A device for stripping electroplated layers using laser radiation

Abstract

The utility model discloses a device is stripped to electroplating layer with laser radium, including operation platform, vertical rod, top plate and electric push rod, and electric push rod output fixedly connected with moving plate, and moving plate bottom fixedly connected with folding baffle, and folding baffle bottom fixedly connected with back type frame, and moving plate bottom side is provided with two -dimensional movement mechanism, the utility model discloses a movable plate cooperation telescopic folding baffle, back type frame are set up on the support platform upside, can form the closed space on the operation platform upside, then industrial camera and display screen provide radium laser processing condition, utilize first air pump to draw the airflow through the shunt pipe and the spray head to form the guided airflow to blow off the folding baffle internal space to the cooperation hydraulic push rod realizes Z axle mobile type spraying, can guide the scrap to the receiving frame, thereby preventing the spillage of the scrap while providing unified collection of the scrap, thereby the security of the workpiece processing of larger area is improved, and the diffusion of the scrap is reduced.

Description

Technical Field

[0001] This utility model relates to the field of electroplating layer peeling technology, specifically to a device for peeling electroplating layers using laser. Background Technology

[0002] Electroplating is a coating layer deposited on a metal surface through electrolysis. Direct current is used to reduce and precipitate metal ions in the electrolyte, forming a coating with strong adhesion and uniform thickness. Some products with electroplating layers have incomplete pretreatment before electroplating, resulting in insufficient adhesion between the coating and the substrate and the formation of bubbles. In such cases, laser stripping is required to remove the coating.

[0003] Common laser peeling methods require placing the workpiece on an operating platform and then using a high-energy pulsed laser to vaporize the coating or generate thermal shock waves to peel it off. This non-contact processing method can adapt to complex curved surfaces and improve peeling speed.

[0004] However, in some cases, laser stripping equipment needs to process workpieces with large areas. The high-temperature plasma generated by laser ablation expands and forms a shock wave, causing local explosive ablation of the material and producing a large number of mushroom cloud-shaped debris. These debris diffuses in the processing environment and may burn operators and contaminate equipment. Utility Model Content

[0005] To address the shortcomings of existing technologies, this invention provides a device for peeling off electroplated layers using laser lithography, thereby improving safety during the processing of large-area workpieces and reducing debris dispersion.

[0006] The technical solution adopted by this utility model to solve the technical problem is: a device for peeling off electroplated layers using laser lithography, including an operating table, a vertical rod, a top plate, and an electric push rod. A moving plate is fixedly connected to the output end of the electric push rod, a folding cover is fixedly connected to the bottom end of the moving plate, a U-shaped frame is fixedly connected to the bottom end of the folding cover, a two-dimensional moving mechanism is provided on the bottom side of the moving plate, a slider is provided at the end of the two-dimensional moving mechanism, a first motor is fixedly connected inside the slider, a rotating frame is fixedly connected to the output end of the first motor, a second motor is fixedly connected to one side of the rotating frame, a laser lithography device is fixedly connected to the output end of the second motor, a support plate is fixedly connected to one side of the two-dimensional moving mechanism, a hydraulic push rod is fixedly connected to the center of the bottom end of the support plate, a diverter pipe is fixedly connected to the output end of the hydraulic push rod, nozzles are evenly fixedly connected to the diverter pipe near the laser lithography device, a first air pump is fixedly connected to the laser lithography device away from the nozzles via a hose, a chip guide groove is provided on the upper end of the operating table, and a receiving frame is provided in the chip guide groove, a second air pump is fixedly connected to one end of the receiving frame.

[0007] As a preferred technical solution of this utility model, the operating table is fixedly connected to a bracket in the chip guide groove, and a support platform is fixedly connected to the bracket. The upper end of the support platform is at the same height as the upper end of the chip guide groove. By setting the support platform, the workpiece to be processed can be supported.

[0008] As a preferred technical solution of this utility model, a display screen is fixedly connected to one side of the operating table, and an industrial camera is connected to the display screen through wires. The industrial camera is fixedly connected to the four sides of the bottom of the moving plate. By setting up the industrial camera and the display screen, the workpiece to be processed can be monitored.

[0009] As a preferred technical solution of this utility model, an inclined surface is provided on one side of the upper end of the receiving frame, and a feeding groove is provided at the lowest point of the inclined surface. By setting the inclined surface and the feeding groove, the debris stripped by laser can be guided and collected.

[0010] As a preferred technical solution of this utility model, an electric telescopic rod is fixedly connected inside the receiving frame, and a striking ball is fixedly connected to the output end of the electric telescopic rod. The striking ball corresponds to the inclined surface of the receiving frame. By setting the electric telescopic rod and the striking ball, the receiving frame can be struck when it extends and retracts, which facilitates the falling of debris.

[0011] This utility model has the following advantages: by setting a movable plate on the upper side of the support platform in conjunction with a retractable folding baffle and a U-shaped frame, a closed space can be formed on the upper side of the operating table. Then, an industrial camera and display screen provide the laser processing conditions. Subsequently, the first air pump draws airflow through the split pipe and nozzle to form a guide airflow, which blows the internal space of the folding baffle. In conjunction with the hydraulic push rod, Z-axis moving spraying is realized, which can guide the debris into the receiving frame. This prevents the debris from spilling and provides unified collection of the debris, thereby improving the safety of processing large-area workpieces and reducing the spread of debris. Attached Figure Description

[0012] Figure 1 This is a three-dimensional structural schematic diagram of a device for peeling off electroplated layers using laser lithography, according to a preferred embodiment of this utility model.

[0013] Figure 2 This is a side cross-sectional view of a preferred embodiment of the present invention, showing a device for peeling off an electroplated layer using laser.

[0014] Figure 3 This is a three-dimensional structural diagram of the two-dimensional moving mechanism of a device for peeling off electroplated layers using laser lithography, according to a preferred embodiment of this utility model.

[0015] Figure 4This is a three-dimensional cross-sectional view of the receiving frame of a device for peeling off electroplated layers using laser etching, according to a preferred embodiment of this utility model.

[0016] Explanation of reference numerals in the attached drawings: 1. Operating platform; 2. Vertical rod; 3. Top plate; 4. Electric push rod; 5. Moving plate; 6. Folding cover; 7. U-shaped frame; 8. Two-dimensional moving mechanism; 9. Slider; 10. Rotating frame; 11. Laser emitter; 12. Support plate; 13. Hydraulic push rod; 14. Diverter pipe; 15. First air pump; 16. Chip guide groove; 17. Receiving frame; 18. Second air pump; 19. Support platform; 20. Display screen; 21. Industrial camera; 22. Electric telescopic rod; 23. Striking ball. Detailed Implementation

[0017] The present invention will be further described below with reference to the accompanying drawings.

[0018] Please refer to the following: Figure 1-4The device shown is for peeling off electroplated layers using laser etching. It includes an operating table 1, a vertical rod 2, a top plate 3, and an electric push rod 4. The electric push rod 4 is a DTX type push rod with a stroke of 100-1300 mm. A movable plate 5 is fixedly connected to the output end of the electric push rod 4. A folding cover 6, made of plastic, is fixedly connected to the bottom end of the movable plate 5. A U-shaped frame 7 is fixedly connected to the bottom of the folding cover 6. A two-dimensional moving mechanism 8 is provided on the bottom side of the movable plate 5. The two-dimensional moving mechanism 8 includes an X-axis vertical plate, an X-axis servo motor, an X-axis screw, an X-axis moving block, a Y-axis servo motor, a Y-axis screw, and a Y-axis moving block. Driven by two servo motors, a slider 9 can move between two vertical plates. The mechanism moves, and with the cooperation of the electric push rod 4, the height of the two-dimensional moving mechanism 8 can be adjusted. Simultaneously, the rotating frame 10 is connected to the two-dimensional moving mechanism 8 via a slider 9. A first motor is fixedly connected inside the slider 9. The first motor drives the rotating frame 10 and the laser emitter 11 to move in the X and Y directions under the drive of the two-dimensional moving mechanism 8, thereby flexibly adjusting the position of the laser emitter 11 in the workspace. A slider 9 is provided at the end of the two-dimensional moving mechanism 8, and a first motor is fixedly connected inside the slider 9. The output end of the first motor is fixedly connected to the rotating frame 10. A second motor is fixedly connected to one side of the rotating frame 10. When the second motor starts, it drives the rotating frame 10 to rotate, causing the laser emitter 11 to adjust its position. The light emission angle ensures that the laser can irradiate the workpiece surface at the optimal angle, achieving efficient peeling of the electroplated layer. A laser emitter 11 is fixedly connected to the output end of the second motor. A support plate 12 is fixedly connected to one side of the two-dimensional moving mechanism 8. A hydraulic push rod 13 is fixedly connected to the center of the bottom end of the support plate 12. The hydraulic push rod 13 is a DYTZ1000 push rod. A diverter pipe 14 is fixedly connected to the output end of the hydraulic push rod 13. With the cooperation of the first air pump 15, the diverter pipe 14 generates a diverter, thereby purifying the area near the laser emitter 11. Furthermore, with the cooperation of the hydraulic push rod 13, the diverter pipe 14 and the nozzle can perform mobile spraying. The diverter pipe 14 is located near the laser emitter 11. The nozzles are uniformly and fixedly connected. The laser emitter 11 is fixedly connected to the first air pump 15 via a hose on the side away from the nozzles (the air inlet of the first air pump 15 can be equipped with a dust cover to prevent debris from entering the first air pump 15. At the same time, the air inlet of the first air pump 15 can be set on the upper side of the moving plate 5 to cooperate with the second air pump 18 to circulate the airflow). The upper end of the operating table 1 is provided with a chip guide groove 16. By setting the chip guide groove 16, the chip can be guided and the chip can be collected. A receiving frame 17 is set in the chip guide groove 16. One end of the receiving frame 17 is fixedly connected to the second air pump 18. The second air pump 18 makes the receiving frame 17 negative pressure, and then the debris enters the receiving frame 17 from the feed chute.

[0019] The operating table 1 is located inside the chip guide groove 16 and is fixedly connected to a bracket, and a support platform 19 is fixedly connected to the bracket. The upper end of the support platform 19 is at the same height as the upper end of the chip guide groove 16. By setting the support platform 19, the workpiece to be peeled off can be provided.

[0020] The control panel 1 has a display screen 20 fixedly connected to one side. Both the display screen 20 and the industrial camera 21 are powered by an external power supply. The display screen 20 is connected to the industrial camera 21 via wires. The model of the industrial camera 21 is DH-HAC-HFW1230D. The industrial camera 21 is fixedly connected to the four sides of the bottom of the moving plate 5. By setting up the industrial camera 21 and the display screen 20, the industrial camera 21 monitors the working conditions and transmits the monitoring data to the display screen 20 in real time. Thus, the operator can directly observe the display screen 20 and perform the peeling operation.

[0021] The receiving frame 17 has an inclined surface on one side of its upper end. The receiving frame 17 has a feeding chute at the lowest point of the inclined surface. By setting the inclined surface, some larger debris can fall to the feeding chute under the action of gravity, thereby reducing the splashing phenomenon caused by the turbulent flow of debris.

[0022] An electric telescopic rod 22 is fixedly connected inside the receiving frame 17. The electric telescopic rod 22 is a miniature telescopic rod of model m192N. A striking ball 23 is fixedly connected to the output end of the electric telescopic rod 22. The striking ball 23 corresponds to the inclined surface of the receiving frame 17. By setting the electric telescopic rod 22 to extend and retract, it drives the striking ball 23 to strike the inclined surface of the receiving frame 17, thereby causing the debris left on the inclined surface of the receiving frame 17 to fall off.

[0023] Different electroplated layers of varying materials and thicknesses may require lasers of different powers and wavelengths for efficient and precise stripping. For instance, a lower power laser may be sufficient to strip a thinner layer while avoiding damage to the substrate; a thicker layer, however, requires a higher power laser. The choice of wavelength also affects the interaction between the laser and the electroplated material, and the laser extractor 11 can be changed according to the specific circumstances.

[0024] Protective structures can be installed on the industrial camera 21, X-axis screw, Y-axis screw, hydraulic push rod 13, and electric telescopic rod 22 to reduce the contact between debris and components during movement and improve the service life of components.

[0025] Working principle: First, the workpiece to be peeled off the electroplated layer is placed on the support platform 19. Then, the electric push rod 4 extends, causing the moving plate 5, the folding cover 6, and the U-shaped frame 7 to move down. Then, the U-shaped frame 7 contacts the operating table 1, forming a closed environment. At this time, the two-dimensional moving mechanism 8 drives the slider 9 to move, and the laser emitter 11 is activated. When the laser emitter 11 reaches the predetermined position and angle, the laser emission function is activated, and the high-energy laser beam irradiates the electroplated layer on the surface of the workpiece. The high energy of the laser rapidly heats up the electroplated layer. Vaporization or other physicochemical changes occur, thereby separating the electroplated layer from the workpiece and completing the electroplated layer peeling work. At the same time, the first air pump 15 and the second air pump 18 are started to form a circulating airflow. The diverter pipe 14 and the nozzle perform moving spraying under the cooperation of the hydraulic push rod 13, which can blow away the debris on the laser laser 11, the workpiece and the operating table 1, and guide it to the receiving frame 17 near the feed trough side to complete the collection of peeling debris. The debris in the receiving frame 17 can be disassembled and cleaned by manually pulling it out.

[0026] The above are merely preferred embodiments of this utility model. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of this utility model, and these improvements and modifications should also be considered within the scope of protection of this utility model.

[0027] All other parts of this utility model that are not described in detail belong to the prior art, and therefore will not be described in detail here.

[0028] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A device for peeling off electroplated layers using laser etching, comprising an operating table (1), a vertical rod (2), a top plate (3), and an electric push rod (4), characterized in that, The output end of the electric push rod (4) is fixedly connected to a moving plate (5), the bottom end of the moving plate (5) is fixedly connected to a folding cover (6), the bottom end of the folding cover (6) is fixedly connected to a U-shaped frame (7), a two-dimensional moving mechanism (8) is provided on the bottom side of the moving plate (5), a slider (9) is provided at the end of the two-dimensional moving mechanism (8), a first motor is fixedly connected inside the slider (9), a rotating frame (10) is fixedly connected to the output end of the first motor, a second motor is fixedly connected to one side of the rotating frame (10), and a laser emitter (11) is fixedly connected to the output end of the second motor. A support plate (12) is fixedly connected to one side of the mechanism (8). A hydraulic push rod (13) is fixedly connected to the center of the bottom end of the support plate (12). A diversion pipe (14) is fixedly connected to the output end of the hydraulic push rod (13). A nozzle is evenly fixedly connected to the side of the diversion pipe (14) near the laser emitter (11). A first air pump (15) is fixedly connected to the side of the laser emitter (11) away from the nozzle through a hose. A chip guide groove (16) is opened at the upper end of the operating table (1), and a receiving frame (17) is set in the chip guide groove (16). A second air pump (18) is fixedly connected to one end of the receiving frame (17).

2. The apparatus for peeling off electroplated layers using laser as described in claim 1, characterized in that, The operating table (1) is fixedly connected to a bracket inside the chip guide groove (16), and a support platform (19) is fixedly connected to the bracket. The upper end of the support platform (19) is at the same height as the upper end of the chip guide groove (16).

3. The apparatus for peeling off electroplated layers using laser as described in claim 2, characterized in that, A display screen (20) is fixedly connected to one side of the operating table (1). An industrial camera (21) is connected to the display screen (20) via wires. The industrial camera (21) is fixedly connected to the four sides of the bottom of the moving plate (5).

4. The apparatus for peeling off electroplated layers using laser as described in claim 1, characterized in that, The upper side of the receiving frame (17) is provided with an inclined surface, and the receiving frame (17) is provided with a feeding groove at the lowest point of the inclined surface.

5. The apparatus for peeling off electroplated layers using laser as described in claim 4, characterized in that, An electric telescopic rod (22) is fixedly connected inside the receiving frame (17), and a striking ball (23) is fixedly connected to the output end of the electric telescopic rod (22). The striking ball (23) corresponds to the inclined surface of the receiving frame (17).

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