A hot-pressing die for a short-distance film-coated busbar

Abstract

The utility model discloses a kind of hot-pressing moulds of short-distance film-coated busbar, comprising: upper die holder, several compression zones are provided on upper die holder, profiling block that cooperates hot-pressing with forming area is provided at compression zone, profiling block both sides are provided with first die holder positioning structure;Lower die holder, several forming areas are provided on lower die holder, L-shaped forming groove that is obliquely arranged is provided in forming area, and diaphragm positioning structure is provided on the both sides of L-shaped forming groove, busbar positioning structure is provided at the short side of L-shaped forming groove, the both sides of forming area on lower die holder are provided with second die holder positioning structure that is positioned with first die holder positioning structure cooperation;The hot-pressing mould of short-distance film-coated busbar is positioned by integration, avoids protection and modular design, significantly improve the combination strength and reliability of film-coated busbar, effectively solve the problem of short-distance film-coated busbar hot-pressing bending after degumming, also can solve the problem of difficult positioning, easy interference, poor adaptability etc.

Description

Technical Field

[0001] This utility model relates to the field of hot pressing mold technology, and more specifically to a hot pressing mold for short-distance coated busbars. Background Technology

[0002] Coated busbars, as critical connecting components in electronic and electrical equipment, typically require short-distance bending to accommodate compact equipment layouts. In existing technologies, the bending process of coated busbars mostly employs traditional hot-press molds, achieving forming through the closing of upper and lower molds and the application of heat and pressure. However, in actual short-distance bending processes, these molds still have the following significant shortcomings: (1) Low positioning accuracy of short-distance bending: Due to the narrow bending area, the busbar and the insulating film are prone to displacement during hot pressing, making it difficult to accurately control the bending angle and position. This can easily lead to wrinkles, damage, or delamination of the insulating film after bending, affecting the product's appearance and insulation performance.

[0003] (2) Poor mold adaptability and high changeover cost: Traditional molds are mostly integral structures with non-adjustable positioning elements. When product specifications change, the entire mold often needs to be replaced, resulting in increased production costs and extended production cycles.

[0004] Therefore, it is necessary to design and develop a short-distance coated busbar hot pressing mold to improve product quality and production efficiency. Utility Model Content

[0005] To address the shortcomings of existing technologies, this utility model provides a hot pressing mold for short-pitch coated busbars. Specifically, it addresses the problems of easy delamination when bending short-pitch coated busbars after hot pressing and easy film detachment during high and low temperature cycling. Through integrated precise positioning, avoidance protection, and modular design, it significantly improves the bonding strength and reliability between the film and the busbar, effectively solving the problem of delamination after hot pressing and bending of short-pitch coated busbars. It also solves problems such as difficult positioning, easy interference, and poor adaptability, thereby improving product production quality and efficiency.

[0006] To achieve the above objectives, the present invention provides the following technical solution: A hot pressing mold for short-pitch coated busbars includes: The upper mold base is provided with several pressing areas. A conforming pressure block that cooperates with the forming area for hot pressing is provided in the pressing area. A first mold base positioning structure is provided on both sides of the conforming pressure block. The lower mold base has several forming areas. Each forming area has an inclined L-shaped forming groove, and both sides of the L-shaped forming groove have diaphragm positioning structures. A busbar positioning structure is provided at the short side of the L-shaped forming groove. The lower mold base has a second mold base positioning structure on both sides of the forming area, which cooperates with the first mold base positioning structure for positioning.

[0007] Furthermore, the upper mold base is provided with a first avoidance structure and a second avoidance structure. The first avoidance structure is used to avoid the diaphragm positioning structure, and the second avoidance structure is used to avoid the busbar positioning structure.

[0008] Furthermore, the diaphragm positioning structure includes a plurality of diaphragm positioning posts, and the first clearance structure includes a plurality of first clearance holes, wherein the diaphragm positioning posts can extend into the first clearance holes.

[0009] Furthermore, the busbar positioning structure includes a plurality of busbar positioning posts, and the second clearance structure includes a plurality of second clearance holes, wherein the busbar positioning posts can extend into the second clearance holes.

[0010] Furthermore, a positioning block is provided in the L-shaped forming groove, the positioning block is detachably connected to the lower mold base, and the busbar positioning column is detachably installed on the positioning block.

[0011] Furthermore, the first mold base positioning structure includes a plurality of mold base positioning holes, and the second mold base positioning structure includes a plurality of mold base positioning posts, wherein the mold base positioning posts cooperate with the mold base positioning holes for positioning.

[0012] Compared with the prior art, the beneficial effects of this utility model are: 1. Precise positioning to prevent film displacement and delamination: By setting a busbar positioning structure at the short side of the L-shaped forming groove in the lower mold base and setting diaphragm positioning structures on both sides of the groove, precise fixation of the busbar and insulating film is achieved before hot pressing. This structure effectively avoids local stress concentration or poor adhesion of the film caused by material displacement, fundamentally preventing delamination caused by film loosening in the bending area after hot pressing. It is especially suitable for short-distance bending scenarios where high film bonding strength is required.

[0013] 2. Interference-free mold closing ensures uniform pressure transmission: The upper mold base has clearance holes corresponding to the positioning structure of the lower mold base, allowing the positioning pins to accurately extend during mold closing, avoiding positioning deviations caused by collisions between the upper and lower molds. This design ensures that pressure is applied evenly to the mating surface between the film and the busbar during hot pressing, preventing the film from becoming loose or detached due to uneven local pressure, and improving the bonding consistency of the film.

[0014] 3. Modular and detachable design to adapt to different process requirements: The L-shaped forming groove is equipped with a detachable positioning block on which the busbar positioning post is installed. This modular structure facilitates quick adjustment according to different busbar sizes and coating thicknesses, ensuring that products of different specifications can achieve ideal coating bonding effects during hot pressing, and reducing problems of poor coating bonding caused by mold mismatch.

[0015] 4. Dual mold base positioning enhances molding repeatability and temperature resistance: The positioning holes and positioning pins between the upper and lower mold bases ensure high repeatability of the mold closing process. Stable alignment and pressure control allow the coating to form a uniform and firm adhesive layer during hot pressing, significantly improving the coating adhesion stability of the product under high and low temperature cycling environments and effectively addressing the problem of thermal stress delamination caused by temperature changes. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein: Figure 1 An exploded schematic diagram of a hot pressing mold for a short-pitch coated busbar; Figure 2 A schematic diagram of a hot pressing mold for a short-pitch coated busbar; Figure 3 This is a schematic diagram of the lower mold base. Figure 4 This is a schematic diagram of the upper mold base.

[0017] The markings in the diagram are as follows: 1. Upper mold base; 101. Pressing area; 102. Contouring pressure block; 103. First clearance hole; 104. Second clearance hole; 105. Mold base positioning hole; 2. Lower mold base; 201. Forming area; 202. L-shaped forming groove; 203. Diaphragm positioning post; 204. Busbar positioning post; 205. Positioning block; 206. Mold base positioning post; 3. Busbar; 4. Insulating film. Detailed Implementation

[0018] In the description of this utility model, it should be noted that the directional terms such as "center", "horizontal (X)", "longitudinal (Y)", "vertical (Z)", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" indicate the orientation and positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of this utility model.

[0019] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. Thus, the use of "first" and "second" to define a feature may explicitly or implicitly include one or more of that feature. In the description of this utility model, "several" or "a number" means two or more, unless otherwise explicitly specified.

[0020] A hot pressing mold for short-pitch coated busbars, such as Figure 1-4 As shown, it includes: The upper mold base 1 is provided with a plurality of pressing areas 101. A contouring block 102 that cooperates with the forming area 201 for hot pressing is provided at the pressing area 101. A first mold base positioning structure is provided on both sides of the contouring block 102. The lower mold base 2 is provided with a plurality of forming areas 201. An inclined L-shaped forming groove 202 is provided in the forming area 201, and a diaphragm positioning structure is provided on both sides of the L-shaped forming groove 202. A busbar positioning structure is provided at the short side of the L-shaped forming groove 202. A second mold base positioning structure is provided on both sides of the forming area 201 on the lower mold base 2, which cooperates with the first mold base positioning structure for positioning.

[0021] Specifically, during the actual hot pressing process, after the busbar 3 and the insulating film 4 are fixed by the positioning structure, the contouring pressure block 102 and the L-shaped forming groove 202 work together to apply temperature and pressure. Due to accurate positioning and reasonable avoidance, the film is uniformly compressed in the bending area, without wrinkles or bubbles, thus forming a tight bond after cooling. This structure is particularly suitable for short-distance bending scenarios where the bonding strength of the film is critical, and can significantly reduce the risk of delamination after hot pressing and during high and low temperature cycling tests.

[0022] This invention achieves precise positioning and uniform pressure on the coated busbar during short-distance bending through multi-level positioning and avoidance design. It directly addresses two major process pain points: "easy delamination after hot pressing and bending" and "easy delamination during high and low temperature cycling". This improves the structural reliability and environmental adaptability of the product and is suitable for the manufacturing of electronic power components with high reliability requirements.

[0023] Preferably, the upper mold base 1 is provided with a first avoidance structure and a second avoidance structure, wherein the first avoidance structure is used to avoid the diaphragm positioning structure and the second avoidance structure is used to avoid the busbar positioning structure. Specifically, by setting a first clearance hole 103 and a second clearance hole 104 in the upper mold base 1, which correspond to the diaphragm positioning post 203 and the busbar positioning post 204 in the lower mold base 2 respectively, precise clearance is achieved during mold closing, avoiding structural interference. This ensures that the positioning structure does not collide during the mold closing process, protects the mold precision, extends its service life, and improves the accuracy of mold closing alignment, while reducing adjustment time.

[0024] Preferably, the diaphragm positioning structure includes a plurality of diaphragm positioning posts 203, and the first clearance structure includes a plurality of first clearance holes 103, wherein the diaphragm positioning posts 203 can extend into the first clearance holes 103; Specifically, the diaphragm positioning post 203 is inserted into the first clearance hole 103 to achieve precise positioning and fixation of the insulating film 4 attached to the busbar 3 during the hot pressing process, effectively preventing the insulating film 4 from shifting or wrinkling during the hot pressing process, and ensuring the consistency of the coating quality and appearance.

[0025] Preferably, the busbar positioning structure includes a plurality of busbar positioning posts 204, and the second clearance structure includes a plurality of second clearance holes 104, wherein the busbar positioning posts 204 can extend into the second clearance holes 104. Specifically, the busbar positioning post 204 is inserted into the second clearance hole 104 to ensure that the busbar 3 is accurately positioned at the short side of the L-shaped forming groove 202, thereby improving the bending position accuracy of the copper busbar and avoiding forming deviation or material waste caused by inaccurate positioning.

[0026] Preferably, a positioning block 205 is provided in the L-shaped forming groove 202, the positioning block 205 is detachably connected to the lower mold base 2, and the busbar positioning column 204 is detachably installed on the positioning block 205; Specifically, the positioning block 205 is detachably connected to the lower mold base 2, and the busbar positioning post 204 is installed on the positioning block 205, which is convenient for replacement or adjustment, thereby enhancing the flexibility and adaptability of the mold. The positioning block 205 can be quickly replaced to adapt to different specifications of busbar 3, reducing the cost of mold modification.

[0027] Preferably, the first mold base positioning structure includes a plurality of mold base positioning holes 105, and the second mold base positioning structure includes a plurality of mold base positioning posts 206, wherein the mold base positioning posts 206 cooperate with the mold base positioning holes 105 for positioning. Specifically, by inserting the mold base positioning pin 206 into the mold base positioning hole 105, the upper mold base 1 and the lower mold base 2 are precisely aligned, thereby ensuring that the mold closing position is consistent each time, improving the repeatability of hot pressing and the stability of product quality.

[0028] advantage: 1. Precise positioning to prevent film displacement and delamination: By setting a busbar positioning structure at the short side of the L-shaped forming groove 202 in the lower mold base 2, and setting diaphragm positioning structures on both sides of the groove, the busbar 3 and the insulating film 4 are precisely fixed before hot pressing. This structure effectively avoids local stress concentration or poor adhesion of the film caused by material displacement, and fundamentally prevents delamination caused by film loosening in the bending area after hot pressing. It is especially suitable for short-distance bending scenarios where high film bonding strength is required.

[0029] 2. No interference during mold closing, ensuring uniform pressure transmission: The upper mold base 1 is equipped with clearance holes corresponding to the positioning structure of the lower mold base 2. During mold closing, the positioning pins can be precisely inserted, avoiding positioning deviations caused by collisions between the upper and lower molds. This design ensures that the pressure is applied evenly to the mating surface between the film and the busbar 3 during hot pressing, avoiding incomplete adhesion or delamination of the film due to uneven local pressure, and improving the bonding consistency of the film.

[0030] 3. Modular and detachable design to adapt to different process requirements: The L-shaped forming groove 202 is equipped with a detachable positioning block 205, on which the busbar positioning post 204 is installed. This modular structure facilitates quick adjustment according to different busbar 3 sizes and film thicknesses, ensuring that products of different specifications can achieve ideal film bonding effects during hot pressing, and reducing problems of poor film bonding caused by mold mismatch.

[0031] 4. Dual mold base positioning enhances molding repeatability and temperature resistance: The positioning holes and positioning pins between the upper and lower mold bases ensure high repeatability of the mold closing process. Stable alignment and pressure control allow the coating to form a uniform and firm adhesive layer during hot pressing, significantly improving the coating adhesion stability of the product under high and low temperature cycling environments and effectively addressing the problem of thermal stress delamination caused by temperature changes.

[0032] The above description is merely a preferred embodiment of this utility model. The protection scope of this utility model is not limited to the above embodiments. All technical solutions falling within the scope of this utility model's concept are protected. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principle of this utility model should also be considered within the protection scope of this utility model.

Claims

1. A hot pressing mold for short-pitch coated busbars, characterized in that, include: The upper mold base is provided with several pressing areas. A conforming pressure block that cooperates with the forming area for hot pressing is provided in the pressing area. A first mold base positioning structure is provided on both sides of the conforming pressure block. The lower mold base has several forming areas. Each forming area has an inclined L-shaped forming groove, and both sides of the L-shaped forming groove have diaphragm positioning structures. A busbar positioning structure is provided at the short side of the L-shaped forming groove. The lower mold base has a second mold base positioning structure on both sides of the forming area, which cooperates with the first mold base positioning structure for positioning.

2. The hot pressing mold for a short-pitch coated busbar according to claim 1, characterized in that: The upper mold base is provided with a first avoidance structure and a second avoidance structure. The first avoidance structure is used to avoid the diaphragm positioning structure, and the second avoidance structure is used to avoid the busbar positioning structure.

3. The hot pressing mold for a short-pitch coated busbar according to claim 2, characterized in that: The diaphragm positioning structure includes a plurality of diaphragm positioning posts, and the first clearance structure includes a plurality of first clearance holes, wherein the diaphragm positioning posts can extend into the first clearance holes.

4. The hot pressing mold for a short-pitch coated busbar according to claim 2, characterized in that: The busbar positioning structure includes a plurality of busbar positioning posts, and the second avoidance structure includes a plurality of second avoidance holes, wherein the busbar positioning posts can extend into the second avoidance holes.

5. The hot pressing mold for a short-pitch coated busbar according to claim 4, characterized in that: A positioning block is provided inside the L-shaped forming groove. The positioning block is detachably connected to the lower mold base, and the busbar positioning column is detachably installed on the positioning block.

6. The hot pressing mold for a short-pitch coated busbar according to claim 1, characterized in that: The first mold base positioning structure includes a plurality of mold base positioning holes, and the second mold base positioning structure includes a plurality of mold base positioning posts, wherein the mold base positioning posts cooperate with the mold base positioning holes for positioning.

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