Electronic switch module semiconductor component processing mold

Abstract

The application relates to the field of stamping dies, and discloses a semiconductor part machining die for an electronic switch module. In the application, a lower die base is arranged at the upper end of a lower die plate, a lower base plate is arranged at the middle position of the lower die base and the lower die plate, a stripping plate is arranged at the upper end of the lower die plate, and a stripping back plate is arranged at the upper end of the stripping plate. The technical scheme is characterized in that the stamping process and the die design are optimized, the flatness deviation after stamping is effectively controlled, the fitting precision of a packaging piece, a chip and a substrate is ensured, the contact gap caused by unevenness of a plane is avoided, the problems of blocked heat dissipation channels and uneven current distribution are reduced, the pin bending angle and the positioning hole precision are accurately controlled, the pin deformation and the hole offset are avoided, the assembly misplacement is avoided, and the consistency and firmness of the packaging piece and the PCB board welding are ensured.

Description

Technical Field

[0001] This application belongs to the field of stamping die technology, specifically a die for processing semiconductor parts for electronic switch modules. Background Technology

[0002] Against the backdrop of the continuous upgrading of the electronic information industry towards high power, high density, and high reliability, higher requirements have been placed on the heat dissipation performance, structural stability, and high-frequency adaptability of power packages in fields such as power management, motor control, and high-efficiency power switching modules.

[0003] The TO263T-clip, as a specially optimized Clip-type packaged product, has significant application value in the electronics field due to its unique structural design.

[0004] In the existing process, after the work is completed and stamped, the flatness is prone to deviation, the pin bending angle is prone to exceed the tolerance, the positioning hole position is prone to offset, and the surface is prone to indentation. Utility Model Content

[0005] The purpose of this application is to provide a processing mold for semiconductor parts of electronic switch modules in order to solve the problem of providing efficient stamping production molds mentioned above.

[0006] The technical solution adopted in this application is as follows: A semiconductor component processing mold for an electronic switch module includes a lower mold base, a lower template is provided at the upper end of the lower mold base, a lower pad is provided at the middle position of the lower mold base and the lower template, a stripper plate is provided at the upper end of the lower template, and a stripper back plate is installed at the upper end of the stripper plate.

[0007] By adopting the above technical solution, the lower mold base serves as the skeleton of the mold, bearing all parts of the upper and lower molds respectively, providing an installation reference, and bearing the load of the entire stamping process. The rigid structure ensures the overall stability of the mold and avoids deformation and misalignment of parts due to excessive force during stamping. The lower pad disperses the stamping load and prevents the mold base from being damaged due to local stress concentration. The stripper plate and stripper back plate assist the stripper parts in realizing the unloading action, while providing layered support for the mold parts.

[0008] In a preferred embodiment, a clamping plate is provided at the upper end of the back plate, an upper mold base is provided at the upper end of the clamping plate, an upper pad is provided at the middle position of the clamping plate and the upper mold base, and an upper cover plate is provided at the upper end of the upper mold base.

[0009] By adopting the above technical solution, the clamping plate is used to fix the upper die working parts such as the punch, ensuring the connection stability of the structure. The upper and lower pads work together to distribute the stamping load, and the lower die holder and the upper die holder work together to ensure the connection of the structure.

[0010] In a preferred embodiment, a plurality of clamping parts are installed inside the clamping plate, and a gasket is provided at the middle position between the clamping parts and the clamping plate.

[0011] By adopting the above technical solution, the clamping plate part is used to fix the punch, unloading parts, etc., and through reliable fastening and positioning, the installation accuracy of each part and the material feeding accuracy are guaranteed, ultimately ensuring the stability of the stamping quality. The shim facilitates the installation and use of the clamping plate part and reduces the stamping load.

[0012] In a preferred embodiment, the clamping plate part is provided with a plurality of punches inside, the punches passing through the lower template, the stripper plate, the stripper back plate and the clamping plate respectively.

[0013] By adopting the above technical solution, the punch moves downward with the upper die during stamping, cooperates with the cutting edge, and completes the punching, forming and other processing of electronic components, realizing the fine structure of electronic components through a specific shape.

[0014] In a preferred embodiment, a cutting edge is installed inside the lower template at a position adjacent to the clamping plate part, and multiple stripping parts are installed inside the stripping plate.

[0015] By adopting the above technical solution, the cutting edge and the punch cooperate to form a stamping cavity, so that the material undergoes plastic deformation or separation between the two, and finally forms the shape, hole position and other structures of electronic components. High-precision processing ensures the size and shape accuracy of the stamped parts, meeting the precision assembly requirements of electronic components. After the stamping of the stripped parts is completed, the stamped parts or waste materials adhering to the punch are peeled off to ensure the smooth progress of the next stamping.

[0016] In a preferred embodiment, the lower pad is provided with a plurality of lower mold parts inside.

[0017] By adopting the above technical solution, the lower die part cooperates with the punch and the cutting edge to carry and position the stamping material, complete the multi-process stamping, and realize the continuous production of electronic components through the multi-station layout, thereby improving production efficiency and part consistency.

[0018] In a preferred embodiment, a plurality of working components are arranged inside the stripper plate at a position adjacent to the clamping plate part. The lower end of the working components is provided with a stripping insert inside the lower template, and the lower end of the stripping insert is provided with a forming block inside the lower template.

[0019] By adopting the above technical solution, the working component works in conjunction with the unloading insert to ensure a stable connection of the structure. After the stamping is completed, the unloading insert and the forming block will peel off the stamped part or scrap from the punch, ensuring the smooth progress of the next stamping, avoiding parts damage, improving production efficiency, and preventing mold jamming.

[0020] In a preferred embodiment, a pad is provided at the lower end of the molding block inside the lower template, the molding block is connected to a push rod, the push rod passes through the lower mold base and the lower pad, and the molding block is fixedly connected to the lower template by screws.

[0021] By adopting the above technical solution, the push rod cooperates with the unloading plate to complete the unloading action, realizing the automation of unloading and resetting without manual intervention, ensuring the continuity of the stamping process, the pad block reduces the stamping load, and the screw setting facilitates the restriction of the structure's position.

[0022] In summary, due to the adoption of the above technical solution, the beneficial effects of this application are: In this application, 1. by optimizing the stamping process and mold design, the flatness deviation after stamping is effectively controlled, ensuring the bonding accuracy between the package and the chip and substrate, avoiding contact gaps caused by uneven planes, and reducing problems such as obstructed heat dissipation channels and uneven current distribution; at the same time, the pin bending angle and positioning hole accuracy are precisely controlled to avoid assembly misalignment caused by pin deformation and hole offset, ensuring the consistency and firmness of the soldering between the package and the PCB board.

[0023] 2. Optimized heat dissipation performance and high-frequency adaptability to meet the needs of high-power and high-density upgrades: Precise control of flatness maximizes the contact area between the TO263T-clip and the heat sink substrate and chip, reducing thermal resistance and accelerating heat conduction and dissipation during power device operation. This effectively alleviates the problem of heat accumulation in high-power scenarios and improves the power carrying capacity of the product. In addition, the accuracy of pin angle and positioning hole position avoids distortion of signal transmission path and reduces signal interference and loss under high-frequency conditions.

[0024] 3. Improve surface quality and reduce production and application costs: Optimize the mold structure to reduce the generation of indentations on the surface of the packaged parts. On the one hand, this improves the consistency of product appearance and reduces the defect rate caused by surface defects. On the other hand, it avoids local stress concentration caused by indentations, reduces the risk of breakage of the packaged parts in subsequent welding and assembly processes, and reduces production rework costs.

[0025] 4. Expand application scenarios and enhance core product competitiveness: With its comprehensive advantages in heat dissipation performance, structural stability, high frequency adaptability and surface quality, the TO263T-clip can better meet the upgrade needs of power management, motor control and high-efficiency power switching modules. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the high-efficiency stamping die structure for electronic component manufacturing according to this application; Figure 2 This is the structural plane of the high-efficiency stamping die in this application; Figure 3 This is a detailed diagram of the connection of the unloading insert structure in this application.

[0027] The markings in the diagram are: 1. Lower mold base; 2. Lower backing plate; 3. Lower template; 4. Stripper plate; 5. Stripper backing plate; 6. Clamping plate; 7. Upper backing plate; 8. Upper mold base; 9. Upper cover plate; 10. Punch; 11. Clamping plate part; 12. Stripper part; 13. Shim; 14. Cutting edge; 15. Lower mold part; 16. Working component; 17. Stripper insert; 18. Forming block; 19. Pad block; 20. Ejector pin; 21. Screw. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the embodiments of this application. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0029] Example:

[0030] Reference Figure 1-3 A semiconductor component processing mold for an electronic switch module includes a lower mold base 1, a lower template 3 at the upper end of the lower mold base 1, a lower pad 2 at the middle position between the lower mold base 1 and the lower template 3, a stripper plate 4 at the upper end of the lower template 3, and a stripper back plate 5 installed at the upper end of the stripper plate 4. The lower mold base 1 serves as the skeleton of the mold, bearing all the components of the upper and lower molds respectively, providing an installation reference, and bearing the load throughout the stamping process. The rigid structure ensures the overall stability of the mold and prevents the components from deforming or misaligning due to excessive force during stamping. The lower pad 2 disperses the stamping load and prevents the mold base from being damaged due to local stress concentration. The stripper plate 4 and the stripper back plate 5 assist the stripping components in achieving the unloading action, while providing layered support for the mold components.

[0031] Reference Figure 1-3 A clamping plate 6 is provided at the upper end of the back plate 5, and an upper die base 8 is provided at the upper end of the clamping plate 6. An upper pad 7 is provided in the middle of the clamping plate 6 and the upper die base 8. An upper cover plate 9 is provided at the upper end of the upper die base 8. The clamping plate 6 is used to fix the upper die working parts such as the punch 10 to ensure the connection stability of the structure. The upper pad 7 and the lower pad 2 are used together to distribute the stamping load. The lower die base 1 and the upper die base 8 are used together to ensure the connection of the structure.

[0032] Reference Figure 1-3The clamping plate 6 has multiple clamping plate parts 11 installed inside. A shim 13 is provided in the middle position between the clamping plate parts 11 and the clamping plate 6. The clamping plate parts 11 are used to fix the punch, unloading parts, etc. Through reliable fastening and positioning, the installation accuracy of each part and the material feeding accuracy are guaranteed, and the stability of the stamping quality is ultimately guaranteed. The shim 13 facilitates the installation of the clamping plate parts 11 and reduces the stamping load.

[0033] Reference Figure 1-3 The clamping plate part 11 has multiple punches 10 inside. The punches 10 pass through the lower template 3, stripper plate 4, stripper back plate 5 and clamping plate 6 respectively. When the punches 10 are stamping, they move down with the upper die and cooperate with the cutting edge to complete the punching, forming and other processing of electronic components. The fine structure of electronic components is realized through specific shapes.

[0034] Reference Figure 1-3 Inside the lower template 3, adjacent to the clamping plate part 11, a cutting edge 14 is installed. The cutting edge 14 and the punch 10 cooperate to form a stamping cavity, causing the material to undergo plastic deformation or separation between the two, ultimately forming the shape, hole position and other structures of the electronic component. High-precision machining ensures the size and shape accuracy of the stamped part, meeting the precision assembly requirements of the electronic component. After the stripping part 12 is stamped, the stamped part or scrap that is stuck to the punch 10 is peeled off to ensure the smooth progress of the next stamping.

[0035] Reference Figure 1-3 The lower pad 2 has multiple lower die parts 15 inside. The lower die parts 15 cooperate with the punch 10 and the cutting edge 14 to carry and position the stamping material and complete the multi-process stamping. The multi-station layout realizes the continuous production of electronic components and improves production efficiency and part consistency.

[0036] Reference Figure 1-3 Inside the stripper plate 4, adjacent to the clamping plate part 11, there are multiple working components 16. The lower end of the working component 16 is located inside the lower template 3 and has a stripping insert 17. The lower end of the stripping insert 17 is located inside the lower template 3 and has a forming block 18. The working components 16 work together with the stripping insert 17 to ensure a stable connection of the structure. After stamping, the stripping insert 17 and the forming block 18 peel off the stamped part or scrap from the punch, ensuring the smooth progress of the next stamping, avoiding parts damage, improving production efficiency, and preventing mold jamming.

[0037] Reference Figure 1-3The lower end of the forming block 18 is located inside the lower template 3 and a pad block 19 is provided. The forming block 18 is connected by a push rod 20, which passes through the lower mold base 1 and the lower pad plate 2. The forming block 18 is fixedly connected to the lower template 3 by screws 21. The push rod 20 works with the stripper plate to complete the unloading action, realizing the automation of unloading and resetting without manual intervention, ensuring the continuity of the stamping process. The pad block 19 reduces the stamping load, and the setting of the screws 21 facilitates the restriction of the position of the structure.

[0038] The implementation principle of the electronic switch module semiconductor component processing mold embodiment of this application is as follows: 1. By optimizing the stamping process and mold design, the flatness deviation after stamping is effectively controlled, ensuring the bonding accuracy between the package and the chip and substrate, avoiding contact gaps caused by uneven planes, and reducing problems such as blocked heat dissipation channels and uneven current distribution; at the same time, the bending angle of the pins and the accuracy of the positioning holes are precisely controlled to avoid assembly misalignment caused by pin deformation and hole offset, ensuring the consistency and firmness of the soldering between the package and the PCB board.

[0039] 2. Optimized heat dissipation performance and high-frequency adaptability to meet the needs of high-power and high-density upgrades: Precise control of flatness maximizes the contact area between the TO263T-clip and the heat sink substrate and chip, reducing thermal resistance and accelerating heat conduction and dissipation during power device operation. This effectively alleviates the problem of heat accumulation in high-power scenarios and improves the power carrying capacity of the product. In addition, the accuracy of pin angle and positioning hole position avoids distortion of signal transmission path and reduces signal interference and loss under high-frequency conditions.

[0040] 3. Improve surface quality and reduce production and application costs: Optimize the mold structure to reduce the generation of indentations on the surface of the packaged parts. On the one hand, this improves the consistency of product appearance and reduces the defect rate caused by surface defects. On the other hand, it avoids local stress concentration caused by indentations, reduces the risk of breakage of the packaged parts in subsequent welding and assembly processes, and reduces production rework costs.

[0041] 4. Expand application scenarios and enhance core product competitiveness: With its comprehensive advantages in heat dissipation performance, structural stability, high frequency adaptability and surface quality, the TO263T-clip can better meet the upgrade needs of power management, motor control and high-efficiency power switching modules.

[0042] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A semiconductor component processing mold for an electronic switch module, comprising a lower mold base (1), characterized in that: The lower mold base (1) is provided with a lower template (3) at its upper end. A lower pad (2) is provided between the lower mold base (1) and the lower template (3). A stripper plate (4) is provided at the upper end of the lower template (3). A stripper back plate (5) is installed at the upper end of the stripper plate (4). A clamping plate (6) is provided at the upper end of the stripper back plate (5). An upper mold base (8) is provided at the upper end of the clamping plate (6). An upper pad (7) is provided between the clamping plate (6) and the upper mold base (8). An upper cover plate (9) is provided at the upper end of the upper mold base (8). The clamping plate (6) has multiple clamping plate parts (11) installed inside. A gasket (13) is provided in the middle position between the clamping plate parts (11) and the clamping plate (6). Multiple punches (10) are provided inside the clamping plate parts (11). The punches (10) pass through the lower template (3), the stripper plate (4), the stripper back plate (5), and the clamping plate (6) respectively. A cutting edge (14) is installed inside the lower template (3) at an adjacent position to the clamping plate parts (11). Multiple stripper parts (12) are installed inside the stripper plate (4).

2. The semiconductor component processing mold for an electronic switch module as described in claim 1, characterized in that: The lower pad (2) has multiple lower mold parts (15) inside.

3. The electronic switch module semiconductor component processing mold as described in claim 1, characterized in that: The stripper plate (4) has multiple working components (16) located adjacent to the clamping plate part (11) inside. The lower end of the working component (16) is provided with a stripping insert (17) inside the lower template (3). The lower end of the stripping insert (17) is provided with a forming block (18) inside the lower template (3).

4. The electronic switch module semiconductor component processing mold as described in claim 3, characterized in that: The lower end of the molding block (18) is located inside the lower template (3) and a pad (19) is provided. The molding block (18) is connected by a top rod (20). The top rod (20) passes through the lower mold base (1) and the lower pad (2). The molding block (18) is fixedly connected to the lower template (3) by screws (21).

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