Dual-lens mode ultrasonic vibration assisted laser scanning machining system

Abstract

The utility model provides a kind of double-lens mode ultrasonic vibration auxiliary laser scanning processing system.The double-lens mode ultrasonic vibration auxiliary laser scanning processing system includes laser light source module, double-lens mode ultrasonic vibration module, scanning galvanometer module, workpiece bearing module and control module, laser light source module is used to provide laser beam, scanning galvanometer module is used to with the laser beam provided by laser light source module to the workpiece to be processed scanning processing, double-lens mode ultrasonic vibration module is used to modulate laser beam, to at least adjust the spatial pose and / or diameter of laser beam.The utility model realizes the high-precision relative position movement of laser spot and the surface of workpiece to be processed by mechanical movement, and combined with scanning galvanometer module, the laser processing of complex component features can be realized.

Description

Technical Field

[0001] This utility model specifically relates to a dual-lens mode ultrasonic vibration-assisted laser scanning processing system, belonging to the field of laser precision processing technology. Background Technology

[0002] Laser precision machining technology plays a crucial role in the micro-machining of difficult-to-machine materials, and can process materials such as ceramics, composite materials, glass, semiconductors, and high-temperature alloys. These materials, due to their high hardness and difficulty in cutting, are widely used in the manufacturing of high-performance components, precision sensors, electronic packaging insulating substrates, and semiconductor chip wafers. Laser machining utilizes a high-energy-density laser beam to ablate, melt, or evaporate materials, achieving non-contact removal and avoiding problems such as cracks and chipping caused by cutting forces in traditional machining. It is also highly efficient and versatile, providing important support for the precision machining of difficult-to-machine materials. However, traditional laser machining has significant drawbacks: First, the heat-affected zone is large, with high heat diffusing into the material, causing phase changes or structural alterations in the surrounding material, affecting mechanical properties and precision, and potentially even scrapping parts for heat-sensitive materials such as ceramics; second, the aspect ratio is low, easily leading to tilted hole walls and uneven hole diameters when machining micro-holes, making it difficult to meet the high aspect ratio requirements of aerospace fuel injection holes; third, poor sidewall quality, with slag and burrs increasing the difficulty of subsequent processing and potentially causing cracking due to stress concentration, reducing reliability. These problems severely limit its application in the precision manufacturing of difficult-to-machine materials.

[0003] To overcome the above limitations, conventional existing technologies mainly attempt to improve in the following aspects: Although special optical components (such as adaptive optical lenses) can improve beam quality, they are limited by the material damage threshold and cannot adapt to long-term stable operation of high-power lasers, thus limiting processing capabilities; Ultrasonic vibration-assisted technology for workpieces promotes slag removal through mechanical vibration, but due to the large workpiece mass, high system inertia, limited vibration frequency, and low energy transfer efficiency, it also introduces positioning errors of the motion platform; Laser parameter optimization (such as pulse width compression and wavelength adjustment) can partially alleviate thermal damage, but it is difficult to fundamentally control the spatiotemporal distribution characteristics of laser energy, resulting in an inherent contradiction between processing efficiency and accuracy.

[0004] With the surge in demand for processing high-performance material components, typical curved surfaces, and functional microstructures (such as high aspect ratio micropores and three-dimensional microchannels) in fields such as aerospace, electronic packaging, and microfluidics, it is of great significance to develop new laser processing technologies that can balance efficiency and quality. Summary of the Invention

[0005] This invention addresses the problem of balancing processing efficiency and accuracy in laser processing of complex parts made of difficult-to-machine materials. It proposes a dual-lens mode ultrasonic vibration-assisted laser scanning processing system and method to overcome the shortcomings of existing technologies.

[0006] To achieve the aforementioned objectives, the technical solution adopted by this utility model includes:

[0007] The first aspect of this utility model provides a dual-lens mode ultrasonic vibration-assisted laser scanning processing system, comprising:

[0008] Laser source module;

[0009] The scanning galvanometer module is used to scan and process the workpiece to be processed using the laser beam provided by the laser source module.

[0010] The control module is connected to the laser source module and the scanning galvanometer module, respectively.

[0011] Furthermore, the dual-lens mode ultrasonic vibration-assisted laser scanning processing system also includes:

[0012] A dual-lens mode ultrasonic vibration module, connected to the control module, is used to modulate the laser beam transmitted from the laser source module to the scanning galvanometer module, so as to at least adjust the spatial orientation and / or diameter of the laser beam;

[0013] Furthermore, the dual-lens mode ultrasonic vibration module includes:

[0014] Vibrating block;

[0015] The lens group includes a first lens and a second lens. The first lens is disposed inside the vibrating block, and the second lens is disposed outside the vibrating block. The second lens and the first lens are spaced apart along the direction of travel of the laser beam, and the focal length of the first lens and the second lens is matched with the distance between the first lens and the second lens to achieve collimated output of the laser beam.

[0016] A multidimensional ultrasonic vibration mechanism is used to drive the vibrating block and the first lens to perform multidimensional ultrasonic frequency vibration, so as to at least cause the relative spatial position of the first lens and the second lens to change with ultrasonic frequency.

[0017] A second aspect of this utility model provides a dual-lens mode ultrasonic vibration-assisted laser scanning processing method, which is implemented based on the aforementioned dual-lens mode ultrasonic vibration-assisted laser scanning processing system, and includes:

[0018] A laser beam is provided by a laser source module, and a multi-dimensional ultrasonic vibration mechanism drives the vibrating block and the first lens to vibrate in multiple dimensions at ultrasonic frequencies, so that the diameter and / or beam eccentricity of the laser beam produce periodic changes in ultrasonic frequency, thereby achieving ultrasonic frequency modulation of the laser beam.

[0019] An ultrasonically frequency-modulated laser beam is incident on a scanning galvanometer module, and the scanning galvanometer module is used to perform laser processing on the processing area of ​​the workpiece to be processed.

[0020] Compared with the prior art, the advantages of this utility model include:

[0021] (1) This utility model uses a dual-lens mode ultrasonic vibration module to dynamically modulate the ultrasonic frequency of the laser beam, and finally realizes high-frequency control of the diameter of the focused spot and its three-dimensional trajectory motion in the geometric space. With the help of high-frequency modulation of energy density in three-dimensional direction, it can more comprehensively improve the heat distribution of the processing area and reduce the heat-affected zone. It is especially suitable for precision processing of difficult-to-machine materials, and improves the integrity and service performance stability of the processed parts.

[0022] (2) This utility model uses a driving optical element (built-in first lens) to perform ultrasonic vibration instead of vibrating the workpiece itself, thereby eliminating the frequency limitation, low energy transfer efficiency and positioning error of the motion platform caused by the vibration of large-mass workpieces, ensuring high repeatability positioning accuracy, and fundamentally avoiding many problems caused by workpiece vibration.

[0023] (3) This utility model uses a scanning galvanometer module to drive the laser beam obtained by ultrasonic vibration modulation in dual-lens mode for laser focusing and high-speed patterning. Combined with multi-axis linkage and CAM software, it can achieve efficient and high-precision processing of complex patterns.

[0024] (4) This utility model optimizes the matching between the damage threshold of the focusing lens material and the laser energy intensity, making it suitable for long-term stable operation in high laser power applications. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of a dual-lens mode ultrasonic vibration-assisted laser scanning processing system provided in a typical embodiment of this utility model;

[0026] Figure 2 A schematic diagram of the dynamic change of laser beam spot pose in the lateral ultrasonic vibration modulation mode of the focusing lens;

[0027] Figure 3 A schematic diagram of the dynamic change of the laser beam spot diameter under the axial ultrasonic vibration modulation mode of the focusing lens;

[0028] Figure 4 This is a flowchart of a dual-lens mode axial ultrasonic vibration modulation assisted laser processing method according to an embodiment of this utility model;

[0029] Figure 5 This is a graph showing the experimental observation results analyzing the influence of ultrasonic vibration dimensions on the laser beam diameter;

[0030] Figure 6a The laser groove morphology obtained without vibration assistance;

[0031] Figure 6b It is a multi-directional lens ultrasonic transverse vibration assisted laser grooving morphology;

[0032] Figure 6c It is a multi-directional lens ultrasonic axial vibration assisted laser grooving morphology;

[0033] Figure 6d It is a laser-etched morphology assisted by ultrasonic axial / transverse composite vibration of multi-directional lens. Detailed Implementation

[0034] In view of the shortcomings of the prior art, the inventor of this case, through long-term research and extensive practice, has come up with the technical solution of this utility model. The following will further explain the technical solution, its implementation process, and its principles.

[0035] This invention proposes a dual-lens mode ultrasonic vibration-assisted laser high-speed / ultra-high-speed scanning processing method and system. By innovatively introducing multi-dimensional ultrasonic vibration into the optical system and combining it with a high-speed / ultra-high-speed scanning system, compared with conventional laser processing, this invention introduces a process freedom that can directly change the interaction characteristics between the laser spot and the material. By controlling the motion characteristics of the laser spot and analyzing energy, the processing quality, accuracy, and efficiency of difficult-to-machine materials can be optimized and improved, providing an effective solution to the above problems and showing broad application prospects.

[0036] This invention uses a dual-lens mode ultrasonic vibration module to modulate the laser beam at high frequency, causing the focused laser spot to perform periodic ultrasonic frequency motion in geometric space. It can also dynamically adjust the size of the laser spot at high frequency. Through the cooperation of the galvanometer system and the multi-axis motion platform, high-speed patterned laser processing is performed, realizing dual-lens mode ultrasonic vibration-assisted laser processing, thereby achieving efficient and high-precision processing of complex parts made of high-performance materials.

[0037] This invention enables the focused laser spot to undergo high-frequency periodic motion (i.e., ultrasonic frequency periodic motion) within geometric space, and allows for dynamic control of the laser spot size. Through the coordinated control of the laser spot's three-dimensional spatial trajectory and size, the energy uniformity of the laser spot is improved, and the thermal impact is reduced. This enhances the matching degree between energy and material requirements in the processing area, improves the precision of the laser processing system, and reduces material stress, providing technical equipment support for achieving high-efficiency, high-precision, and high-quality processing of complex curved surfaces and precision three-dimensional structures.

[0038] It should be noted that the periodic motion of the ultrasonic frequency in this invention refers to the periodic fluctuation of the diameter of the ultrasonic spot and the sinusoidal motion of the center of the ultrasonic spot with a fixed amplitude deviating from the original optical axis.

[0039] The first aspect of this utility model provides a dual-lens mode ultrasonic vibration-assisted laser scanning processing system, comprising:

[0040] Laser source module;

[0041] The scanning galvanometer module is used to scan and process the workpiece to be processed using the laser beam provided by the laser source module.

[0042] The control module is connected to the laser source module and the scanning galvanometer module, respectively.

[0043] Furthermore, the dual-lens mode ultrasonic vibration-assisted laser scanning processing system also includes:

[0044] A dual-lens mode ultrasonic vibration module, connected to the control module, is used to modulate the laser beam transmitted from the laser source module to the scanning galvanometer module, so as to at least adjust the spatial orientation and / or diameter of the laser beam;

[0045] Furthermore, the dual-lens mode ultrasonic vibration module includes:

[0046] Vibrating block;

[0047] The lens group includes a first lens and a second lens. The first lens is disposed inside the vibrating block, and the second lens is disposed outside the vibrating block. The second lens and the first lens are spaced apart along the direction of travel of the laser beam, and the focal length of the first lens and the second lens is matched with the distance between the first lens and the second lens to achieve collimated output of the laser beam.

[0048] A multidimensional ultrasonic vibration mechanism is used to drive the vibrating block and the first lens to perform multidimensional ultrasonic frequency vibration, so as to at least cause the relative spatial position of the first lens and the second lens to change with ultrasonic frequency.

[0049] Furthermore, the frequency of the ultrasonic multidimensional vibration is greater than 20 kHz, and the vibration direction includes one or a combination of two of the first direction and the second direction. The first direction is parallel to the optical axis of the first lens, and the second direction is perpendicular to the optical axis of the first lens.

[0050] Furthermore, the combination of the first lens and the second lens can be either Keplerian or Galilean.

[0051] Furthermore, the second lens and the first lens are arranged sequentially along the direction of travel of the laser beam.

[0052] Furthermore, the second lens includes a plano-convex lens or a plano-concave lens.

[0053] Furthermore, the laser source module includes a laser source, a first reflector, and a second reflector. The second reflector, the lens group, and the first reflector are sequentially arranged in the optical path of the laser beam emitted by the laser source, and the laser source, the first reflector, and the second reflector cooperate to form a flying optical path.

[0054] Furthermore, the control module can achieve synchronous control of the laser source module and the dual-lens mode ultrasonic vibration module.

[0055] Furthermore, the laser beam is incident perpendicularly and centrally onto the dual-lens mode ultrasonic vibration module and the scanning galvanometer module via a flying optical path.

[0056] Furthermore, the scanning galvanometer module includes a scanning galvanometer, a field lens, and a CCD camera; the field lens is used to focus the laser beam passing through the scanning galvanometer to achieve laser patterning processing of the workpiece; the CCD camera is used to assist in calibrating and focusing the processing area on the workpiece.

[0057] In a more specific implementation, the dual-lens mode ultrasonic vibration-assisted laser scanning processing system further includes: a two-dimensional motion mechanism, wherein the scanning galvanometer module is disposed on the two-dimensional motion mechanism, and the two-dimensional motion mechanism is used to drive the scanning galvanometer module to move along a first plane, the first plane being parallel to the optical axis direction of the scanning galvanometer module.

[0058] In a more specific implementation, the dual-lens mode ultrasonic vibration-assisted laser scanning processing system further includes: a workpiece carrying module for carrying the workpiece, the workpiece carrying module being connected to the control module.

[0059] Furthermore, the workpiece carrying module includes a rotary motion mechanism and a translational motion mechanism connected to each other. The rotary motion mechanism is used to drive the workpiece to rotate about an axis, and the translational motion mechanism is used to drive the workpiece to move on a second plane, which intersects the optical axis direction of the scanning galvanometer module.

[0060] A second aspect of this utility model provides a dual-lens mode ultrasonic vibration-assisted laser scanning processing method, which is implemented based on the aforementioned dual-lens mode ultrasonic vibration-assisted laser scanning processing system, and includes:

[0061] A laser beam is provided by a laser source module, and a multi-dimensional ultrasonic vibration mechanism drives the vibrating block and the first lens to vibrate in multiple dimensions at ultrasonic frequencies, so that the diameter and / or beam eccentricity of the laser beam produce periodic changes in ultrasonic frequency, thereby achieving ultrasonic frequency modulation of the laser beam.

[0062] An ultrasonically frequency-modulated laser beam is incident on a scanning galvanometer module, and the scanning galvanometer module is used to perform laser processing on the processing area of ​​the workpiece to be processed.

[0063] Furthermore, when the first lens is driven to perform multidimensional ultrasonic frequency vibration by the multidimensional ultrasonic vibration mechanism, the relative distance between the first lens and the second lens changes with ultrasonic frequency.

[0064] Furthermore, the dual-lens mode ultrasonic vibration-assisted laser scanning processing method also includes:

[0065] First, place the workpiece to be processed on the workpiece support module;

[0066] By adjusting the scanning galvanometer module and / or the workpiece carrier module, the focus of the surface to be processed on the workpiece and the calibration of the processing area can be achieved.

[0067] The following will further explain the technical solution, its implementation process and principle in conjunction with the accompanying drawings and specific implementation examples. Unless otherwise specified, the optical elements involved in the embodiments of this utility model, such as lenses, reflectors, and scanning galvanometers, are all known in the art and can be obtained by commercial purchase or processing based on known processes / equipment in the art. The laser light source, controller (including CNC program and circuit structure), CCD camera, ultrasonic vibration device, and mobile platform involved in the embodiments of this utility model are also known in the art and can be obtained by commercial purchase.

[0068] In a more typical implementation scheme, please refer to Figure 1 , Figure 2 and Figure 3A dual-lens mode ultrasonic vibration-assisted laser scanning processing system includes a laser source module, a dual-lens mode ultrasonic vibration module, a scanning galvanometer module, a workpiece carrier module, and a control module 1. The workpiece carrier module carries a workpiece 9. The laser source module provides a laser beam 8 and transmits the laser beam 8 to the scanning galvanometer module. The scanning galvanometer module scans the workpiece 9 to be processed using the laser beam 8 provided by the laser source module. The dual-lens mode ultrasonic vibration module modulates the laser beam 8 transmitted from the laser source module to the scanning galvanometer module to at least adjust the spatial orientation and / or diameter of the laser beam 8. The control module 1 is connected to the laser source module, the dual-lens mode ultrasonic vibration module, and the scanning galvanometer module, and adjusts the working status and parameters of the laser source module, the dual-lens mode ultrasonic vibration module, and the scanning galvanometer module.

[0069] It should be noted that the control program for the laser source module, scanning galvanometer module, and dual-lens mode ultrasonic vibration module of control module 1 can be obtained commercially. The control logic and its own CNC program of control module 1 are not the inventive concept of this utility model. Therefore, no further explanation will be given regarding its hardware and software.

[0070] Specifically, the laser source module includes a laser source 16, a first reflector 4, and a second reflector 15. The second reflector 15 and the first reflector 4 are sequentially arranged in the optical path of the laser beam 8 emitted by the laser source 16. The laser source 16, the first reflector 4, and the second reflector 15 cooperate to form a flying optical path. The dual-lens mode ultrasonic vibration module is arranged between the first reflector 4 and the second reflector 15 and is located in the optical path of the laser beam 8. The second reflector 15 is used to reflect the laser beam emitted by the laser source 16 to the dual-lens mode ultrasonic vibration module. After passing through the dual-lens mode ultrasonic vibration module, the laser beam 8 is reflected by the first reflector 4 to the scanning galvanometer module.

[0071] The selection of the laser source 16 is not limited by wavelength or pulse width. For example, the laser source 16 can be a laser or the like. There is no limitation on the type of laser. The first reflector 4 and the second reflector 15 are also known components in the art. Of course, in addition to the first reflector 4 and the second reflector 15, the laser source 16 may also include a number of other reflectors so that the laser beam emitted by the laser source 16 can pass through the dual-lens mode ultrasonic vibration module and be incident on the scanning galvanometer module.

[0072] Specifically, the laser source 16, the first reflector 4, and the second reflector 15 work together to form a flying optical path. The laser beam is vertically and centrally incident on the dual-lens mode ultrasonic vibration module and the scanning galvanometer module via the flying optical path. The control module 1 can realize the synchronous control of the laser source module and the dual-lens mode ultrasonic vibration module.

[0073] For details, please refer to Figure 1 The dual-lens ultrasonic vibration module includes a vibrating block 2, a lens group, and a multi-dimensional ultrasonic vibration mechanism 3. The lens group includes a second lens 14 and a first lens 13, which are sequentially spaced between the second reflector 15 and the first reflector 4. The first lens 13 is located inside the vibrating block 2, and the second lens 14 is located outside the vibrating block 2. The second lens 14 and the first lens 13 are spaced apart along the direction of travel of the laser beam 8, and the focal length of the first lens 13 and the second lens 14 is matched with the distance between the first lens 13 and the second lens 14 to achieve collimated output of the laser beam. The multi-dimensional ultrasonic vibration mechanism 3 is used to drive the vibrating block 2 and the first lens 13 to perform multi-dimensional ultrasonic frequency vibration, so as to at least cause the relative spatial position of the first lens 13 and the second lens 14 to change the ultrasonic frequency, thereby realizing the adjustment of the spatial pose and / or diameter of the laser beam 8.

[0074] The first lens 13 and the second lens 14 form a double lens group. Specifically, the combination of the first lens 13 and the second lens 14 can be Keplerian or Galilean. The built-in first lens 13 is a plano-convex lens, and the external second lens 14 can be a plano-convex lens or a plano-concave lens. The focal lengths of the first lens 13 and the second lens 14 are matched to achieve collimated output of the laser beam.

[0075] Specifically, the double lens group formed by the first lens 13 and the second lens 14 constitutes an optical beam expander structure. Both the first lens 13 and the second lens 14 can be focusing lenses, i.e., they can be combined in a Keplerian manner, with the distance between them equal to the sum of the focal lengths of these two focusing lenses. Alternatively, one of the first lens 13 and the second lens 14 can be a focusing lens, and the other a concave lens, i.e., they can be combined in a Galilean manner, with the inter-lens distance between them equal to the difference in their focal lengths. The difference between these two combinations lies in ultimately fixing the distance difference between the two lenses. The first lens built into this invention is a plano-convex lens, resulting in stronger vibration resistance.

[0076] Specifically, the multidimensional ultrasonic vibration mechanism 3 provides an ultrasonic frequency greater than 20 kHz, specifically between 20 kHz and 200 kHz. The vibration direction includes one or a combination of two of the first and second directions. The first direction is parallel to the optical axis of the first lens 13, and the second direction is perpendicular to the optical axis of the first lens 13. As a typical implementation, the multidimensional ultrasonic vibration mechanism 3 can be a three-dimensional ultrasonic vibration mechanism 3. The vibration direction provided by the three-dimensional ultrasonic vibration mechanism 3 can be the X-axis, Y-axis, and Z-axis directions. The Z-axis direction, as the first direction, is parallel to the optical axis of the first lens 13, while the X-axis and Y-axis directions are perpendicular to the optical axis of the first lens 13. Of course, this three-dimensional ultrasonic vibration mechanism 3 is also a known device in the art, and its specific structure and working mechanism will not be explained here.

[0077] The multidimensional ultrasonic vibration mechanism 3 is controlled by the control module 1 to achieve synchronous control of laser beam emission and ultrasonic frequency multidimensional vibration. The control logic and control program of the control module 1 for the multidimensional ultrasonic vibration mechanism 3 can be known in the art and are not limited here.

[0078] For details, please refer to the following document again. Figure 1 The scanning galvanometer module includes a scanning galvanometer 6, a field lens 12, and a CCD camera 7. The scanning galvanometer 6 and the field lens 12 are arranged sequentially in the optical path of the laser beam 8. The field lens 12 is used to focus the laser beam that passes through the scanning galvanometer 6 to achieve laser patterning processing of the workpiece 9. The CCD camera 7 is used to assist in calibrating and focusing the processing area on the workpiece 9.

[0079] Among them, the scanning galvanometer 6, the field lens 12 and the CCD camera 7 are all components / devices known in the art and are not limited here. For example, the scanning galvanometer 6 can be a high-speed / ultra-high-speed scanning module, such as a high-speed prism scanning system.

[0080] As a preferred option, please refer to [the relevant documentation / reference]. Figure 1 The scanning galvanometer module can be mounted on the two-dimensional motion mechanism 5. The two-dimensional motion mechanism 5 is used to drive the scanning galvanometer module to move along a first plane, which is parallel to the optical axis of the scanning galvanometer module. For example, the two-dimensional motion mechanism 5 can be an XZ two-dimensional motion platform known in the art, that is, the two-dimensional motion mechanism 5) is used to drive the scanning galvanometer module to move along the XZ plane (i.e., the first plane) of a three-dimensional coordinate system, specifically along the X-axis and Z-axis of the three-dimensional coordinate system.

[0081] Specifically, the workpiece carrying module includes an interconnected rotary motion mechanism 10 and a translational motion mechanism 11. The rotary motion mechanism 10 drives the workpiece 9 to rotate around an axis, and the translational motion mechanism 11 drives the workpiece 9 to move on a second plane, which is perpendicular to the optical axis of the scanning galvanometer module. Specifically, the workpiece carrying module can be a three-axis motion platform, a four-axis motion platform, or a five-axis motion platform integrating the rotary motion mechanism 10 and the translational motion mechanism 11. For example, the translational motion mechanism 11 can be a Y-axis motion platform, the second plane can be an XY plane, and the rotary motion mechanism 10 can be a C-axis rotary motion platform, etc. It should be noted that the two-dimensional motion mechanism, the rotary motion mechanism, and the translational motion mechanism are constructed based on the same three-dimensional coordinate system.

[0082] It should be noted that the models of scanning galvanometers, field mirrors, reflectors, and lenses are related to the wavelength and pulse width of the laser emitted by the laser source, and can be quickly replaced.

[0083] Example 1

[0084] Please refer to it again. Figure 1 In a dual-lens ultrasonic vibration-assisted laser high-speed / ultra-high-speed scanning processing system, the laser source 16, controlled by the control module 1, emits a laser beam 8. After passing through the second reflector 15, the beam is perpendicularly incident on the second lens 14 and the first lens 13 mounted in the vibrating block 2, which is connected to the beam three-dimensional ultrasonic vibration device (i.e., a typical multi-dimensional ultrasonic vibration mechanism 3). Then, after passing through the second reflector 4, the beam is perpendicularly incident on the scanning galvanometer 6 mounted on the XZ-axis two-dimensional motion platform (i.e., a typical two-dimensional motion mechanism 5). Under the focusing action of the field lens 12, the laser beam 8 is focused onto the workpiece 9 to be processed, which is arranged on the Y-axis motion platform (i.e., a typical translational motion mechanism 11) and the C-axis rotational motion platform (i.e., a typical rotational motion mechanism 101). The vibrating block 2, under the action of the beam three-dimensional ultrasonic vibration device, can drive the first lens 13 to perform periodic ultrasonic frequency motion in three-dimensional space, thereby achieving high-frequency modulation of the laser beam 8. Furthermore, a CCD camera 7 is used to achieve rapid calibration and focusing of the processing area on the surface of the workpiece 9.

[0085] This invention achieves high-precision relative position movement between the laser spot and the surface of the workpiece through mechanical motion. When combined with a scanning galvanometer module, it can realize laser processing of complex parts features.

[0086] Example 2

[0087] Please see Figure 4 A dual-lens mode axial ultrasonic vibration modulation-assisted laser processing method, implemented using the dual-lens mode ultrasonic vibration-assisted high-speed / ultra-high-speed laser scanning processing system in Example 1, specifically includes the following steps:

[0088] 1) Preparation of workpiece to be processed. After surface treatment, workpiece 9 is ultrasonically cleaned with alcohol.

[0089] 2) Workpiece clamping and laser focusing. The workpiece 9 to be processed is fixed on the mechanical motion platform, and the surface of the workpiece 9 is observed based on the CCD camera 7. The relative position between the field lens 12 and the workpiece 9 is adjusted by the XZ axis two-dimensional motion platform (i.e., a typical two-dimensional motion mechanism 5), the C axis rotary motion platform (i.e., a typical rotary motion mechanism 10), and the Y axis motion platform (i.e., a typical translational motion mechanism 11), so as to achieve rapid calibration and focusing of the processing system.

[0090] 3) Activate the beam three-dimensional ultrasonic vibration device (i.e., a typical multi-dimensional ultrasonic vibration mechanism 3, hereinafter the same). Start the beam three-dimensional ultrasonic vibration device through the controller 1, and apply axial ultrasonic vibration (along the Z direction in the beam three-dimensional ultrasonic vibration device) to the vibration block 2 installed in the beam three-dimensional ultrasonic vibration device, driving the relative distance between the first lens 13 and the second lens 14 installed in the vibration block 2 to change the ultrasonic frequency;

[0091] 4) Turn on the laser source 16. The laser beam 8 propagates through the flying optical path. After being modulated by the three-dimensional ultrasonic vibration device of the beam, the diameter of the laser beam 8 undergoes periodic fluctuations in ultrasonic frequency.

[0092] 5) High-speed / ultra-high-speed patterning. The laser beam 8 achieves high-speed / ultra-high-speed patterned trajectory motion under the action of the scanning galvanometer 6, and obtains a focused spot with periodic fluctuations in ultrasonic frequency of the spot diameter under the action of the field lens 12, so as to perform efficient laser processing on the complex features on the workpiece 9 to be processed.

[0093] Example 3

[0094] Please see Figure 4 A dual-lens mode axial ultrasonic vibration modulation-assisted laser processing method, implemented using the dual-lens mode ultrasonic vibration-assisted high-speed / ultra-high-speed laser scanning processing system in Example 1, specifically includes the following steps:

[0095] 1) Preparation of workpiece to be processed. After surface treatment, workpiece 9 is ultrasonically cleaned with alcohol.

[0096] 2) Workpiece clamping and laser focusing. The workpiece 9 to be processed is fixed on the mechanical motion platform, and the surface of the workpiece 9 is observed based on the CCD camera 7. The relative position between the field lens 12 and the workpiece 9 is adjusted by the XZ axis two-dimensional motion platform, the C axis rotary motion platform, and the Y axis motion platform to achieve rapid calibration and focusing of the processing system.

[0097] 3) Activate the beam three-dimensional ultrasonic vibration device. Start the beam three-dimensional ultrasonic vibration device through the controller 1, and apply transverse ultrasonic vibration (along the X or Y direction in the beam three-dimensional ultrasonic vibration device) to the vibrating block 2 installed in the beam three-dimensional ultrasonic vibration device, which drives the ultrasonic frequency change of the distance between the optical axis of the first lens 13 installed in the vibrating block 2 and the optical axis of the laser beam 8;

[0098] 4) The laser source 16 is turned on, and the laser beam 8 propagates through the flying optical path. After being modulated by the three-dimensional ultrasonic vibration device of the beam, the distance between the optical axis of the first lens 13 and the axis of the laser beam 8 fluctuates periodically at the ultrasonic frequency.

[0099] 5) High-speed / ultra-high-speed patterning. The laser beam 8 achieves high-speed / ultra-high-speed patterned trajectory motion under the action of the scanning galvanometer 6, and obtains a focused spot with periodic fluctuations in spatial pose ultrasonic frequency under the action of the field lens 12, so as to perform efficient laser processing of complex features on the workpiece 9 to be processed.

[0100] Example 4

[0101] Please see Figure 4 A dual-lens mode axial ultrasonic vibration modulation-assisted laser processing method, implemented using the dual-lens mode ultrasonic vibration-assisted high-speed / ultra-high-speed laser scanning processing system in Example 1, specifically includes the following steps:

[0102] 1) Preparation of workpiece to be processed. After surface treatment, workpiece 9 is ultrasonically cleaned with alcohol.

[0103] 2) Workpiece clamping and laser focusing. The workpiece 9 to be processed is fixed on the mechanical motion platform, and the surface of the workpiece 9 is observed based on the CCD camera 7. The relative position between the field lens 12 and the workpiece 9 is adjusted by the XZ axis two-dimensional motion platform, the C axis rotary motion platform, and the Y axis motion platform to achieve rapid calibration and focusing of the processing system.

[0104] 3) Activate the beam three-dimensional ultrasonic vibration device. Activate the beam three-dimensional ultrasonic vibration device through the control module 1, and apply three-dimensional ultrasonic vibration to the vibrating block 2 installed in the three-dimensional ultrasonic vibration mechanism. This drives the relative distance between the first lens 13 and the second lens 14 installed in the vibrating block 2 and the distance between the optical axis of the first lens 13 and the optical axis of the laser beam 8 to change ultrasonic frequency simultaneously.

[0105] 4) The laser source 16 is turned on, and the laser beam 8 propagates through the flying optical path. After being modulated by the three-dimensional ultrasonic vibration device, the diameter of the laser beam 8 fluctuates periodically at the ultrasonic frequency. At the same time, the distance between the optical axis of the first lens 13 and the axis of the laser beam 8 fluctuates periodically at the ultrasonic frequency.

[0106] 5) High-speed / ultra-high-speed patterning. The laser beam 8 achieves high-speed / ultra-high-speed patterned trajectory motion under the action of the scanning galvanometer 6. Under the action of the field lens 12, the spot diameter and spatial pose are obtained, and the focused spot with periodic fluctuation of ultrasonic frequency is simultaneously used to perform efficient laser processing of complex features on the workpiece 9 to be processed.

[0107] Figure 2 This is a schematic diagram of the dynamic change of the laser beam spot pose under the lateral ultrasonic vibration modulation mode of the focusing lens. Figure 8-1 shows the laser beam after the optical axis of the laser beam is shifted after lateral ultrasonic vibration modulation. Figure 3 This is a schematic diagram of the dynamic change of the laser beam spot diameter under the axial ultrasonic vibration modulation mode of the focusing lens. Figure 8-2 shows the laser beam after the laser beam diameter changes dynamically after axial ultrasonic vibration modulation, and ΔR represents the change value of the laser beam spot diameter.

[0108] The influence of ultrasonic vibration dimension on the laser beam diameter was analyzed using a beam quality analyzer under ultrasonic vibration-assisted conditions in dual-lens mode, based on experimental observations. (See figure below.) Figure 5 As shown, the results indicate that transverse ultrasonic vibration, axial ultrasonic vibration, and combined vibration will cause the laser beam diameter and the range of laser beam diameter fluctuation to gradually increase.

[0109] When the laser beam frequency is 100kHz and the single pulse energy is 400μJ, laser grooving is performed with ultrasonic vibration assistance through a multi-directional lens. The morphology of the laser grooving obtained without vibration assistance is shown below. Figure 6a As shown, the morphology of the multi-lens ultrasonic transverse vibration-assisted laser grooving is as follows: Figure 6b As shown, the morphology of the multi-directional lens ultrasonic axial vibration assisted laser grooving is as follows: Figure 6c As shown, the morphology of laser grooving assisted by ultrasonic axial / transverse composite vibration of multi-directional lens is as follows: Figure 6d As shown, the groove width obtained without vibration assistance is approximately 45.99 μm. The groove width obtained by transverse (single-direction) ultrasonic vibration-assisted laser processing decreases to approximately 43.15 μm, while the groove width obtained by axial ultrasonic vibration-assisted laser processing increases to approximately 49.79 μm. Under combined vibration conditions, the groove width increases to approximately 60.93 μm. Laser beams modulated by different types of ultrasonic assistance have a significant impact on the material removal process and characteristic parameters, and can be used for high-speed / ultra-high-speed scanning processing of different surfaces, functionalized microstructures, or typical features.

[0110] This invention utilizes a specially designed dual-lens ultrasonic vibration module inserted into the optical path of the laser beam. This module modulates the transmitted laser beam at high frequency, dynamically altering its spatial orientation and diameter. The modulated laser beam is then focused onto the workpiece surface by a high-speed / ultra-high-speed scanning module. The focused spot undergoes high-frequency periodic motion within the geometric space according to specific rules, and its diameter periodically changes within the ultrasonic frequency range. This achieves high-speed dual-lens ultrasonic vibration-assisted laser processing. Through this design, the invention enables high-frequency periodic modulation of the size and spatial orientation of the focused laser spot at the processing point. This modulation method actively controls the laser energy distribution characteristics within the processing area, improving heat accumulation during laser-material interaction. It increases the freedom of control over laser spot motion and energy distribution, optimizes material removal mechanisms, improves molten pool dynamic behavior, and suppresses the heat-affected zone. Furthermore, the high-speed / ultra-high-speed scanning system enables high-efficiency processing, ultimately improving the surface quality, precision, and overall process effect of laser processing.

[0111] Existing technologies generally rely on the ultrasonic vibration of a single lens for modulation. This method focuses the laser beam by vibrating the lens (which is usually fixed or moves unidirectionally along the optical axis), thus limiting processing speed and efficiency. This invention uses a dual-lens ultrasonic vibration module to modulate the laser beam at high frequency. The laser beam remains parallel after passing through the dual-lens group, allowing for rapid insertion into the optical path system. This enables the focused laser spot to perform periodic ultrasonic frequency motion within the geometric space. Furthermore, single-lens two-dimensional motion modulation primarily modulates the deflection of the beam's focal point (which causes the spot to deviate from the processing area, reducing processing accuracy) and changes in height. In contrast, the laser beam modulated by the dual-lens ultrasonic vibration module in this invention can also stably and periodically modulate the diameter of the laser beam (a single lens can also modulate the spot size by changing the focusing height, but this reduces the laser's energy density; this invention controls the size of the focused laser spot by changing the diameter of the laser beam before focusing, ensuring it remains at the focal point and improving energy utilization).

[0112] This invention uses a dual-lens ultrasonic vibration module to high-frequency modulate the laser beam. The ultrasonic vibration of the lenses causes periodic fluctuations in the size of the laser spot and periodic shifts in the laser spot in space, thereby reducing problems such as plasma shielding generated when high-energy pulsed lasers ablate surfaces (improving energy utilization, processing depth, and precision), improving the uniformity of energy distribution on the surface of the workpiece (reducing the heat-affected zone and improving processing precision), and improving the processing quality of the hole wall (sidewall quality) through the optical honing effect.

[0113] It should be understood that the above embodiments are merely illustrative of the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be covered within the scope of protection of this utility model.

Claims

1. A dual-lens mode ultrasonic vibration-assisted laser scanning processing system, comprising: Laser source module; The scanning galvanometer module is used to scan and process the workpiece (9) to be processed using the laser beam provided by the laser source module; The control module is connected to the laser source module and the scanning galvanometer module, respectively. Its characteristic is that it further includes: A dual-lens mode ultrasonic vibration module, connected to the control module, is used to modulate the laser beam transmitted from the laser source module to the scanning galvanometer module, so as to at least adjust the spatial orientation and / or diameter of the laser beam; Furthermore, the dual-lens mode ultrasonic vibration module includes: Vibrating block (2); The lens group includes a first lens (13) and a second lens (14). The first lens (13) is disposed inside the vibrating block (2), and the second lens (14) is disposed outside the vibrating block (2). The second lens (14) and the first lens (13) are spaced apart along the direction of travel of the laser beam, and the focal length of the first lens (13) and the second lens (14) is matched with the distance between the first lens (13) and the second lens (14) to achieve collimated output of the laser beam. A multidimensional ultrasonic vibration mechanism (3) is used to drive the vibration block (2) and the first lens (13) to perform ultrasonic frequency multidimensional vibration, so as to at least cause the relative spatial position of the first lens (13) and the second lens (14) to change ultrasonic frequency.

2. The dual-lens mode ultrasonic vibration-assisted laser scanning processing system according to claim 1, characterized in that: The frequency of the ultrasonic multidimensional vibration is greater than 20KHz, and the vibration direction includes one or a combination of two of the first direction and the second direction. The first direction is parallel to the optical axis of the first lens (13), and the second direction is perpendicular to the optical axis of the first lens (13).

3. The dual-lens mode ultrasonic vibration-assisted laser scanning processing system according to claim 1, characterized in that: The combination of the first lens (13) and the second lens (14) can be either Keplerian or Galilean.

4. The dual-lens mode ultrasonic vibration-assisted laser scanning processing system according to claim 3, characterized in that: The second lens (14) and the first lens (13) are arranged sequentially along the travel direction of the laser beam; And / or, the second lens (14) includes a plano-convex lens or a plano-concave lens.

5. The dual-lens mode ultrasonic vibration-assisted laser scanning processing system according to claim 1, characterized in that: The laser source module includes a laser source (16), a first reflector (4), and a second reflector (15). The second reflector (15), the lens group, and the first reflector (4) are sequentially arranged in the optical path of the laser beam emitted by the laser source (16). The laser source (16), the first reflector (4), and the second reflector (15) cooperate to form a flying optical path. The control module can realize the synchronous control of the laser source module and the dual-lens mode ultrasonic vibration module.

6. The dual-lens mode ultrasonic vibration-assisted laser scanning processing system according to claim 5, characterized in that: The dual-lens mode ultrasonic vibration module and the scanning galvanometer module are configured such that the laser beam is incident perpendicularly and centrally onto the dual-lens mode ultrasonic vibration module and the scanning galvanometer module respectively via a flying optical path.

7. The dual-lens mode ultrasonic vibration-assisted laser scanning processing system according to claim 1, characterized in that: The scanning galvanometer module includes a scanning galvanometer (6), a field lens (12), and a CCD camera (7); the field lens (12) is used to focus the laser beam passing through the scanning galvanometer (6) to achieve laser patterning processing of the workpiece (9); the CCD camera (7) is used to assist in calibrating and focusing the processing area on the workpiece (9).

8. The dual-lens mode ultrasonic vibration-assisted laser scanning processing system according to claim 7, characterized in that, Also includes: A two-dimensional motion mechanism (5) is provided, and the scanning galvanometer module is disposed on the two-dimensional motion mechanism (5). The two-dimensional motion mechanism (5) is used to drive the scanning galvanometer module to move along a first plane, and the first plane is parallel to the optical axis direction of the scanning galvanometer module.

9. The dual-lens mode ultrasonic vibration-assisted laser scanning processing system according to claim 1, characterized in that, Also includes: The workpiece carrying module is used to carry the workpiece (9), and the workpiece carrying module is also connected to the control module.

10. The dual-lens mode ultrasonic vibration-assisted laser scanning processing system according to claim 9, characterized in that, The workpiece carrying module includes a rotary motion mechanism (10) and a translational motion mechanism (11) connected to each other. The rotary motion mechanism (10) is used to drive the workpiece (9) to rotate around an axis, and the translational motion mechanism (11) is used to drive the workpiece (9) to move on a second plane, which is perpendicular to the optical axis direction of the scanning galvanometer module.

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