A laser drilling machine

Abstract

The utility model discloses a kind of laser drilling machines, including coiling device, drilling device, coiling-out device and adsorption device;Coiling device, drilling device and coiling-out device are sequentially distributed;Drilling device includes rack, drilling platform and laser drilling assembly, drilling platform is installed in rack, laser drilling assembly is movably connected rack along X axis direction and Y axis direction;Adsorption device connects drilling platform.This drilling machine uses roll-to-roll working mode, coiling device, coiling-out device cooperate the positioning effect of adsorption device and drilling platform, can ensure that copper foil is not displaced in the process of drilling processing.Meanwhile, this drilling machine uses laser drilling assembly to drill, not limited to drill bit size, also not prone to vibration, can satisfy the demand of high-precision micro-hole drilling.In addition, adsorption device can also suck foreign matter generated by drilling processing while positioning and adsorbing copper foil, avoid foreign matter remaining on copper foil and affect the processing quality of copper foil.

Description

Technical Field

[0001] This utility model relates to the field of FPC processing technology, specifically to a laser drilling machine. Background Technology

[0002] In the production of flexible printed circuit boards (FPCs), mechanical drilling is typically used to process the required holes on copper foil. However, with the miniaturization of electronic products, the holes on FPCs also need to meet the requirements of micro-hole design. Mechanical drilling is limited by the size of the drill bit, making it difficult to meet the size requirements of micro-hole processing. Furthermore, the thinner and longer the drill bit, the greater the vibration during drilling, resulting in lower drilling accuracy. This makes it increasingly impossible to meet the needs of high-precision micro-hole drilling, thus requiring a device that can achieve high-precision micro-hole drilling. Utility Model Content

[0003] In order to overcome the shortcomings of the existing technology, the purpose of this utility model is to provide a laser drilling machine that can improve drilling accuracy and copper foil processing quality, and meet the needs of high-precision micro-hole drilling.

[0004] To solve the above problems, the technical solution adopted by this utility model is as follows: A laser drilling machine includes a winding device, a drilling device, a winding-out device, and an adsorption device; the winding device, the drilling device, and the winding-out device are arranged sequentially; the winding device is used to rotate and release copper foil; the drilling device is used to drill holes in the copper foil; and the winding-out device is used to wind up the copper foil; the drilling device includes a frame, a drilling platform, and a laser drilling assembly; the drilling platform is mounted on the frame; and the laser drilling assembly is movably connected to the frame along the X-axis and Y-axis directions; the adsorption device is connected to the drilling platform and is used to adsorb the copper foil onto the drilling platform.

[0005] Compared to existing technologies, the advantages of this invention are as follows: This drilling machine adopts a roll-to-roll working mode. The winding and unwinding devices, along with the positioning function of the adsorption device and the drilling platform, ensure the accurate positioning of the copper foil and prevent displacement during drilling. Simultaneously, this drilling machine uses a laser drilling assembly, which is not limited by drill bit size and is less prone to vibration, further improving drilling accuracy and meeting the requirements of high-precision micro-hole drilling. Furthermore, while positioning and adsorbing the copper foil, the adsorption device can also remove foreign matter generated during drilling, preventing foreign matter residue from remaining on the copper foil and affecting its processing quality.

[0006] The aforementioned laser drilling machine, the drilling device further includes a first lifting assembly disposed on the frame, the first lifting assembly being used to lift the copper foil upward.

[0007] The aforementioned laser drilling machine has two sets of first lifting components. One set of the first lifting components is located between the winding device and the drilling platform, and the other set of the first lifting components is located between the drilling platform and the winding device.

[0008] The aforementioned laser drilling machine includes a first lifting assembly comprising a first driving component, a first material support base plate, a top material roller, and an ion rod. The first driving component is mounted on the frame, the first material support base plate is connected to the output end of the first driving component, the top material roller is rotatably connected to the first material support base plate, the ion rod is connected to the first material support base plate, and there is a gap between the ion rod and the top material roller that allows copper foil to pass through.

[0009] The aforementioned laser drilling machine further includes a second lifting assembly disposed on the frame, the second lifting assembly being located between the drilling platform and another set of the first lifting assemblies.

[0010] The laser drilling machine described above includes a second lifting component, a lifting plate, and a second material support base plate. The second driving component is mounted on the frame, and the lifting plate is connected to the output end of the second driving component. The lifting plate has a first inclined surface, and the second material support base plate has a second inclined surface. The second material support base plate is located on the upper part of the lifting plate, and the second inclined surface abuts against the first inclined surface.

[0011] The laser drilling machine described above includes a mounting frame, a galvanometer, and a dust collection component. The mounting frame is movably connected to the machine frame along the X-axis and Y-axis directions, and the galvanometer and the dust collection component are mounted on the mounting frame.

[0012] In the aforementioned laser drilling machine, the dust collection component includes a third driving component and a dust collection chamber. The third driving component is mounted on the mounting frame, and the dust collection chamber is mounted on the output end of the third driving component, and the dust collection chamber is connected to the adsorption device.

[0013] The laser drilling machine described above, the laser drilling assembly also includes a camera mounted on the mounting bracket.

[0014] The aforementioned laser drilling machine also includes a water cooling device, which is used to cool the drilling device.

[0015] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0016] Figure 1 This is a front-axis view of the laser drilling machine according to an embodiment of the present invention; Figure 2This is a rear axial view of the laser drilling machine according to an embodiment of the present invention; Figure 3 This is a partial structural schematic diagram of the winding device, drilling device, and winding device according to an embodiment of the present utility model. Figure 4 This is a schematic diagram of the drilling device according to an embodiment of the present utility model; Figure 5 This is a schematic diagram of the drilling platform according to an embodiment of the present utility model; Figure 6 This is a schematic diagram of the structure of the laser drilling assembly according to an embodiment of the present invention; Figure 7 This is a schematic diagram of the structure of the first lifting component according to an embodiment of the present utility model; Figure 8 This is a schematic diagram of the structure of the second lifting component according to an embodiment of the present utility model.

[0017] Explanation of icon numbers: 100 winding device; 200 Drilling device, 210 Frame, 220 Drilling platform, 221 Fixed frame, 222 Honeycomb structure, 230 Laser drilling assembly, 231 Mounting bracket, 232 Galvanometer, 233 Dust collection assembly, 2331 Third drive component, 2332 Dust collection chamber, 240 First lifting assembly, 241 First drive component, 242 First material support base plate, 243 Top material roller, 244 Ion rod, 250 Second lifting assembly, 251 Second drive component, 252 Lifting plate, 2521 First inclined surface, 253 Second material support base plate, 2531 Second inclined surface, 2532 Z-axis slide rail, 254 Pad plate; 300 winding device; 400 adsorption device; 500 water cooling unit. Detailed Implementation

[0018] The embodiments of this utility model are described in detail below, with reference to Figures 1 to 8This utility model provides a laser drilling machine, including a winding device 100, a drilling device 200, a winding-out device 300, and an adsorption device 400. The winding device 100, drilling device 200, and winding-out device 300 are sequentially distributed along the X-axis, and the adsorption device 400 is located behind the drilling device 200. The winding device 100 is used to rotate and release copper foil, the drilling device 200 is used to drill holes in the copper foil, and the winding-out device 300 is used to wind up the copper foil. The copper foil rotated and released from the winding device 100 passes through the drilling device 200, stops moving forward at the drilling device 200, and is laser-drilled by the drilling device 200. After drilling, it is wound up by the winding-out device 300. Both the winding device 100 and the winding-out device 300 can use multiple spools in conjunction with a motor to realize the winding and releasing of copper foil, and can be used with a correction system to correct the movement of the copper foil.

[0019] Furthermore, referring to Figures 4 to 6 The drilling apparatus 200 includes a frame 210, a drilling platform 220, and a laser drilling assembly 230. The drilling platform 220 is mounted on the frame 210, and the laser drilling assembly 230 is movably connected to the frame 210 along the X-axis and Y-axis directions. An adsorption device 400 is connected to the drilling platform 220. When the copper foil moves forward to below the laser drilling assembly 230, the adsorption device 400 adsorbs the copper foil onto the drilling platform 220. The laser drilling assembly 230 moves along the X-axis and Y-axis directions to perform laser drilling at the target position of the copper foil.

[0020] This drilling machine adopts a roll-to-roll working mode. The winding device 100 and winding device 300, together with the adsorption device 400 and the drilling platform 220, ensure the accurate positioning of the copper foil and prevent it from shifting during the drilling process. Simultaneously, this drilling machine uses a laser drilling assembly 230 for drilling, which is not limited by drill bit size and is less prone to vibration, further improving drilling accuracy and meeting the requirements of high-precision micro-hole drilling. Furthermore, while positioning and adsorbing the copper foil, the adsorption device 400 can also remove foreign matter generated during drilling, preventing foreign matter residue from remaining on the copper foil and affecting the processing quality.

[0021] Furthermore, the adsorption device 400 can be a general device with negative pressure function, located behind the drilling device 200, and connected to the drilling platform 220 through a structure such as an air pipe. It uses negative pressure to adsorb and fix the copper foil to the drilling platform 220, and absorbs the debris generated during drilling. Furthermore, a water cooling device 500 is also provided behind the drilling device 200. The water cooling device 500 includes a water chiller and circulating water pipes, which cool the drilling device 200 through water cooling.

[0022] Furthermore, referring to Figure 3 , Figure 4 and Figure 7The drilling apparatus 200 also includes a first lifting assembly 240 disposed on the frame 210. The first lifting assembly 240 is used to lift the copper foil upward. There are two sets of the first lifting assembly 240. One set of the first lifting assembly 240 is located between the winding device 100 and the drilling platform 220, and the other set of the first lifting assembly 240 is located between the drilling platform 220 and the winding device 300. During the process of the winding device 100 and the winding device 300 moving the copper foil forward, the two sets of first lifting assemblies 240 lift the copper foil upward, so that the copper foil is detached from the drilling platform 220, making the forward movement of the copper foil smoother and preventing friction and pulling, thus ensuring the surface quality of the copper foil. When the copper foil has moved forward to the correct position, the two sets of first lifting assemblies 240 descend, causing the copper foil to descend close to the drilling platform 220 and be adsorbed and fixed on the drilling platform 220 by the adsorption device 400.

[0023] Specifically, refer to Figure 7 The first lifting assembly 240 includes a first driving component 241, a first material support base plate 242, a top material roller 243, and an ion bar 244. The first driving component 241 can be a cylinder or similar structure and is mounted on the frame 210. The first material support base plate 242 is connected to the output end of the first driving component 241. The top material roller 243 is rotatably connected to the first material support base plate 242. The ion bar 244 is connected to the first material support base plate 242, and there is a gap between the ion bar 244 and the top material roller 243 that allows copper foil to pass through. When the copper foil moves forward, the first driving component 241 lifts the first material support base plate 242 upward, thereby moving the copper foil upward as well. When the copper foil moves forward, the top material roller 243 rotates relative to the first material support base plate 242 to make the copper foil move forward more smoothly. The ion bar 244 at the top can reduce static electricity on the copper foil to avoid affecting subsequent drilling.

[0024] Furthermore, referring to Figure 3 , Figure 4 and Figure 8 The drilling device 200 also includes a second lifting assembly 250 disposed on the frame 210. The second lifting assembly 250 is located between the drilling platform 220 and another set of first lifting assemblies 240 to assist in supporting the copper foil, making the positioning of the copper foil more stable. Specifically, refer to... Figure 8The second lifting assembly 250 includes a second driving component 251, a lifting plate 252, and a second material-supporting base plate 253. The second driving component 251 is mounted on the frame 210, and the lifting plate 252 is connected to the output end of the second driving component 251. The lifting plate 252 has a first inclined surface 2521, and the second material-supporting base plate 253 has a second inclined surface 2531. The second material-supporting base plate 253 is located on the upper part of the lifting plate 252, and the second inclined surface 2531 abuts against the first inclined surface 2521. The frame 210 has a Z-axis slide groove, and the side of the second material-supporting base plate 253 is connected to the Z-axis slide groove via a Z-axis slide rail 2532. When the second driving member 251 drives the lifting plate 252 to move forward, under the action of the first inclined surface 2521 and the second inclined surface 2531, and under the limiting action of the Z-axis slide rail 2532 and the Z-axis slide groove, the second material support base plate 253 will move upward, and the pad plate 254 on it will support the copper foil below.

[0025] Furthermore, referring to Figure 5 The drilling platform 220 includes a fixed frame 221 and a honeycomb structure 222 located within the fixed frame 221. Each unit of the honeycomb structure 222 has openings on its sidewall, allowing the adsorption device 400 to create a negative pressure within the honeycomb structure 222 to adsorb the copper foil onto the drilling platform 220. Furthermore, the honeycomb structure 222 provides clearance for laser drilling, ensuring that the laser drilling assembly 230 can drill smoothly into the copper foil without damaging the drilling platform 220. Further, referring to… Figure 6 The laser drilling assembly 230 includes a mounting bracket 231, a galvanometer 232, and a dust collection assembly 233. The mounting bracket 231 is movably connected to the frame 210 along the X-axis and Y-axis directions. The galvanometer 232 and the dust collection assembly 233 are mounted on the mounting bracket 231.

[0026] Furthermore, the dust collection assembly 233 includes a third driving component 2331 and a dust collection chamber 2332. The third driving component 2331 is mounted on the mounting bracket 231, and the dust collection chamber 2332 is mounted on the output end of the third driving component 2331. The dust collection chamber 2332 is connected to the adsorption device 400. Under the action of the adsorption device 400, debris generated on the surface of the copper foil can be sucked into the dust collection chamber 2332, further ensuring the quality of the copper foil. Furthermore, the laser drilling assembly 230 also includes a camera mounted on the mounting bracket 231, which can assist in positioning the copper foil and laser processing, improving processing accuracy.

[0027] It should be noted that in the description of this utility model, any descriptions of orientation, such as up, down, front, back, left, right, etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed or operated in a specific orientation, and should not be construed as a limitation of this utility model.

[0028] In the description of this utility model, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" or "second" is mentioned, it is only for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0029] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0030] The above embodiments are merely preferred embodiments of this utility model and should not be construed as limiting the scope of protection of this utility model. Any non-substantial changes and substitutions made by those skilled in the art based on this utility model shall fall within the scope of protection claimed by this utility model.

Claims

1. A laser drilling machine, characterized in that, It includes a winding device (100), a drilling device (200), a winding device (300), and an adsorption device (400). The winding device (100), the drilling device (200) and the winding device (300) are arranged in sequence. The winding device (100) is used to rotate and release the copper foil. The drilling device (200) is used to drill holes in the copper foil. The winding device (300) is used to wind up the copper foil. The drilling device (200) includes a frame (210), a drilling platform (220), and a laser drilling assembly (230). The drilling platform (220) is mounted on the frame (210), and the laser drilling assembly (230) is movably connected to the frame (210) along the X-axis and Y-axis directions. The adsorption device (400) is connected to the drilling platform (220) and is used to adsorb copper foil onto the drilling platform (220).

2. The laser drilling machine according to claim 1, characterized in that, The drilling device (200) further includes a first lifting assembly (240) disposed on the frame (210), the first lifting assembly (240) being used to lift the copper foil upward.

3. The laser drilling machine according to claim 2, characterized in that, The first lifting assembly (240) is provided in two sets. One set of the first lifting assembly (240) is located between the winding device (100) and the drilling platform (220), and the other set of the first lifting assembly (240) is located between the drilling platform (220) and the winding device (300).

4. The laser drilling machine according to claim 2 or 3, characterized in that, The first lifting assembly (240) includes a first driving member (241), a first material support base plate (242), a top material roller (243), and an ion bar (244). The first driving member (241) is mounted on the frame (210). The first material support base plate (242) is connected to the output end of the first driving member (241). The top material roller (243) is rotatably connected to the first material support base plate (242). The ion bar (244) is connected to the first material support base plate (242), and there is a gap between the ion bar (244) and the top material roller (243) that allows copper foil to pass through.

5. The laser drilling machine according to claim 3, characterized in that, The drilling device (200) further includes a second lifting assembly (250) disposed on the frame (210), the second lifting assembly (250) being disposed between the drilling platform (220) and another set of the first lifting assemblies (240).

6. The laser drilling machine according to claim 5, characterized in that, The second lifting assembly (250) includes a second driving member (251), a lifting plate (252), and a second material support base plate (253). The second driving member (251) is mounted on the frame (210). The lifting plate (252) is connected to the output end of the second driving member (251). The lifting plate (252) has a first inclined surface (2521). The second material support base plate (253) has a second inclined surface (2531). The second material support base plate (253) is located on the upper part of the lifting plate (252), and the second inclined surface (2531) abuts against the first inclined surface (2521).

7. The laser drilling machine according to claim 1, characterized in that, The laser drilling assembly (230) includes a mounting bracket (231), a galvanometer (232), and a dust collection assembly (233). The mounting bracket (231) is movably connected to the frame (210) along the X-axis and Y-axis directions. The galvanometer (232) and the dust collection assembly (233) are mounted on the mounting bracket (231).

8. The laser drilling machine according to claim 7, characterized in that, The vacuuming assembly (233) includes a third drive (2331) and a vacuum chamber (2332). The third drive (2331) is mounted on the mounting bracket (231), and the vacuum chamber (2332) is mounted on the output end of the third drive (2331). The vacuum chamber (2332) is connected to the adsorption device (400).

9. The laser drilling machine according to claim 7, characterized in that, The laser drilling assembly (230) also includes a camera mounted on the mounting bracket (231).

10. The laser drilling machine according to claim 1, characterized in that, It also includes a water cooling device (500) for cooling the drilling device (200).

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