Automobile industry semiconductor part processing mold

Abstract

The application relates to the field of stamping equipment and discloses a semiconductor part machining die for the automobile industry. In the application, a clamping plate part and a material removing part are arranged in the middle of a lower die base and an upper die base, the clamping plate part is fixedly installed with a clamping plate insert in the inside of a stripper back plate through clamping plate gaskets, a plurality of clamping plate sleeves are arranged on the side surface of the clamping plate insert, a punch is arranged in the inside of the clamping plate insert, a latch is movably arranged on the outside surface of the clamping plate insert, the material removing part is fixedly installed with a concave die cushion block in the inside of a lower die plate through clamping plate gaskets, the clamping plate insert is fixed in the stripper back plate through the clamping plate gaskets and the latch, the punch is embedded in the inside of the clamping plate insert, the core component is prevented from shaking and deviating during stamping, the machining precision of electronic components is ensured, the clamping plate sleeves can reduce the friction and abrasion between the punch and the clamping plate insert, metal scraps are prevented from being left, meanwhile, the clamping plate sleeves are convenient to disassemble and clean, dust and scraps in the inside of the die are reduced, the stamping process is ensured to be smooth, and product defects caused by the scraps are reduced.

Description

Technical Field

[0001] This application belongs to the field of stamping equipment technology, specifically a mold for processing semiconductor parts in the automotive industry. Background Technology

[0002] Semiconductor components are widely used in the automotive industry, covering multiple fields such as automotive electronic power module chip packaging, on-board chargers, automotive connectors, automotive electronic chip packaging, and silicon carbide power module packaging. With the continuous miniaturization, high performance, and high-density integration of electronic devices, the demand for domestically produced alternatives for electronic components is becoming increasingly urgent. Simultaneously, the specialization of their structures is constantly increasing, and thermal management technology must also possess excellent performance, placing increasingly stringent performance requirements on semiconductor electronic components. Traditional semiconductor components are gradually revealing limitations in thermal management and adapting to the needs of new circuit designs. This R&D project aims to develop the first domestically produced alternative semiconductor component, FDSDFN3X3CLIP, which boasts superior heat dissipation performance without compromising the functionality of traditional jumpers. By overcoming numerous technical challenges in product design, mold processing, and production, the project aims to achieve mass production of this product, meeting the market's urgent demand for high-performance semiconductor components with excellent thermal management, enhancing the company's market competitiveness in the semiconductor electronic component field, creating new profit growth points, and generating greater economic and social benefits for the enterprise. Utility Model Content

[0003] The purpose of this application is to provide a semiconductor parts processing mold for the automotive industry in order to achieve the above-mentioned objectives.

[0004] The technical solution adopted in this application is as follows: A semiconductor part processing mold for the automotive industry includes a lower mold base, an upper mold base, a clamping plate part, and a stripping part. The clamping plate part and the stripping part are arranged between the lower mold base and the upper mold base. The clamping plate part has a clamping plate insert fixedly installed inside the stripping plate by clamping plate gaskets. A plurality of clamping plate sleeves are arranged on one side surface of the clamping plate insert, and a punch is arranged inside the clamping plate insert. A pin is movably arranged on the outer side surface of the clamping plate insert. The stripping part has a die pad fixedly installed inside the lower mold plate by clamping plate gaskets.

[0005] In a preferred embodiment, the die pad is provided with a die insert on the inner surface of the lower template, the punch is provided with a stripper pad and a stripper insert at one end of the stripper plate, and the stripper insert and the die insert are provided correspondingly, and the lower template is provided with a cutting edge on one side of the stripper plate.

[0006] In a preferred embodiment, a lower pad is fixedly disposed on the upper surface of the lower mold base, and a lower template is disposed on the surface of the lower pad.

[0007] In a preferred embodiment, an upper cover plate is fixedly provided on the top surface of the upper mold base, and an upper pad plate is fixedly provided on the bottom surface of the upper mold base. A backing plate, an upper clamping plate, and a stripping plate are sequentially provided on the other side surface of the upper pad plate.

[0008] In a preferred embodiment, an equal-height sleeve is installed in the middle of the interior of the back panel via an equal-height pad.

[0009] In a preferred embodiment, a floating pin is provided on one side of the lower pad, and the floating pin passes through the lower pad and is connected to the lower template. A pressure plate and a cutting punch are provided on the floating pin at the positions corresponding to the upper clamping plate and the back plate.

[0010] In a preferred embodiment, punches are provided inside the clamping plate and the stripping plate respectively, and the punches are located inside the stripping back plate, the upper clamping plate and the stripping plate.

[0011] In summary, due to the adoption of the above technical solution, the beneficial effects of this application are:

[0012] 1. Innovative product structure design: The semiconductor component FDSDFN3X3CLIP developed in this project adopts a unique non-uniform thickness structure design. While meeting other functional requirements, it achieves excellent thermal management performance through local thinning. Compared with traditional semiconductor components, its thermal management efficiency is improved by 50%, effectively solving the thermal management bottleneck problem of traditional jumpers in high-power, high-density circuit applications, and providing a reliable guarantee for the high-performance operation of electronic devices.

[0013] 2. Mold Innovation: Addressing the challenges of mold design and manufacturing for semiconductor parts with uneven thickness, the project team, through in-depth research and repeated practice, successfully designed a thinning mold structure that meets precision requirements and developed corresponding processing techniques. Simultaneously, considering the characteristics of this technology, a suitable high-precision punch press was carefully selected, and the production process was comprehensively optimized. Through these innovative measures, a series of difficulties, including the high complexity of mold processing and the demanding requirements for production tools, were effectively overcome, providing a solid guarantee for the production of new semiconductor parts and ensuring a stable and efficient production process. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the cross-sectional structure of the metal stamping die for electronic component processing according to this application;

[0015] Figure 2 This is a schematic diagram of the outer shell structure of the metal stamping die for electronic component processing in this application;

[0016] Figure 3This is a schematic diagram of the clamping plate part and the stripping part in this application.

[0017] The markings in the diagram are: 1. Lower mold base; 2. Upper mold base; 3. Upper cover plate; 4. Lower backing plate; 5. Lower template; 6. Stripper plate; 7. Upper clamping plate; 8. Stripper backing plate; 9. Upper backing plate; 10. Clamping plate parts; 11. Stripper parts; 12. Floating pin; 13. Pressure plate; 14. Punch; 15. Cutting punch; 16. Equalizing pad; 17. Equalizing sleeve; 18. Pin; 19. Clamping plate gasket; 20. Clamping plate insert; 21. Clamping plate sleeve; 22. Punch; 23. Stripper pad; 24. Stripper insert; 25. Die insert; 26. Die pad. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the embodiments of this application. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0019] Example:

[0020] Reference Figure 1-3 A semiconductor component processing mold for the automotive industry includes a lower mold base 1, an upper mold base 2, a clamping plate part 10, and a stripper part 11. The clamping plate part 10 and the stripper part 11 are disposed between the lower mold base 1 and the upper mold base 2. A clamping plate insert 20 is fixedly mounted inside the stripper back plate 8 via clamping plate gaskets 19. Multiple clamping plate sleeves 21 are provided on one side surface of the clamping plate insert 20, and a punch 22 is disposed inside the clamping plate insert 20. A pin 18 is movably disposed on the outer surface of the clamping plate insert 20. A die pad 26 is fixedly mounted inside the lower mold plate 5 via clamping plate gaskets 19. The clamping plate insert 20 is fixed inside the stripper back plate 8 via clamping plate gaskets 19 and pins 18. The punch 22 is embedded in the clamping plate insert 11. Inside the plate insert, the core components are kept stable and do not shift during stamping, ensuring the processing accuracy of electronic components and avoiding forming deviations. The clamping plate 21 reduces friction and wear between the punch and the clamping plate insert, preventing metal debris residue. It also facilitates disassembly and cleaning, reducing dust and debris accumulation inside the mold, ensuring a smooth stamping process, and reducing product defects caused by debris. The die pad 26 of the stripper part 11 provides stable support for the die insert 25, ensuring accurate die positioning and achieving efficient stamping in conjunction with the punch. It also disperses the stamping impact force and extends the service life of the die. The movable design of the pin 18 allows for quick disassembly of the clamping plate insert, facilitating the cleaning and replacement of the punch and clamping plate, adapting to mold maintenance in high-frequency processing scenarios, and improving operational efficiency.

[0021] Reference Figure 1-3 The die pad 26 has a die insert 25 on the inner surface of the lower template 5. The punch 22 has a stripper pad 23 and a stripper insert 24 at one end of the stripper plate 6. The stripper insert 24 and the die insert 25 are correspondingly set. The lower template 5 has a cutting edge on one side of the stripper plate 6. The die insert 25 and the stripper insert 24 are correspondingly set. Together with the punch 22, they form a complete stamping cavity, ensuring that the shape and size of the electronic components meet the design requirements. It is suitable for high-precision and miniaturized electronic component processing. The stripper pad 23 and the stripper insert 24 cooperate to quickly eject the formed workpiece from the punch or die after stamping, avoiding workpiece jamming and residue, reducing the frequency of mold cleaning, and improving processing efficiency. It is suitable for mass production. The cutting edge of the lower template 5 cooperates with the stamping shearing. The clamping plate and stripper structure can reduce the accumulation of metal debris at the cutting edge, which is convenient for subsequent cleaning. It avoids debris scratching the workpiece surface or damaging the cutting edge, ensuring product quality and mold life.

[0022] Reference Figure 1-2 A lower pad 4 is fixedly installed on the upper surface of the lower die base 1, and a lower template 5 is installed on the surface of the lower pad 4. The lower pad 4 is fixed between the lower die base 1 and the lower template 5 to provide uniform support for the lower template, disperse the stamping impact force, avoid deformation of the lower template due to uneven force, and ensure the overall structural stability of the mold. The lower pad 4 has a certain buffering performance, which can absorb the vibration and impact force during stamping, reduce the hard contact wear between the lower die base and the lower template, extend the service life of the mold, and reduce the equipment load.

[0023] Reference Figure 1-2 The top surface of the upper die holder 2 is fixedly provided with an upper cover plate 3, and the bottom surface of the upper die holder 2 is fixedly provided with an upper pad plate 9. The other side surface of the upper pad plate 9 is sequentially provided with a backing plate 8, an upper clamping plate 7, and a stripper plate 6. The layered layout of the upper pad plate 9, the backing plate 8, the upper clamping plate 7, and the stripper plate 6 respectively undertakes the functions of buffering, fixing, guiding, and unloading, forming an integrated stamping and unloading process, which is suitable for the multi-process requirements of electronic component processing and improves processing efficiency. The upper cover plate 3 and the upper pad plate 9 work together to fix the core components of the upper die, preventing the upper die structure from loosening or deforming during stamping, ensuring the accuracy of the punch movement trajectory, and protecting the upper die holder from direct impact, thus extending the service life of the upper die.

[0024] Reference Figure 1 An equalizing sleeve 17 is installed in the middle of the back plate 8 through an equalizing pad 16. The equalizing sleeve 17 is fixed in the back plate 8 through the equalizing pad 16, which can accurately control the spacing of each layer of the upper die components, ensure that the height between the back plate, the upper clamping plate, and the stripping plate is consistent, and avoid the decrease in stamping accuracy caused by height deviation.

[0025] Reference Figure 1A floating pin 12 is provided on one side of the lower pad 4, and the floating pin 12 passes through the lower pad 4 and is connected to the lower template 5. A pressure plate 13 and a cutting punch 15 are provided at the positions of the upper clamping plate 7 and the back plate 8 corresponding to the floating pin 12. The floating pin 12 can lift the raw material, which is convenient for the automatic feeding device to transport the material. At the same time, it reduces the friction between the raw material and the lower template 5, avoids surface scratches, reduces the generation of debris, and assists in mold cleaning. The pressure plate 13 presses the raw material during stamping to prevent the processing deviation caused by material displacement, ensures the processing accuracy of electronic components, and avoids the metal debris residue caused by material sliding, thus improving stamping stability. The cutting punch 15 can simultaneously cut off the waste material after stamping, prevent the waste material from accumulating inside the mold, reduce the frequency of cleaning, and improve processing efficiency, realizing the integration of stamping, cutting, and unloading.

[0026] Reference Figure 1 Punches 14 are correspondingly provided inside the clamping plate part 10 and the stripping part 11. The punches 14 are located inside the stripping back plate 8, the upper clamping plate 7 and the stripping plate 6. The punches 14 penetrate through the stripping back plate 8, the upper clamping plate 7 and the stripping plate 6. They can realize multi-process stamping according to the processing requirements of electronic components, adapt to the processing of complex electronic components, and improve the practicality of the mold. The punches are correspondingly provided with the clamping plate part 10 and the stripping part 11 to ensure that the components work together during stamping without interference. At the same time, it enhances the overall structural stability of the mold and reduces component wear caused by vibration.

[0027] The implementation principle of an embodiment of a semiconductor component processing mold for the automotive industry in this application is as follows:

[0028] During assembly, the clamping plate insert 20 is placed into the preset slot of the backing plate 8. The height is adjusted and pressure is buffered by the clamping plate shims 19. The pin 18 is inserted to lock the position of the clamping plate insert, and then the punch 22 is embedded inside the clamping plate insert. On the stripped part side, the die pad 26 is fixed in the lower template 5 by the clamping plate shims, providing a foundation for the subsequent installation of the die insert. During the stamping process, the clamping plate sleeve 21 reduces the friction of the punch movement and avoids metal debris residue. During maintenance, the clamping plate insert can be removed by pulling out the pin to clean the inner wall of the punch and insert, or to replace worn parts, making the operation convenient.

[0029] The die insert 25 is fixed to the surface of the die pad 26, ensuring precise alignment with the stripper insert 24. During stamping, the punch 22 moves downward with the upper die base, passes through the stripper insert 24, and engages with the die insert 25 to shear and shape the raw material. After stamping, the upper die base moves upward, and the stripper insert 24, driven by the stripper plate 6, lifts the workpiece. The stripper pad 23 buffers the pressure, preventing workpiece deformation, and simultaneously removes residual metal debris, reducing chip accumulation inside the die and aiding in cleaning. The cutting edge of the lower die plate is kept sharp to ensure smooth shearing and reduce chip generation.

[0030] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A semiconductor component processing mold for the automotive industry, comprising a lower mold base (1), an upper mold base (2), a clamping plate component (10), and a stripping component (11), characterized in that: A clamping plate part (10) and a stripper part (11) are provided in the middle of the lower mold base (1) and the upper mold base (2). The clamping plate part (10) is fixedly installed with a clamping plate insert (20) inside the stripper back plate (8) by a clamping plate gasket (19). A plurality of clamping plate sleeves (21) are provided on one side surface of the clamping plate insert (20), and a punch (22) is provided inside the clamping plate insert (20). A pin (18) is movably provided on the outer side surface of the clamping plate insert (20). The stripper part (11) is fixedly installed with a die pad (26) inside the lower mold plate (5) by a clamping plate gasket (19).

2. The automotive semiconductor parts processing mold as described in claim 1, characterized in that: The die pad (26) has a die insert (25) on the inner surface of the lower template (5). The punch (22) has a stripper pad (23) and a stripper insert (24) at one end of the stripper plate (6). The stripper insert (24) and the die insert (25) are arranged correspondingly. The lower template (5) has a cutting edge on one side of the stripper plate (6).

3. The automotive semiconductor parts processing mold as described in claim 1, characterized in that: The lower mold base (1) is fixedly provided with a lower pad (4) on its upper surface, and the lower pad (4) is provided with a lower template (5) on its surface.

4. The automotive semiconductor parts processing mold as described in claim 1, characterized in that: The upper mold base (2) is fixedly provided with an upper cover plate (3) and the upper mold base (2) is fixedly provided with an upper pad plate (9). The other side surface of the upper pad plate (9) is provided with a back plate (8), an upper clamping plate (7) and a stripping plate (6) in sequence.

5. A semiconductor component processing mold for the automotive industry as described in claim 1, characterized in that: The back panel (8) has an equal-height sleeve (17) installed in the middle of its interior through an equal-height pad (16).

6. The automotive semiconductor parts processing mold as described in claim 3, characterized in that: A floating pin (12) is provided on one side of the lower pad (4), and the floating pin (12) passes through the lower pad (4) and is connected to the lower template (5). A pressure plate (13) and a cutting punch (15) are provided on the floating pin (12) corresponding to the position of the upper clamping plate (7) and the back plate (8).

7. The automotive semiconductor parts processing mold as described in claim 1, characterized in that: Punches (14) are provided inside the clamping plate part (10) and the stripping part (11), and the punches (14) are provided inside the stripping back plate (8), the upper clamping plate (7) and the stripping plate (6).

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