pump provides power for the flow of the cleaning fluid. The cleaning fluid is filtered through the filter cotton inside the filter barrel and filter box, intercepting impurities inside the filter cotton and filter barrel, thereby maintaining the cleanliness of the cleaning fluid inside the cleaning tank and improving the cleaning effect on integrated circuit components.

[0020] 2. This ultra-clean cleaning device for integrated circuit components, through the cooperation between support rods, connecting feet and receiving baskets, uses four support rods to support four receiving baskets, and the four support rods circulate into the cleaning tank, which can continuously clean the integrated circuit components, thereby improving the cleaning operation of integrated circuit components. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the internal structure of the cleaning machine body in this utility model; Figure 3 This is a schematic diagram of the sedimentation tank structure in this utility model; Figure 4 This is a top view of the sedimentation tank structure in this utility model; Figure 5 This is a schematic diagram of the filter barrel structure in this utility model; Figure 6 This is a cross-sectional schematic diagram of the internal structure of the cleaning tank in this utility model.

[0022] The markings in the diagram are as follows: 1. Cleaning machine body; 2. Cleaning tank; 3. Container basket; 4. Guide nozzle; 5. Settling tank; 6. Filter barrel; 7. Water pump; 8. Delivery pipe; 9. Guide plate; 10. Filter box; 11. Filter cotton; 12. Support frame; 13. Slot; 14. Handle; 15. Bracket; 16. Rotating shaft; 17. Four-legged stand; 18. Support rod; 19. Connecting foot; 20. Motor. Detailed Implementation

[0023] The following is in conjunction with the appendix Figures 1-6 This application will be described in further detail.

[0024] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," and "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0025] Example 1: This example provides an ultra-clean cleaning device for integrated circuit components, including: a cleaning machine body 1 and a cleaning tank 2. The cleaning tank 2 is fixedly installed inside the cleaning machine body 1. A receiving basket 3 is provided above the cleaning tank 2. A guide nozzle 4 is fixedly connected to one side of the cleaning tank 2. A sink tank 5 is fixedly connected to the end of the guide nozzle 4 away from the cleaning tank 2. A filter barrel 6 is provided inside the sink tank 5. A water pump 7 is fixedly installed inside the sink tank 5. A delivery pipe 8 is fixedly connected to the output end of the water pump 7. The bottom of the sink tank 5 is lower than the cleaning tank 2, and the top of the sink tank 5 is higher to prevent the cleaning liquid inside the cleaning tank 2 from overflowing from the top of the sink tank 5. The top of the sink tank 5 is located below the cover plate of the cleaning machine body 1, which facilitates the flow of the cleaning liquid inside the cleaning tank 2 into the sink tank 5. The water pump 7 is used as a power source to provide power for the flow of the cleaning liquid and output the cleaning liquid collected inside the sink tank 5.

[0026] A guide plate 9 is fixedly connected to the inner wall of the cleaning tank 2. A filter box 10 is fixedly installed on one side of the cleaning tank 2. Filter cotton 11 is fixedly installed inside the filter box 10. The end of the conveying pipe 8 away from the water pump 7 is fixedly connected to one side of the filter box 10.

[0027] The filter box 10 is connected to the inside of the cleaning tank 2. The cleaning liquid delivered by the conveying pipe 8 is filtered through the filter cotton 11 inside the filter tank, and the impurities inside the cleaning liquid are intercepted inside the filter cotton 11, thereby improving the cleanliness of the cleaning liquid. The filtered cleaning liquid is then reinjected into the cleaning tank 2. The top of the filter box 10 can be opened for replacing the filter cotton 11 inside the filter box 10.

[0028] Example 2: This example provides an ultra-clean cleaning device for integrated circuit components. In addition to the technical solutions of the above examples, it also has the following technical features: a support frame 12 is fixedly installed on the outer surface of the cleaning machine body 1, and the inner wall of the support frame 12 is in contact with the outer surface of the conveying pipe 8.

[0029] The support frame 12 provides support for the conveying pipe 8, maintaining the stability of the conveying pipe 8.

[0030] Example 3: This example provides an ultra-clean cleaning device for integrated circuit components. In addition to the technical solutions of the above examples, it also has the following technical features: a slot 13 is provided on the inner side of the settling tank 5, and the filter bucket 6 is located inside the slot 13. A handle 14 is fixedly installed on the top of the filter bucket 6.

[0031] The cleaning fluid flowing into the settling tank 5 is filtered by the filter bucket 6 to prevent large particles of impurities from coming into contact with the water pump 7 and causing damage to the water pump 7, thereby improving the safety of the water pump 7. The settling tank 5 provides a space for the filter bucket 6 through the slot 13, and the filter bucket 6 can be easily lifted out of the slot 13 through the handle 14. After the filter bucket 6 is lifted out of the slot 13, the impurities trapped inside are cleaned away.

[0032] Example 4: This example provides an ultra-clean cleaning device for integrated circuit components. In addition to the technical solutions of the above examples, it also has the following technical features: the number of guide plates 9 is multiple, and the multiple guide plates 9 are arrayed at equal intervals.

[0033] The guide plate 9 guides the flow of the cleaning liquid below the cleaning tank 2. The guide plate 9 also has an inclined angle. By guiding the impurities inside the cleaning liquid to flow towards the guide nozzle 4, the probability of impurities floating upwards during flow is reduced.

[0034] Example 5: This example provides an ultra-clean cleaning device for integrated circuit components. In addition to the technical solutions of the above examples, it also has the following technical features: two brackets 15 are fixedly installed on the top of the cleaning machine body 1, and the two brackets 15 are symmetrical. The inner walls of the two brackets 15 are rotatably connected to the rotating shafts 16, and the opposite ends of the two rotating shafts 16 are fixedly connected to the four-legged brackets 17.

[0035] The quadrupole 17 has four support rods 18 installed inside. These four support rods 18 can support the four containers 3. The four containers 3 can improve the cleaning effect on the integrated circuit components. The four containers 3 can be divided into cleaning, waiting, water control and drying. Multiple cleaning steps are completed through multiple containers 3, forming a continuous cycle, thereby improving the cleaning efficiency of the integrated circuit components.

[0036] Example 6: This example provides an ultra-clean cleaning device for integrated circuit components. In addition to the technical solutions of the above examples, it also has the following technical features: four support rods 18 are fixedly connected to the inner wall of the tripod 17, and connecting feet 19 are fixedly connected to the outer surface of the receiving basket 3. The end of the connecting foot 19 away from the receiving basket 3 is hinged to the outer surface of the support rods 18.

[0037] The support rod 18 provides support for the container basket 3, maintaining its stability. The connecting foot 19 allows the container basket 3 to be rotated to adjust its angle, ensuring that the container basket 3 remains horizontal at all times.

[0038] Example 7: This example provides an ultra-clean cleaning device for integrated circuit components. In addition to the technical solutions of the above examples, it also has the following technical features: a motor 20 is fixedly installed on one side of a bracket 15, and the output shaft of the motor 20 is fixedly connected to one end of a rotating shaft 16.

[0039] The motor 20 serves as the power source, providing power for the rotation of the container basket 3, which drives multiple container baskets 3 to enter the interior of the cleaning tank 2 in sequence. The motor 20 is controlled by a controller and an encoder, and the rotation speed and angle of the motor 20 are set so that the container basket 3 can accurately enter the interior of the cleaning tank 2.

[0040] Working principle: First, water pump 7 is started. After water pump 7 starts, the cleaning liquid inside the settling tank 5 is drawn into the filter box 10. After the cleaning liquid inside the settling tank 5 is discharged, the water level drops. The cleaning liquid inside the cleaning tank 2 continues to flow into the settling tank 5. While flowing into the settling tank 5, the cleaning liquid first passes through the filter barrel 6 for filtration. After filtration, large particles of impurities inside the cleaning liquid are intercepted inside. The cleaning liquid drawn by water pump 7 is transported into the filter box 10 through the delivery pipe 8. The cleaning liquid is filtered again by the filter cotton 11 inside the filter box 10 and then injected back into the cleaning tank 2.

[0041] The embodiments of this application have been described above with reference to the accompanying drawings. Unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other. This application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. An ultra-clean cleaning device for integrated circuit components, comprising: The cleaning machine body (1) and the cleaning tank (2) are characterized in that the cleaning tank (2) is fixedly installed inside the cleaning machine body (1), a receiving basket (3) is provided above the cleaning tank (2), a guide nozzle (4) is fixedly connected to one side of the cleaning tank (2), a sinking tank (5) is fixedly connected to the end of the guide nozzle (4) away from the cleaning tank (2), a filter barrel (6) is provided inside the sinking tank (5), a water pump (7) is fixedly installed inside the sinking tank (5), and a delivery pipe (8) is fixedly connected to the output end of the water pump (7). A guide plate (9) is fixedly connected to the inner wall of the cleaning tank (2). A filter box (10) is fixedly installed on one side of the cleaning tank (2). Filter cotton (11) is fixedly installed inside the filter box (10). The end of the conveying pipe (8) away from the water pump (7) is fixedly connected to one side of the filter box (10).

2. The ultra-clean cleaning device for integrated circuit components according to claim 1, characterized in that, A support frame (12) is fixedly installed on the outer surface of the cleaning machine body (1), and the inner wall of the support frame (12) is in contact with the outer surface of the conveying pipe (8).

3. The ultra-clean cleaning device for integrated circuit components according to claim 1, characterized in that, The sink (5) has a slot (13) on its inner side, and the filter bucket (6) is located inside the slot (13). A handle (14) is fixedly installed on the top of the filter bucket (6).

4. The ultra-clean cleaning device for integrated circuit components according to claim 1, characterized in that, The number of the guide plates (9) is multiple, and the multiple guide plates (9) are arranged in an equidistant array.

5. The ultra-clean cleaning device for integrated circuit components according to claim 1, characterized in that, Two brackets (15) are fixedly installed on the top of the main body (1) of the cleaning machine, and the two brackets (15) are symmetrical. The inner walls of the two brackets (15) are rotatably connected to the shafts (16), and the opposite ends of the two shafts (16) are fixedly connected to the tripods (17).

6. The ultra-clean cleaning device for integrated circuit components according to claim 5, characterized in that, The inner wall of the tripod (17) is fixedly connected with four support rods (18), and the outer surface of the container (3) is fixedly connected with connecting feet (19). The end of the connecting feet (19) away from the container (3) is hinged to the outer surface of the support rods (18).

7. The ultra-clean cleaning device for integrated circuit components according to claim 5, characterized in that, A motor (20) is fixedly mounted on one side of one of the brackets (15), and the output shaft of the motor (20) is fixedly connected to one end of one of the rotating shafts (16).

Images