A kind of cushion plate jig for PCB board laser grooving

Abstract

The utility model relates to PCB processing technical field discloses a kind of backing plate fixture for PCB board radium and slot, it includes backing plate body, with opposite first side and second side, first side is attached to processing machine, and second side is attached to PCB board;Backing plate body is equipped with multiple first through holes and multiple second through holes, multiple first through holes and multiple slotting areas of PCB board one-to-one correspondence, multiple second through holes and multiple air suction holes of processing machine one-to-one correspondence;First side is equipped with multiple first air guide grooves and multiple second air guide grooves, and first air guide groove is connected multiple first through holes and / or multiple second through holes;Second air guide groove is connected multiple first through holes and / or multiple second through holes;First air guide groove, second air guide groove are communicated with air suction hole of processing machine respectively.The air guide groove is evenly transmitted to all first through holes and second through holes by the adsorption of processing machine, ensure that every first through hole can reliably adsorb waste, improve system security.

Description

Technical Field

[0001] This utility model relates to the field of PCB processing technology, and in particular to a pad fixture for laser slotting of PCB boards. Background Technology

[0002] In microelectronics manufacturing, PCB laser drilling (also known as "laser drilling") is a key technology, mainly in two forms: CO2 laser and ultraviolet laser. The principle is to use a high-energy laser beam to ablate and process micro-holes on the circuit board to achieve the purpose of tight connection between circuit layers.

[0003] In actual production, the processing machine table is equipped with suction holes. Negative pressure is used to adhere and fix the PCB board to the processing table surface. A pad fixture is typically used to assist in positioning the PCB board, preventing the laser beam from directly ablating the processing table surface. For example, Chinese utility model patent CN207099441U discloses a special pad for laser drilling of printed circuit boards. This pad has several ventilation holes corresponding to the suction holes on the laser drilling machine table surface. Ventilation holes cannot be made near the drill holes on the printed circuit board. The diameter of the ventilation holes is larger than the diameter of the suction holes. Positioning holes are set on the adjacent sides of the pad corresponding to the pipe positioning pins on the laser drilling machine table surface, so that the positioning holes are arranged in an L-shape.

[0004] The existing pad has ventilation holes that correspond one-to-one with the suction holes on the drilling table, allowing for the adsorption and fixation of printed circuit boards (PCBs), while the ventilation holes avoid the drill holes on the PCBs. However, currently, PCBs also require laser drilling to cut grooves, and the cut-off portions are discarded as waste. Since this waste lacks effective containment, it is prone to displacement, affecting subsequent laser processing. Furthermore, the displacement of the waste may clog the machine's adsorption system, causing damage to the system. Utility Model Content

[0005] The technical problem this invention aims to solve is that during laser grooving, the cut-off portion is discarded as waste material. This waste material lacks effective restraint and is prone to displacement, affecting subsequent laser processing. Furthermore, the displacement of the waste material may clog the machine's adsorption system, causing damage to the adsorption system.

[0006] To solve the above-mentioned technical problems, this utility model provides a technical solution for a pad fixture for laser slotting of PCB boards: A pad fixture for laser slotting of PCB board, which is used to be set between processing machine table and PCB board, includes a pad body, the pad body having a first side and a second side opposite to each other, the first side being attached to the processing machine table and the second side being attached to the PCB board; The pad body has multiple first through holes and multiple second through holes. The multiple first through holes and multiple second through holes are distributed at intervals on the second side. The multiple first through holes correspond one-to-one with the multiple slotted areas of the PCB board, and the multiple second through holes correspond one-to-one with the multiple air suction holes of the processing machine. The first side has a plurality of first air guide grooves and a plurality of second air guide grooves. The first air guide grooves extend along the length direction of the pad body and connect to a plurality of first through holes and / or a plurality of second through holes. The second air guide groove extends along the width direction of the pad body and connects to multiple first through holes and / or multiple second through holes; the multiple first air guide grooves and multiple second air guide grooves are respectively connected to the air suction hole of the processing machine.

[0007] As a further preferred embodiment, a plurality of first through holes and a plurality of second through holes are alternately distributed along the length direction of the pad body; and / or, a plurality of first through holes and a plurality of second through holes are alternately distributed along the width direction of the pad body.

[0008] As a further preferred embodiment, the diameter of the first through hole is d1, the diameter of the second through hole is d2, and the diameter of the air intake hole of the processing machine is d, satisfying: d1 < d2 < d.

[0009] As a further preferred embodiment, the diameter of the first through hole is d1, the diameter of the second through hole is d2, and the waste size of the PCB board is D, satisfying: d1 < D and d2 < D.

[0010] As a further preferred embodiment, the diameter of the first through hole is d1, the diameter of the second through hole is d2, and the waste size of the PCB board is D, satisfying that: d1, d2 ≤ 0.2 mm and d1, d2 ≤ D - 0.1 mm.

[0011] As a further preferred embodiment, the depth of the first air guide groove and the depth of the second air guide groove are both h, and the thickness of the pad body is H, satisfying: h≤1 / 2*H.

[0012] As a further preferred embodiment, multiple first air guide grooves and multiple second air guide grooves are intersected and connected to form a grid groove, and the first through hole, the second through hole, and the air intake hole of the processing machine are respectively located at the intersection of the first air guide groove and the second air guide groove.

[0013] As a further preferred embodiment, the pad body is a square plate, and at least two first fixing holes are provided on one long side of the pad body, and the at least two first fixing holes are distributed at intervals along the length direction of the pad body. At least one second fixing hole is provided on one wide side of the pad body. At least two second fixing holes are distributed at intervals along the width direction of the pad body. The first fixing hole and the second fixing hole correspond to the threaded hole of the processing machine and are connected to fasteners.

[0014] As a further preferred embodiment, the PCB board is provided with optical positioning points on the side away from the pad body. The optical positioning points are located at each of the top corners of the PCB board, and the first fixing hole, the second fixing hole and the optical positioning points are distributed at intervals.

[0015] Compared with the prior art, the advantages of this utility model for a pad fixture for laser grooving of PCB boards are as follows: the pad fixture for laser grooving of PCB boards is used to be set between the processing machine table and the PCB board. The pad fixture includes a pad body with opposing first and second sides. The first side is attached to the processing machine table, and the second side is attached to the PCB board. This can prevent the PCB board from warping and allow the PCB board to be flatly adsorbed on the upper side of the processing machine table through the pad fixture, thus ensuring the accuracy of laser grooving.

[0016] The pad body has multiple first through holes and multiple second through holes. The first through holes correspond one-to-one with multiple slotted areas on the PCB board, and the second through holes correspond one-to-one with multiple suction holes on the processing machine. During laser cutting, the moment the waste material in the slotted area separates from the PCB board, the vacuum suction force of the processing machine acts on the waste material through the first through holes. This is equivalent to having a dedicated suction cup for each piece of waste material, firmly adhering it to the second side and preventing it from moving around. Simultaneously, the second through holes correspond to the suction holes on the processing machine, used to adsorb the non-slotted areas of the PCB board, ensuring the PCB board is stably fixed to the pad body, thus guaranteeing the overall stability and processing accuracy of the process.

[0017] In addition, multiple first air guide grooves and multiple second air guide grooves are provided on the first side. The first air guide grooves connect to multiple first through holes and / or multiple second through holes, and the second air guide grooves connect to multiple first through holes and / or multiple second through holes. A crisscrossing air guide groove design is provided on the first side of the pad body that adheres to the processing machine. These air guide grooves connect multiple first through holes, multiple second through holes, and suction holes. Even if some suction holes are blocked, the adsorption effect is ensured to remain effective. The air guide grooves evenly transmit the adsorption force of the processing machine to all first and second through holes, ensuring that each first through hole can reliably adsorb and fix the waste material in the slotted area, preventing waste material from clogging the machine's adsorption system and improving the safety of the machine's adsorption system. Attached Figure Description

[0018] Figure 1This is a top view of the pad fixture for laser slotting of PCB board and the PCB board according to an embodiment of the present invention. Figure 2 This is a plan view of a pad fixture for laser slotting of a PCB board according to an embodiment of the present invention; Figure 3 This is a plan view of a processing machine for laser drilling of PCB boards according to an embodiment of the present invention. Figure 4 yes Figure 1 Cross-sectional schematic diagram of the intermediate pad fixture, processing machine, and PCB board; In the figure: 1. Pad body; 11. First side; 12. Second side; 13. First through hole; 14. Second through hole; 15. First air guide groove; 16. Second air guide groove; 17. First fixing hole; 18. Second fixing hole; 2. Processing table; 21. Suction hole; 22. Threaded hole; 3. PCB board; 31. Slotted area; 32. Scrap material; 33. Optical positioning point. Detailed Implementation

[0019] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit its scope.

[0020] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise" used to indicate the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0022] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0023] like Figures 1 to 4 As shown in the figure, a pad fixture for laser slotting of PCB board according to an embodiment of the present invention is used to be set between processing machine table 2 and PCB board 3. It includes a pad body 1, which has a first side 11 and a second side 12 facing each other. The first side 11 is attached to the processing machine table 2 and the second side 12 is attached to the PCB board 3. The pad body 1 has a plurality of first through holes 13 and a plurality of second through holes 14, which are distributed at intervals on the second side 12.

[0024] Multiple first through holes 13 correspond one-to-one with multiple slotted areas 31 of PCB board 3, and multiple second through holes 14 correspond one-to-one with multiple air suction holes 21 of processing machine table 2; multiple first air guide grooves 15 and multiple second air guide grooves 16 are provided on the first side 11. The first air guide grooves 15 extend along the length direction of the pad body 1 and connect multiple first through holes 13 and / or multiple second through holes 14; the second air guide grooves 16 extend along the width direction of the pad body 1 and connect multiple first through holes 13 and / or multiple second through holes 14; the multiple first air guide grooves 15 and multiple second air guide grooves 16 are respectively connected to the air suction holes 21 of processing machine table 2.

[0025] The pad fixture for laser grooving of PCB boards is used to be set between the processing machine table 2 and the PCB board 3. The pad fixture includes a pad body 1, which has a first side 11 and a second side 12. The first side 11 is attached to the processing machine table 2, and the second side 12 is attached to the PCB board 3. This prevents the PCB board 3 from warping and allows the PCB board 3 to be flatly adsorbed on the upper side of the processing machine table 2 through the pad fixture, thus ensuring the accuracy of laser grooving.

[0026] The pad body 1 has multiple first through holes 13 and multiple second through holes 14. The multiple first through holes 13 correspond one-to-one with the multiple slotted areas 31 of the PCB board 3, and the multiple second through holes 14 correspond one-to-one with the multiple suction holes 21 of the processing machine 2. When laser cutting is performed, at the moment the waste material 32 in the slotted area 31 separates from the PCB board 3, the vacuum suction force of the processing machine 2 acts on the waste material 32 through the first through holes 13, which is equivalent to equipping each waste material 32 with a dedicated suction cup to firmly adhere it to the second side 12, preventing the waste material 32 from moving around. At the same time, the second through holes 14 correspond to the suction holes 21 of the processing machine 2 and are used to adsorb the non-slotted areas 31 of the PCB board 3, ensuring that the PCB board 3 is stably fixed on the pad body 1, thus ensuring the overall stability and processing accuracy of the processing process.

[0027] In addition, the first side surface 11 is provided with multiple first air guide grooves 15 and multiple second air guide grooves 16. The first air guide grooves 15 are connected to multiple first through holes 13 and / or multiple second through holes 14, and the second air guide grooves 16 are connected to multiple first through holes 13 and / or multiple second through holes 14. The first side surface 11 of the pad body 1, which is attached to the processing table 2, is designed with crisscrossing air guide grooves. These air guide grooves connect multiple first through holes 13, multiple second through holes 14 and suction holes 21. Even if some suction holes 21 are blocked, the adsorption effect can be ensured to remain effective. The adsorption force of the processing table 2 is evenly transmitted to all first through holes 13 and second through holes 14 through the air guide grooves. This ensures that each first through hole 13 can reliably adsorb and fix the waste material 32 in the slotted area 31, avoids the waste material 32 from clogging the adsorption system of the table, and improves the safety of the adsorption system of the table.

[0028] As a further preferred embodiment, along the length direction of the pad body 1, a plurality of first through holes 13 and a plurality of second through holes 14 are alternately distributed; and / or, along the width direction of the pad body 1, a plurality of first through holes 13 and a plurality of second through holes 14 are alternately distributed. In this embodiment, as... Figure 1 As shown, along the length of the pad body 1, multiple first through holes 13 are spaced apart to form a first hole group, and multiple second through holes 14 are spaced apart to form a second hole group; along the width of the pad body 1, the first hole group and the second hole group are alternately distributed, thereby forming a pad fixture that can simultaneously adsorb the waste material 32 of the slotted area 31 and the PCB board 3 body.

[0029] In some embodiments, the distribution of the first through holes 13 and the second through holes 14 can be flexibly adjusted according to the position of the air intake hole 21 of the processing machine 2 and the slot position of the PCB board 3. It can be that along the width direction of the pad body 1, multiple first through holes 13 are spaced apart to form a first hole group, and multiple second through holes 14 are spaced apart to form a second hole group, with the first hole group and the second hole group alternating along the length direction of the pad body 1. Alternatively, multiple first through holes 13 and multiple second through holes 14 can be alternately distributed along both the width and length directions of the pad body 1.

[0030] like Figure 2 , Figure 3 As shown, the diameter of the first through hole 13 is d1, the diameter of the second through hole 14 is d2, and the diameter of the suction hole 21 of the processing machine 2 is d, satisfying: d1 < d2 < d. The first through hole 13 and the second through hole 14 can transmit the adsorption force while preventing small-sized waste material 32 from clogging the suction hole 21 of the processing machine 2.

[0031] like Figure 1 , Figure 2 As shown, the diameter of the first through hole 13 is d1, the diameter of the second through hole 14 is d2, and the size of the waste material 32 on the PCB board 3 is D, satisfying: d1 < D and d2 < D. Specifically, the diameter of the first through hole 13 is d1, the diameter of the second through hole 14 is d2, and the size of the waste material 32 on the PCB board 3 is D, satisfying: d1, d2 ≤ 0.2 mm and d1, d2 ≤ D - 0.1 mm. The small diameter design of the first through hole 13 and the second through hole 14 can prevent the waste material 32 from being sucked into the adsorption system of the machine through the through holes.

[0032] like Figure 4 As shown, the depth of the first air guide groove 15 and the depth of the second air guide groove 16 are both h, and the thickness of the pad body 1 is H, satisfying: h≤1 / 2*H. While forming air guide grooves on the first side 11 of the pad body 1, it can also ensure that the structural strength of the pad body 1 itself meets the usage requirements.

[0033] It should be noted that the thickness H of the pad body 1 is 0.5mm to 1.0mm, and the first side 11 and the second side 12 are double-sided copper-clad with a thickness of 0.5 to 1.0 oz (equivalent to 17.5μm to 35μm), and the copper foil provides good heat dissipation. In this embodiment, multiple first air guide grooves 15 and multiple second air guide grooves 16 are intersected to form a grid groove. The first through hole 13, the second through hole 14, and the air intake hole 21 of the processing table 2 correspond to the intersection of the first air guide groove 15 and the second air guide groove 16, respectively, ensuring the smooth flow of air throughout the entire air passage of the pad body 1.

[0034] The pad body 1 is a square plate. At least two first fixing holes 17 are provided on one long side of the pad body 1, spaced apart along the length of the pad body 1. At least two second fixing holes 18 are provided on one wide side of the pad body 1, spaced apart along the width of the pad body 1. The first fixing holes 17 and second fixing holes 18 correspond to and are connected to the threaded holes 22 of the processing machine base 2 by fasteners. Specifically, the fasteners are bolts, which pass through the first fixing holes 17 or second fixing holes 18 of the pad body 1 and connect to the threaded holes 22 of the processing machine base 2, thereby reliably fixing the pad body 1 to the processing machine base 2.

[0035] In addition, optical positioning points 33 are provided on the side of the PCB board 3 away from the pad body 1. The optical positioning points 33 are located at each of the top corners of the PCB board 3, and the first fixing hole 17 and the second fixing hole 18 are distributed at intervals with the optical positioning points 33. The optical positioning points 33 are also called "mark points". The laser grooving equipment can identify the planar position of the PCB board 3 through the optical positioning points 33. The first fixing hole 17 and the second fixing hole 18 are distributed at intervals with the optical positioning points 33 to prevent fasteners from possibly blocking the optical positioning points 33 and affecting the laser identification and positioning.

[0036] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present utility model, and these improvements and substitutions should also be considered within the protection scope of the present utility model.

Claims

1. A pad fixture for laser slotting of PCB boards, used to be positioned between the processing machine and the PCB board, characterized in that, Includes a pad body, the pad body having a first side and a second side opposite to each other, the first side being attached to the processing machine table, and the second side being attached to the PCB board; The pad body has multiple first through holes and multiple second through holes. The multiple first through holes and multiple second through holes are distributed at intervals on the second side. The multiple first through holes correspond one-to-one with the multiple slotted areas of the PCB board, and the multiple second through holes correspond one-to-one with the multiple air suction holes of the processing machine. The first side has a plurality of first air guide grooves and a plurality of second air guide grooves. The first air guide grooves extend along the length direction of the pad body and connect to a plurality of first through holes and / or a plurality of second through holes. The second air guide groove extends along the width direction of the pad body and connects to multiple first through holes and / or multiple second through holes; the multiple first air guide grooves and multiple second air guide grooves are respectively connected to the air suction hole of the processing machine.

2. The pad fixture for laser slotting of PCB boards according to claim 1, characterized in that, Along the length direction of the pad body, a plurality of first through holes and a plurality of second through holes are alternately distributed; and / or, along the width direction of the pad body, a plurality of first through holes and a plurality of second through holes are alternately distributed.

3. The pad fixture for laser slotting of PCB boards according to claim 2, characterized in that, The diameter of the first through hole is d1, the diameter of the second through hole is d2, and the diameter of the air intake hole of the processing machine is d, satisfying: d1 < d2 < d.

4. The pad fixture for laser slotting of PCB boards according to claim 2, characterized in that, The diameter of the first through hole is d1, the diameter of the second through hole is d2, and the waste size of the PCB board is D, satisfying: d1 < D and d2 < D.

5. The pad fixture for laser slotting of PCB boards according to claim 2, characterized in that, The diameter of the first through hole is d1, the diameter of the second through hole is d2, and the waste size of the PCB board is D, satisfying that: d1, d2 ≤ 0.2 mm and d1, d2 ≤ D - 0.1 mm.

6. The pad fixture for laser slotting of PCB boards according to claim 2, characterized in that, The depth of the first air guide groove and the depth of the second air guide groove are both h, and the thickness of the pad body is H, satisfying: h≤1 / 2*H.

7. The pad fixture for laser slotting of PCB boards according to any one of claims 1 to 6, characterized in that, Multiple first air guide grooves and multiple second air guide grooves are intersected and connected to form a grid groove. The first through hole, the second through hole, and the air suction hole of the processing machine are respectively located at the intersection of the first air guide groove and the second air guide groove.

8. The pad fixture for laser slotting of PCB boards according to any one of claims 1 to 6, characterized in that, The pad body is a square plate, and at least two first fixing holes are provided on one long side of the pad body. The at least two first fixing holes are distributed at intervals along the length direction of the pad body. At least one second fixing hole is provided on one wide side of the pad body. At least two second fixing holes are distributed at intervals along the width direction of the pad body. The first fixing hole and the second fixing hole correspond to the threaded hole of the processing machine and are connected to fasteners.

9. The pad fixture for laser slotting of PCB boards according to claim 8, characterized in that, The PCB board is also provided with optical positioning points on the side away from the pad body. The optical positioning points are located at each of the top corners of the PCB board, and the first fixing hole, the second fixing hole and the optical positioning points are distributed at intervals.

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