A silicon steel strip surface laser marking device and a rust-proof treatment production line

Abstract

The utility model discloses a kind of silicon steel strip surface laser marking equipment, including processing device and flattening device, flattening device includes placing table, press bar and first drive mechanism, placing table is set below processing device, placing table is equipped with vertical mounting plate in the both sides of silicon steel strip width direction, two mounting plates are each provided with two inclined guide slots, and the interval between the two guide slots on the same mounting plate gradually increases from top to bottom;Press bar is equipped with two, and each press bar is slidably connected in the guide slot corresponding to the layout position on two mounting plates by two ends respectively;First drive mechanism is used to drive two press bars to slide along guide slot synchronously, to flatten silicon steel strip to placing table.Equipment of the utility model can effectively improve the flatness of the silicon steel strip to be handled, and improve laser marking processing effect.The utility model further provides a kind of silicon steel strip surface laser marking rust-proof treatment production line.

Description

Technical Field

[0001] This utility model belongs to the field of silicon steel strip processing technology, specifically relating to a laser marking device for the surface of silicon steel strip and a rust prevention treatment production line. Background Technology

[0002] In the production process of silicon steel strip, various magnetic domain refinement technologies are used to reduce iron loss. Among them, the working principle of laser marking is to introduce thermal stress into the metal structure, thereby improving the iron loss performance of the substrate. It has become one of the main solutions because it has the advantages of effectively improving performance and reducing costs.

[0003] However, silicon steel strip is usually stored in a coiled form. In order to perform laser marking on the surface of the coiled silicon steel strip, it is usually necessary to release and fix the coiled silicon steel strip. However, due to the long coiling time, the strip may still have a certain degree of curvature after being unfolded. This curvature makes it impossible for the surface to achieve the flatness required for the treatment, which will affect the effect of laser marking. Utility Model Content

[0004] The technical problem this invention aims to solve is to address the aforementioned shortcomings in the existing technology by providing a laser marking device for the surface of silicon steel strip. This device can effectively improve the flatness of the silicon steel strip to be treated and enhance the laser marking treatment effect. This invention also provides a production line for laser marking and rust prevention treatment of silicon steel strip.

[0005] This utility model provides a laser marking device for the surface of silicon steel strip, including a processing device and a flattening device. The flattening device includes a placement table, pressure rods, and a first driving mechanism. The placement table is located below the processing device and is used to place the silicon steel strip to be processed. The placement table has vertical mounting plates on both sides of the silicon steel strip in the width direction. Each of the two mounting plates has two oblique guide grooves in the same layout, and the distance between the two guide grooves on the same mounting plate gradually increases from top to bottom. There are two pressure rods, each of which is slidably connected at both ends to the guide grooves corresponding to the layout positions on the two mounting plates. The pressure rod at the bottom of the guide groove can abut against the surface of the placement table. The first driving mechanism is used to drive the two pressure rods to slide synchronously along the guide grooves to flatten the silicon steel strip onto the placement table.

[0006] Optionally, the two pressure rods are connected by an elastic element; the first driving mechanism includes a lifting slider, which is placed above the two pressure rods and drives the two pressure rods to slide synchronously downward and outward along the guide groove by descending, and drives the two pressure rods to slide synchronously upward and inward along the guide groove by rising, under the pulling force of the elastic element.

[0007] Optionally, the ends of each pressure rod extend to the outside of the guide groove; the lifting slider is a frame structure surrounding the outside of the two mounting plates and is placed above the ends of each pressure rod; the lifting slider is provided with a connecting block at the position between the two guide grooves on the same mounting plate, and the connecting block and the ends of the pressure rods on both sides are connected by elastic elements.

[0008] Optionally, limiting plates are provided at both ends of the frame of the mounting plate on the lifting slider. The two limiting plates have a hook-shaped structure with openings facing each other, and the depth of the hook-shaped structure covers the projection range of the guide groove in the horizontal direction. The end of the pressure rod is slidably set in the hook-shaped area of ​​the limiting plate.

[0009] Optionally, the leveling device also includes a top plate located above the processing device and connected to the top of two mounting plates, with a lifting slider connected to the processing device; the first drive mechanism also includes a vertical drive component mounted on the top plate, with its drive end connected to the processing device, so that while driving the processing device to approach the silicon steel strip, it drives the lifting slider to move synchronously, thereby driving the pressure rod to flatten the silicon steel strip onto the placement table.

[0010] Optionally, the placement platform is a belt conveyor mechanism, which is arranged along the direction of the silicon steel strip, with its top surface serving as the placement plane for the silicon steel strip, and the pressure bar being a cylindrical rod.

[0011] Optionally, the processing device includes a support plate, a slide bar, a laser etching machine, and a second drive mechanism. Two support plates are arranged parallel to each other and spaced apart. The space between the two support plates serves as the processing area for the silicon steel strip. Each support plate has a horizontal groove at the same height. The two ends of the slide bar are slidably disposed in the grooves of the two support plates. The laser etching machine is slidably connected to the slide bar. The second drive mechanism is used to drive the laser etching machine to slide along the slide bar and to drive the slide bar to slide along the grooves, so that the laser etching machine moves within the processing area.

[0012] Optionally, the second driving mechanism includes a lead screw and a first driving member. The lead screw is arranged parallel to the slide bar and is rotatably connected to the slide bar. The laser etching machine has a threaded sleeve that connects to the lead screw. The first driving member is installed at the end of the slide bar and the driving end is connected to the lead screw to drive the lead screw to rotate and drive the laser etching machine to slide along the slide bar.

[0013] Optionally, the second drive mechanism includes a gear, a rack, and a second drive member. The rack is arranged along the slide groove at the edge of the slide groove on a support plate. The second drive member is installed at the end of the slide rod, and the drive end is connected to the gear. The gear meshes with the rack so that the slide rod slides along the slide groove through meshing under the drive of the second drive member.

[0014] Optionally, the processing device further includes an air intake mechanism, which includes an air chamber, an air intake fan, an air collection pipe, and an air intake port. The air chamber is connected to the top of the two support plates and has an internal cavity. An air intake fan is installed in the cavity of the air chamber. The air intake port has a groove-shaped structure with one end open and is arranged at the bottom of the support plate, with the opening facing the processing area. The cavity inside the groove is connected to the cavity of the air chamber through the air collection pipe.

[0015] This utility model also provides a production line for laser marking and rust prevention treatment of silicon steel strip surface, including a feeding device, a rust prevention treatment device, and the aforementioned laser marking device for silicon steel strip surface. The feeding device is used to supply silicon steel strip to the laser marking device for silicon steel strip surface, the laser marking device for silicon steel strip surface is used to perform laser marking treatment on the silicon steel strip, and the rust prevention treatment device is used to perform rust prevention treatment on the silicon steel strip after laser marking treatment.

[0016] This utility model discloses a laser marking device for silicon steel strip surfaces. Through a cleverly designed guide groove and synchronously driven pressure rod structure, it efficiently solves the flatness problem of silicon steel strip during laser marking. Firstly, the guide grooves on both sides of the placement table, along with two pressure rods, apply downward pressure and outward flattening force to the silicon steel strip during the pressing process. Furthermore, when the two pressure rods move to the bottom of the guide grooves, they abut against the surface of the placement table, fixing the silicon steel strip between the pressure rods and the placement table in a flattened state. That is, by flattening first and then fixing, the silicon steel strip is laid flat and positioned. This solution eliminates the bending state of the strip caused by winding, effectively improving the accuracy of subsequent laser marking and reducing marking deviations caused by uneven strip surfaces. Moreover, this structure eliminates the need for manual adjustment of the strip position or application of flattening force; the flattening operation can be automatically driven by the first drive mechanism, reducing the labor intensity of manual operation and ensuring consistency in each flattening process, thus improving the overall processing efficiency of the equipment. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of the laser marking device for silicon steel strip surface in Embodiment 1 of this utility model;

[0018] Figure 2 This is a schematic diagram of the flattening device of the laser marking equipment for silicon steel strip surface in Embodiment 1 of this utility model;

[0019] Figure 3 This is a schematic diagram of the processing device for the laser marking equipment on the surface of silicon steel strip in Embodiment 1 of this utility model;

[0020] Figure 4 This is a schematic diagram of the sliding rod connection structure of the laser marking equipment for silicon steel strip surface in Embodiment 1 of this utility model;

[0021] Figure 5This is a schematic diagram of the air intake mechanism of the laser marking equipment for silicon steel strip surface in Embodiment 1 of this utility model.

[0022] In the diagram: 1. Processing device; 11. Support plate; 111. Slide groove; 12. Slide rod; 121. Auxiliary slide rod; 13. Laser etching machine; 14. Lead screw; 15. First driving component; 16. Gear; 17. Rack; 18. Second driving component; 19. Suction mechanism; 191. Air chamber; 192. Suction fan; 193. Air collection pipe; 194. Suction port; 2. Leveling device; 21. Placement platform; 211. Mounting plate; 212. Guide groove; 22. Pressure rod; 23. Elastic component; 24. Lifting slider; 241. Connecting block; 242. Limiting plate; 25. Top plate; 26. Vertical driving component; 3. Base. Detailed Implementation

[0023] The technical solutions of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of this utility model.

[0024] In the description of this utility model, it should be noted that the terms "upper" and "lower" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience and simplification of the description and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0025] In the description of this utility model, the terms "first", "second", and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0026] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connection," "setting," "installation," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0027] Example 1

[0028] The laser marking equipment for silicon steel strip surface described in this embodiment can be used in the field of silicon steel strip processing technology, such as the core winding process, and specifically in a production line for laser marking and rust prevention treatment of silicon steel strip surface. Figures 1 to 3 As shown, the equipment includes a processing device 1 and a leveling device 2. The leveling device 2 includes a placement platform 21, a pressure bar 22 and a first drive mechanism. The placement platform 21 is located below the processing device 1 and is used to place silicon steel strip to be processed by the processing device 1.

[0029] The placement table 21 has vertical mounting plates 211 on both sides of the silicon steel strip in the width direction. The direction perpendicular to the side where the mounting plate 211 is located is the direction of the silicon steel strip and is an empty area to facilitate the passage of the silicon steel strip and achieve continuous processing.

[0030] Both mounting plates 211 have two oblique guide grooves 212 arranged in the same layout. Specifically, these are oblique arc-shaped grooves, which can be used... Figure 1 The arc shape in the middle can also be used Figure 2 The structure combines straight lines with arcs. Furthermore, the two guide grooves 212 on the same mounting plate 211 are arranged symmetrically with respect to the vertical axis of the mounting plate 211. The distance between the two guide grooves 212 gradually increases from top to bottom, forming a gradually outward-flaring layout.

[0031] like Figure 2 As shown, there are two pressure rods 22, each of which is slidably connected at both ends to guide grooves 212 on the two mounting plates 211 at corresponding positions. That is, both pressure rods 22 span between the two mounting plates 211, with one pressure rod 22 slidably connected at both ends to corresponding guide grooves 212 on one side of the two mounting plates 211, and the other pressure rod 22 slidably connected at both ends to corresponding guide grooves 212 on the other side of the two mounting plates 211. The pressure rod 22 located at the bottom of the guide groove 212 can abut against the surface of the placement platform 21. The first driving mechanism is used to drive the two pressure rods 22 to slide synchronously along the guide groove 212 to flatten the silicon steel strip onto the placement platform 21.

[0032] The laser marking equipment for silicon steel strip in this embodiment, through its cleverly designed guide groove 212 and synchronously driven pressure rod 22 structure, can efficiently solve the flatness problem of silicon steel strip during laser marking. First, the guide grooves 212 on both sides of the placement stage 21, in conjunction with the two pressure rods 22, can apply downward pressure and outward flattening force to the silicon steel strip during the pressing process. Furthermore, when the two pressure rods 22 move to the bottom of the guide grooves 212, they can also abut against the surface of the placement stage 21, thus fixing the silicon steel strip between the pressure rods 22 and the placement stage 21 in a flattened state. That is, by flattening first and then fixing, the silicon steel strip is laid flat and positioned. This solution can eliminate the bending state of the strip caused by winding, effectively improve the accuracy of subsequent laser marking processing, and reduce marking deviation problems caused by uneven strip. Furthermore, this structure eliminates the need for manual adjustment of the strip position or application of flattening force. The flattening operation can be automatically driven by the first drive mechanism, reducing the labor intensity of manual operation and ensuring the consistency of each flattening process, thereby improving the overall processing efficiency of the equipment.

[0033] In this embodiment, the two pressure rods 22 are connected by an elastic element 23. The first driving mechanism includes a lifting slider 24, which is placed above the two pressure rods 22. The lifting slider 24 drives the two pressure rods 22 to slide synchronously downward and outward along the guide groove 212 by descending, and drives the two pressure rods 22 to slide synchronously upward and inward along the guide groove 212 by rising, under the pulling force of the elastic element 23. This structure simplifies the device while achieving multiple functions. First, by placing the lifting slider 24 on the pressure rods 22, the complex driving motion along the guide groove 212 is converted into a simpler lifting driving motion. Second, the elastic restoring capability of the elastic element 23 allows the pressure rods 22 to continue moving after the lifting slider 24 rises, so the lifting slider 24 can only be limited on one side. More importantly, placing the lifting slider 24 above the two pressure rods 22 enables the two pressure rods 22 to move synchronously, eliminating the need for complex synchronous driving equipment.

[0034] In this embodiment, the ends of each pressure rod 22 extend beyond the guide groove 212; the lifting slider 24 has a frame-like structure surrounding the two mounting plates 211 and is placed above the ends of each pressure rod 22; a connecting block 241 is provided on the lifting slider 24 at the position between the two guide grooves 212 on the same mounting plate 211, and the connecting block 241 and the ends of the two pressure rods 22 are connected by elastic members 23. The elastic member 23 can be a spring. In this embodiment, by placing the lifting slider 24 externally, the area between the two mounting plates 211 is avoided, allowing the processing device 1 to be arranged separately in the area between the two mounting plates 211, avoiding interference between the moving parts and ensuring processing quality.

[0035] In this embodiment, limiting plates 242 are provided at both ends of the lifting slider 24 corresponding to the lower edge of the mounting plate 211. The two limiting plates 242 have a hook-shaped structure with openings facing each other, and the depth of the hook-shaped structure covers the projection range of the guide groove 212 in the horizontal direction. The end of the pressure rod 22 is slidably disposed in the hook-shaped area of ​​the limiting plate 242. By limiting the end of the pressure rod 22 through the hook-shaped structure, not only can the pressure rod 22 be ensured to follow the movement, but also the stability of the sliding movement of the pressure rod 22 can be further improved in combination with the elastic element 23, eliminating the vibration caused by the inherent gap between the lifting slider 24 and the guide groove 212.

[0036] In this embodiment, the leveling device 2 also includes a top plate 25, which is located above the processing device 1, spanning across the two mounting plates 211, and connected to the top of the two mounting plates 211. Together with the mounting plates 211 and the placement platform 21, it forms a box-shaped structure with openings at both ends, which serve as inlets and outlets for the movement of the silicon steel strip. Figure 3 As shown, the lifting slider 24 is connected to the processing device 1. Specifically, the lifting slider 24 is connected to the bottom of the support plate 11 of the processing device 1 at the frame of the opening at both ends of the box structure.

[0037] The first drive mechanism also includes a vertical drive component 26, which is mounted on the top plate 25. The drive end of the vertical drive component 26 is connected to the processing device 1, so that while driving the processing device 1 closer to the silicon steel strip, it simultaneously drives the lifting slider 24 to move synchronously, thereby driving the pressure rod 22 to flatten the silicon steel strip onto the placement table 21. That is, this embodiment successfully achieves a dual-purpose drive by directly associating the lifting slider 24 with the processing device 1: using only the vertical drive component 26 as a single drive source, two key operations can be completed simultaneously—on the one hand, driving the pressure rod 22 to flatten the silicon steel strip; on the other hand, driving the processing device 1 closer to the strip to meet the scoring processing requirements. This design not only avoids configuring separate drive mechanisms for the two actions, significantly reducing the number of parts and the overall size of the equipment, but also simplifies the transmission link and control logic of the equipment, reducing manufacturing and maintenance costs. It also improves the stability and accuracy of the coordinated operation of the two actions, effectively optimizing the overall performance of the equipment. The vertical drive component 26 can be a hydraulic rod.

[0038] In this embodiment, the placement platform 21 is a belt conveyor mechanism, which is arranged along the direction of the silicon steel strip. The top surface serves as the placement plane for the silicon steel strip, and the pressure bar 22 is a cylindrical rod. The transmission belt within the belt conveyor mechanism can drive the silicon steel strip, facilitating continuous processing of the strip. The cylindrical pressure bar 22 can rotate on the surface of the silicon steel strip as the transmission belt moves, assisting the strip's movement and preventing damage to the strip's surface.

[0039] In this embodiment, as Figure 3As shown, the processing device 1 includes a support plate 11, a slide bar 12, a laser etching machine 13, and a second drive mechanism. Two support plates 11 are provided, arranged parallel to each other at intervals, and the interval area enclosed by the two support plates 11 serves as the processing area for the silicon steel strip. In this embodiment, the two support plates 11 are perpendicular to the two mounting plates 211, and the two support plates 11 and the two mounting plates 211 together enclose a square horizontal processing area.

[0040] Each support plate 11 has a horizontal groove 111 at the same height; a slide rod 12 is vertically connected to the two support plates 11. Specifically, the two ends of the slide rod 12 are slidably disposed in the grooves 111 of the two support plates 11. The laser etching machine 13 is slidably connected to the slide rod 12. The second drive mechanism is used to drive the laser etching machine 13 to slide along the slide rod 12 and drive the slide rod 12 to slide along the groove 111, so that the laser etching machine 13 can move within the processing area. By combining the two sliding directions of sliding along the groove 111 and sliding along the slide rod 12, the laser etching machine 13 can reach any position within the processing area.

[0041] In this embodiment, as Figure 4 As shown, the second driving mechanism includes a lead screw 14 and a first driving member 15. The lead screw 14 is arranged parallel to the slide bar 12 and is rotatably connected to the slide bar 12. The laser etching machine 13 has a sleeve inside that connects to the lead screw 14. The first driving member 15 is installed at the end of the slide bar 12 and the driving end is connected to the lead screw 14 to drive the lead screw 14 to rotate and drive the laser etching machine 13 to slide along the slide bar 12.

[0042] In this embodiment, the second driving mechanism includes a gear 16, a rack 17, and a second driving member 18. The rack 17 is arranged along the slide groove 111 at the edge of the slide groove 111 of a support plate 11. The second driving member 18 is installed at the end of the slide rod 12, and the driving end is connected to the gear 16. The gear 16 meshes with the rack 17 so that under the drive of the second driving member 18, the slide rod 12 is driven to slide along the slide groove 111 by meshing (generating a support reaction force).

[0043] Both the first driving element 15 and the second driving element 18 can be rotary driving devices such as motors, and they are respectively connected to the two ends of the slide rod 12.

[0044] In this embodiment, as Figure 5As shown, the processing device 1 also includes an air suction mechanism 19, which includes an air chamber 191, an air suction fan 192, an air collection pipe 193, and an air intake 194. The air chamber 191 is connected to the top of the two support plates 11 and has a cavity inside. The air suction fan 192 is installed in the cavity of the air chamber 191. The air intake 194 has a groove-shaped structure with one end open and is arranged at the bottom of the support plate 11 with the opening facing the processing area. The cavity inside the groove is connected to the cavity of the air chamber 191 through the air collection pipe 193.

[0045] In this embodiment, the air intake 194 is located on the bottom surface of the lifting slider 24, and two are symmetrically arranged with their openings facing each other, both pointing towards the processing area. They are close to the working position of the laser etching machine 13. While the laser etching machine 13 is processing, the air intake fan 192 inside the air chamber 191 can generate suction. At this time, the air collection pipe 193 connected to the air chamber 191 and the air intake 194 can also generate suction, so that the air intake 194 can absorb the toxic and harmful gases generated when the laser etching machine 13 is working, ensuring that it will not affect the continuous operation of the silicon steel strip and reducing the physical harm to the operator during operation.

[0046] In this embodiment, the device also includes a base 3. The top surface of the base 3 is provided with a steel strip (silicon steel strip) leveling unit or leveling device 2. The steel strip leveling unit is provided with a steel strip processing unit or processing device 1. The steel strip processing unit is connected to a lifting slider 24. The lifting slider 24 is slidably connected to the outer surface of the mounting plate 211 of the leveling device 2.

[0047] The lifting slider 24 has a frame structure and can move up and down synchronously with its internal processing device 1. The limiting plate 242 moves outside the steel strip leveling unit. Through the combination of the limiting plate 242 and the inner guide groove 212, it is convenient to push the pressure rod 22 of the steel strip leveling unit, which facilitates the leveling of the silicon steel strip.

[0048] A rack 17 is fixedly connected to one end of the bearing plate 11 of the processing device 1. Both bearing plates 11 are provided with grooves 111. A slide rod 12 is slidably connected inside the groove 111. An auxiliary slide rod 121 (similar to a roller) can be rotatably connected inside the slide rod 12 at the corresponding segment of the groove 111. A second drive member 18 is connected to one end of the slide rod 12. A gear 16 is fixedly connected to the output end of the second drive member 18. The gear 16 meshes with the rack 17. A threaded rod or lead screw 14 is rotatably connected inside the slide rod 12. A laser etching machine 13 is threadedly connected to the outer surface of the threaded rod. The laser etching machine 13 is slidably connected to the outer surface of the slide rod 12. A first drive member 15 is connected to the other end of the slide rod 12. The threaded rod is connected to the output end of the first drive member 15. Both the first drive member 15 and the second drive member 18 can be adjustable motors.

[0049] The driving end of the second driving member 18 faces the axis of the slide rod 12. Therefore, both the gear 16 and the driving end are rotatably connected inside the slide rod 12 (located on the segment of the slide rod 12 that extends out of the slide groove 111) through bearings and other means. The driving end will drive the gear 16 to rotate inside the slide rod 12. At the same time, the gear 16 meshes with the rack 17. The rotating gear 16 can drive the slide rod 12 to slide inside the slide groove 111. The rotating auxiliary slide rod 121 reduces the friction generated when the slide rod 12 moves, ensuring the sliding efficiency of the slide rod 12. The first driving member 15 will drive the threaded rod to rotate, so that the laser etching machine 13 on the surface of the threaded rod can move along the threaded rod. Through the cooperation between the gear 16 and the threaded rod, the laser etching machine 13 can easily perform comprehensive marking operations on the surface of the steel strip.

[0050] The vertical drive component 26, combined with the guide groove 212, limits the movement trajectory of the pressure rod 22, allowing the pressure rod 22 to push the curved silicon steel strip to both sides, flattening the silicon steel strip and ensuring that the silicon steel strip is relatively flat when processed by the laser etching machine 13, thus ensuring processing accuracy. At the same time, when the conveyor belt (transmission belt) transports the silicon steel strip, the pressure rod 22 can rotate on the surface of the silicon steel strip with the movement of the conveyor belt, assisting the movement of the silicon steel strip.

[0051] In general, in this embodiment, the vertical drive member 26 drives the processing device 1 to move up and down inside the steel strip leveling unit, bringing the laser etching machine 13 closer to the surface of the workpiece to be processed. The second drive member 18 drives the gear 16 to rotate, allowing the gear 16 to move along the surface of the rack 17, thus enabling the laser etching machine 13 to move left and right. At the same time, the first drive member 15 on the side of the slide bar 12 can drive the threaded rod to rotate, enabling the laser etching machine 13 to move back and forth. This allows the laser etching machine 13 to move freely in a two-dimensional plane, facilitating comprehensive processing of the workpiece surface. The steel strip leveling unit transports the silicon steel strip and brings the steel strip processing unit closer to it. Simultaneously, the steel strip processing unit drives the internal components of the steel strip leveling unit to level the strip, allowing for precise processing. During processing, the steel strip processing unit can also absorb the fumes generated during processing, collect them, and discharge them, reducing the various impacts of the fumes.

[0052] Example 2

[0053] The silicon steel strip surface laser marking and rust prevention production line of this embodiment includes a feeding device, a rust prevention treatment device, and the silicon steel strip surface laser marking device from Embodiment 1. The feeding device supplies silicon steel strip to the silicon steel strip surface laser marking device, which performs laser marking on the silicon steel strip. The rust prevention treatment device performs rust prevention treatment on the silicon steel strip after laser marking. Since laser marking can also affect the surface condition of the steel strip to a certain extent, thereby affecting the rust prevention performance, and at the same time generate minute deformations and stress concentrations on the substrate surface, affecting the surface microstructure, thus indirectly affecting the corrosion resistance of the material, the production line of this embodiment is equipped with rust prevention treatment equipment after etching. Specifically, conventional rust prevention facilities can be used.

[0054] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of this utility model, and the utility model is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of this utility model, and these modifications and improvements are also considered to be within the protection scope of this utility model.

Claims

1. A laser marking device for the surface of silicon steel strip, characterized in that: The device includes a processing unit (1) and a leveling unit (2), wherein the leveling unit (2) includes a placement platform (21), a pressure bar (22), and a first drive mechanism. The placement platform (21) is located below the processing device (1) and is used to place the silicon steel strip to be processed by the processing device (1). The placement platform (21) has vertical mounting plates (211) on both sides of the silicon steel strip in the width direction. Two oblique guide grooves (212) are provided on each of the two mounting plates (211) in the same layout, and the distance between the two guide grooves (212) on the same mounting plate (211) gradually increases from top to bottom; The pressure rod (22) is provided in two parts. Each pressure rod (22) is slidably connected at both ends to the guide groove (212) corresponding to the layout position on the two mounting plates (211). The pressure rod (22) located at the bottom end of the guide groove (212) can abut against the surface of the placement platform (21). The first driving mechanism is used to drive the two pressure rods (22) to slide synchronously along the guide groove (212) to flatten the silicon steel strip onto the placement platform (21).

2. The laser marking equipment for silicon steel strip surface according to claim 1, characterized in that: The two pressure rods (22) are connected by an elastic element (23) to tighten them together; The first driving mechanism includes a lifting slider (24), which is placed above the two pressure rods (22). The lifting slider (24) drives the two pressure rods (22) to slide synchronously downward and outward along the guide groove (212) by descending, and the two pressure rods (22) slide synchronously upward and inward along the guide groove (212) by rising, driven by the tension of the elastic element (23).

3. The laser marking equipment for silicon steel strip surface according to claim 2, characterized in that: The ends of each of the pressure rods (22) extend to the outside of the guide groove (212); The lifting slider (24) is a frame structure surrounding the two mounting plates (211) and is placed above the ends of each of the pressure rods (22); The lifting slider (24) has a connecting block (241) located between the two guide grooves (212) on the same mounting plate (211). The connecting block (241) and the ends of the pressure rods (22) on both sides are connected by the elastic element (23).

4. The laser marking equipment for silicon steel strip surface according to claim 3, characterized in that: Limiting plates (242) are provided at both ends of the lifting slider (24) corresponding to the lower edge of the mounting plate (211). The two limiting plates (242) are hook-shaped structures with openings facing each other, and the depth of the hook-shaped structure covers the projection range of the guide groove (212) in the horizontal direction; The end of the pressure rod (22) is slidably disposed in the hook-shaped area of ​​the limiting plate (242).

5. The laser marking equipment for silicon steel strip surface according to claim 3, characterized in that: The leveling device (2) further includes a top plate (25), which is located above the processing device (1) and connected to the top of the two mounting plates (211). The lifting slider (24) is connected to the processing device (1); The first driving mechanism also includes a vertical driving component (26), which is mounted on the top plate (25) and connected to the processing device (1) at the driving end. While driving the processing device (1) to approach the silicon steel strip, it drives the lifting slider (24) to move synchronously, so as to drive the pressure rod (22) to flatten the silicon steel strip onto the placement platform (21).

6. The laser marking equipment for silicon steel strip surface according to any one of claims 1 to 5, characterized in that: The placement platform (21) is a belt conveyor mechanism, which is arranged along the direction of the silicon steel strip, and its top surface serves as the placement plane for the silicon steel strip. The pressure bar (22) is a cylindrical rod.

7. The laser marking equipment for silicon steel strip surface according to claim 1 or 5, characterized in that: The processing device (1) includes a support plate (11), a slide bar (12), a laser etching machine (13), and a second drive mechanism; The bearing plate (11) is provided in two pieces and is arranged in parallel and spaced apart. The spaced area enclosed by the two bearing plates (11) serves as the processing area of ​​the silicon steel strip. Each bearing plate (11) has a horizontal groove (111) at the same height. The two ends of the slide rod (12) are respectively slidably disposed in the slide grooves (111) of the two bearing plates (11). The laser etching machine (13) is slidably connected to the slide rod (12). The second driving mechanism is used to drive the laser etching machine (13) to slide along the slide bar (12) and drive the slide bar (12) to slide along the slide groove (111) so that the laser etching machine (13) moves within the processing area.

8. The laser marking equipment for silicon steel strip surface according to claim 7, characterized in that: The second drive mechanism includes a lead screw (14) and a first drive member (15). The lead screw (14) is arranged parallel to the slide rod (12) and is rotatably connected to the slide rod (12). The laser etching machine (13) is equipped with a sleeve that connects to the lead screw (14). The first driving member (15) is installed at the end of the slide bar (12), and the driving end is connected to the lead screw (14) to drive the lead screw (14) to rotate and drive the laser etching machine (13) to slide along the slide bar (12).

9. The laser marking equipment for silicon steel strip surface according to claim 7, characterized in that: The second drive mechanism includes a gear (16), a rack (17), and a second drive member (18). The rack (17) is arranged along the groove (111) at the edge of the groove (111) of the bearing plate (11). The second driving member (18) is installed at the end of the slide bar (12), and the driving end is connected to the gear (16). The gear (16) meshes with the rack (17) so that, under the drive of the second drive member (18), the slide rod (12) slides along the slide groove (111) through meshing.

10. The laser marking equipment for silicon steel strip surface according to claim 7, characterized in that: The processing device (1) further includes an air intake mechanism (19), which includes an air chamber (191), an air intake fan (192), an air collection pipe (193), and an air intake (194). The air chamber (191) is connected to the top of the two supporting plates (11) and has an internal cavity. The air intake fan (192) is installed inside the cavity of the air chamber (191). The air intake (194) has a groove-shaped structure with one end open, and is arranged at the bottom of the support plate (11). The opening faces the processing area, and the cavity inside the groove is connected to the cavity of the air chamber (191) through the air collection pipe (193).

11. A production line for laser marking and rust prevention treatment of silicon steel strip surface, characterized in that: Includes feeding equipment, rust prevention equipment, and laser marking equipment for the surface of silicon steel strip as described in any one of claims 1 to 10. The feeding device is used to supply silicon steel strip to the laser marking device on the surface of the silicon steel strip. The laser marking equipment for silicon steel strip is used to perform laser marking treatment on silicon steel strip. The rust prevention equipment is used to perform rust prevention treatment on silicon steel strip that has undergone laser marking.

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