Semiconductor system soldering fixture dismounting device

Abstract

The utility model relates to a semiconductor system welding fixture dismounting device belongs to the technical field of semiconductor system welding, it includes support assembly and sets up in its inside dismounting assembly, wherein, support assembly provides installation base and positioning, and dismounting assembly contains pressure jaw assembly, first jacking assembly and second jacking assembly, work, pressure jaw assembly first compresses tightly the copper plate of clamp, subsequently, first jacking assembly jacks up and separates pin clamp and pressure head, and second jacking assembly separates copper plate again. The device is through the mechanization operation of pneumatic cylinder drive, replaces manual dismounting, effectively solved the product collision, chip breakage and signal needle deformation etc. problems caused by the adhesion of part, jam, improved the dismounting efficiency and product quality.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor system welding technology, and in particular to a semiconductor system welding fixture disassembly device. Background Technology

[0002] With the development of semiconductor packaging technology, system welding technology has emerged. This technology uses welding fixtures to position and assemble components such as copper base plates, solder, copper-clad substrates, solder paste, and signal pins to achieve efficient product assembly.

[0003] In related technologies, the system welding fixture is usually disassembled manually to complete the separation of the welded products.

[0004] However, the above-mentioned manual disassembly method has the following drawbacks: Because the flux evaporates and adheres to the surface of the fixture during vacuum reflow, it causes adhesion between the fixture and the product, which in turn leads to problems such as pressure head jamming and fixture jamming with the copper base plate. At the same time, uneven force during manual disassembly can easily cause the pressure head to collide with the chip on the copper-clad substrate, resulting in chip damage or wire slippage. During the disassembly of the pin insertion fixture, signal pins may deform or break, ultimately leading to product scrap. Utility Model Content

[0005] In response to the shortcomings of the existing production technology, the applicant provides a semiconductor system welding fixture disassembly device, which replaces manual disassembly with cylinder-driven disassembly. This device is stable in operation, low in cost, reduces the labor intensity of workers, improves product quality, and solves the problem of manually disassembling system welding fixtures.

[0006] The technical solution adopted in this utility model is as follows: A semiconductor system welding fixture disassembly device includes a support assembly and a disassembly assembly, wherein the disassembly assembly is disposed within the support assembly; The support assembly includes a support base, multiple support columns, a disassembly platform, a barrier, and a limiting block. The multiple support columns are arranged on the support base along the height direction, and the disassembly platform is located on the top of the support columns. The barrier surrounds the multiple support columns and forms a cavity inside to accommodate the disassembly assembly. The limiting block is located on the disassembly platform to limit the position of the clamp assembly. The disassembly assembly includes a pressure claw assembly, a first lifting assembly, and a second lifting assembly; The pressure claw assembly is disposed on both sides of the copper plate of the clamp assembly and is used to press down the copper plate during disassembly. The first lifting assembly is disposed at the bottom of the disassembly table, and the first lifting assembly is used to lift the pin clamp of the clamp assembly; The second lifting assembly is located at the bottom of the disassembly platform and is used to lift the copper plate of the clamp assembly.

[0007] As a further improvement to the above technical solution: In one embodiment, the gripper assembly includes a clamping cylinder, a connecting part, a gripper, and a mounting part; the output end of the clamping cylinder is connected to the gripper through the connecting part, and the other end of the gripper is mounted on the disassembly table through the mounting part.

[0008] In one embodiment, the gripper assembly further includes a sensor disposed on the clamping cylinder for detecting the positioning state of the clamping cylinder to determine the gripper state.

[0009] In one embodiment, the first lifting assembly includes a first lifting cylinder, a first lifting frame, and a plurality of first lifting rods; the fixed end of the first lifting cylinder is connected to the bottom of the disassembly platform, and the output end is connected to the first lifting frame; the first lifting frame moves up and down in the height direction along with the output end of the first lifting cylinder; the plurality of first lifting rods are disposed on the first lifting frame, and during the lifting process, they penetrate the disassembly platform and abut against the pin clamps of the clamping assembly.

[0010] In one embodiment, there are four first lifting rods, which are respectively set at the four corners of the edge of the first lifting frame.

[0011] In one embodiment, the second lifting assembly includes a second lifting cylinder, a second lifting frame, and a plurality of second lifting rods; the fixed end of the second lifting cylinder is connected to the bottom of the disassembly platform, and the output end is connected to the second lifting frame; the second lifting frame moves up and down in the height direction along with the output end of the second lifting cylinder; the plurality of second lifting rods are disposed on the second lifting frame, and pass through the disassembly platform during the lifting process and abut against the copper plate of the clamp assembly.

[0012] In one embodiment, there are four second lifting rods, which are respectively set at the four corners of the edge of the second lifting frame.

[0013] In one embodiment, the limiting block cooperates with the base plate of the clamping assembly to limit the position of the clamping assembly on the disassembly table.

[0014] In one embodiment, the disassembly platform is provided with multiple through holes for the first lifting rod of the first lifting assembly and the second lifting rod of the second lifting assembly to pass through.

[0015] The beneficial effects of this utility model are as follows: This utility model has a compact structure. By adopting a cylinder-driven lifting mechanism and a pressure claw mechanism, it replaces the completely manual disassembly method. The mechanized operation process is stable and controllable, which can avoid problems such as chip collision damage, wire slippage, and signal pin bending or breakage caused by unstable manual operation and uneven force. This greatly improves the yield and quality of the product.

[0016] This utility model also has the following advantages: This invention combines the layered relationship between the base plate, copper plate, pin clamp, and pressure head in the fixture assembly to be disassembled. By setting up a claw assembly for clamping the copper plate, a first lifting assembly for lifting the pin clamp and pressure head, and a second lifting assembly for lifting the copper plate, it achieves layered and step-by-step disassembly of the fixture assembly. This avoids mutual interference between components during disassembly, making the disassembly process smooth and improving disassembly efficiency. In addition, the limiting block in the support assembly can accurately initially position the fixture assembly placed on the disassembly table. The claw assembly can reliably clamp the copper plate before the lifting operation to prevent it from shifting during disassembly. The arrangement of multiple lifting rods at the four corners of the edge can simultaneously and smoothly lift the components, ensuring a uniform distribution of lifting force and preventing the components from jamming or deforming due to single-point or eccentric forces. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0018] Figure 2 This is a schematic diagram of the fixture assembly of this utility model.

[0019] Figure 3 This is a structural schematic diagram of the disassembly assembly of this utility model (the enclosure is hidden).

[0020] Figure 4 This is a schematic diagram of the bottom structure of the disassembly tabletop of this utility model.

[0021] Figure 5 This is a schematic diagram of the structure of the first lifting component of this utility model.

[0022] Figure 6 This is a schematic diagram of the pressure claw assembly of this utility model.

[0023] Figure 7 This is a schematic diagram of the structure of the second lifting component of this utility model.

[0024] Among them: 100, clamp assembly; 200, support assembly; 300, disassembly assembly. 110. Base plate; 120. Copper plate; 130. Pin clamp; 140. Pressure head; 210. Disassemble the tabletop; 220. Enclosure; 230. Support base; 240. Support rod; 250. Limiting block; 310. First lifting assembly; 320. Pressure claw assembly; 330. Second lifting assembly; 311. First lifting frame; 312. First lifting cylinder; 313. First lifting rod; 321. Clamping cylinder; 322. Connecting part; 323. Mounting part; 324. Claw; 325. Sensor; 331. Second lifting frame; 332. Second lifting cylinder; 333. Second lifting rod. Detailed Implementation

[0025] The specific embodiments of this utility model are described below with reference to the accompanying drawings.

[0026] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this utility model.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0028] When using the terms “including,” “having,” and “comprising” as described herein, another component may be added unless explicitly qualifying terms such as “only,” “consisting of,” etc. are used. Unless otherwise stated, singular terms may include plural forms and should not be construed as having a quantity of one.

[0029] It should be understood that although the terms "first," "second," etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the scope of this invention, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0030] Furthermore, the accompanying drawings are not drawn to a 1:1 scale, and the relative dimensions of the components are shown in the drawings only as examples and not necessarily to actual scale.

[0031] like Figures 1-7 The accompanying drawing shows a schematic diagram of the structural state of a semiconductor system welding fixture disassembly device according to an embodiment of the present invention; for ease of description, the drawing only shows the structure related to the embodiment of the present invention.

[0032] This application provides a semiconductor system welding fixture disassembly device for automatically disassembling the fixture assembly 100 used in the semiconductor system welding process, so as to avoid component damage caused by manual disassembly. It includes a support assembly 200 and a disassembly assembly 300, wherein the disassembly assembly 300 is disposed inside the support assembly 200 and is driven by a cylinder to achieve mechanized operation.

[0033] First, refer to Figure 1 and Figure 2 In this embodiment, the clamp assembly 100 is the object to be disassembled, including a base plate 110 and a copper plate 120 arranged sequentially in the height direction; a copper-clad substrate is provided on the copper plate 120, and a solder layer is provided between the copper plate 120 and the copper-clad substrate. A pin clamp 130 is disposed above the copper plate 120. The pin clamp 130 is used to limit and fix the signal pins on the copper-clad substrate. It also includes a pressure head 140, the top post at the bottom of the pressure head 140 passing through the through hole on the pin clamp 130 and abutting against the upper surface of the copper-clad substrate, and the top profile of the pressure head 140 is larger than the through hole of the pin clamp 130, so as to ensure that the pressure head 140 can be driven to rise by the pin clamp 130 during the process of the pin clamp 130 being lifted.

[0034] Please refer to the following: Figure 1 and Figure 3 The support assembly 200 includes a support base 230, multiple support rods 240, a disassembly platform 210, a barrier 220, and a limiting block 250. The multiple support rods 240 are fixedly mounted on the support base 230 along the height direction, and the disassembly platform 210 is fixedly installed on the top of the support rods 240 to support the clamp assembly 100. The enclosure 220 surrounds the perimeter of the multiple support rods 240 and forms a closed cavity inside, which is used to accommodate and protect the disassembly assembly 300. The limiting block 250 is fixedly installed on the disassembly table 210. Its shape matches the edge of the base plate 110 of the clamp assembly 100. It is used to precisely limit the horizontal position of the clamp assembly 100 on the disassembly table 210 and prevent displacement during disassembly.

[0035] Please see Figures 3 to 7 In this embodiment, the disassembly assembly 300 is responsible for performing the layered disassembly operation, including the pressure claw assembly 320, the first lifting assembly 310, and the second lifting assembly 330; Among them, such as Figure 1As shown, the clamping claw assembly 320 is disposed on both sides of the copper plate 120 of the clamping assembly 100, and is used to clamp the copper plate 120 during the initial disassembly stage to prevent it from moving. Specifically, such as Figure 6 As shown, the gripper assembly 320 includes a clamping cylinder 321, a connecting part 322, a gripper 324, and a mounting part 323. The clamping cylinder 321 is fixed to the disassembly table 210 through the mounting part 323, and its output end is connected to the gripper 324 through the connecting part 322, driving the gripper 324 to perform clamping or releasing actions. In practical applications, a protective cover can be added above the pressure claw assembly 320. The protective cover can be fixed on the disassembly table 210 to further reduce external interference.

[0036] In addition, the gripper assembly 320 is also equipped with a sensor 325, which is installed on the clamping cylinder 321 to detect the piston rod stroke position of the clamping cylinder 321, thereby determining the opening and closing state of the gripper 324 and ensuring that the clamping operation is in place.

[0037] In this embodiment, the first lifting assembly 310 is disposed at the bottom of the disassembly table 210 and is used to lift the pin clamp 130 and the pressure head 140 of the clamp assembly 100.

[0038] like Figure 5 As shown, the first lifting assembly 310 includes a first lifting cylinder 312, a first lifting frame 311, and a plurality of first lifting rods 313; the fixed end of the first lifting cylinder 312 is connected to the bottom of the disassembly platform 210, and the output end is connected to the first lifting frame 311, driving the first lifting frame 311 to rise and fall along the height direction. Furthermore, there are four first lifting rods 313, which are fixedly installed at the four corners of the edge of the first lifting frame 311. During the lifting process, the first lifting rods 313 pass through the corresponding through holes on the disassembly table 210 and abut against the bottom of the four corners of the pin clamp 130, thereby smoothly lifting the pin clamp 130.

[0039] Combination Figure 7 As shown, the second lifting assembly 330 is also located at the bottom of the disassembly platform 210 and is used to lift the copper plate 120 of the clamp assembly 100. Furthermore, the second lifting assembly 330 includes a second lifting cylinder 332, a second lifting frame 331, and a plurality of second lifting rods 333; The fixed end of the second lifting cylinder 332 is connected to the bottom of the disassembly platform 210, and the output end is connected to the second lifting frame 331, driving the second lifting frame 331 to rise and fall along the height direction; There are four second lifting rods 333, which are fixedly installed at the four corners of the edge of the second lifting frame 331. During the lifting process, the second lifting rods 333 pass through the corresponding through holes on the disassembly platform 210 and abut against the bottom of the four corners of the edge of the copper plate 120, so as to achieve the smooth lifting of the copper plate 120.

[0040] Specifically, the disassembly table 210 is provided with multiple through holes, the positions of which correspond to the first lifting rod 313 and the second lifting rod 333, ensuring that the lifting rods can smoothly pass through the table and contact the corresponding parts of the clamp assembly 100.

[0041] In practical applications, the workflow of this utility model is as follows: The welded fixture assembly 100 is positioned on the disassembly table 210 by the limiting block 250; The clamping cylinder 321 of the clamping claw assembly 320 drives the claw 324 to clamp the copper plate 120; The first lifting cylinder 312 of the first lifting assembly 310 drives the first lifting frame 311 to rise, which in turn drives the first lifting rod 313 to lift the pin clamp 130 and the pressure head 140. The operator then removes the pin clamp 130 and the pressure head 140. When the pressure claw assembly 320 is released, the second lifting cylinder 332 of the second lifting assembly 330 drives the second lifting frame 331 to rise, which in turn drives the second lifting rod 333 to lift the copper plate 120, and the operator removes the copper plate 120. Finally, the first lifting assembly 310 and the second lifting assembly 330 are reset, and the operator removes the base plate 110 to complete the disassembly process.

[0042] In summary, the present invention has a reasonable structure. By using a cylinder-driven lifting mechanism and a pressure claw mechanism, it replaces the manual disassembly method. The mechanized operation process is stable and controllable, which can avoid problems such as chip collision damage, wire slippage, and signal pin bending or breakage caused by unstable manual operation and uneven force. This greatly improves the yield and quality of the product.

[0043] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0044] The embodiments described above merely illustrate the implementation of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A semiconductor system welding fixture disassembly device, characterized in that, It includes a support assembly (200) and a disassembly assembly (300), the disassembly assembly (300) being disposed within the support assembly (200); The support assembly (200) includes a support base (230), multiple support columns (240), a disassembly platform (210), a barrier (220), and a limiting block (250). The multiple support columns (240) are arranged on the support base (230) along the height direction, and the disassembly platform (210) is arranged on the top of the support columns (240). The enclosure (220) surrounds the perimeter of the multiple support columns (240) and forms a cavity inside, which is used to accommodate the disassembly assembly (300); the limiting block (250) is disposed on the disassembly table (210) to limit the position of the clamp assembly (100); The disassembly assembly (300) includes a pressure claw assembly (320), a first lifting assembly (310), and a second lifting assembly (330). The pressure claw assembly (320) is disposed on both sides of the copper plate (120) of the clamp assembly (100) and is used to press down the copper plate (120) during disassembly. The first lifting assembly (310) is disposed at the bottom of the disassembly table (210), and the first lifting assembly (310) is used to lift the pin clamp (130) of the clamp assembly (100). The second lifting assembly (330) is disposed at the bottom of the disassembly table (210) and is used to lift the copper plate (120) of the clamp assembly (100).

2. The semiconductor system welding fixture disassembly device according to claim 1, characterized in that, The clamping claw assembly (320) includes a clamping cylinder (321), a connecting part (322), a claw (324), and a mounting part (323). The output end of the clamping cylinder (321) is connected to the claw (324) through the connecting part (322), and the other end of the claw (324) is set on the disassembly table (210) through the mounting part (323).

3. The semiconductor system welding fixture disassembly device according to claim 2, characterized in that, The gripper assembly (320) also includes a sensor (325), which is disposed on the clamping cylinder (321) and is used to detect the position of the clamping cylinder (321) to determine the state of the gripper (324).

4. The semiconductor system welding fixture disassembly device according to claim 1, characterized in that, The first lifting assembly (310) includes a first lifting cylinder (312), a first lifting frame (311), and a plurality of first lifting rods (313). The fixed end of the first lifting cylinder (312) is connected to the bottom of the disassembly platform (210), and the output end is connected to the first lifting frame (311); The first lifting frame (311) moves up and down in the height direction along with the output end of the first lifting cylinder (312); The plurality of first lifting rods (313) are mounted on the first lifting frame (311), and during the lifting process, they pass through the disassembly platform (210) and abut against the pin clamps (130) of the clamp assembly (100).

5. The semiconductor system welding fixture disassembly device according to claim 4, characterized in that, There are four first lifting rods (313), which are respectively set at the four corners of the edge of the first lifting frame (311).

6. The semiconductor system welding fixture disassembly device according to claim 1, characterized in that, The second lifting assembly (330) includes a second lifting cylinder (332), a second lifting frame (331), and a plurality of second lifting rods (333). The fixed end of the second lifting cylinder (332) is connected to the bottom of the disassembly platform (210), and the output end is connected to the second lifting frame (331); The second lifting frame (331) moves up and down in the height direction along with the output end of the second lifting cylinder (332); The plurality of second lifting rods (333) are mounted on the second lifting frame (331), and during the lifting process, they pass through the disassembly platform (210) and abut against the copper plate (120) of the clamp assembly (100).

7. The semiconductor system welding fixture disassembly device according to claim 6, characterized in that, There are four second lifting rods (333), which are respectively set at the four corners of the edge of the second lifting frame (331).

8. The semiconductor system welding fixture disassembly device according to claim 1, characterized in that, The limiting block (250) cooperates with the base plate (110) of the clamp assembly (100) to limit the position of the clamp assembly (100) on the disassembly table (210).

9. The semiconductor system welding fixture disassembly device according to claim 1, characterized in that, The disassembly platform (210) is provided with multiple through holes for the first lifting rod (313) of the first lifting assembly (310) and the second lifting rod (333) of the second lifting assembly (330) to pass through.

Images