High-cleanliness cleaning device for integrated circuit processing

Abstract

The utility model belongs to integrated circuit processing equipment technical field especially relates to a kind of high-cleanliness cleaning device for integrated circuit processing, including placing table, and the upper end of the placing table is provided with cleaning mechanism, and cleaning mechanism includes: cleaning box, the cleaning box is curved tubular setting, both ends are inclined downward setting, and one end is set as air outlet, and the other end is provided with air inlet;Fan frame, the fan frame is inserted in cleaning box.Through being provided with cleaning mechanism, fan inhales air from air inlet, and strong airflow is blown out through air outlet, can powerfully blow up dust on the surface of circuit board, immediately air inlet rapidly inhales the dust blown up into cleaning box, when dust passes through cleaning frame, strong electrostatic field generated by electrostatic plate will be accurately adsorbed and fixed, and airflow sweeping is used instead of brush, scraper and other contact cleaning mode, and strong airflow only acts on dust surface, will not contact circuit board, avoid the circuit damage caused by traditional contact cleaning.

Description

Technical Field

[0001] This utility model belongs to the technical field of integrated circuit processing equipment, and in particular relates to a high-cleanliness cleaning device for integrated circuit processing. Background Technology

[0002] In the field of integrated circuit manufacturing, as chip integration continues to increase and electronic devices develop towards miniaturization and high performance, the cleanliness requirements for integrated circuit processing have reached an unprecedented level. The tiny size and complex structure of integrated circuits mean that even the adhesion of extremely small dust particles or impurities can lead to serious problems such as short circuits and abnormal signal transmission, thereby affecting the performance, reliability and service life of the product.

[0003] However, traditional integrated circuit cleaning methods, such as contact cleaning with brushes and scrapers, while able to remove some dust to a certain extent, have many drawbacks. Brushes or scrapers are prone to friction damage when in contact with the circuit board surface. At the same time, contact cleaning tools themselves may leave behind tiny fibers or impurities, which may contaminate the circuit board during the cleaning process. In addition, brushes and scrapers cannot penetrate into the complex structure of integrated circuits and cannot effectively remove dust from some tiny gaps and holes. The cleaning effect is difficult to meet the needs of today's high-precision integrated circuit processing.

[0004] In view of this, we propose a high-cleanliness cleaning device for integrated circuit processing. Utility Model Content

[0005] The purpose of this invention is to provide a high-cleanliness cleaning device for integrated circuit processing, so as to solve the problems mentioned in the background art.

[0006] In view of this, the present invention provides a high-cleanliness cleaning device for integrated circuit processing, including a placement platform, wherein a cleaning mechanism is provided at the upper end of the placement platform, and the cleaning mechanism includes: The cleaning box is a curved tube with both ends tilted downwards. One end is a blower and the other end is an air inlet. A fan frame is inserted into the cleaning box, and a fan is installed inside the fan frame. A cleaning frame is inserted into a cleaning box, and multiple horizontally arranged electrostatic plates are evenly connected inside the cleaning frame; An electrostatic generator is located at the side of the placement platform, and its output end is connected to the electrostatic plate inside the cleaning frame via a wire. The weighing plate and pressure sensor are located inside the cleaning box, with the cleaning frame placed on the upper part of the weighing plate. The pressure sensor is connected to the lower part of the cleaning box, and its detection end is connected to the weighing plate.

[0007] In the above technical solution, the lower end of the placement platform is connected to a support leg, the upper end of the placement platform is provided with a control panel, and the upper end of the control panel is provided with an indicator light.

[0008] In the above technical solution, the air outlet end of the cleaning box has a tapered cross-section, and the air blowing end of the fan in the fan frame faces the air outlet.

[0009] In the above technical solution, the upper ends of the fan frame and the cleaning frame are both connected to a cover plate, and the upper ends of both cover plates are connected to a handle. The cover plate at the upper end of the cleaning frame does not contact the upper surface of the cleaning box.

[0010] In the above technical solution, the upper end of the placement platform is connected to an electric telescopic rod, and the driving end of the electric telescopic rod is connected to the rear end of the cleaning box through a flange.

[0011] In the above technical solution, the placement platform is further provided with multiple adsorption holes, and a conical cover is connected to the lower end of the placement platform, with the conical cover located below the adsorption holes.

[0012] In the above technical solution, a vacuum pump is further connected to the lower end of the placement platform, and the pumping end of the vacuum pump is connected to the lower end of the conical cover through a gas guide pipe.

[0013] The beneficial effects of this utility model are: 1. This high-cleanliness cleaning device for integrated circuit processing, equipped with a cleaning mechanism, draws in air through the air inlet and blows out a strong airflow through the air outlet, which can effectively blow up the dust on the surface of the circuit board. Then, the air inlet quickly sucks the blown dust into the cleaning box. When the dust passes through the cleaning frame, the strong electrostatic field generated by the electrostatic plate will accurately attract and fix it. Moreover, the airflow sweeping replaces contact cleaning methods such as brushes and scrapers. The strong airflow only acts on the surface of the dust and will not come into contact with the circuit board, avoiding circuit damage caused by traditional contact cleaning.

[0014] 2. This high-cleanliness cleaning device for integrated circuit processing monitors the weight of dust in the cleaning frame in real time through a weighing plate and pressure sensor. It can accurately reflect the adsorption status and cleaning effect of the cleaning frame. Once the weight reaches the set threshold, the indicator light can promptly remind the operator to replace the cleaning frame, ensuring that the cleaning device always maintains the best cleaning performance and continuously provides a stable and reliable clean environment for integrated circuit processing. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the placement platform structure in this utility model; Figure 3This is a schematic diagram of the side end structure in this utility model; Figure 4 This is a schematic diagram of the cleaning box structure in this utility model; Figure 5 This is a schematic cross-sectional view of the cleaning box in this utility model.

[0016] The markings in the diagram are as follows: 1. Placement platform; 2. Cleaning box; 3. Air outlet; 4. Air inlet; 5. Fan frame; 6. Cleaning frame; 7. Static plate; 8. Static generator; 9. Weighing plate; 10. Pressure sensor; 11. Electric telescopic rod; 12. Adsorption hole; 13. Conical cover; 14. Vacuum pump. Detailed Implementation

[0017] The following is in conjunction with the appendix Figures 1-5 This application will be described in further detail.

[0018] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," and "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0019] Example 1: This example provides a high-cleanliness cleaning device for integrated circuit processing, including a placement table 1. A cleaning mechanism is provided on the upper end of the placement table 1. The cleaning mechanism includes: Cleaning box 2 is a curved tube with both ends tilted downwards. One end is a blower 3 and the other end is an air inlet 4. Fan frame 5 is inserted into cleaning box 2, and a fan is installed inside fan frame 5; Cleaning frame 6 is inserted into cleaning box 2. Multiple horizontally arranged electrostatic plates 7 are evenly connected inside cleaning frame 6. The electrostatic generator 8 is located on the side of the placement platform 1, and its output end is connected to the electrostatic plate 7 in the cleaning frame 6 through a wire. Weighing plate 9 and pressure sensor 10 are located inside cleaning box 2. Cleaning frame 6 is placed on the upper end of weighing plate 9. Pressure sensor 10 is connected to the lower end of cleaning box 2, and its detection end is connected to weighing plate 9.

[0020] The process involves placing the integrated circuit to be cleaned on the placement platform 1, activating the device, and starting the fan inside the fan frame 5. Air is drawn in through the air inlet 4 and blown out through the air outlet 3 onto the surface of the integrated circuit, dislodging dust and other contaminants. Simultaneously, the electrostatic generator 8 charges the electrostatic plate 7 inside the cleaning frame 6, causing it to attract and remove the blown-up dust and contaminants, preventing them from re-adhering to the integrated circuit or the surrounding environment. A weighing plate 9 supports the cleaning frame 6, and a pressure sensor 10 monitors the pressure on the weighing plate 9 in real time, representing the total weight of the cleaning frame 6 and the adsorbed contaminants, and feeds this data back to the control system. Advantages: This cleaning method, combining fan blowing and electrostatic adsorption, effectively removes tiny particles and charged contaminants from the surface and crevices of integrated circuits, significantly improving cleaning efficiency. Furthermore, the pressure sensor 10 monitors the weight of contaminants in the cleaning frame 6 in real time, providing timely information on the cleaning status and allowing for timely cleaning or replacement of the cleaning frame 6, ensuring consistently good cleaning performance.

[0021] Example 2: This example provides a high-cleanliness cleaning device for integrated circuit processing. In addition to the technical solutions of the above examples, it also has the following technical features: the lower end of the placement platform 1 is connected to a support leg, the upper end of the placement platform 1 is provided with a control panel, and the upper end of the control panel is provided with an indicator light.

[0022] The support legs provide stable support for the placement platform 1. The control panel integrates various control buttons and parameter display areas. Operators can set cleaning parameters such as fan speed and voltage of electrostatic generator 8 through the control panel. Indicator lights display different colors or flashing patterns based on data feedback from pressure sensor 10 and the operating status of the device. For example, when the weight of contaminants in cleaning box 6 reaches a certain threshold, the indicator light illuminates to remind the operator to clean or replace cleaning box 6; when the device is operating normally, the indicator light remains constantly lit. Advantages: The support legs ensure the stability of the device; the control panel allows operators to precisely control the cleaning device; the indicator lights intuitively provide feedback to the operator on the device's working status and cleaning level, improving the convenience of operation and the monitorability of the cleaning process.

[0023] Example 3: This example provides a high-cleanliness cleaning device for integrated circuit processing. In addition to the technical solutions of the above examples, it also has the following technical features: the air outlet 3 of the cleaning box 2 has a tapered cross-section, and the air blower in the fan frame 5 has its air blowing end facing the air outlet 3.

[0024] In this process, the air blown out by the fan inside the fan frame 5 passes through the cleaning box 2. Because the cross-section of the air outlet 3 is conical, the air is concentrated when it is blown out, forming a stronger and more concentrated airflow. This concentrated airflow blows onto the surface of the integrated circuit, which can more effectively blow up dust and other contaminants, improving the efficiency and effect of air blowing cleaning. Advantages: The conical air outlet 3 design enhances the strength and concentration of the airflow, enabling the cleaning device to more effectively remove contaminants from the surface of the integrated circuit, further improving the cleaning effect and meeting the high cleanliness requirements of integrated circuits.

[0025] Example 4: This example provides a high-cleanliness cleaning device for integrated circuit processing. In addition to the technical solutions of the above examples, it also has the following technical features: the upper ends of the fan frame 5 and the cleaning frame 6 are both connected to cover plates, and the upper ends of both cover plates are connected to handles. The cover plate at the upper end of the cleaning frame 6 does not contact the upper surface of the cleaning box 2.

[0026] When maintenance or cleaning of the fan in the fan frame 5 is required, or inspection and replacement of the electrostatic plate 7 in the cleaning frame 6 is required, the operator can easily remove the fan frame 5 and the cleaning frame 6 by lifting the cover plate of the fan frame 5 and the cleaning frame 6 with the handle. The upper cover plate of the cleaning frame 6 does not contact the upper surface of the cleaning box 2, ensuring that the weight of the cleaning frame 6 can act on the weighing plate 9. Advantages: The cover plate design with handle facilitates the maintenance and component replacement of the fan frame 5 and the cleaning frame 6, and improves the maintainability of the device.

[0027] Example 5: This example provides a high-cleanliness cleaning device for integrated circuit processing. In addition to the technical solutions of the above examples, it also has the following technical features: an electric telescopic rod 11 is connected to the upper end of the placement platform 1, and the driving end of the electric telescopic rod 11 is connected to the rear end of the cleaning box 2 through a flange.

[0028] Depending on the size and shape of the integrated circuit to be cleaned, the operator can control the extension and retraction of the electric telescopic rod 11 via the control panel. When the electric telescopic rod 11 extends or retracts, it drives the cleaning box 2 to move horizontally, adjusting the positional relationship between the cleaning box 2 and the integrated circuit. This allows the air nozzle 3 to be more accurately aimed at the parts of the integrated circuit that need cleaning, improving the targeting and effectiveness of the cleaning. Advantages: The electric telescopic rod 11 allows for flexible adjustment of the position of the cleaning box 2, enhancing the adaptability of the cleaning device to integrated circuits of different sizes and shapes. It can better meet diverse cleaning needs and improve the versatility and work efficiency of the cleaning device.

[0029] Example 6: This example provides a high-cleanliness cleaning device for integrated circuit processing. In addition to the technical solutions of the above examples, it also has the following technical features: a plurality of adsorption holes 12 are provided in the placement stage 1, and a conical cover 13 is connected to the lower end of the placement stage 1. The conical cover 13 is located at the lower end of the adsorption holes 12.

[0030] The adsorption holes 12 are located only at the lower end of the circuit board. The conical cover 13 is used to connect multiple adsorption holes 12. The conical cover 13 can facilitate the joint adsorption and fixation of the circuit board by multiple adsorption holes 12.

[0031] Example 7: This example provides a high-cleanliness cleaning device for integrated circuit processing. In addition to the technical solutions of the above examples, it also has the following technical features: a vacuum pump 14 is connected to the lower end of the placement platform 1, and the suction end of the vacuum pump 14 is connected to the lower end of the conical cover 13 through a gas guide pipe.

[0032] When the vacuum pump 14 is started, it is connected to the conical shroud 13 through the air guide tube, and a negative pressure is generated in the adsorption hole 12 and the conical shroud 13, so as to adsorb and fix the circuit board on the upper end of the placement platform 1, thereby avoiding it from being blown away by the airflow. Advantages: It can adsorb and fix the circuit board without damaging it.

[0033] Working principle: First, the integrated circuit to be cleaned is placed on the placement platform 1, with the circuit board covering the upper end of the suction hole 12. The vacuum pump 14 is activated via the control panel, creating a negative pressure between the suction hole 12 and the conical cover 13, thereby adsorbing and fixing the circuit board to the upper end of the placement platform 1. The fan inside the fan frame 5 is then activated, drawing air into the cleaning box 2 through the air inlet 4 and blowing it out through the air outlet 3, blowing away dust and other contaminants from the surface of the integrated circuit. Simultaneously, the electrostatic generator 8 charges the electrostatic plate 7 inside the cleaning frame 6, which then attracts the blown-up dust and other contaminants. During this process, the electric telescopic rod... 11 The position of the cleaning box 2 can be adjusted according to the size and shape of the integrated circuit so that the air outlet 3 can be better aligned with the part that needs to be cleaned; the pressure sensor 10 detects the weight of the cleaning box 6 and the adsorbed contaminants in real time and feeds the data back to the control system. The control panel displays the cleaning status to the operator through indicator lights based on the feedback data. When the weight of the contaminants in the cleaning box 6 reaches a certain threshold, the indicator light prompts the operator to clean or replace the cleaning box 6; when maintenance or replacement of parts is required, the operator can easily remove the fan frame 5 and the cleaning box 6 through the handles on the cover plates of the fan frame 5 and the cleaning box 6.

[0034] The embodiments of this application have been described above with reference to the accompanying drawings. Unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other. This application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A high-cleanliness cleaning device for integrated circuit processing, comprising a placement stage (1), characterized in that: The upper end of the placement platform (1) is provided with a cleaning mechanism, which includes: Cleaning box (2), the cleaning box (2) is a curved tube with both ends tilted downwards, one end is a blower (3) and the other end is an air inlet (4). A fan frame (5) is inserted into a cleaning box (2), and a fan is installed inside the fan frame (5); Cleaning frame (6), the cleaning frame (6) is inserted into the cleaning box (2), and multiple horizontally arranged electrostatic plates (7) are evenly connected in the cleaning frame (6). An electrostatic generator (8) is located at the side of the placement platform (1), and its output end is connected to the electrostatic plate (7) inside the cleaning frame (6) via a wire. Weighing plate (9) and pressure sensor (10). The weighing plate (9) is located inside the cleaning box (2), and the cleaning frame (6) is placed on the upper end of the weighing plate (9). The pressure sensor (10) is connected to the lower end of the cleaning box (2), and its detection end is connected to the weighing plate (9).

2. The high-cleanliness cleaning device for integrated circuit processing according to claim 1, characterized in that, The lower end of the placement platform (1) is connected to a support leg, and the upper end of the placement platform (1) is provided with a control panel, and the upper end of the control panel is provided with an indicator light.

3. The high-cleanliness cleaning device for integrated circuit processing according to claim 1, characterized in that, The air outlet (3) of the cleaning box (2) has a tapered cross section, and the air blower in the fan frame (5) faces the air outlet (3).

4. The high-cleanliness cleaning device for integrated circuit processing according to claim 1, characterized in that, The upper ends of the fan frame (5) and the cleaning frame (6) are both connected to cover plates, and the upper ends of both cover plates are connected to handles. The cover plate at the upper end of the cleaning frame (6) does not contact the upper end of the cleaning box (2).

5. The high-cleanliness cleaning device for integrated circuit processing according to claim 1, characterized in that, The upper end of the placement platform (1) is connected to an electric telescopic rod (11), and the driving end of the electric telescopic rod (11) is connected to the rear end of the cleaning box (2) through a flange.

6. The high-cleanliness cleaning device for integrated circuit processing according to claim 1, characterized in that, The placement platform (1) has multiple adsorption holes (12) inside, and a conical cover (13) is connected to the lower end of the placement platform (1). The conical cover (13) is located at the lower end of the adsorption holes (12).

7. The high-cleanliness cleaning device for integrated circuit processing according to claim 6, characterized in that, The lower end of the placement platform (1) is connected to a vacuum pump (14), and the suction end of the vacuum pump (14) is connected to the lower end of the conical cover (13) through a gas guide pipe.

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