An electronic manufacturing industry semiconductor parts processing mold

Abstract

The application relates to the field of electronic component processing, and discloses a semiconductor part processing die for electronic manufacturing industry. In the application, a lower base plate is fixedly arranged above a lower die holder, a concave die plate is fixedly arranged above the lower base plate, an upper cover plate is installed at the top end of an upper die holder through a stop screw, the bottom end surface of the upper die holder is sequentially provided with an upper base plate, an upper clamping plate, a back plate and a discharging plate, the internal components of the concave die plate and the discharging plate are correspondingly arranged, a knife edge is arranged at one side of the discharging plate, a clamping plate part is arranged between the upper base plate and the lower base plate, the lower die holder and the upper die holder form a die core frame, a stable installation basis is provided for various functional components, the overall structure of the die does not shake during the stamping process, the processing precision is ensured, the upper base plate, the upper clamping plate, the back plate and the discharging plate are layered with the lower base plate and the concave die plate, and the layered layout respectively undertakes the functions of guiding, fixing, discharging and forming, adapts to the multi-process requirements of electronic component stamping, and realizes positioning, stamping and discharging integration.

Description

Technical Field

[0001] This application belongs to the field of electronic component processing technology, specifically a semiconductor part processing mold for the electronics manufacturing industry. Background Technology

[0002] Electronic components are the basic elements in electronic circuits. They are usually individually packaged and have two or more leads or metal contacts. Electronic components must be interconnected to form an electronic circuit with a specific function.

[0003] The CDFN5060-8H is a semiconductor device using advanced packaging technology. Its name directly reflects its key physical characteristics: "CDFN" stands for "Ceramic Twin Flat Leadless Package", "5060" indicates that the package size is approximately 5.0mm x 6.0mm, and "8H" indicates that it has 8 exposed heat dissipation pads.

[0004] The development of this component stems from the continuous pursuit of high performance, miniaturization, and high reliability in modern electronic products. With the development of 5G communication, high-speed computing, automotive electronics, and portable devices, traditional packages (such as QFP and SOP) are increasingly unable to meet the design requirements of high frequency, high power density, and compact space due to issues such as lead inductance and large size. Under this trend, leadless packaging technology, represented by CDFN, has emerged. By eliminating traditional leads and using pads for direct mounting to the PCB, it significantly reduces parasitic inductance and resistance, improving electrical performance. Its core "H" structure, namely the large exposed heat dissipation pad at the bottom, greatly optimizes the heat conduction path from the chip to the PCB, enabling the component to efficiently dissipate internal heat, thereby stably carrying larger operating currents and power. It is particularly suitable for high-temperature applications such as power amplifiers, power management chips, and RF modules. Utility Model Content

[0005] The purpose of this application is to provide a semiconductor component processing mold for the electronics manufacturing industry in order to achieve the above-mentioned purpose.

[0006] The technical solution adopted in this application is as follows: A semiconductor component processing mold for the electronics manufacturing industry includes a lower mold base and an upper mold base. A lower pad is fixedly arranged above the lower mold base, and a concave template is fixedly arranged above the lower pad. An upper cover plate is installed on the top of the upper mold base by a negative screw. An upper pad, an upper clamping plate, a backing plate, and a stripper plate are sequentially arranged on the bottom surface of the upper mold base. The internal components of the concave template and the stripper plate are arranged correspondingly. A cutting edge is provided on one side of the stripper plate in the concave template. A clamping plate is arranged between the upper pad and the lower pad.

[0007] In a preferred embodiment, the clamping plate part is provided with a clamping plate pad at the connection between the upper pad and the upper clamping plate. A clamping plate insert is installed on the lower surface of the clamping plate pad, and a locking strip is provided on the surface of the clamping plate insert. A clamping plate sleeve is provided on the lower surface of the clamping plate insert, and a punch is provided inside the clamping plate insert. A discharge pad and a discharge insert are provided around one end of the punch inside the discharge plate.

[0008] In a preferred embodiment, the concave template is provided with a concave mold insert corresponding to the unloading insert on the surface of the unloading plate, and the concave mold insert is provided with a concave mold pad at the bottom of the inner side of the concave template. A side stop block is installed on one side surface of the concave mold insert and the concave mold pad.

[0009] In a preferred embodiment, the anti-negative screw has a spring between the upper cover plate and the upper pad plate, and the spring has a push rod at one end of the upper pad plate. The push rod passes through the upper pad plate, the upper clamping plate and the back plate and is connected to the forming gasket at the top of the unloading plate.

[0010] In a preferred embodiment, the unloading plate and the backing plate are fixed by screw thread connection, and the lower pad plate and the concave template are fixed by screw thread connection. The screw inside the unloading plate passes through the forming washer and the top rod fixing seat, and the screw inside the concave template passes through the forming pad block and the forming punch fixing seat.

[0011] In a preferred embodiment, two molding pads are provided inside the unloading plate, and a top rod fixing seat is fixedly provided on the surface of the molding pad, a molding top rod is provided on the surface of the top rod fixing seat, and a second unloading insert is provided below the top rod fixing seat.

[0012] In a preferred embodiment, the concave template is provided with a forming float at the position of the second unloading insert corresponding to the unloading plate. A forming punch is provided inside the forming float, and a forming punch fixing seat and a forming pad are provided below the forming punch.

[0013] In summary, due to the adoption of the above technical solution, the beneficial effects of this application are: 1. Innovative Product Structure Design: The product features a unique design with flattened edges and a partially flattened center, breaking away from traditional semiconductor component structures. This design better meets the high-precision circuit control requirements of fields such as digital ICs and power management. Simultaneously, the less than 0.5mm convex hull design achieves miniaturization and refinement of the product structure, improving integration and performance stability, and providing strong support for the miniaturization and high performance of electronic devices.

[0014] 2. Mold Innovation: In mold design and manufacturing, a multi-step flattening forming mold is innovatively adopted. By flattening in stages, precise control of the flattening dimensions is achieved step by step, solving the problem of dimensional deviations that easily occur in traditional one-step flattening forming. Simultaneously, to address the difficulty of forming small convex bumps, a specialized convex bump forming mold was designed. By optimizing the mold structure and processing technology, the success rate and quality of forming small convex bumps are improved, providing reliable mold assurance for product production. This mold innovation not only improves production efficiency and product quality but also reduces production costs, resulting in significant economic and social benefits. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the planar structure of the electronic component stamping die of this application; Figure 2 This is a schematic diagram of the structure of a partial clamping plate part in this application; Figure 3 This is a schematic diagram of a partial template component structure in this application; Figure 4 This is a schematic diagram of the outer shell structure of the electronic component stamping die in this application.

[0016] The markings in the diagram are: 1. Lower die base; 2. Upper die base; 3. Upper cover plate; 4. Upper backing plate; 5. Lower backing plate; 6. Upper clamping plate; 7. Die plate; 8. Stripper plate; 9. Backing plate; 10. Die insert; 11. Clamping plate part; 12. Clamping plate pad; 13. Locking bar; 14. Clamping plate insert; 15. Clamping plate sleeve; 16. Punch; 17. Stripper pad; 18. Side stop block; 19. Stripper insert; 20. Die pad; 21. Anti-negative screw; 22. Spring; 23. Ejector rod; 24. Screw; 25. Forming shim; 26. Forming ejector rod; 27. Second stripper insert; 28. Ejector rod fixing seat; 29. ​​Forming punch; 30. Forming float; 31. Forming punch fixing seat; 32. Forming pad. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the embodiments of this application. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0018] Example:

[0019] Reference Figure 1-4A semiconductor component processing mold for the electronics manufacturing industry includes a lower mold base 1 and an upper mold base 2. A lower pad 5 is fixedly disposed on the upper part of the lower mold base 1, and a concave template 7 is fixedly disposed on the upper part of the lower pad 5. An upper cover plate 3 is installed on the top of the upper mold base 2 by a negative screw 21. An upper pad 4, an upper clamping plate 6, a backing plate 9, and a stripper plate 8 are sequentially disposed on the bottom surface of the upper mold base 2. The internal components of the concave template 7 and the stripper plate 8 are correspondingly arranged. A cutting edge is provided on one side of the stripper plate 8 in the concave template 7. A clamping plate part 11 is disposed between the upper pad 4 and the lower pad 5. The lower mold base 1 and the upper mold base 2 constitute the core frame of the mold, providing a stable mounting base for each functional component. To ensure the overall structure of the mold remains stable during stamping and guarantee machining accuracy, the layered layout of the upper backing plate 4, upper clamping plate 6, backing plate 9, stripper plate 8, lower backing plate 5, and concave template 7 serves functions such as guiding, fixing, unloading, and forming, adapting to the multi-process requirements of electronic component stamping and achieving integrated positioning, stamping, and unloading. The internal components of the concave template 7 and stripper plate 8 are correspondingly set, and the cutting edge of the concave template, together with the punch, achieves the shearing and forming of electronic components, ensuring accurate stamping dimensions and meeting the processing requirements of miniaturized, high-precision electronic components. The upper and lower backing plates can buffer the impact force during stamping, avoid direct hard contact between the mold base and functional components, reduce wear, and extend the service life of the mold.

[0020] Reference Figure 1-2 The clamping plate part 11 has a clamping plate pad 12 at the connection between the upper pad 4 and the upper clamping plate 6. A clamping plate insert 14 is installed on the lower surface of the clamping plate pad 12, and a locking strip 13 is provided on the surface of the clamping plate insert 14. A clamping plate sleeve 15 is provided on the lower surface of the clamping plate insert 14, and a punch 16 is provided inside the clamping plate insert 14. A discharge pad 17 and a discharge insert 19 are provided around one end of the punch 16 inside the discharge plate 8. The clamping plate insert 14 is fixed between the upper pad 4 and the upper clamping plate 6 by the clamping plate pad 12 and the locking strip 13, ensuring that the punch 16 is firmly installed and does not shake or shift, thus ensuring the stamping dimensional accuracy and avoiding... To address the forming deviation of electronic components, the stripper pad 17 and stripper insert 19 are arranged around the punch 16. They not only provide guidance for the punch, ensuring accurate punch movement trajectory, but also assist the stripper plate in ejecting the workpiece after stamping, preventing the workpiece from getting stuck on the punch or die plate. The clamping plate sleeve 15 reduces friction between the punch and the clamping plate insert, preventing punch wear. It also adapts to punches of different specifications, improving the mold's compatibility with different models of electronic components and reducing replacement costs. The combination of the clamping plate pad 12 and the locking strip 13 disperses the punching reaction force of the punch to the upper clamping plate and the upper pad, preventing excessive local stress from causing component deformation and extending the mold's service life.

[0021] Reference Figure 1-2The die plate 7 is provided with a die insert 10 corresponding to the stripper insert 19 on the surface of the stripper plate 8. The die insert 10 is provided with a die pad 20 at the bottom of the inside of the die plate 7. A side stop 18 is installed on one side surface of the die insert 10 and the die pad 20. The die insert 10 and the stripper insert 19 of the stripper plate 8 are provided with a precise forming cavity for electronic components, ensuring that the shape and size of the stamped components meet the design requirements and are suitable for high-precision electronic component processing. The die pad 20 supports the die insert 10, and the side stop 18 restricts the lateral displacement of the die insert and the die pad, avoiding the die insert from shifting during stamping and causing forming deviation, thus ensuring processing stability.

[0022] Reference Figure 1-3 The anti-negative screw 21 has a spring 22 in the middle between the upper cover plate 3 and the upper pad plate 4, and the spring 22 has a push rod 23 at one end of the upper pad plate 4. The push rod 23 passes through the upper pad plate 4, the upper clamping plate 6 and the back plate 9 and is connected to the forming pad 25 at the top of the stripper plate 8. The spring 22 and the push rod 23 cooperate to automatically drive the stripper plate 8 to move upward after stamping, and push the formed workpiece out of the die, replacing manual unloading, improving processing efficiency, and adapting to batch production scenarios. During the stamping process, the spring 22 can buffer the downward impact force of the upper die seat, avoid wear caused by hard contact between the punch and the die, reduce the equipment load, and extend the service life of the equipment and the mold.

[0023] Reference Figure 1-3 The stripper plate 8 and the backing plate 9 are fixed by screws 24, and the lower pad plate 5 and the concave template 7 are fixed by screws 24. The screws 24 inside the stripper plate 8 pass through the forming pad 25 and the ejector pin fixing seat 28, and the screws 24 inside the concave template 7 pass through the forming pad 32 and the forming punch fixing seat 31. The screws 24 fix the stripper plate 8 and the backing plate 9, and the lower pad plate 5 and the concave template 7, ensuring that the components are tightly connected and do not have relative displacement, ensuring the stability of the mold structure during the stamping process and improving the processing accuracy. The screws inside the stripper plate pass through the forming pad 25 and the ejector pin fixing seat 28, and the screws inside the concave template pass through the forming pad 32 and the forming punch fixing seat 31, achieving precise positioning while fixing the components and avoiding processing errors caused by installation deviations.

[0024] Reference Figure 1-3Two forming pads 25 are provided inside the unloading plate 8, and a push rod fixing seat 28 is fixedly provided on the surface of the forming pad 25. A forming push rod 26 is provided on the surface of the push rod fixing seat 28, and a second unloading insert 27 is provided below the push rod fixing seat 28. The forming pads 25 cooperate with the push rod fixing seat 28 to fix the position of the forming push rod 26, ensuring the precise movement trajectory of the push rod, avoiding workpiece displacement or damage during ejection, and ensuring smooth unloading. The two forming pads 25 are symmetrically arranged, driving multiple forming push rods 26 to eject synchronously, so that the workpiece is subjected to uniform force, avoiding workpiece deformation caused by single-point ejection, especially suitable for the unloading needs of thin and precision electronic components. The second unloading insert 27 cooperates with the forming push rod 26, providing guidance for the push rod and conforming to the workpiece surface to assist ejection, reducing the pressure marks of the push rod on the workpiece surface, and improving the product appearance quality.

[0025] Reference Figure 1-3 The concave template 7 is provided with a forming float 30 at the position of the second unloading insert 27 on the unloading plate 8. A forming punch 29 is provided inside the forming float 30. A forming punch fixing seat 31 and a forming pad 32 are provided below the forming punch 29. The forming float 30 corresponds to the second unloading insert 27 of the unloading plate 8. The forming punch 29 inside can realize the forming of complex structures of electronic components, meet the processing requirements of high-precision, multi-feature electronic components. The forming float 30 can float slightly during stamping to buffer the impact force of the forming punch 29 on the workpiece, avoid the workpiece from cracking or deformation due to excessive instantaneous pressure, and improve the product qualification rate. The forming punch 29 is fixed in the concave template 7 by the forming punch fixing seat 31 and the forming pad 32 to ensure that the forming punch is firmly installed and does not shake, thus ensuring the forming dimensional accuracy.

[0026] The implementation principle of an embodiment of a semiconductor component processing mold in the electronics manufacturing industry according to this application is as follows: During mold assembly, the lower mold base 1 is fixed to the worktable of the stamping equipment, and the lower pad 5 and the concave template 7 are stacked and fixed in sequence. The upper mold base 2 is connected to the power end of the stamping equipment, and the upper cover plate 3, upper pad 4, upper clamping plate 6, backing plate 9, and stripper plate 8 are installed in sequence, with the positions of each layer of components locked by the anti-negative screws 21. During stamping, the power end of the equipment drives the upper mold base to move downward, and the punch fixed by the upper clamping plate 6 moves downward with the upper mold base, cooperating with the cutting edge of the concave template 7 to shear and shape the raw material placed on the surface of the concave template. After stamping, the upper mold base moves upward, and the stripper plate 8 is reset under the action of the subsequent spring and ejector rod, pushing the formed electronic component out of the concave template to complete the unloading. The layered layout allows each component to perform its function, and the pads buffer the impact force, ensuring a stable and precise stamping process.

[0027] During assembly, the punch 16 is inserted into the clamping plate insert 14, and the position of the punch is locked by the locking strip 13 to prevent the punch from loosening during stamping. The clamping plate insert is fixed between the upper pad 4 and the upper clamping plate 6 by the clamping plate pad 12, and the clamping plate sleeve 15 fits against the surface of the punch to reduce friction during punch movement. During stamping, the punch moves downward with the upper die base, passes through the corresponding hole in the stripper plate 8, and cooperates with the die plate 7 to complete the forming; during unloading, the stripper insert 19 and the stripper pad 17 move upward under the action of the stripper plate, pushing out the workpiece stuck on the punch, and guiding the punch to reset to ensure accuracy for the next stamping.

[0028] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A semiconductor component processing mold for the electronics manufacturing industry, comprising a lower mold base (1) and an upper mold base (2), characterized in that: A lower pad (5) is fixedly installed above the lower mold base (1), and a concave template (7) is fixedly installed above the lower pad (5). An upper cover plate (3) is installed on the top of the upper mold base (2) by a negative screw (21). An upper pad (4), an upper clamping plate (6), a back plate (9) and a stripper plate (8) are sequentially arranged on the bottom surface of the upper mold base (2). The internal components of the concave template (7) and the stripper plate (8) are arranged accordingly. A cutting edge is provided on one side of the stripper plate (8) of the concave template (7). A clamping plate part (11) is provided between the upper pad (4) and the lower pad (5).

2. The semiconductor component processing mold for the electronics manufacturing industry as described in claim 1, characterized in that: The clamping plate part (11) is provided with a clamping plate pad (12) at the connection between the upper pad (4) and the upper clamping plate (6). A clamping plate insert (14) is installed on the lower surface of the clamping plate pad (12), and a locking strip (13) is provided on the surface of the clamping plate insert (14). A clamping plate sleeve (15) is provided on the lower surface of the clamping plate insert (14), and a punch (16) is provided inside the clamping plate insert (14). A discharge pad (17) and a discharge insert (19) are provided around one end of the discharge plate (8).

3. The semiconductor component processing mold for the electronics manufacturing industry as described in claim 1, characterized in that: The concave template (7) is provided with a concave mold insert (10) on the unloading insert (19) on the surface of the unloading plate (8), and the concave mold insert (10) is provided with a concave mold pad (20) at the bottom inside the concave template (7). A side stop block (18) is installed on one side surface of the concave mold insert (10) and the concave mold pad (20).

4. The semiconductor component processing mold for the electronics manufacturing industry as described in claim 1, characterized in that: The anti-negative screw (21) has a spring (22) in the middle between the upper cover plate (3) and the upper pad plate (4), and the spring (22) has a push rod (23) at one end of the upper pad plate (4). The push rod (23) passes through the upper pad plate (4), the upper clamping plate (6) and the back plate (9) and is connected to the forming gasket (25) at the top of the unloading plate (8).

5. A semiconductor component processing mold for the electronics manufacturing industry as described in claim 1, characterized in that: The unloading plate (8) and the back plate (9) are fixed by screws (24) threaded connection, and the lower pad plate (5) and the concave template (7) are fixed by screws (24) threaded connection. The screws (24) inside the unloading plate (8) pass through the forming pad (25) and the top rod fixing seat (28), and the screws (24) inside the concave template (7) thread through the forming pad (32) and the forming punch fixing seat (31).

6. The semiconductor component processing mold for the electronics manufacturing industry as described in claim 5, characterized in that: Two molding pads (25) are provided inside the unloading plate (8), and a top rod fixing seat (28) is fixedly provided on the surface of the molding pad (25). A molding top rod (26) is provided on the surface of the top rod fixing seat (28), and a second unloading insert (27) is provided below the top rod fixing seat (28).

7. The semiconductor component processing mold for the electronics manufacturing industry as described in claim 6, characterized in that: The concave template (7) is provided with a forming float (30) at the position of the second unloading insert (27) corresponding to the unloading plate (8). A forming punch (29) is provided inside the forming float (30). A forming punch fixing seat (31) and a forming pad (32) are provided below the forming punch (29).

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