A laser welding device

Abstract

The utility model relates to electronic component welding technical field discloses a kind of laser welding devices, including device main body, and the inside hollow of device main body is formed with cavity, the top of cavity is provided with laser emitter, the side of cavity is provided with protective gas input channel and tin bead supply channel, protective gas input channel is located above tin bead supply channel, the bottom of cavity is provided with tin bead outlet, the outside of cavity is equipped with energized coil and energized coil is located between tin bead supply channel and tin bead outlet, the side wall of cavity is formed with orientation positioning structure, orientation positioning structure is located between tin bead supply channel and energized coil, and orientation positioning structure is used to guide tin bead to drop along the central axis position of cavity.The utility model plays the following technical effects: through the magnetic field effect of energized coil, tin bead can complete preliminary melting in falling process, need not contact with tin bead outlet, can improve welding quality, extend device service life, and versatility is strong.

Description

Technical Field

[0001] This utility model belongs to the field of electronic component welding technology, specifically relating to a laser welding device. Background Technology

[0002] Currently, laser welding technology is widely used in the welding of electronic components, such as welding sensors onto FPCs. Conventional laser welding technology achieves welding by heating and melting solder balls with a laser beam. However, it still has some drawbacks in practical applications. For example, in one existing laser welding device, the nozzle size is set slightly smaller than the solder ball size. During welding, the solder ball is first dropped from the solder ball container to the nozzle position by the rotation of the ball separator. Because the nozzle size is smaller than the solder ball size, the nozzle can hold the solder ball. Then, under the protection of a shielding gas, the solder ball is heated and melted by laser irradiation. When the solder ball melts to a size smaller than the nozzle size, it can be ejected onto the welding point under the action of the shielding gas. Under the continuous action of laser heat and shielding gas, the solder ball can completely fuse with the welding point, thus completing the laser welding. During use, existing laser welding devices are prone to solder buildup or oxidation at the nozzle orifice, which affects both welding quality and the lifespan of the device itself. In addition, since the solder ball needs to be positioned at the nozzle orifice before being heated, the size of the nozzle orifice must be smaller than the size of the solder ball. This limitation in nozzle orifice size design makes it unsuitable for solder balls of different sizes and specifications, resulting in poor versatility. Utility Model Content

[0003] To address the shortcomings of the existing technology, this utility model provides a laser welding device that controls the falling speed of solder balls through a ring magnetic field formed by an energized coil. This allows the solder balls to undergo preliminary melting before reaching the solder ball nozzle, eliminating the need for contact between the solder balls and the nozzle. This effectively prevents solder buildup or oxidation at the nozzle, improves welding quality, and extends the service life of the laser welding device. Furthermore, it removes the size limitations of the solder ball nozzle, enhancing versatility.

[0004] The technical effects to be achieved by this utility model are realized through the following technical aspects: This utility model provides a laser welding device, including a device body with a hollow cavity inside. A laser emitter is disposed on the top of the cavity, and a protective gas input channel and a solder ball supply channel are disposed on the side of the cavity. The protective gas input channel is located above the solder ball supply channel, and a solder ball ejection outlet is opened at the bottom of the cavity. An energized coil is sleeved on the outside of the cavity and is located between the solder ball supply channel and the solder ball ejection outlet. A guide positioning structure is formed on the side wall of the cavity and is located between the solder ball supply channel and the energized coil. The guide positioning structure is used to guide the solder ball to fall along the central axis of the cavity.

[0005] As a further description of the technical solution of this utility model, the cavity is cylindrical, and the guiding and positioning structure is formed by the inner diameter of the cavity decreasing from top to bottom.

[0006] As a further description of the technical solution of this utility model, the energized coil is a multi-turn coil.

[0007] As a further description of the technical solution of this utility model, the solder ball ejection outlet is circular, and the diameter of the solder ball ejection outlet is larger than the diameter of the solder ball.

[0008] As a further description of the technical solution of this utility model, a limiting spring and a pushing force assembly are respectively provided on the opposite sides of the solder ball supply channel, and the limiting spring and the pushing force assembly are both located at the end of the solder ball supply channel closer to the cavity.

[0009] As a further description of the technical solution of this utility model, the pushing force component includes a linear drive motor and a pushing member driven and connected to the linear drive motor. A first through groove and a second through groove are respectively opened on the two opposite side walls of the solder ball supply channel. The limiting spring is disposed in the first through groove, the pushing member passes through the second through groove, and the linear drive motor is fixedly connected to the outside of the main body of the device.

[0010] As a further description of the technical solution of this utility model, guide inclined portions are formed on both opposite sides of the end of the pusher.

[0011] As a further description of the technical solution of this utility model, a control valve is provided on the protective gas input channel.

[0012] As a further description of the technical solution of this utility model, the control valve is a solenoid valve.

[0013] As a further description of the technical solution of this utility model, the laser welding device also includes a control module, and the laser emitter and the energized coil are both electrically connected to the control module.

[0014] In summary, this utility model has at least the following advantages: The laser welding device provided by this invention controls the falling speed of the solder balls through a ring magnetic field formed by an energized coil, providing sufficient heating time for the solder balls. This ensures that the solder balls are initially melted before reaching the solder ball nozzle, allowing them to pass directly through the nozzle without contact. This effectively prevents solder buildup or oxidation at the nozzle, improving welding quality and extending the lifespan of the laser welding device. Furthermore, it eliminates the size limitations of the solder ball nozzle, accommodating solder balls of various sizes and specifications, thus offering greater versatility. In addition, the guiding and positioning structure ensures that the solder balls fall in a centered position within the cavity, allowing them to reach the target welding point more precisely, thereby improving welding accuracy. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the laser welding device according to Embodiment 1 of this utility model; Figure 2 This is a cross-sectional view of the laser welding device according to Embodiment 1 of this utility model; Figure 3 for Figure 2 Enlarged view of section A; Figure 4 This is a cross-sectional view of the laser welding device according to Embodiment 2 of this utility model; Figure 5 for Figure 4 Enlarged view of section B; Figure 6 This is a schematic diagram of the laser welding device according to Embodiment 3 of this utility model.

[0016] Marked in the image: 1. Main body of the device; 11. Cavity; 111. Guide and positioning structure; 12. Protective gas input channel; 13. Solder ball supply channel; 131. First through slot; 132. Second through slot; 14. Solder ball outlet; 2. Laser emitter; 3. Energizing coil; 4. Limiting spring; 5. Pushing force assembly; 51. Linear drive motor; 52. Pushing component; 521. Guide tilting part; 6. Control valve; 7. Control module. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. The described embodiments are some, but not all, of the embodiments of this utility model.

[0018] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0019] Example 1 refer to Figures 1 to 3 The laser welding apparatus provided in this embodiment includes a main body 1, a hollow cavity 11 formed inside the main body 1, a laser emitter 2 disposed on the top of the cavity 11, a protective gas input channel 12 and a solder ball supply channel 13 disposed on the side of the cavity 11, the protective gas input channel 12 being located above the solder ball supply channel 13, a solder ball ejection outlet 14 being opened at the bottom of the cavity 11, an energized coil 3 being sleeved on the outside of the cavity 11 and the energized coil 3 being located between the solder ball supply channel 13 and the solder ball ejection outlet 14, a guide positioning structure 111 being formed on the side wall of the cavity 11, the guide positioning structure 111 being located between the solder ball supply channel 13 and the energized coil 3, the guide positioning structure 111 being used to guide the solder balls falling from the solder ball supply channel 13 to fall along the central axis of the cavity 11.

[0020] Understandably, after the solder ball enters the cavity 11 from the solder ball supply channel 13, it first reaches the position of the guide positioning structure 111. Under the guidance of the guide positioning structure 111, the solder ball can fall in the cavity 11 at a central position, and then enter the interior of the energized coil 3. Under the action of current, the energized coil 3 will form a ring magnetic field inside. The solder ball can be suspended in the center and fall slowly under the action of the magnetic field of the energized coil 3. During the slow fall of the solder ball, the laser emitter 2 can continuously heat the solder ball to make the solder ball initially melt. When the solder ball leaves the magnetic field area of ​​the energized coil 3, it can be ejected from the solder ball ejection outlet 14 to the target soldering point.

[0021] It should be noted that the laser emitter 2 begins to continuously heat the solder ball as soon as it reaches the position of the energized coil 3 until the solder ball is completely melted and fused to the target solder joint. The protective gas input channel 12 introduces a portion of protective gas into the cavity 11 before the solder ball enters, to prevent oxidation of the solder ball during the initial melting process. Once the solder ball has completed its initial melting and left the area of ​​the annular magnetic field, the protective gas input channel 12 continues to introduce protective gas until the welding is complete. This prevents oxidation of the solder ball during welding, which would affect the welding quality. Simultaneously, the protective gas also helps to propel the solder ball quickly to the target solder joint. In some embodiments, the protective gas can be argon, helium, or nitrogen, etc.

[0022] The guiding and positioning structure 111 guides the solder ball to fall centrally within the cavity and precisely reach the target welding point, effectively improving welding accuracy. The annular magnetic field formed by the energized coil 3 causes the solder ball to suspend centrally and fall slowly, providing heating time for the laser emitter 2. The solder ball can complete its initial melting before reaching the solder ball nozzle 14, eliminating contact with it and effectively preventing solder buildup or oxidation at the nozzle, thus improving welding quality and extending the lifespan of the laser welding device. Simultaneously, the size limitation of the solder ball nozzle 14 is removed; its size can be set larger than the solder ball size, accommodating various solder ball sizes and specifications, thus offering greater versatility. Furthermore, the height of the solder ball can be determined by the current change in the energized coil 3. Adjusting the current in the coil 3 can indirectly regulate the falling speed of the solder ball, controlling the time it takes for the solder ball to pass through the annular magnetic field region, thereby controlling the heating time for the initial melting process and providing greater operational flexibility.

[0023] In this embodiment, the cavity 11 is cylindrical, and the guide positioning structure 111 is formed by the inner diameter of the cavity 11 decreasing from top to bottom. It can be understood that the guide positioning structure 111 is equivalent to a ramp structure formed on the inner wall of the cavity 11. The solder ball entering the cavity 11 can slide down along the ramp structure. When the solder ball leaves the ramp structure, it is exactly at the central axis position of the cavity 11, and can continue to fall to the position of the energized coil 3 from this position.

[0024] It should be noted that in this embodiment, the energized coil 3 is a multi-turn coil, which ensures that the annular magnetic field formed by the energized coil 3 covers part of the falling path of the solder ball, so as to ensure sufficient heating time for the initial melting of the solder ball.

[0025] In this embodiment, the solder ball nozzle 14 is circular, and the diameter of the solder ball nozzle 14 is larger than the diameter of the solder ball. Therefore, the solder ball nozzle 14 can be adapted to a variety of solder balls of different specifications and sizes, and has strong versatility.

[0026] Example 2 As a further optimization of Example 1, refer to Figures 4 to 5 The solder ball supply channel 13 is inclined, allowing the solder balls to fall into the cavity 11 under gravity. Limiting springs 4 and abutting force components 5 are respectively provided on the upper and lower sides of the solder ball supply channel 13, with both limiting springs 4 and abutting force components 5 located at the end of the solder ball supply channel 13 closest to the cavity 11. The limiting springs 4 prevent the solder balls in the solder ball supply channel 13 from moving into the cavity 11, while the abutting force components 5 release the blocking effect of the limiting springs 4 and assist the solder balls in falling naturally into the cavity 11.

[0027] In one embodiment, the pushing force assembly 5 includes a linear drive motor 51 and a pushing member 52 driven and connected to the linear drive motor 51. The upper and lower side walls of the solder ball supply channel 13 are respectively provided with a first through groove 131 and a second through groove 132. The limiting spring 4 is disposed in the first through groove 131, and the pushing member 52 passes through the second through groove 132. The linear drive motor 51 is fixedly connected to the outside of the device body 1.

[0028] In its natural state, the limiting spring 4 extends out of the solder ball supply channel 13 and abuts against the solder ball closest to the cavity 11. When the cavity 11 needs to supply solder balls, the linear drive motor 51 drives the pushing member 52 to extend into the solder ball supply channel 13 and push the solder ball closest to the cavity 11 toward the cavity 11. Due to the external force, the limiting spring 4 is temporarily retracted into the first through slot 131, thereby releasing the restriction on the movement of the solder ball and allowing the solder ball to smoothly enter the cavity 11.

[0029] As a further optimization, guide inclined portions 521 are formed on both opposite sides of the end of the pusher 52. The two guide inclined portions 521 on the pusher 52 can be used to abut against two adjacent solder balls in the solder ball supply channel 13, thereby making the pushing action of the pusher 52 smoother and improving the efficiency of the welding operation.

[0030] Example 3 As a further optimization of Example 2, refer to Figure 6 A control valve 6 is provided on the protective gas input channel 12. Preferably, the control valve 6 is a solenoid valve, which can be used to control the charging time and amount of protective gas. In this embodiment, before the solder ball enters the cavity 11, the control valve 6 is opened to charge a certain amount of protective gas into the cavity, and then the control valve 6 is closed. After that, the solder ball enters the cavity 11. When the solder ball has completed its initial melting and leaves the annular magnetic field area, the control valve 6 is opened again until the welding is completed and then closed.

[0031] In some embodiments, the laser welding apparatus further includes a control module 7. The laser emitter 2, the energized coil 3, the linear drive motor 51, and the control valve 6 are all electrically connected to the control module 7. The control module 7 can automatically regulate the laser emitter 2, the energized coil 3, the linear drive motor 51, and the control valve 6 according to the set instructions, thereby realizing automated laser welding operations, which is beneficial to improving the efficiency and accuracy of laser welding operations.

[0032] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0033] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0034] In this invention, unless otherwise expressly specified and limited, "above or below" the first feature may include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on" the first feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the first feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0035] Although the description of this utility model has been given in conjunction with the specific embodiments described above, it is obvious to those skilled in the art that many substitutions, modifications, and variations can be made based on the above description. Therefore, all such substitutions, modifications, and variations are included within the spirit and scope of the appended claims.

Claims

1. A laser welding apparatus, characterized in that, The device includes a main body (1), which has a hollow cavity (11) inside. A laser emitter (2) is provided on the top of the cavity (11). A protective gas input channel (12) and a solder ball supply channel (13) are provided on the side of the cavity (11). The protective gas input channel (12) is located above the solder ball supply channel (13). A solder ball ejection outlet (14) is provided at the bottom of the cavity (11). An energized coil (3) is sleeved on the outside of the cavity (11) and the energized coil (3) is located between the solder ball supply channel (13) and the solder ball ejection outlet (14). A guide positioning structure (111) is formed on the side wall of the cavity (11). The guide positioning structure (111) is located between the solder ball supply channel (13) and the energized coil (3). The guide positioning structure (111) is used to guide the solder ball to fall along the central axis of the cavity (11).

2. The laser welding apparatus according to claim 1, characterized in that, The cavity (11) is cylindrical, and the guide positioning structure (111) is formed by the inner diameter of the cavity (11) decreasing from top to bottom.

3. The laser welding apparatus according to claim 1, characterized in that, The energized coil (3) is a multi-turn coil.

4. The laser welding apparatus according to claim 1, characterized in that, The tin ball ejection outlet (14) is circular, and the diameter of the tin ball ejection outlet (14) is larger than the diameter of the tin ball.

5. The laser welding apparatus according to claim 1, characterized in that, The solder ball supply channel (13) is provided with a limiting spring (4) and a pushing force component (5) on opposite sides, and the limiting spring (4) and the pushing force component (5) are both located at one end of the solder ball supply channel (13) close to the cavity (11).

6. The laser welding apparatus according to claim 5, characterized in that, The pushing force assembly (5) includes a linear drive motor (51) and a pushing member (52) driven and connected to the linear drive motor (51). The solder ball supply channel (13) has a first through groove (131) and a second through groove (132) respectively on its two opposite side walls. The limiting spring (4) is disposed in the first through groove (131), and the pushing member (52) passes through the second through groove (132). The linear drive motor (51) is fixedly connected to the outside of the device body (1).

7. The laser welding apparatus according to claim 6, characterized in that, The pusher (52) has guide inclined portions (521) formed on both opposite sides of its end.

8. The laser welding apparatus according to claim 1, characterized in that, A control valve (6) is provided on the protective gas input channel (12).

9. The laser welding apparatus according to claim 8, characterized in that, The control valve (6) is a solenoid valve.

10. The laser welding apparatus according to claim 1, characterized in that, It also includes a control module (7), and the laser emitter (2) and the energized coil (3) are both electrically connected to the control module (7).

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