Automobile electronic semiconductor part processing mold

Abstract

The application relates to the field of stamping dies, and discloses an automobile electronic semiconductor part machining die. In the application, the lower die base is provided with an upper end structure, which comprises a lower base plate, a lower die plate, a stripping plate, a stripping back plate, a clamping plate, an upper base plate, an upper die base and an upper cover plate. The technical scheme is characterized in that the die bears all parts through the lower die base, the upper die base and other main body structures, the clamping plate and the stripping back plate are matched to fix the position of core components, the punch and the cutting edge are accurately matched, and then the second gasket is used for fine adjustment of the gap, so that the dislocation of the components in the stamping process is effectively avoided, the size precision and structural consistency of the semiconductor parts are greatly improved, and the product demand of high density and miniaturization is met.

Description

Technical Field

[0001] This application belongs to the field of stamping die technology, specifically a processing die for automotive electronic semiconductor parts. Background Technology

[0002] Against the backdrop of the booming development of the electronics and information industry, the performance and precision requirements for semiconductor components in fields such as digital ICs, power management, motor drives, radio frequency communications, and automotive electronics are increasing. The CSOT5070-10A is a semiconductor component; these products are core structural components in electronic devices that realize the electrical connection between chip circuits and external leads, and are widely used in various integrated circuit modules. As the electronics industry moves towards high density and miniaturization, the requirements for dimensional accuracy and pin density of these components continue to increase, driving the development of corresponding molding dies towards precision.

[0003] In production, these parts are mostly formed through stamping processes, making stamping dies a key piece of equipment for mass production. They need to meet high adaptability and high stability to ensure product consistency. This application provides a processing mold for automotive electronic semiconductor parts, which ensures the processing and production of electronic components, guarantees the production stability of stamping dies, and facilitates subsequent operations. Utility Model Content

[0004] The purpose of this application is to provide a processing mold for automotive electronic semiconductor parts in order to solve the problem of ensuring stable production of stamping dies mentioned above.

[0005] The technical solution adopted in this application is as follows: A processing mold for automotive electronic semiconductor parts, including a lower mold base, wherein the upper structure of the lower mold base includes a lower pad, a lower template, a stripper plate, a stripper back plate, a clamping plate, an upper pad, an upper mold base, and an upper cover plate.

[0006] By adopting the above technical solution, the lower mold base, lower template, upper mold base, and upper cover plate serve as the main structure of the mold, bearing all parts of the upper and lower molds, ensuring the stability of the mold position, making the structure complete, and facilitating subsequent operations. The lower and upper pads are mainly used to distribute the stamping load, prevent the mold base from being damaged due to local stress concentration, extend the service life of the mold base, and facilitate subsequent operations. The backing plate and clamping plate are used to fix the working position of clamping plate parts and other parts, ensuring the stability of the structure and facilitating subsequent operations. The backing plate assists in unloading the stripping parts, facilitating subsequent operations. The clamping plate is used in conjunction with the stripping operation to ensure the integrity of the mold structure.

[0007] In a preferred embodiment, the lower template has a plurality of lower mold parts inside.

[0008] By adopting the above technical solution, the lower die part carries and positions the stamping material, and works with the upper die to complete multiple stamping processes. The multi-station layout enables continuous production of electronic components, thus ensuring the production efficiency of the mold.

[0009] In a preferred embodiment, the stripper plate is provided with a plurality of stripping parts inside.

[0010] By adopting the above technical solution, the stripping part is used in conjunction with the stripping plate to strip the stamped parts or waste material inside the mold after stamping, which facilitates subsequent operation and ensures the subsequent operation of the mold.

[0011] In a preferred embodiment, a clamping plate component is installed inside the clamping plate, and a punch is provided inside the clamping plate component. The lower end of the punch passes through the stripper plate, the stripper component, and the lower die plate, respectively. A cutting edge is installed inside the lower die component adjacent to the punch, and a gasket is provided at the lower end of the clamping plate component.

[0012] By adopting the above technical solution, the clamping plate part is easy to use to restrict the working position of the punch, ensuring the stability of the punch position. The punch is set to move down with the upper die and work in conjunction with the cutting edge to complete the processing of electronic components. It can be actually controlled according to different production needs. The fine adjustment function of the shim improves the mold's adaptability to materials.

[0013] In a preferred embodiment, a retaining screw is provided inside the upper mold base, and a spring is provided inside the upper mold base at the lower end of the retaining screw. A push rod is provided at the lower end of the spring, and the push rod passes through the stripper plate, the stripper back plate, the clamping plate, and the upper pad plate.

[0014] By adopting the above technical solution, the stop screw is used to control the movement range of the spring and ejector pin, preventing them from excessive displacement or falling off during the stamping process. The mechanical limit ensures the movement stability of the mold components, avoiding mold damage or scrap of stamped parts due to component misalignment. The spring provides a restoring force for the ejector pin, unloading components, etc., so that the mold returns to its initial state when the upper mold moves upward, ensuring the continuity and rhythm of the stamping process. The ejector pin works with the unloading components to complete the unloading action, pushing the stamped parts or scrap out of the working area of ​​the mold.

[0015] In a preferred embodiment, the lower end of the push rod is provided with a plurality of second gaskets inside the stripper plate, the lower end of the second gaskets is provided with a push rod fixing seat inside the stripper plate, the push rod fixing seat is provided with a plurality of forming push rods inside, and the lower end of the push rod fixing seat is provided with a discharge insert.

[0016] By adopting the above technical solution, the second shim is used to fine-tune the fitting clearance between the forming punch and the lower die, adapt to materials of different thicknesses or optimize the forming quality; the forming ejector pin assists the forming punch in completing the forming action, and participates in the reset during unloading. The ejector pin fixing seat supports the position of the ejector pin, and the forming ejector pin assists the forming punch in completing the forming action, and participates in the reset during unloading.

[0017] In a preferred embodiment, a forming float is provided at the lower end of the unloading insert inside the lower template, a forming punch is provided inside the forming float, a forming punch fixing seat is installed at the lower end of the forming float inside the lower template, and a forming pad is fixedly connected to the lower end of the forming punch fixing seat.

[0018] By adopting the above technical solution, the forming float is used in conjunction with the forming punch. The forming punch can realize the specific shape of electronic components, and the forming punch fixing seat fixes the forming punch on the upper die to ensure stability during stamping, realize the forming of complex structures of electronic components, meet the product function and assembly requirements, improve the installation accuracy of the formed parts and the adaptability of the mold, and the forming pad is used to adjust the height and position of the forming punch to optimize the forming effect.

[0019] In a preferred embodiment, the forming punch holder is fixedly connected to the lower template by a first screw, and the second washer is fixedly connected to the back plate by a second screw.

[0020] By adopting the above technical solution, both the first screw and the second screw are used for installation and fixing operations, ensuring the stability of the structure and facilitating subsequent operations.

[0021] In summary, due to the adoption of the above technical solution, the beneficial effects of this application are: In this application, 1. the mold supports all parts through the main structure such as the lower mold base and the upper mold base, and fixes the position of the core components with the clamping plate and the back plate. The punch and the cutting edge are precisely matched, and the matching gap is finely adjusted by the second shim, which effectively avoids the misalignment of the parts during the stamping process, greatly improves the dimensional accuracy and structural consistency of semiconductor parts, and meets the product requirements of high density and miniaturization.

[0022] 2. The lower and upper pads disperse the stamping load, reduce local stress concentration in the mold base, and extend the overall service life of the mold; the stripping parts, ejector pins, and springs work together to achieve efficient unloading and reset; the multi-station layout supports continuous production, while simplifying mold debugging and subsequent operation processes, taking into account both mass production needs and ease of operation.

[0023] 3. The combined design of forming punch, forming float and forming pad can realize the forming of complex electronic components and adapt to different functions and assembly requirements; through screw fixing and component limiting design, the mold's adaptability to materials of different thicknesses is improved, while avoiding surface damage to stamped parts and ensuring product forming quality and appearance integrity. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the metal stamping die structure for electronic component processing according to this application; Figure 2 This is a plan view of the metal stamping die structure for electronic component processing in this application; Figure 3 This is a schematic diagram of the lower end structure of the push rod in this application.

[0025] The markings in the diagram are: 1. Lower die base; 2. Lower backing plate; 3. Lower template; 4. Stripper plate; 5. Stripper backing plate; 6. Clamping plate; 7. Upper backing plate; 8. Upper die base; 9. Upper cover plate; 10. Clamping plate part; 11. Punch; 12. Washer; 13. Stripper part; 14. Lower die part; 15. Cutting edge; 16. Stop screw; 17. Spring; 18. Ejector rod; 19. Second screw; 20. Forming ejector rod; 21. Unloading insert; 22. Forming float; 23. Forming punch; 24. Forming punch fixing seat; 25. Forming pad; 26. First screw; 27. Second washer; 28. Ejector rod fixing seat. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the embodiments of this application. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0027] Example:

[0028] Reference Figure 1-3A processing mold for automotive electronic semiconductor parts includes a lower mold base 1. The structure of the lower mold base 1 includes a lower pad 2, a lower template 3, a stripper plate 4, a stripper back plate 5, a clamping plate 6, an upper pad 7, an upper mold base 8, and an upper cover plate 9. The lower mold base 1, lower template 3, upper mold base 8, and upper cover plate 9 form the main structure of the mold, supporting all parts of the upper and lower molds, ensuring the stability of the mold position, making the structure complete, and facilitating subsequent operations. The lower pad 2 and upper pad 7 are mainly used to distribute the stamping load, prevent the mold base from being damaged due to local stress concentration, extend the service life of the mold base, and facilitate subsequent operations. The stripper back plate 5 and clamping plate 6 are used to fix the working position of clamping plate parts 10 and other parts, ensuring the stability of the structure and facilitating subsequent operations. The stripper back plate 5 assists in unloading the stripped parts, facilitating subsequent operations. The clamping plate 6 is used in conjunction with the stripping operation to ensure the integrity of the mold structure.

[0029] Reference Figure 1-3 The lower mold plate 3 has multiple lower mold parts 14 inside. The lower mold parts 14 carry and position the stamping material, and work with the upper mold to complete multiple stamping processes. The multi-station layout enables continuous production of electronic components, thus ensuring the production efficiency of the mold.

[0030] Reference Figure 1-3 The stripper plate 4 is equipped with multiple stripping parts 13. The stripping parts 13 work in conjunction with the stripper plate 4 to strip the stamped parts or waste material from the mold after stamping, so as to facilitate subsequent operations and ensure the mold's subsequent operation.

[0031] Reference Figure 1-3 The clamping plate 6 has a clamping plate component 10 installed inside, and a punch 11 is set inside the clamping plate component 10. The lower end of the punch 11 passes through the stripping plate 5, the stripping component 13 and the lower template 3 respectively. The adjacent position of the punch 11 is a cutting edge 15 installed inside the lower mold component 14. A shim 12 is set at the lower end of the clamping plate component 10. The clamping plate component 10 is used to restrict the working position of the punch 11 and ensure the stability of the punch 11. The punch 11 is set to work with the upper mold as it moves downward and works with the cutting edge 15 to complete the processing of electronic components. It can be actually controlled according to different production needs. The fine adjustment function of the shim 12 can improve the mold's adaptability to materials.

[0032] Reference Figure 1-3The upper die holder 8 is equipped with a stop screw 16 inside. A spring 17 is located at the lower end of the stop screw 16 inside the upper die holder 8. A push rod 18 is located at the lower end of the spring 17. The push rod 18 passes through the stripper plate 4, the stripper back plate 5, the clamping plate 6, and the upper pad plate 7. The stop screw 16 is used to control the movement range of the spring 17 and the push rod 18, preventing them from excessive displacement or falling off during the stamping process. The mechanical limit ensures the movement stability of the die components and avoids damage to the die or scrap of the stamped parts due to component misalignment. The spring 17 provides a restoring force for the push rod 18, the unloading components, etc., so that the die returns to its initial state when the upper die moves upward, ensuring the continuity and rhythm of the stamping process. The push rod 18 works with the unloading components to complete the unloading action, pushing the stamped parts or scrap out of the die working area.

[0033] Reference Figure 1-3 The lower end of the ejector pin 18 is located inside the stripper plate 4 and is provided with multiple second shims 27. The lower end of the second shims 27 is located inside the stripper plate 4 and is provided with an ejector pin fixing seat 28. The ejector pin fixing seat 28 is provided with multiple forming ejector pins 20. The lower end of the ejector pin fixing seat 28 is provided with a stripper insert 21. The second shims 27 are used to fine adjust the fit clearance between the forming punch 23 and the lower die to adapt to materials of different thicknesses or optimize the forming quality. The forming ejector pins assist the forming punch 23 in completing the forming action and participate in the reset during stripping. The ejector pin fixing seat 28 supports the position of the ejector pin 18 and assists the forming punch 23 in completing the forming action through the forming ejector pins 20 and participates in the reset during stripping.

[0034] Reference Figure 1-3 The lower end of the unloading insert 21 is located inside the lower mold plate 3 and a forming float 22 is provided. The forming float 22 is located inside the forming punch 23. The lower end of the forming float 22 is located inside the lower mold plate 3 and a forming punch fixing seat 24 is installed. The lower end of the forming punch fixing seat 24 is fixedly connected to a forming pad 25. The forming float 22 works in conjunction with the forming punch 23. The forming punch 23 can realize the specific shape of electronic components. The forming punch fixing seat 24 fixes the forming punch 23 to the upper mold to ensure the stability during stamping, realize the complex structure forming of electronic components, meet the product function and assembly requirements, improve the installation accuracy of the formed parts and the adaptability of the mold. The forming pad 25 is used to adjust the height and position of the forming punch 23 and optimize the forming effect.

[0035] Reference Figure 1-3 The forming punch holder 24 is fixedly connected to the lower template 3 by the first screw 26, and the second washer 27 is fixedly connected to the back plate 5 by the second screw 19. The first screw 26 and the second screw 19 are used for installation and fixing operations to ensure the stability of the structure and facilitate subsequent operations.

[0036] The implementation principle of an embodiment of a processing mold for automotive electronic semiconductor parts in this application is as follows: 1. The mold supports all parts through the main structure such as the lower mold base 1 and the upper mold base 3. It is equipped with the clamping plate 6 and the back plate 5 to fix the position of the core components. The punch 11 and the cutting edge 15 are precisely matched, and the fitting gap is finely adjusted by the second shim 27. This effectively avoids the misalignment of parts during the stamping process, greatly improves the dimensional accuracy and structural consistency of semiconductor parts, and meets the needs of high-density and miniaturized products.

[0037] 2. The lower pad 2 and the upper pad 7 disperse the stamping load, reduce local stress concentration in the mold base, and extend the overall service life of the mold; the stripping part 13, the ejector pin 18 and the spring 17 work together to achieve efficient unloading and reset; the multi-station layout supports continuous production, while simplifying mold debugging and subsequent operation processes, taking into account both mass production needs and ease of operation.

[0038] 3. The combined design of the forming punch 23, forming float 22 and forming pad 25 can realize the forming of complex electronic components and adapt to different functions and assembly requirements; through screw fixing and component limiting design, the mold's adaptability to materials of different thicknesses is improved, while avoiding surface damage to stamped parts and ensuring product forming quality and appearance integrity.

[0039] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A mold for processing automotive electronic semiconductor parts, comprising a lower mold base (1), characterized in that: The upper structure of the lower die base (1) includes a lower pad plate (2), a lower template plate (3), a stripper plate (4), a stripper back plate (5), a clamping plate (6), an upper pad plate (7), an upper die base (8), and an upper cover plate (9). The lower template plate (3) contains multiple lower die parts (14). The stripper plate (4) contains multiple stripper parts (13). The clamping plate (6) contains clamping plate parts (10), and the clamping plate parts (10) contain punches (11). The lower end passes through the back plate (5), the stripper part (13), and the lower template (3) respectively. The punch (11) is adjacent to the lower die part (14) and is equipped with a cutting edge (15). The lower end of the clamping plate part (10) is provided with a gasket (12). The upper die base (8) is provided with a stop screw (16). The upper die base (8) is provided with a spring (17) located at the lower end of the stop screw (16). The lower end of the spring (17) is provided with a push rod (18). The push rod (18) passes through... The stripper plate (4), stripper back plate (5), clamping plate (6) and upper pad plate (7) are connected. The lower end of the push rod (18) is located inside the stripper plate (4) and is provided with multiple second pads (27). The lower end of the second pads (27) is located inside the stripper plate (4) and is provided with a push rod fixing seat (28). The push rod fixing seat (28) is provided with multiple forming push rods (20). The lower end of the push rod fixing seat (28) is provided with a discharge insert (21). The lower end of the discharge insert (21) is located at the lower template (3). The interior of the molded float (22) is provided with a forming float (22), and the interior of the forming float (22) is provided with a forming punch (23). The lower end of the forming float (22) is located inside the lower template (3) and a forming punch fixing seat (24) is installed. The lower end of the forming punch fixing seat (24) is fixedly connected with a forming pad (25). The forming punch fixing seat (24) is fixedly connected to the lower template (3) by a first screw (26), and the second pad (27) is fixedly connected to the back plate (5) by a second screw (19).

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