Bonding wire pressure plate and bonding wire apparatus
Patent Information
- Application Number
- CN202522562259.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-02
- Publication Date
- 2026-10-27
- Estimated Expiration
- 2035-12-02
AI Technical Summary
[0003]但现有技术存在以下缺陷：压合装置会对基板焊盘的覆盖区域形成遮挡，导致惰性气体难以渗透至基板焊盘的底部区域，使得该区域的气体流动性显著变差；这一问题直接导致基板焊盘底部区域易发生氧化，尤其是当基板焊盘在等待焊线的过程中停留时间过长时，氧化现象更为突出，进而影响焊接质量与器件可靠性
[0014]本申请实施例的第二方面，提供一种焊线设备，包括上述的焊线压板。该焊线压板通过在容纳槽开设第一导气槽，使惰性气体可顺畅流向基板焊盘的底部区域，有效避免焊盘氧化，保障半导体器件的焊接质量与可靠性。
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Figure CN224896015U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor equipment technology, and more specifically, to a wire bonding plate and wire bonding equipment. Background Technology
[0002] In the semiconductor device manufacturing process, chip pads need to be soldered to substrate pads via wire bonding, and the substrate needs to be pressed together by a laminating device to suppress warping. Existing wire bonding typically uses materials such as aluminum wire or gold wire, and the connection is completed through ultrasonic welding. To prevent the metal layer from oxidizing due to contact with air during the welding process, inert gases (such as helium, nitrogen, neon, argon, krypton, etc.) must be introduced for protection throughout the welding process.
[0003] However, the existing technology has the following drawbacks: the pressing device will block the coverage area of the substrate pads, making it difficult for inert gas to penetrate to the bottom area of the substrate pads, which significantly reduces the gas flow in this area. This problem directly leads to oxidation in the bottom area of the substrate pads, especially when the substrate pads stay for too long while waiting for wire bonding, the oxidation phenomenon is more prominent, which in turn affects the welding quality and device reliability. Utility Model Content
[0004] The purpose of this application is to provide a wire bonding plate and wire bonding equipment. By opening a first gas guide groove in the receiving groove, inert gas can flow smoothly to the bottom area of the substrate pad, effectively avoiding pad oxidation and ensuring the welding quality and reliability of semiconductor devices.
[0005] The embodiments of this application are implemented as follows: A first aspect of this application provides a wire bonding plate, including a plate body. The lower surface of the plate body has a receiving groove for accommodating a substrate, and the upper surface of the plate body has a window unit for exposing the pads of the substrate. A first gas guide groove is formed on the side of the receiving groove near the upper surface of the plate body, allowing inert gas to flow to the pads via the first gas guide groove. This wire bonding plate, by forming a first gas guide groove in the receiving groove, allows inert gas to flow smoothly to the bottom area of the substrate pads, effectively preventing pad oxidation and ensuring the bonding quality and reliability of semiconductor devices.
[0006] In one possible implementation, there are multiple window units and the first air guide groove. The multiple window units are arranged in an array along the upper surface of the pressure plate body, and at least one first air guide groove is arranged between each two adjacent window units.
[0007] As one possible implementation, the upper surface of the pressure plate body is also provided with a second air guide groove. There are multiple second air guide grooves, and at least one second air guide groove is arranged between each two adjacent window units.
[0008] In one possible implementation, at least one of the second air guide grooves is provided with at least one through hole on the side near the lower surface of the pressure plate body, so that the first air guide groove and the second air guide groove are connected through the through hole.
[0009] As one possible implementation, it also includes mounting portions located at both ends of the pressure plate body, wherein the mounting portions are provided with connecting grooves for connecting to the equipment base.
[0010] As one possible implementation, a third air guide groove is provided on the outer wall of the mounting part, and the third air guide groove is arranged in a through manner along the line connecting the two mounting parts so that the third air guide groove is connected to the receiving groove.
[0011] In one possible implementation, the pressure plate body and the two mounting portions form a convex structure. Along the height direction of the pressure plate body, the upper surface of the mounting portion is higher than the side of the receiving groove near the upper surface of the pressure plate body. The first air guide groove passes through the mounting portion along the line connecting the two mounting portions.
[0012] As one possible implementation, the inner wall of the receiving groove is provided with a stepped structure.
[0013] As one possible implementation, the pressure plate body is made of metal.
[0014] A second aspect of this application provides a wire bonding apparatus, including the aforementioned wire bonding plate. This wire bonding plate, by creating a first gas guide groove in the receiving groove, allows inert gas to flow smoothly to the bottom area of the substrate pads, effectively preventing pad oxidation and ensuring the bonding quality and reliability of semiconductor devices.
[0015] The beneficial effects of the embodiments of this application include: The wire bonding plate includes a plate body. A receiving groove for accommodating a substrate is formed on the lower surface of the plate body, and a window unit for exposing the bonding pads of the substrate is formed on the upper surface of the plate body. A first gas guide groove is formed on the side of the receiving groove near the upper surface of the plate body, allowing inert gas to flow to the bonding pads through the first gas guide groove. The wire bonding plate provided in this application achieves multiple goals—precise positioning, all-around oxidation prevention, and convenient operation—through the innovative design of "receiving groove positioning, window unit exposing the bonding pads, and first gas guide groove." By forming a first gas guide groove on the side of the receiving groove near the upper surface of the plate body, the protection blind spot of traditional pressing devices is solved, while simultaneously considering substrate deformation control and operational convenience, significantly improving the welding quality and reliability of semiconductor devices. Attached Figure Description
[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0017] Figure 1 This is one of the structural schematic diagrams of the wire bonding plate provided in the embodiments of this application; Figure 2 This is a second schematic diagram of the structure of the wire bonding plate provided in the embodiments of this application; Figure 3 This is the third schematic diagram of the structure of the wire bonding plate provided in the embodiments of this application; Figure 4 The fourth schematic diagram of the wire bonding plate provided in the embodiments of this application.
[0018] Icons: 100-Wire bonding plate; 10-Plate body; 11-Receiving groove; 111-First air guide groove; 112-Step structure; 12-Window unit; 13-Second air guide groove; 131-Through hole; 20-Mounting part; 21-Connecting groove; 22-Third air guide groove. Detailed Implementation
[0019] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. The described embodiments are only some embodiments of this application, not all embodiments. Similar reference numerals and letters in the following drawings indicate similar items. Once an item is defined in one drawing, it does not need to be further defined in other drawings.
[0020] The terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and should not be construed as limiting this application. The terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0021] Unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to connections within two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0022] Please refer to the reference. Figures 1 to 4 This application provides a wire bonding plate 100, including a plate body 10. The lower surface of the plate body 10 has a receiving groove 11 for accommodating a substrate, and the upper surface of the plate body 10 has a window unit 12 for exposing the bonding pads of the substrate. A first gas guide groove 111 is formed on the side of the receiving groove 11 near the upper surface of the plate body 10, allowing inert gas to flow to the bonding pads via the first gas guide groove 111. By forming the first gas guide groove 111 in the receiving groove 11, the wire bonding plate 100 allows inert gas to flow smoothly to the bottom area of the substrate bonding pads, effectively preventing pad oxidation and ensuring the bonding quality and reliability of semiconductor devices.
[0023] It should be noted that the wire bonding plate 100 includes a plate body 10, which is a rectangular flat plate structure. A receiving groove 11 for accommodating the substrate is formed on the lower surface of the plate body 10. The shape of the receiving groove 11 is adapted to the shape of the substrate; for example, the receiving groove 11 is a rectangular recess. Window units 12 for exposing the pads of the substrate are formed on the upper surface of the plate body 10. The number of window units 12 is adapted to the number of substrate pads. The orthographic projection of the window units 12 falls entirely within the receiving groove 11, and the edges of the window units 12 are spaced from the edges of the pads. This ensures that the pads are fully exposed to meet the wire bonding operation, and also forms a peripheral pressure on the substrate through the plate body 10, preventing warping and deformation of the substrate during welding. A first air guide is formed on the side of the receiving groove 11 near the upper surface of the plate body 10. The first gas guide groove 111 is located on the outer side directly below the window unit 12. The two ends of the first gas guide groove 111 extend to the side of the pressure plate body 10, forming a gas flow path of "first gas guide groove 111 - gap between receiving groove 11 - bottom of pad - window unit 12 - bonding wire area". This ensures that inert gas (such as helium, nitrogen, neon, argon, krypton, etc.) enters the first gas guide groove 111 from the side of the pressure plate body 10, and permeates to the bottom area of the substrate pad through the gap between the receiving groove 11 and the substrate. It can also flow to the bonding wire area through the window unit 12, so that the top, side and bottom of the pad are all wrapped with inert gas, forming a stable protective atmosphere, completely blocking the oxidation reaction, effectively avoiding the problems of poor soldering and desoldering caused by oxidation, and ensuring the soldering quality and reliability of semiconductor devices.
[0024] Compared to existing technologies, the wire bonding plate 100 provided in this application achieves multiple goals of "precise positioning, all-round oxidation prevention, and convenient operation" through the innovative design of "positioning with a receiving groove 11, exposing the pads with a window unit 12, and guiding air with a first air guide groove 111". By providing a first air guide groove 111 on the side of the receiving groove 11 near the upper surface of the plate body 10, the protection blind spot of traditional pressing devices is solved, while taking into account substrate deformation control and ease of operation, significantly improving the welding quality and reliability of semiconductor devices.
[0025] As one possible implementation method, such as Figure 1 and Figure 2 As shown, there are multiple window units 12 and first air guide grooves 111. Multiple window units 12 are arranged in an array along the upper surface of the pressure plate body 10, and at least one first air guide groove 111 is arranged between each two adjacent window units 12.
[0026] It should be noted that there are multiple window units 12, which are arranged in a rectangular array along the length and width of the pressure plate body 10 on the upper surface of the pressure plate body 10 to match the array layout of the substrate pads; there are multiple first air guide grooves 111, with at least one first air guide groove 111 arranged between each two adjacent window units 12. The orthographic projection of the first air guide groove 111 is offset from the orthographic projection of the window unit 12, and the edges of the two have a certain gap to avoid affecting the wire bonding operation; each first air guide groove 111 is linear, forming a grid distribution of "first air guide grooves 111 arranged along the length direction and first air guide grooves 111 arranged along the width direction". The first air guide grooves 111 in different directions are connected at the intersection. The grid-shaped first air guide grooves 111 can solve the problem that inert gas is difficult to reach in the middle area of the pads, further improve the air intake effect in the bottom area of the substrate pads, and avoid uneven welding quality caused by local oxidation.
[0027] As one possible implementation method, such as Figure 1 and Figure 2 As shown, a second air guide groove 13 is also provided on the upper surface of the pressure plate body 10. There are multiple second air guide grooves 13, and at least one second air guide groove 13 is arranged between each two adjacent window units 12.
[0028] It should be noted that a second air guide groove 13 is also provided on the upper surface of the pressure plate body 10 to improve the flow of inert gas in the top area of the pressure plate body 10. Specifically, there are multiple second air guide grooves 13, with at least one second air guide groove 13 arranged between each pair of adjacent window units 12. The orthographic projection of the second air guide groove 13 is also staggered with the orthographic projection of the window unit 12, and the edges of the two are spaced apart to avoid affecting the wire bonding operation. The orthographic projection of the second air guide groove 13 is also offset from the orthographic projection of the first air guide groove 111. The orthographic projections can overlap, with the two located on the upper and lower surfaces of the pressure plate body 10, respectively. Each second gas guide groove 13 is linear, forming a grid-like distribution of "first gas guide grooves 111 arranged along the length direction and first gas guide grooves 111 arranged along the width direction". The second gas guide grooves 13 in different directions are connected at the intersection. The grid-like second gas guide grooves 13 can solve the problem of poor inert gas flow in the middle area of the pads, further improve the flow of inert gas in the top area of the pressure plate body 10, and ensure that each pad has a continuous gas supply.
[0029] As one possible implementation method, such as Figure 1 , Figure 2 and Figure 4 As shown, at least one second air guide groove 13 has at least one through hole 131 on the side near the lower surface of the pressure plate body 10, so that the first air guide groove 111 and the second air guide groove 13 are connected through the through hole 131.
[0030] It should be noted that at least one second air guide groove 13 has at least one through hole 131 on the side near the lower surface of the pressure plate body 10. That is, the through hole 131 is opened at the bottom of the second air guide groove 13. The through hole 131 can be arranged at the intersection of the transverse second air guide groove 13 and the longitudinal second air guide groove 13 (i.e., at the node of the grid). Each through hole 131 is cylindrical and penetrates vertically through the first air guide groove 111 and the second air guide groove 13 along the height direction of the pressure plate body 10, ensuring that the gas inert body flows from the second air guide groove 111. 3. The inert gas can flow into the first gas guide groove 111 through the through hole 131. In use, the inert gas can enter the grid-shaped second gas guide groove 13 and diffuse rapidly along the horizontal and vertical second gas guide grooves 13 to achieve full coverage of the top of the pad. The inert gas flows vertically downward through multiple evenly distributed through holes 131 and enters each of the first gas guide grooves 111 at the bottom of the pad, further improving the flow and uniformity of the inert gas in the first gas guide groove 111 and avoiding insufficient inert gas in local areas.
[0031] In addition, some through holes 131 can be used as positioning holes for wire bonding equipment to facilitate precise positioning of substrate pads by the wire bonding equipment, thereby improving the accuracy of welding between chip pads and substrate pads.
[0032] As one possible implementation method, such as Figures 1 to 4 As shown, the wire bonding pressure plate 100 also includes mounting portions 20 located at both ends of the pressure plate body 10, and the mounting portions 20 are provided with connecting grooves 21 for connecting with the equipment base.
[0033] It should be noted that the wire bonding pressure plate 100 also includes mounting portions 20 located at both ends of the pressure plate body 10. For example, two mounting portions 20 are arranged at both ends of the pressure plate body 10 along the length direction of the pressure plate body 10. The width of the mounting portion 20 is adapted to the width of the pressure plate body 10, and the length of the mounting portion 20 is sufficient to ensure that the mounting portion 20 has a sufficient contact area with the equipment. The mounting portion 20 is provided with a connecting groove 21 for connecting with the equipment. For example, the connecting groove 21 is opened on the upper surface or side wall of the mounting portion 20, and can be a U-shaped groove (opening upward) or a waist-shaped groove (extending along the length direction) to facilitate precise matching with the positioning pins or bolts of the equipment.
[0034] As one possible implementation method, such as Figure 1 and Figure 4 As shown, a third air guide groove 22 is provided on the outer wall of the mounting part 20. The third air guide groove 22 is arranged in a through manner along the line connecting the two mounting parts 20 so that the third air guide groove 22 is connected to the receiving groove 11.
[0035] It should be noted that a third air guide groove 22 is provided on the outer wall of the mounting part 20. The third air guide groove 22 is provided through the line connecting the two mounting parts 20 so that the third air guide groove 22 is connected to the receiving groove 11. This ensures that the inert gas flows into the receiving groove 11 through the third air guide groove 22 and diffuses evenly, covering the edge of the substrate end, so as to avoid oxidation of the pads in the edge area of the substrate end. In addition, the third air guide groove 22 can also further supplement the inert gas in the central area of the substrate, improving the anti-oxidation effect. Moreover, the first air guide groove 111, the second air guide groove 13 and the third air guide groove 22 provided in this application can also improve the heat dissipation effect of the substrate, so as to avoid the substrate warping and deformation caused by overheating during soldering.
[0036] As one possible implementation method, such as Figure 1 , Figure 3 and Figure 4 As shown, the pressure plate body 10 and the two mounting parts 20 form a convex structure. Along the height direction of the pressure plate body 10, the upper surface of the mounting part 20 is higher than the side of the receiving groove 11 that is close to the upper surface of the pressure plate body 10. The first air guide groove 111 passes through the mounting part 20 along the line connecting the two mounting parts 20.
[0037] It should be noted that the pressure plate body 10 and the two mounting parts 20 form a convex structure. Along the height direction of the pressure plate body 10, the upper surface of the mounting part 20 is higher than the side of the receiving groove 11 that is close to the upper surface of the pressure plate body 10, so as to ensure that the thickness of the mounting part 20 can meet the connection strength. On this basis, the first air guide groove 111 penetrates the mounting part 20 along the line connecting the two mounting parts 20, so that the air intake effect of the first air guide groove 111 is not affected by the mounting part 20.
[0038] In this application, by adjusting the size of the receiving groove 11, the number and position of the window units 12, and the specifications of each air guide groove, substrates of different sizes and pad layouts can be adapted. As one possible implementation, such as... Figure 1 and Figure 3 As shown, a stepped structure 112 is provided on the inner wall of the receiving groove 11 to adapt to substrates of different sizes, thereby improving the compatibility of the wire bonding plate 100 provided in this application.
[0039] As one possible implementation, the pressure plate body 10 is made of metal, such as copper or aluminum, to ensure that the pressure plate body 10 can reliably press the substrate while being unaffected by the high temperature during welding.
[0040] This application also provides a wire bonding apparatus, including the wire bonding pressure plate 100 described above. Since the structure and beneficial effects of the wire bonding pressure plate 100 have been described in detail in the foregoing embodiments, they will not be repeated here.
[0041] The above description is merely an optional embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
[0042] It should also be noted that the various specific technical features described in the above embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this application will not describe the various possible combinations separately.
Claims
1. A wire bonding pressure plate, characterized in that, The device includes a pressure plate body, the lower surface of which has a receiving groove for accommodating a substrate, and the upper surface of which has a window unit for exposing the pads of the substrate. A first gas guide groove is provided on the side of the receiving groove near the upper surface of the pressure plate body so that inert gas can flow to the pads through the first gas guide groove.
2. The wire bonding pressure plate according to claim 1, characterized in that, The number of the window units and the first air guide groove is multiple. The multiple window units are arranged in an array along the upper surface of the pressure plate body, and at least one first air guide groove is arranged between each two adjacent window units.
3. The wire bonding pressure plate according to claim 2, characterized in that, The upper surface of the pressure plate body is also provided with a second air guide groove. There are multiple second air guide grooves, and at least one second air guide groove is arranged between each two adjacent window units.
4. The wire bonding pressure plate according to claim 3, characterized in that, At least one of the second air guide grooves has at least one through hole on the side near the lower surface of the pressure plate body, so that the first air guide groove and the second air guide groove are connected through the through hole.
5. The wire bonding pressure plate according to claim 1, characterized in that, It also includes mounting portions located at both ends of the pressure plate body, and the mounting portions are provided with connecting grooves for connecting to the equipment base.
6. The wire bonding pressure plate according to claim 5, characterized in that, A third air guide groove is provided on the outer wall of the mounting part. The third air guide groove is arranged in a through manner along the line connecting the two mounting parts so that the third air guide groove is connected to the receiving groove.
7. The wire bonding pressure plate according to claim 5, characterized in that, The pressure plate body and the two mounting parts form a convex structure. Along the height direction of the pressure plate body, the upper surface of the mounting part is higher than the side of the receiving groove that is close to the upper surface of the pressure plate body. The first air guide groove passes through the mounting part along the line connecting the two mounting parts.
8. The wire bonding pressure plate according to claim 1, characterized in that, The inner wall of the receiving groove is provided with a stepped structure.
9. The wire bonding pressure plate according to claim 1, characterized in that, The pressure plate body is made of metal.
10. A wire bonding device, characterized in that, Includes the wire bonding plate as described in any one of claims 1 to 9.