A positioning precise semiconductor production use cutting equipment

Abstract

The utility model relates to a positioning accurate semiconductor production is with cutting equipment, belong to semiconductor cutting technical field, this positioning accurate semiconductor production is with cutting equipment, include: laser cutting machine, the surface of laser cutting machine is installed with electric guide rail, the surface sliding connection of electric guide rail has the sliding block, the top of sliding block is installed with the locating seat, the surface sliding connection of locating seat has the pressure seat, and the opposite end fixed connection of locating seat and pressure seat has the spring, and the elastic force of spring promotes the pressure seat to move down, and then carries out the positioning to the semiconductor diode on locating seat, and the cooperation of limiting block, blocking block and limiting hole realizes that the pressure seat is locked on locating seat, and then guarantees the pressure seat and locating seat steady positioning to semiconductor diode, avoids the displacement of semiconductor diode in laser cutting, guarantees the cutting effect to semiconductor diode.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor lead cutting technology, and in particular to a lead cutting device for semiconductor production with precise positioning. Background Technology

[0002] A semiconductor diode is a basic electronic component with unidirectional conductivity. Its core function is to allow current to flow freely in one direction while almost completely blocking it in the opposite direction. After a semiconductor diode chip is packaged, the excess lead frame needs to be removed. This requires a laser cutting device to cut the lead frame according to a preset program, so that the leads reach the specified size and shape.

[0003] When existing laser cutting equipment cuts semiconductor diodes, it typically positions the semiconductor diode on a special elastic clamp, using springs on the clamp to flexibly hold the semiconductor diode. However, the vibration force generated during laser cutting can easily be transmitted to the elastic clamp, causing the semiconductor diode to shift on the clamp and thus affecting the cutting effect. Utility Model Content

[0004] Therefore, it is necessary to provide a precision semiconductor manufacturing cutting device to address the problem that the vibration force generated during laser cutting of semiconductor diodes can easily be transmitted to the elastic clamp, thereby causing displacement of the semiconductor diodes on the elastic clamp.

[0005] The device includes: a laser tendon cutting machine, wherein an electric guide rail is mounted on the surface of the laser tendon cutting machine, a slider is slidably connected to the surface of the electric guide rail, a positioning seat is mounted on the top of the slider, a pressure seat is slidably connected to the surface of the positioning seat, and a spring is fixedly connected to the opposite end of the positioning seat and the pressure seat; and an anti-loosening mechanism, wherein the anti-loosening mechanism includes a limiting block and a blocking block slidably connected to one side of the inner wall of the pressure seat, a limiting hole is provided on one side of the surface of the positioning seat, the surface of the limiting block is engaged with the inner wall of one of the limiting holes, and the surface of the blocking block is engaged with the inner wall of the limiting block.

[0006] In one embodiment, a plurality of rubber rods are slidably connected to the inner wall of the pressure seat, and the surface of the rubber rods is "L" shaped.

[0007] In one embodiment, the surface of the positioning seat is fixedly connected with equally spaced support blocks.

[0008] In one embodiment, one end of the rubber rod is fixedly connected to a connecting frame, and the surface of the connecting frame is slidably connected to the inner wall of the pressure seat.

[0009] In one embodiment, anti-slip pads are fixedly connected to the ends of the positioning seat, the pressure seat, and the support block, and the surface of the anti-slip pads is "V" shaped. The cooperation between the support block and the anti-slip pads enables flexible clamping of the semiconductor diode and support of the ribs on the diode.

[0010] In one embodiment, a first magnetic block is fixedly connected to the top of the pressure seat, and the inner wall of the connecting frame is slidably connected to the surface of the first magnetic block.

[0011] In one embodiment, a second magnetic block is slidably connected to the inner wall of the connecting frame, and the surface of the second magnetic block is slidably connected to the inner wall of the first magnetic block, wherein the opposite poles of the first magnetic block and the second magnetic block attract each other.

[0012] In one embodiment, the surface of the pressure base is provided with drainage holes. These holes are used to drain impurities that fall into the pressure base.

[0013] Beneficial effects 1. The spring force pushes the pressure seat downward, thereby positioning the semiconductor diode on the positioning seat. The limit block, the blocking block and the limit hole cooperate with each other to lock the pressure seat on the positioning seat, thereby ensuring that the pressure seat and the positioning seat stably position the semiconductor diode, avoiding displacement of the semiconductor diode during laser cutting, and ensuring the cutting effect of the semiconductor diode. 2. The connecting bracket is used to adjust the position of the rubber rod within the pressure seat, enabling the rubber rod to flexibly contact one end of the semiconductor diode, thereby centering the semiconductor diode on the positioning seat. The first and second magnetic blocks cooperate to lock the connecting bracket and the rubber rod, ensuring that the rubber rod stably positions the semiconductor diode, thus ensuring accurate positioning of the semiconductor diode. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the positioning seat, pressing seat, and anti-loosening mechanism of this utility model; Figure 3 This is an exploded view of the pressure seat and rubber rod of this utility model; Figure 4 This utility model Figure 3 Enlarged view of point A in the middle; Figure 5 This utility model Figure 3 Enlarged view of point B in the middle.

[0016] Figure label: 100. Laser tendon cutting machine; 200. Electric guide rail; 300. Slider; 400. Positioning seat; 500. Pressure seat; 600. Spring; 700. Anti-loosening mechanism; 701. Limiting hole; 702. Anti-slip pad; 703. Limiting block; 704. Blocking block; 705. Rubber rod; 706. Connecting frame; 707. Leakage hole; 708. Support block; 709. First magnetic block; 710. Second magnetic block. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0018] The following is combined Figures 1-5 This invention describes a precision-positioning semiconductor manufacturing lead cutting device.

[0019] In one embodiment, a precision semiconductor manufacturing lead cutting device includes: a laser lead cutting machine 100, an electric guide rail 200 mounted on the surface of the laser lead cutting machine 100, a slider 300 slidably connected to the surface of the electric guide rail 200, a positioning seat 400 mounted on the top of the slider 300, a pressure seat 500 slidably connected to the surface of the positioning seat 400, and a spring 600 fixedly connected to the opposite ends of the positioning seat 400 and the pressure seat 500; and an anti-loosening mechanism 700, which includes a limiting block 703 slidably connected to one side of the inner wall of the pressure seat 500 and a blocking block 704. The positioning seat 400 has equally spaced limiting holes 701 on one side of its surface, the limiting block 703 is engaged with the inner wall of one of the limiting holes 701, and the blocking block 704 is engaged with the inner wall of the limiting block 703.

[0020] It should be noted that the 100 model of laser tendon cutting machine can be selected from Lianying Laser.

[0021] In this embodiment, when the semiconductor diodes need to be cut, multiple semiconductor diodes are placed sequentially at appropriate positions on the top of the positioning base 400. The blocking block 704 is pulled upward within the pressure base 500 away from the limiting block 703. The limiting block 703 is pulled laterally within the pressure base 500 and away from the corresponding limiting hole 701, thereby releasing the locking of the pressure base 500. At this time, the elastic force of the spring 600 pushes the pressure base 500 downward, thereby simultaneously positioning multiple diodes on the positioning base 400. The limiting block 703 is pushed laterally within the pressure base 500 and locked in the corresponding limiting hole 701. The blocking block 704 is pushed downward within the pressure base 500 and locked in the limiting block 703.

[0022] The PLC controller on the laser tendon cutting machine 100 is operated to automatically open the electric guide rail 200, thereby driving the slider 300 and the positioning seat 400 to move laterally to a suitable position inside the laser tendon cutting machine 100. By operating the PLC controller, the cutting program is automatically started. The laser tendon cutting machine 100 will cut the ribs of the semiconductor diode according to the preset parameters and path. During the cutting process, the control system of the equipment will precisely control the laser output and the movement of the cutting head to ensure the accuracy and quality of the tendon cutting.

[0023] During the cutting process, the laser tendon cutting machine 100's built-in monitoring system monitors key parameters such as laser power, cutting speed, and cutting depth in real time. Simultaneously, it observes the diode cutting process for any abnormal sparks, smoke, or other abnormal phenomena. If any abnormal parameters or unsatisfactory cutting results are detected, the equipment parameters are adjusted promptly or cutting is stopped, and appropriate measures are taken.

[0024] After cutting, by adjusting the positions of the limiting block 703 and the blocking block 704, the locking of the pressure seat 500 is released, allowing the pressure seat 500 to move up the surface of the positioning seat 400, and the cut semiconductor diode can be picked up. The quality of the cut semiconductor diode is then inspected using microscopes, electron microscopes, and other testing equipment. The inspection includes checking the dimensional accuracy of the cut leads, surface roughness, and the presence of defects such as burrs and cracks. Products that do not meet quality requirements are marked and classified.

[0025] like Figure 4-5As shown, a plurality of rubber rods 705 are slidably connected to the inner wall of the pressure base 500. The surface of the rubber rods 705 is "L" shaped. One end of the rubber rod 705 is fixedly connected to a connecting frame 706. The surface of the connecting frame 706 is slidably connected to the inner wall of the pressure base 500. A first magnetic block 709 is fixedly connected to the top of the pressure base 500. The inner wall of the connecting frame 706 is slidably connected to the surface of the first magnetic block 709. A second magnetic block 710 is slidably connected to the inner wall of the connecting frame 706. The surface of the second magnetic block 710 is slidably connected to the inner wall of the first magnetic block 709. The first magnetic block 709 and the second magnetic block 710 are attracted to each other by opposite poles. A leakage hole 707 is opened on the surface of the pressure base 500.

[0026] In this embodiment, the connecting frame 706 is pushed to move laterally to a suitable position on the surface of the first magnetic block 709, thereby pushing the second magnetic block 710 to move downward within the connecting frame 706 and the first magnetic block 709, so that the second magnetic block 710 is attracted to the first magnetic block 709.

[0027] like Figure 2-3 As shown, the surface of the positioning seat 400 is fixedly connected with equally arranged support blocks 708. The ends of the positioning seat 400, the pressure seat 500 and the support blocks 708 are all fixedly connected with anti-slip pads 702. The surface of the anti-slip pads 702 is "V" shaped.

[0028] Working principle: Multiple semiconductor diodes are placed sequentially on the anti-slip pad 702 surface of the positioning base 400, so that the ribs of the semiconductor diodes contact the anti-slip pad 702 surface of the support block 708. The blocking block 704 is pulled upward within the pressure base 500 away from the limiting block 703. The limiting block 703 is pulled laterally within the pressure base 500 and away from the corresponding limiting hole 701, thereby releasing the locking of the pressure base 500. At this time, the elastic force of the spring 600 pushes the pressure base 500 downward, so that the anti-slip pad 702 on the pressure base 500 abuts against the surface of the semiconductor diodes. The two sets of rubber rods 705 simultaneously position the two ends of the multiple semiconductor diodes, thereby simultaneously positioning the multiple diodes on the positioning base 400. The limiting block 703 is pushed laterally within the pressure base 500 and locked in the corresponding limiting hole 701. The blocking block 704 is pushed downward within the pressure base 500 and locked in the limiting block 703.

[0029] It should be noted that the laser tendon cutting machine 100, electric guide rail 200, slider 300, positioning seat 400, pressure seat 500, spring 600, first magnetic block 709 and second magnetic block 710 mentioned above are all devices with relatively mature existing technology. The specific model can be selected according to actual needs. At the same time, the laser tendon cutting machine 100 and electric guide rail 200 can be powered by the built-in power supply or by the mains power. The specific power supply method is selected according to the situation and will not be elaborated here.

[0030] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A precision-positioning semiconductor lead cutting device, characterized in that, include: A laser tendon cutting machine (100) has an electric guide rail (200) mounted on its surface. A slider (300) is slidably connected to the surface of the electric guide rail (200). A positioning seat (400) is mounted on the top of the slider (300). A pressure seat (500) is slidably connected to the surface of the positioning seat (400). A spring (600) is fixedly connected to the opposite ends of the positioning seat (400) and the pressure seat (500). The anti-loosening mechanism (700) includes a limiting block (703) and a blocking block (704) that are slidably connected to one side of the inner wall of the pressure seat (500). The positioning seat (400) has equal rows of limiting holes (701) on one side of its surface. The surface of the limiting block (703) is engaged with the inner wall of one of the limiting holes (701), and the surface of the blocking block (704) is engaged with the inner wall of the limiting block (703).

2. The precision semiconductor lead cutting equipment according to claim 1, characterized in that, The inner wall of the pressure seat (500) is slidably connected with several rubber rods (705), and the surface of the rubber rods (705) is "L" shaped.

3. The precision semiconductor manufacturing lead cutting equipment according to claim 2, characterized in that, The surface of the positioning seat (400) is fixedly connected with equally arranged support blocks (708).

4. The precision semiconductor manufacturing lead cutting equipment according to claim 3, characterized in that, One end of the rubber rod (705) is fixedly connected to a connecting frame (706), and the surface of the connecting frame (706) is slidably connected to the inner wall of the pressure seat (500).

5. The precision semiconductor manufacturing lead cutting equipment according to claim 1, characterized in that, The ends of the positioning seat (400), the pressure seat (500), and the support block (708) are all fixedly connected with anti-slip pads (702), and the surface of the anti-slip pads (702) is "V" shaped.

6. The precision semiconductor manufacturing lead cutting equipment according to claim 4, characterized in that, The top of the pressure base (500) is fixedly connected to the first magnetic block (709), and the inner wall of the connecting frame (706) is slidably connected to the surface of the first magnetic block (709).

7. The precision semiconductor manufacturing lead cutting equipment according to claim 6, characterized in that, The inner wall of the connecting frame (706) is slidably connected to a second magnetic block (710), and the surface of the second magnetic block (710) is slidably connected to the inner wall of the first magnetic block (709). The first magnetic block (709) and the second magnetic block (710) are attracted to each other by opposite poles.

8. The precision semiconductor manufacturing lead cutting equipment according to claim 1, characterized in that, The surface of the pressure base (500) is provided with a leakage hole (707).

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