A mold for processing a semiconductor part of an in-vehicle electronic device

Abstract

The application relates to the technical field of vehicle-mounted electronic equipment, and discloses a vehicle-mounted electronic equipment semiconductor part machining die. In the application, a sealing structure is arranged between a stripping plate and a lower die plate, a dustproof gap control device is arranged between an upper clamping plate and a stripping back plate, and a scrap flow guide channel is arranged in the die. Through the multiple sealing structures and the protection device, the possibility of dust and scrap entering the key parts of the die is significantly reduced, the inside of the die is ensured to be clean, the impurities are prevented from abrading and scratching the precise surface of the die, the service life of key parts such as punches and cutting edges is significantly prolonged, the flexibility and guiding precision of the moving parts of the die are maintained, the consistency of product sizes is ensured, the cleaning frequency and maintenance cost are reduced, the equipment utilization rate is improved, the scattering of scrap is effectively controlled, and the working environment is improved.

Description

Technical Field

[0001] This application belongs to the field of automotive electronic equipment technology, specifically a semiconductor component processing mold for automotive electronic equipment. Background Technology

[0002] Currently, electronic devices are rapidly evolving towards miniaturization, high performance, and high-density integration, making the demand for domestic substitution in the semiconductor electronic component field increasingly urgent. Simultaneously, the increasing complexity of product structures places higher demands on thermal management technology. Traditional semiconductor components perform poorly in thermal management and are difficult to adapt to new circuit designs, their limitations becoming increasingly apparent and unable to meet the industry's evolving needs.

[0003] In the field of automotive electronic equipment, the shortcomings of traditional semiconductor components are even more obvious, making it difficult to meet the dual requirements of thermal management and new circuit design in automotive scenarios.

[0004] Against this backdrop, our company has developed a new type of semiconductor component, a UPDFN5*6 automotive electronic device semiconductor component processing mold, a double-sided heat dissipation automotive electronic device semiconductor component processing mold, and a CLIP automotive electronic device semiconductor component processing mold. This product uses 0.5mm thin copper strip as raw material and has excellent thermal management performance, which can accurately respond to market pain points. Utility Model Content

[0005] The purpose of this application is to provide a mold for processing semiconductor parts for automotive electronic devices in order to solve the problems mentioned above.

[0006] The technical solution adopted in this application is as follows: A semiconductor component processing mold for automotive electronic devices includes an upper mold assembly, a lower mold assembly, and a stripping mechanism. The upper mold assembly includes an upper mold base, from which an upper cover plate, an upper pad plate, and an upper clamping plate are sequentially connected from top to bottom. A punch is fixed to the upper clamping plate via clamping plate components. The lower mold assembly includes a lower mold base, from which a lower pad plate and a lower template plate are sequentially connected from bottom to top. A cutting edge is provided on the lower template plate, and a die gasket is provided between the lower template plate and the cutting edge. A locking strip is installed on the side of the lower mold base. The stripping mechanism includes a stripping back plate and a stripping plate. Stripping components are provided on the stripping plate, and the stripping back plate and the stripping plate are positioned and connected by a top pin. A sealing structure is provided between the stripping plate and the lower template plate, and a dustproof gap control device is provided between the upper clamping plate and the stripping back plate. A debris guiding channel is provided inside the mold. Through multiple sealing structures and protective devices, the possibility of dust and debris entering key parts of the mold is significantly reduced, ensuring the cleanliness of the mold interior. It prevents impurities from wearing and scratching the precision surfaces of the mold, significantly extending the service life of key components such as punches and cutting edges. It maintains the flexibility and guiding accuracy of moving parts in the mold, ensuring consistent product dimensions. It reduces cleaning frequency and maintenance costs, improving equipment utilization. It effectively controls debris splashing, improving working environment conditions.

[0007] In a preferred embodiment, the lower surface of the stripping plate is provided with an annular sealing groove, and a sealing element is embedded inside, forming a tight contact with the upper surface of the lower template.

[0008] In a preferred embodiment, the mating surfaces of the upper clamping plate and the backing plate are provided with a labyrinth-type sealing structure to effectively prevent dust from entering the interior of the upper mold.

[0009] In a preferred embodiment, the stripper plate is provided with an inclined guide channel to guide the debris generated during the stamping process to the outside of the mold.

[0010] In a preferred embodiment, a protective baffle is provided around the blade of the lower template to prevent debris from splashing.

[0011] In a preferred embodiment, a dustproof sleeve is provided at the mating part of the top pin and the back plate to prevent dust from entering the guide gap.

[0012] In a preferred embodiment, a sealing gasket is provided on the mounting surface of the locking bar and the lower mold base to enhance the overall dustproof effect.

[0013] In a preferred embodiment, a clamping plate sleeve is provided between the upper clamping plate and the clamping plate parts to form a secondary sealing barrier.

[0014] In summary, due to the adoption of the above technical solution, the beneficial effects of this application are: 1. Innovative Product Structure Design An innovative design employs a 0.5mm thin copper strip in a semiconductor component processing mold for automotive electronic devices to achieve a stepped, uneven thickness product structure at both ends, breaking the limitations of traditional semiconductor component structures that are simple and uniform in thickness. This structural design better adapts to the spatial layout requirements of automotive electronic devices and provides a structural foundation for achieving double-sided heat dissipation, effectively improving the product's thermal management performance and solving the problem of insufficient thermal management efficiency of traditional semiconductor components in automotive scenarios. Furthermore, an innovative product structure integrating multiple bending forming and crack-free operation has been developed. Through optimized design of the product's transition area and precise control of stress distribution, multiple bending forming can be achieved to meet complex structural requirements while ensuring no internal cracks are generated. Compared to the crack-prone nature of traditional bending forming products, this structural design significantly improves the product's structural reliability and service life, meeting the high reliability requirements of automotive electronic devices.

[0015] 2. Mold Innovation We developed a high-precision matching flattening mold, innovatively designing cavities and cutting edges adapted to the inconsistent thickness of product steps. By precisely controlling the machining accuracy and fitting clearance of mold parts, we achieved high-precision flattening of thin copper strips. This allows us to accurately control the dimensional errors of the product's stepped sections within the customer's requirements, solving the technical challenge of achieving high-precision forming of products with non-uniform thickness using traditional molds. We also innovatively designed a multi-station mold suitable for multiple bending processes. By optimizing the mold's guiding and positioning mechanism and process connection methods, we enabled thin copper strips to complete multiple bending processes within the same mold, reducing errors during product transfer between different molds and significantly improving bending accuracy. Simultaneously, this multi-station mold design optimizes the structural layout of complex molds to some extent, alleviating the cost pressure caused by mold lengthening and improving mold production efficiency and cost-effectiveness. Attached Figure Description

[0016] Figure 1 This is a cross-sectional view of the stamping die structure in this application; Figure 2 This is a schematic diagram of the overall structure of the stamping die in this application; Figure 3 This is a cross-sectional view of the stamping die structure in this application.

[0017] The markings in the diagram are: 1. Lower mold base; 2. Upper mold base; 3. Upper cover plate; 4. Upper backing plate; 5. Lower backing plate; 6. Upper clamping plate; 7. Backing plate; 8. Stripper plate; 9. Lower template; 10. Clamping plate parts; 11. Punch; 12. Ejector pin; 13. Stripper parts; 14. Cutting edge; 15. Lower mold pad; 16. Clamping plate pad; 17. Locking bar; 18. Clamping plate sleeve; 19. Stripper pad; 20. Die insert; 21. Die gasket. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the embodiments of this application. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0019] Example:

[0020] Reference Figure 1-3 The lower mold base 1 has a lower template 9 at its upper end, a lower pad 5 at the middle of the lower mold base 1 and the lower template 9, a stripper plate 8 at the upper end of the lower template 9, and a stripper back plate 7 at the upper end of the stripper plate 8. The lower mold base 1 serves as the basic support structure for the mold, and its stability is enhanced by the lower mold pad 15. A locking strip 17 is installed on the side of the lower mold base 1 to ensure precise positioning when the mold is closed.

[0021] Reference Figure 1-3 An upper clamping plate 6 is provided at the upper end of the back plate 7, and an upper mold base 2 is provided at the upper end of the upper clamping plate 6. An upper pad 4 is provided in the middle of the upper clamping plate 6 and the upper mold base 2, and an upper cover plate 3 is provided at the upper end of the upper mold base 2. A punch 11 is fixed to the upper clamping plate 6 by a clamping plate part 10, and a clamping plate sleeve 18 is provided between the upper clamping plate 6 and the clamping plate part 10 to form an effective dust barrier.

[0022] Reference Figure 1-3 The contact surface between the stripper plate 8 and the lower template 9 is equipped with a sealing structure. The stripper part 13 is installed inside the stripper plate 8, enabling reliable stripping after stamping. The top pin 12 penetrates the stripper back plate 7 and the stripper plate 8, and is fitted with a dustproof sleeve to prevent dust from entering the guide gap.

[0023] Reference Figure 1-3 The lower die plate 9 is provided with a cutting edge 14. The die insert 20 and die shim 21 are installed inside the lower die plate 9 to form a complete stamping cavity. The unloading pad 19 is provided inside the lower die plate 9 to assist in the unloading action.

[0024] Reference Figure 1-3The stripper plate 8 has an inclined guide channel inside, which effectively guides the metal scrap generated during the stamping process to the collection device on the side of the mold. The cutting edge 14 of the lower mold plate 9 is provided with a protective baffle to effectively prevent scrap from splashing.

[0025] Reference Figure 1-3 The mating surfaces of the upper clamping plate 6 and the backing plate 7 adopt a labyrinth-style sealing structure, with multiple layers of protection to ensure that dust cannot enter the interior of the upper mold. The clamping plate pads 16 are set at key contact points to ensure the parallelism and stability between the templates.

[0026] The implementation principle of the semiconductor component processing mold for automotive electronic devices in this application is as follows: This application effectively solves the dust prevention problem during the stamping process by setting multiple sealing and protective structures in key parts of the mold. The sealing structure between the stripper plate and the lower die plate prevents debris from entering the working area of ​​the mold; the labyrinth seal device prevents dust from penetrating into the upper die; and the flow channel system promptly discharges generated debris from the mold. These structures work together to achieve dust prevention without excessively increasing the complexity of the mold, ensuring the long-term stable operation of the mold in a clean environment.

[0027] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A semiconductor component processing mold for automotive electronic devices, comprising an upper mold assembly, a lower mold assembly, and a stripping mechanism, wherein the upper mold assembly comprises an upper mold base (2), the upper mold base (2) being connected to an upper cover plate (3), an upper pad plate (4), and an upper clamping plate (6), and the upper clamping plate (6) having a punch (11) fixed thereon via a clamping plate component (10); the lower mold assembly comprises a lower mold base (1), the lower mold base (1) being connected to a lower pad plate (5) and a lower template plate (9), the lower template plate (9) having a cutting edge (14), and the lower mold base (1) having a locking strip (17) on its side; the stripping mechanism comprises a stripping back plate (7) and a stripping plate (8), the stripping plate (8) having a stripping component (13), and the stripping back plate (7) and the stripping plate (8) being connected via a ejector pin (12); characterized in that: A sealing structure is provided between the stripping plate (8) and the lower template (9), and a dustproof gap control device is provided between the upper clamping plate (6) and the stripping back plate (7).

2. The semiconductor component processing mold for automotive electronic devices according to claim 1, characterized in that: The contact surface between the stripper plate (8) and the lower template (9) is provided with a sealing groove and a sealing element.

3. The semiconductor component processing mold for automotive electronic devices according to claim 1, characterized in that: The mating surfaces of the upper clamping plate (6) and the back plate (7) adopt a labyrinth-type sealing structure.

4. The semiconductor component processing mold for automotive electronic devices according to claim 1, characterized in that: The stripping plate (8) is provided with a debris guiding channel inside.

5. The semiconductor component processing mold for automotive electronic devices according to claim 1, characterized in that: The lower template (9) is provided with a protective guard around the blade (14).

6. The semiconductor component processing mold for vehicle-mounted electronic devices according to claim 1, characterized in that: The mating part between the top pin (12) and the back plate (7) is provided with a dustproof sleeve.

7. The semiconductor component processing mold for automotive electronic devices according to claim 1, characterized in that: The mounting surfaces of the locking bar (17) and the lower mold base (1) are provided with sealing gaskets.

8. The semiconductor component processing mold for automotive electronic devices according to claim 1, characterized in that: A clamping plate sleeve (18) is provided between the upper clamping plate (6) and the clamping plate part (10).

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