Flow blocking device, dust removal device and laser cutting equipment

Abstract

The application provides a flow blocking device, a dust removal device and a laser cutting equipment. The flow blocking device is used for preventing dust or gasification flow generated by a laser cutting wafer from flowing to a protective mirror of the laser, and comprises a flow blocking body. The flow blocking body is provided with a through hole. The through hole is used for laser passing to cut a wafer to form a groove. The flow blocking body is along an air duct. An air outlet end of the air duct is communicated with the through hole. The flow blocking body is provided with an air inlet communicated with the air duct. The air inlet is used for connecting an air source. The air source is used for supplying air to the air duct to form an air curtain in the through hole, so as to prevent the dust or the gasification flow from flowing to the protective mirror of the laser. The flow blocking device is arranged between the laser and a cutting surface. The flow blocking device can provide the through hole for the laser to pass, and can form the air curtain in the through hole to prevent the dust or the gasification flow from flowing to the protective mirror of the laser, so as to protect the protective mirror.

Description

Technical Field

[0001] This application relates to the field of laser cutting technology, and more specifically, to a flow-blocking device, a dust removal device, and a laser cutting equipment. Background Technology

[0002] In the semiconductor packaging field, wafer laser grooving is a key process, primarily used to create microgrooves within the dicing channels on the wafer surface to remove surface oxides and metal layers, thereby improving wafer dicing quality. This process uses lasers to precisely process the wafer surface; however, during laser grooving, localized high-temperature burning generates a large amount of dust or vapors. These dust or vapors not only adhere to the wafer surface but may also diffuse into the laser beam path via airflow, contaminating the protective lens.

[0003] Existing laser grooving machines are typically equipped with dust removal devices that use suction to remove most of the dust or vaporized matter. However, a small amount of dust or vaporized matter can still bypass the dust removal device and adhere to the protective lens of the laser beam. This leads to a decrease in laser transmittance, resulting in energy attenuation at the processing point and severely affecting the grooving quality. Utility Model Content

[0004] This application provides at least one flow-blocking device, a dust removal device, and a laser cutting device. The component is used to be disposed between the laser and the cutting surface. It can provide a through hole for the laser to pass through and can form an air curtain in the through hole to prevent dust or vaporized material from flowing to the protective mirror of the laser, thereby protecting the protective mirror.

[0005] In a first aspect, embodiments of this application provide a flow-blocking device for preventing dust or vaporized material generated during laser wafer cutting from flowing towards the laser's protective mirror. The device includes: a flow-blocking body with a through-hole for the laser to pass through to cut grooves in the wafer; an air channel within the flow-blocking body, the outlet of which is connected to the through-hole; and an air inlet connected to the air channel, which is connected to an air source for supplying air to the air channel to form an air curtain within the through-hole, thereby preventing dust or vaporized material from flowing towards the laser's protective mirror.

[0006] In one optional embodiment, the air passage includes a plurality of first air grooves, the first air grooves extending radially along the through hole and arranged at intervals circumferentially along the through hole, one end of the first air groove being connected to the air inlet and the other end being connected to the through hole.

[0007] In one alternative embodiment, the air passage further includes an annular air groove arranged around the through hole, the annular air groove connecting a plurality of the first air grooves.

[0008] In one optional embodiment, the flow-blocking body is further provided with a plurality of second air grooves, the second air grooves extending radially along the through hole and alternately arranged with the first air grooves at circumferential intervals, one end of the second air groove being connected to the annular air groove and the other end being connected to the through hole.

[0009] In one optional embodiment, the flow-blocking body includes a first plate and a second plate, which are stacked from the direction of proximity to the laser to the direction of distance from the laser. The first plate is provided with a first through hole that extends through its thickness, and the second plate is provided with a second through hole corresponding to the first through hole. The air passage is provided on the side of the first plate facing the second plate.

[0010] In one alternative embodiment, the diameter of the second through hole is smaller than the diameter of the first through hole.

[0011] In one alternative embodiment, the diameter of the second through-hole gradually decreases from the direction closer to the laser to the direction farther away from the laser.

[0012] In one alternative embodiment, the side of the second plate facing the first plate is provided with a groove.

[0013] Secondly, embodiments of this application also provide a dust removal device, including the flow-blocking device described above.

[0014] Thirdly, embodiments of this application also provide a laser cutting device, including the dust removal device described above.

[0015] The above-mentioned technical solution of this application has the following beneficial technical effects: The flow-blocking device of this application embodiment is used to be disposed between the laser and the cutting surface. It can provide a through hole for the laser to pass through and can form an air curtain in the through hole to prevent dust or vapors from flowing through the through hole to the protective mirror of the laser, thereby protecting the protective mirror and preventing dust or vapors from flowing into the through hole and adhering to the surface of the protective mirror, causing energy attenuation at the processing point, which helps to improve the grooving quality.

[0016] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly described below. These drawings are incorporated in and constitute a part of this specification. They illustrate embodiments conforming to this application and, together with the specification, serve to explain the technical solutions of this application. It should be understood that the following drawings only show some embodiments of this application and should not be considered as limiting the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0018] Figure 1 A schematic diagram of the structure of a flow-blocking device provided in an embodiment of this application is shown; Figure 2 It shows Figure 1 A front view of the flow-blocking device in the middle; Figure 3 It shows Figure 2 Sectional view of AA; Figure 4 It shows Figure 1 A front view of the first plate in the middle; Figure 5 It shows Figure 1 A schematic diagram of the back of the first plate in the middle; Figure 6 It shows Figure 5 Sectional view of BB; Figure 7 It shows Figure 1 A front view of the second plate in the diagram; Figure 8 It shows Figure 1 A schematic diagram of the back of the second plate in the diagram; Figure 9 It shows Figure 7 Sectional view of CC; Figure 10 It shows Figure 1 A schematic diagram of the operation of the flow-blocking device in the diagram; In the picture: 1. Flow-blocking body; 11. First plate; 12. Second plate; 2. Through hole; 21. First through hole; 22. Second through hole; 3. Air passage; 31. First air groove; 32. Annular air groove; 33. Second air groove; 4. Air inlet; 5. Groove; 100. Protective mirror. Detailed Implementation

[0019] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present application.

[0020] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0021] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0022] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0023] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0024] refer to Figures 1 to 10This application provides a flow-blocking device suitable for dust removal in laser cutting equipment. The laser cutting equipment includes a laser that emits laser light onto a wafer surface to cut grooves. The dust removal device is positioned between the laser and the wafer and removes dust or vapors generated during the cutting process via suction. The flow-blocking device, located within the dust removal device, prevents dust or vapors generated during the cutting process from flowing towards the protective mirror 100 of the laser, thereby avoiding dust or vapors adhering to the surface of the protective mirror 100 and causing energy attenuation at the processing point, thus improving the grooving quality.

[0025] refer to Figure 1 , Figure 2 , Figure 3 and Figure 10 The flow-blocking device includes: a flow-blocking body 1, which has a through hole 2 for the laser to pass through to cut grooves on a wafer; an air channel 3 in the flow-blocking body 1, the outlet of which is connected to the through hole 2; and an air inlet 4 connected to the air channel 3, which is connected to an air source to supply air to the air channel 3 to form an air curtain within the through hole 2, preventing dust or vaporized material from flowing to the protective mirror 100 of the laser. In practical use, the flow-blocking device can be placed between the laser and the cutting surface (on the side of the dust removal device closer to the laser). It not only provides the laser with a through hole 2 for the laser to pass through, but also forms an air curtain within the through hole 2 to prevent dust or vaporized material from flowing through the through hole 2 to the protective mirror 100 of the laser, thus protecting the protective mirror 100 and preventing dust or vaporized material from adhering to the surface of the protective mirror 100, causing energy attenuation at the processing point, and helping to improve the grooving quality.

[0026] refer to Figure 1 and Figure 3 In some embodiments, the flow-blocking body 1 includes a first plate 11 and a second plate 12, which are stacked from the direction closest to the laser to the direction furthest from the laser. The first plate 11 has a first through-hole 21 extending through its thickness, and the second plate 12 has a second through-hole 22 corresponding to the first through-hole 21. That is, the through-hole 2 is formed by connecting the first through-hole 21 and the second through-hole 22. In practical use, the laser can sequentially pass through the first through-hole 21 and the second through-hole 22 and be directed toward the wafer surface to cut grooves on the wafer surface.

[0027] refer to Figure 3 and Figure 6In some embodiments, an air passage 3 is provided on the side of the first plate 11 facing the second plate 12. That is, the air passage 3 can be formed by grooving the surface of the first plate 11 and fitting it with the second plate 12. Compared with the method of opening the air passage 3 inside the flow-blocking body 1, this design can reduce the processing difficulty of the air passage 3, which helps to improve production efficiency and reduce costs. Of course, in other embodiments, the air passage 3 can also be provided on the surface of the second plate 12 facing the first plate 11.

[0028] refer to Figure 5 In some embodiments, the air passage 3 includes a plurality of first air grooves 31. The first air grooves 31 extend radially along the through hole 2 and are arranged at intervals circumferentially along the through hole 2. One end of the first air groove 31 is connected to the air inlet 4, and the other end is connected to the through hole 2. This embodiment shows that there are eight first air grooves 31, which are evenly distributed circumferentially along the first through hole 21. Each first air groove 31 has a first end close to the through hole 2 and a second end away from the through hole 2, and the second end of each first air groove 31 is connected to the air inlet 4. In practical use, each first air groove 31 can simultaneously direct gas toward the center of the through hole 2, thereby forming an air curtain. Of course, the number and arrangement of the first air grooves 31 can be selected according to the actual situation and are not limited to the methods discussed above.

[0029] refer to Figure 1 and Figure 2 In some embodiments, an air inlet 4 is provided on the side of the first plate 11 opposite to the second plate 12. This embodiment shows that the first plate 11 has multiple circular holes along its axial direction as air inlets 4, each air inlet 4 communicating with the air inlet end of the corresponding first air groove 31. Of course, in other embodiments, the air inlets 4 can also be located in other positions, such as the outer peripheral surface of the first plate 11 or the outer peripheral surface of the second plate 12.

[0030] refer to Figure 5 In some embodiments, the air duct 3 further includes an annular air groove 32, which surrounds the through hole 2 and connects multiple first air grooves 31. This arrangement can balance the gas pressure of each first air groove 31, making the gas output from each first air groove 31 uniform. It forms a laminar flow barrier with uniform velocity and consistent direction around the through hole 2, effectively blocking dust or vaporized flow from all directions to the laser protective mirror 100, avoiding turbulence caused by excessively strong local airflow or dust penetration risk caused by excessively weak local airflow. In this embodiment, the axis of the annular air groove 32 coincides with the axis of the first through hole 21, and the annular air groove 32 intersects with each of the first air grooves 31, thereby connecting the first air grooves 31 through the annular air groove 32. Of course, the shape and position of the annular air groove 32 can be selected according to the actual situation and are not limited to the methods discussed above.

[0031] refer to Figure 5 In some embodiments, the flow-blocking body 1 is further provided with a plurality of second air grooves 33. The second air grooves 33 extend radially along the through hole 2 and are alternately arranged with the first air grooves 31 in a circumferential manner. One end of the second air groove 33 is connected to the annular air groove 32, and the other end is connected to the through hole 2. This arrangement allows the second air grooves 33 to fill the circumferential gaps of the first air grooves 31, thereby increasing the number of air outlets in the circumferential direction of the through hole 2, eliminating air curtain gaps, and preventing dust or vaporized substances from passing through the air curtain gaps and adhering to the surface of the protective mirror 100, which helps to improve the reliability of the device. This embodiment shows that there are 8 second air grooves 33, with one second air groove 33 between every two first air grooves 31. Each second air groove 33 has a first end close to the through hole 2 and a second end away from the through hole 2, and the second end of each second air groove 33 is connected to the annular air groove 32. Of course, the number and position of the second air grooves 33 can be selected according to the actual situation and are not limited to the methods discussed above.

[0032] refer to Figures 1 to 3 In some embodiments, the diameter of the second through-hole 22 is smaller than the diameter of the first through-hole 21. This arrangement reduces the exposed area of ​​the protective lens 100, helping to reduce contamination of the protective lens 100 by dust or vapors. This embodiment shows the first through-hole 21 as a circular hole with a diameter of 20mm, and the second through-hole 22 as a rectangular hole with a length of 12mm and a width of 6mm. Of course, the shape and size of the first through-hole 21 and the second through-hole 22 can be selected according to actual conditions and are not limited to the methods discussed above.

[0033] refer to Figure 3 , Figure 7 and Figure 9 In some embodiments, the diameter of the second through-hole 22 gradually decreases from near the laser to far away from the laser. This configuration further reduces the exposed area of ​​the protective mirror 100, reducing contamination of the protective mirror 100 by dust or vapors. Simultaneously, it facilitates gas flow from the second through-hole 22 to the space between the second plate 12 and the wafer, allowing the gas, along with dust or vapors, to be drawn away by the exhaust fan. This embodiment shows that the cross-section of the second through-hole 22 is trapezoidal, with one end being a rectangular hole 12mm long and 6mm wide, and the other end being a rectangular hole 8mm long and 4mm wide. Of course, the shape and size of the second through-hole 22 can be selected according to actual conditions and are not limited to the methods discussed above.

[0034] refer to Figure 3 , Figure 7 and Figure 9In some embodiments, the side of the second plate 12 facing the first plate 11 is provided with a groove 5. This embodiment shows that the groove 5 is a circular groove, and the radius of the groove 5 is the distance from the air inlet end of the first air groove 31 to the axis of the first through hole 21. In the assembled state, both the air passage 3 and the first through hole 21 fall within the range of the groove 5, thus forming a gap to prevent gas from colliding with the side of the second plate 12 facing the first plate 11 after being ejected from the air outlet end of the air passage 3, causing the gas to change direction and failing to form a continuous and stable air curtain barrier within the through hole 2.

[0035] In some embodiments, the flow-blocking device further includes a sealing cap (not shown) disposed on the first plate 11 and sealing the gap between the first plate 11 and the laser, preventing airflow carrying dust and vapors from flowing out of the gap between the first plate 11 and the laser, thus preventing dust and vapors from adhering to the surface of the protective mirror 100 of the laser. This embodiment shows that the first plate 11 has internal threads on its inner wall (i.e., around the end of the first through hole 21), which can be used to install the sealing cap of the flow-blocking device.

[0036] The flow-blocking device in this embodiment can be disposed between the laser and the cutting surface. It can not only provide a through hole 2 for the laser to pass through, but also form an air curtain in the through hole 2 to prevent dust or vapors from flowing through the through hole 2 to the protective mirror 100 of the laser, thereby protecting the protective mirror 100 and preventing dust or vapors from flowing into the through hole 2 and adhering to the surface of the protective mirror 100, causing energy attenuation at the processing point, and helping to improve the grooving quality.

[0037] This application also provides a dust removal device, including a flow-blocking device. This flow-blocking device is the flow-blocking device described above; its specific structure has been described in detail previously and will not be repeated here.

[0038] The dust removal device in this application embodiment includes a flow-blocking device, which can be disposed between the laser and the cutting surface. It can not only provide a through hole 2 for the laser to pass through, but also form an air curtain in the through hole 2 to prevent dust or vapors from flowing through the through hole 2 to the protective mirror 100 of the laser, thereby protecting the protective mirror 100 and preventing dust or vapors from flowing into the through hole 2 and adhering to the surface of the protective mirror 100, causing energy attenuation at the processing point, and helping to improve the grooving quality.

[0039] This application also provides a laser cutting device, including the dust removal device described above. This dust removal device is the aforementioned dust removal device that includes a flow-blocking device; the specific structure of its flow-blocking device has been described in detail above and will not be repeated here.

[0040] The laser cutting equipment of this application embodiment includes a flow-blocking device, which can be disposed between the laser and the cutting surface. It can not only provide a through hole 2 for the laser to pass through, but also form an air curtain in the through hole 2 to prevent dust or vapors from flowing through the through hole 2 to the protective mirror 100 of the laser, thereby protecting the protective mirror 100 and preventing dust or vapors from flowing into the through hole 2 and adhering to the surface of the protective mirror 100, causing energy attenuation at the processing point, and helping to improve the grooving quality.

[0041] One or more embodiments in this specification are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of one or more embodiments in this specification should be included within the protection scope of this application.

[0042] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A flow-blocking device for preventing dust or vaporized material generated during laser wafer cutting from flowing towards a protective mirror of the laser, characterized in that, include: The flow-blocking body has a through hole for the laser to pass through to cut grooves in the wafer. The flow-blocking body has an air channel with its outlet connected to the through hole. The flow-blocking body also has an air inlet connected to the air channel for connecting to an air source. The air source supplies air to the air channel to form an air curtain within the through hole, preventing dust or vaporized material from flowing towards the laser's protective lens.

2. The flow-blocking device according to claim 1, characterized in that, The air passage includes a plurality of first air grooves, which extend radially along the through hole and are arranged at intervals circumferentially along the through hole. One end of the first air groove is connected to the air inlet, and the other end is connected to the through hole.

3. The flow-blocking device according to claim 2, characterized in that, The air passage also includes an annular air groove, which is arranged around the through hole and connects multiple first air grooves.

4. The flow-blocking device according to claim 3, characterized in that, The flow-blocking body is also provided with a plurality of second air grooves. The second air grooves extend radially along the through hole and are alternately arranged with the first air grooves at circumferential intervals. One end of the second air groove is connected to the annular air groove, and the other end is connected to the through hole.

5. The flow-blocking device according to claim 1, characterized in that, The flow-blocking body includes a first plate and a second plate, which are stacked from the direction closest to the laser to the direction furthest from the laser. The first plate has a first through hole that extends through its thickness, and the second plate has a second through hole corresponding to the first through hole. The air passage is provided on the side of the first plate facing the second plate.

6. The flow-blocking device according to claim 5, characterized in that, The diameter of the second through hole is smaller than the diameter of the first through hole.

7. The flow-blocking device according to claim 5, characterized in that, The diameter of the second through hole gradually decreases from the direction closer to the laser to the direction farther away from the laser.

8. The flow-blocking device according to claim 5, characterized in that, The second plate has a groove on the side facing the first plate.

9. A dust removal device, characterized in that, Includes the flow-blocking device as described in any one of claims 1-8.

10. A laser cutting device, characterized in that, Includes the dust removal device as described in claim 9.

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