A bending jig, a copper foil assembly, and a laminator

Abstract

The utility model relates to copper foil bending technical field discloses a kind of bending fixture, copper foil assembly and laminating machine, multiple limit plates are installed on pedestal, and multiple limit plates are sequentially arranged along the length direction of pedestal, bending hole for sheet material to pass through is provided on each limit plate, bending hole provides specific passageway for sheet material, to form continuous guide path, and along the advancing direction of sheet material, the included angle between bending hole on multiple limit plates and horizontal plane gradually decreases, so that when sheet material sequentially passes through bending hole on multiple limit plates, sheet material can be sequentially and progressively bent, improve the consistency of sheet material bending form, to solve the surface wrinkle problem caused by irregular deformation of sheet material in folding process, in subsequent laminating or laminating process, sheet material can be ensured to be laminated on target surface, reduce the residual probability of bubble, improve product quality and production efficiency.

Description

Technical Field

[0001] This utility model relates to the field of copper foil bending technology, and in particular to a bending fixture, a copper foil assembly, and a bonding machine. Background Technology

[0002] With the development of consumer electronics, especially the increasing power of smartphones, improvements in processor performance and other aspects, the widespread adoption of 5G networks, and the increase in high-performance and high-power applications, the heat generated by high-performance operation inside electronic products is also rising significantly, affecting the stability of the processor.

[0003] Mobile phone heat dissipation, electromagnetic interference, and shielding are very important topics. As smartphones become more and more powerful, the heat generated inside them also increases. Heat dissipation and signal stability not only affect the phone's performance but also shorten battery life and even pose a safety hazard to users. Therefore, electronic products, especially smartphones, generally adopt a variety of heat dissipation technologies and absorb or reflect electromagnetic interference to ensure the stable operation of the device.

[0004] Copper foil is a very thin metal material (usually 1µm to 200µm) with excellent electrical conductivity, thermal conductivity and ductility. It is widely used in smartphones, new energy vehicles, energy storage batteries, aerospace and other fields.

[0005] However, as electronic products become thinner and more integrated, the processing challenges of copper foil in practical applications are becoming increasingly apparent. Particularly during localized bending, the extremely thin copper foil has limited compressive strength, making it difficult to precisely control force and angle during manual bending. This easily leads to appearance defects such as wrinkles and bubbles, and also makes it impossible to guarantee batch-to-batch consistency. Furthermore, manual operation is inefficient and cannot meet the precision and yield requirements of large-scale mass production. Utility Model Content

[0006] The main purpose of this utility model is to provide a bending fixture, which aims to improve the shortcomings of the prior art and solve the problem that sheet materials are prone to wrinkling and difficult to fit when bent.

[0007] To achieve the above objectives, this utility model proposes a bending fixture, comprising: Base; Multiple limiting plates are installed on the base, and the multiple limiting plates are arranged sequentially along the length direction of the base; Each of the limiting plates is provided with bending holes for sheet material to pass through, and the angle between the multiple bending holes and the horizontal plane gradually decreases along the direction of travel of the sheet material.

[0008] Optionally, each of the limiting plates has a through hole at its bottom, and the through hole is connected to the bending hole.

[0009] Optionally, the through holes are rectangular, and the widths of any two through holes are equal, and the lengths of any two through holes are equal.

[0010] Optionally, four limiting plates are provided along the traveling direction of the sheet material. The four limiting plates are a first limiting plate, a second limiting plate, a third limiting plate, and a fourth limiting plate. The angle between the bending hole on the first limiting plate and the horizontal plane is 90°, the angle between the bending hole on the second limiting plate and the horizontal plane is 75°, the angle between the bending hole on the third limiting plate and the horizontal plane is 55°, and the angle between the bending hole on the fourth limiting plate and the horizontal plane is 25°.

[0011] Optionally, both the limiting plate and the base are made of aluminum alloy.

[0012] This application also provides a copper foil assembly, which is bent using the aforementioned bending fixture. The copper foil assembly includes a cover film, a copper foil layer, a microwave absorbing layer, and an adhesive layer. The microwave absorbing layer includes a first large surface and a second large surface. The adhesive layer is disposed on the first large surface, and the copper foil layer is disposed on the second large surface. At least a portion of the copper foil layer is bent along one side of the microwave absorbing layer to cover at least a portion of the first large surface. The cover film is disposed on the side of the copper foil layer facing away from the microwave absorbing layer.

[0013] Optionally, the thickness of the copper foil layer is 20um to 50um.

[0014] Optionally, the thickness of the absorbing layer is 8µm to 12µm.

[0015] Optionally, the adhesive layer is double-sided adhesive, and the thickness of the adhesive layer is 45um~55um.

[0016] In addition, this application also provides a bonding machine that includes the bending fixture described above.

[0017] Beneficial Effects: The bending fixture proposed in this utility model includes a base and multiple limiting plates. The multiple limiting plates are installed on the base and are arranged sequentially along the length of the base. Each limiting plate is provided with a bending hole for sheet material to pass through. The bending hole provides a specific passage for the sheet material, thus forming a continuous guide path. Along the direction of travel of the sheet material, the angle between the bending hole on the multiple limiting plates and the horizontal plane gradually decreases. This allows the sheet material to bend gradually as it passes through the bending holes on the multiple limiting plates, improving the consistency of the bending shape of the sheet material. This solves the problem of surface wrinkles caused by irregular deformation during the folding process of sheet material. In subsequent lamination or bonding processes, it can ensure that the sheet material adheres to the target surface, reducing the probability of residual air bubbles and improving product quality and production efficiency. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0019] Figure 1 This is a three-dimensional structural diagram of the bending fixture disclosed in this application; Figure 2 This is a front view of the bending fixture disclosed in this application; Figure 3 This is a schematic diagram of the structure of the copper foil assembly disclosed in this application; Figure 4 This is a schematic diagram of the punching process on die A. Figure 5 This is a schematic diagram of the punching process for the punching material on die B. Figure 6 A diagram illustrating the flipping process when a semi-finished product is partially folded. Figure 7 A schematic diagram of a semi-finished product after it has been partially folded. Figure 8 A schematic diagram illustrating the flipping process during partial folding of copper foil; Figure 9 A schematic diagram showing the copper foil after partial folding; Figure 10 This is a schematic diagram of the die-cutting process for the product.

[0020] Explanation of icon numbers: 1. Base; 2. Limiting plate; 21. Bending hole; 22. Through hole; W, width of through hole; L, length of through hole; 3. Copper foil assembly; 31. Covering film; 32. Copper foil layer; 33. Wave-absorbing layer; 34. Adhesive layer; 4. Bottom protective film; 5. Bending auxiliary protective film; 6. Double-sided adhesive; 7. Facing paper; 8. Copper foil; 9. Cutter; 10. Wave-absorbing material.

[0021] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0022] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0023] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0024] In this application, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0025] Furthermore, the use of terms such as "first" and "second" in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. If the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed in this application.

[0026] With the development of consumer electronics, especially the increasing power of smartphones, improvements in processor performance and other aspects, the widespread adoption of 5G networks, and the increase in high-performance and high-power applications, the heat generated by high-performance operation inside electronic products is also rising significantly, affecting the stability of the processor.

[0027] Mobile phone heat dissipation, electromagnetic interference, and shielding are very important topics. As smartphones become more and more powerful, the heat generated inside them also increases. Heat dissipation and signal stability not only affect the phone's performance but also shorten battery life and even pose a safety hazard to users. Therefore, electronic products, especially smartphones, generally adopt a variety of heat dissipation technologies and absorb or reflect electromagnetic interference to ensure the stable operation of the device.

[0028] Copper foil is a very thin metal material (usually 1µm to 200µm) with excellent electrical conductivity, thermal conductivity and ductility. It is widely used in smartphones, new energy vehicles, energy storage batteries, aerospace and other fields.

[0029] Microwave-absorbing materials are multi-component composite materials that can shield electronic devices, absorb resonance and reflect waves, prevent electromagnetic interference, and reduce noise. They can effectively absorb and attenuate incident electromagnetic waves and dissipate electromagnetic energy, thermal energy, or other forms of energy, thereby significantly reducing reflected waves.

[0030] However, when copper foil is bent and pressed to wrap a portion of the microwave absorbing material to form a copper foil assembly, the copper foil is extremely thin during the local bending process, resulting in limited compressive strength. Manual bending makes it difficult to precisely control the force and angle, easily leading to appearance defects such as wrinkles and bubbles, and making it impossible to guarantee batch-to-batch consistency. Furthermore, manual operation is inefficient and cannot meet the precision and yield requirements of large-scale mass production.

[0031] Based on this, the present application provides a bending fixture, see [link to relevant documentation]. Figure 1 As shown, the bending fixture includes a base 1 and multiple limiting plates 2. The multiple limiting plates 2 are installed on the base 1 and are arranged sequentially along the length of the base 1. Each limiting plate 2 is provided with a bending hole 21 for sheet material to pass through. Along the direction of travel of the sheet material, the angle between the multiple bending holes 21 and the horizontal plane gradually decreases.

[0032] Specifically, multiple limiting plates 2 are installed on the base 1, and the multiple limiting plates 2 are arranged sequentially along the length direction of the base 1. Each limiting plate 2 is provided with bending holes 21 for sheet material to pass through. The bending holes 21 provide a specific passage for the sheet material, thereby forming a continuous guide path. Along the direction of travel of the sheet material, the angle between the bending holes 21 on the multiple limiting plates 2 and the horizontal plane gradually decreases. This allows the sheet material to bend gradually as it passes through the bending holes 21 on the multiple limiting plates 2, improving the consistency of the bending shape of the sheet material. This solves the problem of surface wrinkles caused by irregular deformation of the sheet material during the folding process. In subsequent lamination or bonding processes, it can ensure that the sheet material adheres to the target surface, reduce the probability of residual air bubbles, and improve product quality and production efficiency.

[0033] In this embodiment, the base 1 is made of aluminum alloy or steel frame, and the surface of the base 1 is finely ground so that its surface flatness is less than or equal to 0.1 mm / m.

[0034] In this embodiment, the sheet material includes, but is not limited to, copper foil assembly 3 and copper foil 8. It can be used to fold and bond the copper foil assembly 3 so that the microwave absorbing material 10 is pressed onto the copper foil 8 after being folded. It can also be used to fold part of the copper foil 8 to form a semi-enclosed form for the microwave absorbing material 10.

[0035] See Figure 1 and Figure 2 As shown in this embodiment, in order to facilitate the passage of the copper foil assembly 3, each limiting plate 2 has a through hole 22 at its bottom. The through hole 22 is connected to the bending hole 21. Specifically, the through hole 22 is rectangular, and the width W of any two through holes is equal, and the length L of any two through holes is equal.

[0036] In this embodiment, the width W of the through hole is equal to the thickness of the copper foil assembly 3, and the length L of the through hole is equal to the width of the copper foil assembly 3. This design can reduce the risk of slippage of the copper foil assembly 3 during its movement.

[0037] In a preferred embodiment of this application, four limiting plates 2 are provided along the traveling direction of the sheet material. The four limiting plates 2 are a first limiting plate, a second limiting plate, a third limiting plate, and a fourth limiting plate. The angle between the bending hole 21 on the first limiting plate and the horizontal plane is 90°, the angle between the bending hole 21 on the second limiting plate and the horizontal plane is 75°, the angle between the bending hole 21 on the third limiting plate and the horizontal plane is 55°, and the angle between the bending hole 21 on the fourth limiting plate and the horizontal plane is 25°.

[0038] Specifically, after the part of the copper foil 8 to be bent is sequentially passed through the bending holes 21 on the first limiting plate, the second limiting plate, the third limiting plate and the fourth limiting plate, as the copper foil 8 continues to move forward, the copper foil 8 can be gradually flipped and bent to a certain extent. Finally, under the pressing action of the bonding machine, the copper foil 8 can be bonded to the wave-absorbing layer 33.

[0039] Preferably, both the limiting plate 2 and the base 1 are made of aluminum alloy.

[0040] In this embodiment, the thickness of the copper foil layer 32 is 20um~50um, the thickness of the microwave absorbing layer 33 is 8um~12um, the adhesive layer 34 is double-sided adhesive 6, and the thickness of the adhesive layer 34 is 45um~55um.

[0041] Preferably, the copper foil layer 32 has a thickness of 30 μm, the microwave absorbing layer 33 has a thickness of 10 μm, and the adhesive layer 34 has a thickness of 50 μm.

[0042] To further illustrate this point, this embodiment also provides a copper foil assembly 3 and its manufacturing method. The copper foil assembly 3 is bent using the aforementioned bending fixture. The copper foil assembly 3 is specifically as follows: See Figure 3 As shown, the copper foil assembly 3 includes a cover film 31, a copper foil layer 32, an absorbing layer 33, and an adhesive layer 34. The absorbing layer 33 includes a first large surface and a second large surface. The adhesive layer 34 is disposed on the first large surface, and the copper foil layer 32 is disposed on the second large surface. At least a portion of the copper foil layer 32 is bent along one side of the absorbing layer 33 to cover at least a portion of the first large surface. The cover film 31 is disposed on the side of the copper foil layer 32 facing away from the absorbing layer 33.

[0043] The production method of copper foil component 3 is as follows: Semi-finished product processing procedures Step 1: Overlap the bottom protective film 4 and the bending auxiliary protective film 5, then cover them with double-sided adhesive 6 and face paper 7 to obtain the die-cutting material. Next, peel off the self-adhesive film on one side of the die-cutting material, and use a die-cutting method to cover the double-sided adhesive 6 and face paper 7. Use die A to punch out positioning holes and completely cut off the inner holes to facilitate the removal of waste material. Figure 4 As shown, the cutting line of the blade 9 directly opposite the double-sided tape 6 cuts to the auxiliary protective film; the cutting line of the blade 9 offset from the double-sided tape 6 cuts the auxiliary protective film. After the punching is completed, the waste material on one side of the double-sided tape 6 is removed.

[0044] Step 2, as follows Figure 5As shown, copper foil 8 and face paper 7 are covered on the bending auxiliary protective film 5. Double-sided tape 6 is attached to the adhesive side of the wave absorbing material 10. The copper foil 8 is punched using B mold. The copper foil 8 is punched halfway to the bending auxiliary protective film 5. The wave absorbing material 10 is punched halfway to the bending auxiliary protective film 5. After the waste removal process is completed, the entire face paper 7 is covered to obtain a semi-finished product.

[0045] The bending process is carried out using a bending fixture. Step 1: Half-fold like Figures 6-7 As shown, a bending fixture is installed on the laminating machine, and then the semi-finished product is passed through the through hole 22 on the bending fixture. The semi-finished product is also partially inserted into multiple bending holes 21 of the bending fixture. As the semi-finished product travels along the direction of travel, it passes through multiple bending holes 21 on the bending fixture in sequence, gradually turning and bending. After all the semi-finished products have turned upward and bent, they are pressed together by the laminating machine to obtain a copper foil assembly 3 arranged in a stacked manner.

[0046] Step 2: Partial folding like Figures 8-9 As shown, the product obtained after bending and pressing in step 1 is installed on a bending fixture. The copper foil 8 to be bent is inserted into multiple bending holes 21 of the bending fixture. During the movement of the copper foil 8, the copper foil 8 gradually folds downward.

[0047] Die-cut finished product process like Figure 10 As shown, the product that has been bent and bonded is flipped and transferred to the release film. The C-film is punched and positioned using positioning holes and positioning pins. The outer frame is punched halfway down to the bending auxiliary protective film 5. Then the waste material is removed, the bending auxiliary protective film 5 is peeled off, and the product is transferred to the release film. Finally, after passing the inspection, the finished product is packaged.

[0048] Using the bending fixture provided in this embodiment to bend the copper foil 8 has at least the following beneficial effects: (1) The copper foil 8 bending structure requires no wrinkles and no bubbles. Although the copper foil 8 itself has good ductility, its compressive strength decreases when it is too thin, and it is difficult to meet the appearance requirements after the surface is folded. The bending fixture provided in this embodiment is used for folding, and a pressing machine is used for pressing. After bonding, the copper foil 8 can be flatly bonded to the microwave absorbing material 10, which reduces the probability of bubbles and wrinkles and improves the bonding effect.

[0049] (2) Traditional partial bending process of copper foil relies on manual operation, which is inefficient and makes it difficult to ensure consistent bending force each time, resulting in poor product appearance consistency and a high rate of defects such as bubbles and wrinkles. Using the bending fixture provided in this embodiment, the machine can bend and bond in one step, which not only improves production efficiency and product yield, but is also applicable to the manufacturing of most die-cut and bent products.

[0050] (3) The dimensions of the bending fixture can be designed according to the dimensions of different products. It is not limited by the bending angle and overlap width of the product, but also ensures that the bending process is flat and controllable, and guides the product to complete the bending operation step by step.

[0051] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A bending fixture, characterized in that, include: Base; Multiple limiting plates are installed on the base, and the multiple limiting plates are arranged sequentially along the length direction of the base; Each of the limiting plates is provided with bending holes for sheet material to pass through, and the angle between the multiple bending holes and the horizontal plane gradually decreases along the direction of travel of the sheet material.

2. The bending fixture according to claim 1, characterized in that, Each of the limiting plates has a through hole at its bottom, and the through hole is connected to the bending hole.

3. The bending fixture according to claim 2, characterized in that, The through holes are rectangular in shape, and the width of any two through holes is equal, and the length of any two through holes is equal.

4. The bending fixture according to claim 3, characterized in that, Four limiting plates are provided along the traveling direction of the sheet material. The four limiting plates are a first limiting plate, a second limiting plate, a third limiting plate, and a fourth limiting plate. The angle between the bending hole on the first limiting plate and the horizontal plane is 90°, the angle between the bending hole on the second limiting plate and the horizontal plane is 75°, the angle between the bending hole on the third limiting plate and the horizontal plane is 55°, and the angle between the bending hole on the fourth limiting plate and the horizontal plane is 25°.

5. The bending fixture according to claim 2, characterized in that, Both the limiting plate and the base are made of aluminum alloy.

6. A copper foil assembly, characterized in that, The copper foil assembly is bent using a bending fixture as described in any one of claims 1 to 5. The copper foil assembly includes a cover film, a copper foil layer, a microwave absorbing layer, and an adhesive layer. The microwave absorbing layer includes a first large surface and a second large surface. The adhesive layer is disposed on the first large surface, and the copper foil layer is disposed on the second large surface. At least a portion of the copper foil layer is bent along one side of the microwave absorbing layer to cover at least a portion of the first large surface. The cover film is disposed on the side of the copper foil layer facing away from the microwave absorbing layer.

7. The copper foil assembly according to claim 6, characterized in that, The thickness of the copper foil layer is 20um to 50um.

8. The copper foil assembly according to claim 6, characterized in that, The thickness of the absorbing layer is 8µm to 12µm.

9. The copper foil assembly according to claim 6, characterized in that, The adhesive layer is double-sided adhesive, and the thickness of the adhesive layer is 45um~55um.

10. A bonding machine, characterized in that, Includes the bending fixture described in any one of claims 1 to 5.

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