A substrate wafer slicing and dicing device

Abstract

The utility model relates to the field of semiconductor manufacturing technology discloses a kind of substrate crystal bar slicing and picking device, including segmentation component, picking component and drive assembly, segmentation component includes laser and segmentation workstation, segmentation workstation is located just below laser, and segmentation workstation is used to carry the substrate piece to be separated, and laser is used to cut and separate substrate piece and jig;Picking component includes gripper, and gripper is used to clamp jig and / or substrate piece;Drive assembly is connected with gripper, and drive assembly is used to drive gripper to move between material taking position, segmentation workstation and material discharge position;The utility model moves first gripper and second gripper by first drive part and second drive part, and the transfer of substrate piece is realized quickly and stably, improves the transfer efficiency, stability and reliability of substrate piece, reduces the risk and loss of substrate piece drop.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a substrate crystal rod slicing and wafer taking device. Background Technology

[0002] Indium phosphide substrates have a large application market in the manufacture of high-frequency, high-power devices, optical fiber communication, wireless transmission, radio astronomy and other radio frequency devices. Radio frequency devices made using indium phosphide substrates have demonstrated excellent performance in applications such as satellites and radar.

[0003] After slicing, adjacent substrate wafers need to be separated from the substrate ingots to facilitate subsequent processes such as polishing and testing. In existing technologies, the separation of different substrate wafers is typically achieved by using adhesive ingots to hold and transfer the wafers. However, this method suffers from unstable and uncontrollable connections between the adhesive ingots and the substrate wafers, leading to issues such as wafers falling off and being damaged. Utility Model Content

[0004] The technical problem to be solved by this utility model is: how to more stably separate and transfer substrate wafers. In order to solve the above technical problem, this utility model provides a substrate crystal rod slicing and taking device, including a slicing component, a taking component and a driving component. The slicing component includes a laser and a slicing stage. The slicing stage is located directly below the laser. The slicing stage is used to carry the substrate wafer to be separated. The laser is used to cut and separate the substrate wafer from the jig. The wafer picking assembly includes grippers for gripping a jig and / or a substrate wafer. The drive assembly is connected to the gripper, and the drive assembly is used to drive the gripper to move between the material picking position, the dividing worktable and the material unloading position. The material feeding position is used to store the substrate wafers and jigs to be separated, and the material discharging position is used to store the separated substrate wafers.

[0005] Preferably, the slice-retrieving assembly includes a first gripper and a second gripper disposed opposite to each other; the first gripper and the second gripper move synchronously or asynchronously.

[0006] Preferably, both the first gripper and the second gripper are connected to a gripper cylinder, which is used to drive the first gripper and the second gripper to expand and contract.

[0007] Preferably, the end of the gripper is provided with a receiving platform, the vertical thickness of the receiving platform is less than the thickness of the gripper, and the receiving platform protrudes towards the inside of the gripper.

[0008] Preferably, the dividing worktable includes a first support column and a second support column. The first support column is disposed in the middle of the dividing worktable and is used to support the substrate sheet. Multiple second support columns are provided, and the multiple second support columns are evenly distributed around the circumference of the axis of the first support column. The second support columns are used to support the fixture.

[0009] Preferably, the driving assembly includes a first driving member and a second driving member; the first driving member is throttle-connected to the second driving member, and the second driving member is throttle-connected to the gripper. The first driving member is used to drive the second driving member and the gripper to move along a first direction, and the second driving member is used to drive the gripper to move along a second direction between the material picking position, the dividing worktable and the material discharging position, and the first direction is perpendicular to the second direction.

[0010] Preferably, there are two of the first driving member and the second driving member corresponding to the first gripper and the second gripper.

[0011] Preferably, the first driving component and the second driving component are linear lead screw modules driven by motors.

[0012] Preferably, it also includes a height sensor, which is disposed above the material handling position.

[0013] Preferably, the material receiving position is provided with a plurality of first limiting plates and limiting corner plates, the first limiting plates abutting against the side of the jig, and the limiting corner plates abutting against the corner of the jig, so as to limit the substrate to be cut and separated from the jig; The feeding position is provided with a feeding platform and a second limiting plate. Multiple second limiting plates are arranged on opposite sides of the axis of the feeding platform. The feeding platform is used to support and carry the substrate sheet after cutting and separation, and the second limiting plate is used to abut and limit the substrate sheet.

[0014] Compared with the prior art, the substrate rod slicing and wafer taking device provided in this embodiment of the utility model has the following advantages: In this invention, the sliced ​​substrate sheet is transferred to the pick-up position via the connected jig. The gripper, driven by the drive assembly, moves to the pick-up position and picks up the top substrate sheet and jig. The gripper then transfers the substrate sheet and jig to the slitting table, where the laser begins to slit the jig, thus separating the substrate sheet from the jig. The gripper then picks up the substrate sheet again and transfers it to the unloading position, thereby achieving the separation and transfer of the substrate sheet, improving the efficiency of substrate sheet separation and transfer, as well as the stability and reliability of the substrate sheet separation and transfer process. Attached Figure Description

[0015] Figure 1 This is a top view of the present invention; Figure 2 This is a three-dimensional view of the present invention.

[0016] In the image: 1. Laser; 2. Dividing workbench; 21. First support column; 22. Second support column; 3. Substrate; 4. Metallurgy; 41. Upper metallurgical tool; 42. Lower metallurgical tool; 5. Gripper; 51. First gripper; 52. Second gripper; 53. Gripper cylinder; 54. Receiving platform; 6. Drive component; 61. First drive element; 62. Second drive element; 7. Material receiving position; 71. First limiting plate; 72. Limiting angle plate; 8. Material feeding position; 81. Material feeding platform; 82. Second limit plate; 9. Altitude sensor. Detailed Implementation

[0017] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit the scope of this utility model.

[0018] like Figure 1 and Figure 2 The preferred embodiment of the present invention provides a substrate crystal rod slicing and taking device, which includes a slicing component, a taking component and a driving component 6. The slicing component includes a laser 1 and a slicing worktable 2. The slicing worktable 2 is located directly below the laser 1. The slicing worktable 2 is used to carry the substrate slice 3 to be separated. The laser 1 is used to cut and separate the substrate slice 3 from the jig 4. The wafer picking assembly includes a gripper 5, which is used to pick up the jig 4 and / or the substrate 3. The drive assembly 6 is connected to the gripper 5, and the drive assembly 6 is used to drive the gripper 5 to move between the material picking position 7, the dividing worktable 2 and the material discharging position 8. The material feeding position 7 is used to store the substrate 3 and the jig 4 to be separated, and the material discharging position 8 is used to store the separated substrate 3.

[0019] Specifically, in this embodiment, the material picking position 7, the dividing worktable 2, and the material unloading position 8 are all arranged along a horizontal straight line, and the material unloading position 8 and the material picking position 7 are located on both sides of the dividing worktable 2, thereby facilitating the movement of the gripper 5 and the transfer of the substrate 3. In the prior art, when the substrate ingot is sliced, a corresponding jig 4 is required. The jig 4 is divided into an upper jig 41 and a lower jig 42, which are connected together to completely enclose the substrate ingot. After the substrate ingot is sliced, the upper jig 41 and the lower jig 42 still enclose the corresponding substrate 3. At this time, it is necessary to separate the substrate 3 from the upper jig 41 and the lower jig 42 to facilitate the normal operation of subsequent processes. In the traditional approach, the substrate 3 and the fixture 4 are transferred to the area below the laser 1 by adhesive bonding of a crystal rod. On the one hand, this approach is relatively complex and prone to problems such as structural and operational interference. On the other hand, it is also prone to problems such as the substrate 3 falling off and being damaged. The transfer process of the substrate 3 is very unstable and unsafe.

[0020] In this application, the substrate 3 and the jig 4 located at the top of the picking position 7 are lifted by the gripper 5, and then the substrate 3 and the jig 4 are transferred to the dividing worktable 2 for temporary storage. The laser 1 can perform laser cutting on the upper jig 41 and the lower jig 42 located on the dividing worktable 2, thereby detaching the upper jig 41 and the lower jig 42 from the connection state. Naturally, the substrate 3 is also detached from the upper jig 41 and the lower jig 42. Finally, the gripper 5 can quickly and stably lift the substrate 3 and transfer it to the unloading position 8 for stacking, in preparation for subsequent work.

[0021] In some embodiments, the chip-retrieving assembly includes a first gripper 51 and a second gripper 52 disposed opposite to each other; the first gripper 51 and the second gripper 52 move synchronously or asynchronously.

[0022] Specifically, in a preferred embodiment, the gripper 5 is divided into a first gripper 51 and a second gripper 52. The first gripper 51 and the second gripper 52 are arranged opposite to each other and can move synchronously, thereby lifting the first jig 4 and the second jig 4 respectively, or simultaneously lifting both sides of the substrate 3. This ensures the stability and reliability of the substrate 3's position during the transfer process, preventing the substrate 3 from falling and being damaged due to unstable force. Furthermore, the first gripper 51 and the second gripper 52 can also move asynchronously. That is, when the first gripper 51 transfers the divided substrate 3 to the unloading position 8, the second gripper 52 can simultaneously grab a new substrate 3 to be divided and the jig 4, and transfer the new substrate 3 and the jig 4 to the dividing worktable 2 for dividing, thereby improving the separation efficiency between the substrate 3 and the jig 4. In addition, in one embodiment, the first gripper 51 and the second gripper 52 perform their functions alternately. In a preferred embodiment, the first gripper 51 only performs the function of transferring the substrate 3 from the sizing table 2 to the feeding position 8, while the second gripper 52 only performs the function of transferring the substrate 3 from the picking position 7 to the sizing table 2.

[0023] In another alternative embodiment, a single gripper 5 is provided, which undertakes the entire transfer of the substrate 3 from the pick-up position 7 to the dividing worktable 2, and then to the unloading position 8.

[0024] In some embodiments, the first gripper 51 and the second gripper 52 are both connected to a gripper cylinder 53, which is used to drive the first gripper 51 and the second gripper 52 to expand and contract.

[0025] Specifically, the first gripper 51 and the second gripper 52 are each provided with two gripping arms. The gripper cylinder 53 drives the two gripping arms to move towards each other or away from each other by adjusting the air passage, thereby realizing the expansion and contraction of the gripper 5, and thus realizing the lifting and lowering of the substrate 3, achieving stable and reliable transfer of the substrate 3.

[0026] In some embodiments, the end of the gripper 5 is provided with a receiving platform 54, the thickness of the receiving platform 54 in the vertical direction is less than the thickness of the gripper 5, and the receiving platform 54 protrudes toward the inside of the gripper 5.

[0027] Specifically, the gripper 5 can have multiple ends. In this embodiment, two ends are preferably arranged opposite each other on the left and right. In other alternative embodiments, four ends can be provided, including two ends corresponding to the top and bottom, for clamping the substrate 3 or the fixture 4 in the vertical direction, thereby further improving the stability and reliability of the substrate 3 during the transfer process. The receiving boss can be inserted between two adjacent fixtures 4 as the gripper retracts, which can more quickly and stably separate the two adjacent substrates 3, thus facilitating subsequent transfer operations. In a preferred embodiment, the protruding part of the receiving platform 54 has a trapezoidal cross-section with a slope, which can better insert between adjacent fixtures 4. At the same time, the receiving platform 54 also has a step. When the gripper 5 retracts, the step can abut against the side wall of the fixture 4 or the substrate 3, thereby more stably and reliably supporting the substrate 3 and the fixture 4. In addition, in some other embodiments, the receiving platform 54 is also provided with anti-slip pads and other structures to further increase the stability and reliability of the substrate 3 during the clamping process.

[0028] In some embodiments, the dividing worktable 2 includes a first support column 21 and a second support column 22. The first support column 21 is disposed in the middle of the dividing worktable 2 and is used to support the substrate 3. Multiple second support columns 22 are provided, and the multiple second support columns 22 are evenly distributed around the axis of the first support column 21. The second support columns 22 are used to support the fixture 4.

[0029] Specifically, before the actual cutting, the first support column 21 supports the substrate 3, while the second support column 22 supports the upper jig 41 and the lower jig 42 respectively. After the laser 1 divides the upper jig 41 and the lower jig 42, the first support column 21, being the middle support of the substrate 3, can still stably support the substrate 3. The second support column 22 supports both the upper jig 41 and the lower jig 42 on one side. When the connection between the upper jig 41 and the lower jig 42 is broken, the upper jig 41 and the lower jig 42 will fall off the second support column 22, thus not affecting the subsequent transfer of the substrate 3, improving the transfer efficiency and safety of the substrate 3.

[0030] In some embodiments, the drive assembly 6 includes a first drive member 61 and a second drive member 62; the first drive member 61 is tractively connected to the second drive member 62, and the second drive member 62 is tractively connected to the gripper 5. The first driving member 61 is used to drive the second driving member 62 and the gripper 5 to move along the first direction. The second driving member 62 is used to drive the gripper 5 to move along the second direction between the material picking position 7, the dividing worktable 2 and the material discharging position 8. The first direction is perpendicular to the second direction.

[0031] Furthermore, there are two first driving members 61 and two second driving members 62 corresponding to the first gripper 51 and the second gripper 52.

[0032] Furthermore, the first drive unit 61 and the second drive unit 62 adopt a linear screw module driven by a motor.

[0033] Specifically, in the preferred embodiment, the two first driving members 61 are arranged in parallel, and the two second driving members 62 are also arranged in parallel. The first direction is vertical, and the second direction is horizontal. The picking position 7, the dividing worktable 2, and the placing position 8 are all located between the two second driving members 62 and extend along the second direction. The second gripper 52 can conveniently transfer the substrate 3. In the actual transfer process, the first driving member 61 first drives the second driving member 62 and the gripper 5 to move upward. Then, the second driving member 62 drives the gripper 5 to move directly above the picking position 7, the dividing worktable 2, or the placing position 8. The first driving member 61 then drives the second driving member 62 and the gripper 5 to move downward to a preset position. Finally, the gripper 5 expands or contracts, thereby completing the gripping or placing of the substrate 3. The transfer process of the substrate 3 is more efficient and more stable and reliable. Of course, in some other alternative embodiments, the first driving member 61 and the second driving member 62 can also adopt structures such as electric push rods.

[0034] In some embodiments, a height sensor 9 is also included, which is correspondingly disposed above the material handling position 7. The height sensor 9 can monitor the height of the stacked, to-be-divided substrate sheets 3 in real time, thereby providing guidance for the movement of the first drive member 61. This allows the first drive member 61 to drive the gripper 5 to move along a first direction within the specified time, enabling the gripper 5 to move more precisely between two adjacent jigs 4. This provides data support for the gripper 5 to separate and lift the top layer of the substrate sheet 3 at the material handling position 7, making the gripper 5 more efficient and accurate in lifting and transferring the substrate sheet 3.

[0035] In some embodiments, the material picking position 7 is provided with a plurality of first limiting plates 71 and limiting corner plates 72. The first limiting plates 71 abut against the side of the jig 4, and the limiting corner plates 72 abut against the corner of the jig 4 to limit the substrate sheet 3 to be cut and separated from the jig 4. The material feeding position 8 is provided with a feeding platform 81 and a second limiting plate 82. A plurality of second limiting plates 82 are provided on opposite sides along the axis of the feeding platform 81. The feeding platform 81 is used to support and carry the substrate sheet 3 after cutting and separation, and the second limiting plates 82 are used to abut against and limit the substrate sheet 3.

[0036] The first limiting plate 71, together with the limiting angle plate 72, can better restrict the state of the substrate 3 and the jig 4 at the picking position 7, thereby facilitating the gripper 5 to pick up the substrate. The setting of the second limiting plate 82 and the feeding table 81 can stably support the divided substrate 3 and restrict the position of the substrate 3, thereby facilitating the picking up of the substrate in subsequent work and improving the efficiency and reliability of substrate 3 transfer.

[0037] In summary, this utility model embodiment provides a substrate ingot slicing and unloading device, which drives the first gripper 51 and the second gripper 52 to move through the first driving member 61 and the second driving member 62, thereby enabling the substrate wafer 3 to be quickly and stably transferred from the unloading position 7 to the slitting table 2, and then from the slitting table 2 to the unloading position 8. This not only improves the transfer efficiency of the substrate wafer 3, but also improves the stability and reliability of the substrate wafer 3 during the transfer process, and reduces the risk and loss of the substrate wafer 3 falling off.

[0038] The above are merely preferred embodiments of this utility model. It should be noted that, for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of this utility model, and these improvements and substitutions should also be considered within the protection scope of this utility model.

Claims

1. A substrate rod slicing and wafer taking device, characterized in that, include: A slitting assembly, comprising a laser and a slitting stage, the slitting stage being located directly below the laser, the slitting stage being used to hold a substrate to be separated, and the laser being used to cut and separate the substrate from the jig; A wafer picking assembly, the wafer picking assembly including grippers for gripping a jig and / or a substrate wafer; A drive assembly is connected to the gripper and is used to drive the gripper to move between the picking position, the dividing worktable and the unloading position. The material feeding position is used to store the substrate wafers and jigs to be separated, and the material discharging position is used to store the separated substrate wafers.

2. The substrate ingot slicing and wafer taking device according to claim 1, characterized in that, The film-retrieving component includes a first gripper and a second gripper positioned opposite each other; the first gripper and the second gripper move synchronously or asynchronously.

3. The substrate rod slicing and wafer taking device according to claim 2, characterized in that, Both the first gripper and the second gripper are connected to gripper cylinders, which are used to drive the first gripper and the second gripper to expand and contract.

4. The substrate ingot slicing and wafer taking device according to claim 2, characterized in that, The end of the gripper is provided with a receiving platform, the thickness of the receiving platform in the vertical direction is less than the thickness of the gripper, and the receiving platform protrudes towards the inside of the gripper.

5. The substrate ingot slicing and wafer taking device according to claim 1, characterized in that, The dividing worktable includes a first support column and a second support column. The first support column is disposed in the middle of the dividing worktable and is used to support the substrate sheet. Multiple second support columns are provided, and the multiple second support columns are evenly distributed around the circumference of the axis of the first support column. The second support columns are used to support the jig.

6. The substrate ingot slicing and wafer taking device according to claim 2, characterized in that, The drive assembly includes a first drive member and a second drive member; the first drive member is drivenly connected to the second drive member, and the second drive member is drivenly connected to the gripper. The first driving member is used to drive the second driving member and the gripper to move along a first direction, and the second driving member is used to drive the gripper to move along a second direction between the material picking position, the dividing worktable and the material discharging position, and the first direction is perpendicular to the second direction.

7. The substrate ingot slicing and wafer taking device according to claim 6, characterized in that, The first driving member and the second driving member are provided in twos, corresponding to the first gripper and the second gripper.

8. The substrate ingot slicing and wafer taking device according to claim 6, characterized in that, The first driving component and the second driving component are linear lead screw modules driven by motors.

9. The substrate ingot slicing and wafer taking device according to claim 1, characterized in that, It also includes a height sensor, which is positioned above the material handling position.

10. The substrate ingot slicing and wafer taking device according to claim 1, characterized in that, The material taking position is provided with a plurality of first limiting plates and limiting corner plates. The first limiting plates abut against the side of the jig, and the limiting corner plates abut against the corner of the jig, so as to limit the substrate to be cut and separated from the jig. The feeding position is provided with a feeding platform and a second limiting plate. Multiple second limiting plates are arranged on opposite sides of the axis of the feeding platform. The feeding platform is used to support and carry the substrate sheet after cutting and separation, and the second limiting plate is used to abut and limit the substrate sheet.

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