Soldering fixture for semiconductor systems

Abstract

The utility model relates to a kind of welding fixture for semiconductor system, belong to the technical field of semiconductor system welding.It includes bottom plate assembly, copper plate assembly, pressing plate assembly, pin clamp and pressure head assembly, through the containment cavity formed by pressing plate combination to limit copper plate, signal pin is accurately positioned using the limiting hole on pin clamp, and copper clad laminate is pressed down by pressure head assembly across pin clamp, the collaborative positioning and compression of multiple components in semiconductor system welding process are realized, and clamping efficiency and welding quality are effectively improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor system welding technology, and in particular to a welding fixture for semiconductor systems. Background Technology

[0002] With the development of semiconductor packaging technology, a process for soldering semiconductor systems has emerged. This process typically requires precise positioning and fixation of multiple components, such as copper base plates, copper-clad substrates, and signal pins, during the soldering process to ensure soldering accuracy and reliability.

[0003] In related technologies, general-purpose fixtures are typically used for individual fixation. For example, multiple positioning blocks are used to constrain the position of the copper base plate, and multiple plug-in positioning blocks are used to insert and position the signal pins.

[0004] However, the above method requires the use of a large number of independent positioning structures, which has problems such as poor positioning coordination and low clamping efficiency. Furthermore, due to the lack of a unified positioning reference between the components, relative positional shifts are prone to occur under the action of welding heat, resulting in welding misalignment or incomplete welding. At the same time, repeated adjustments and clamping also reduce production efficiency. Utility Model Content

[0005] In response to the shortcomings of the existing manufacturing technology, the applicant provides a welding fixture for semiconductor systems, which enables coordinated positioning between different parts in the height direction, resulting in good positioning coordination and high clamping efficiency.

[0006] The technical solution adopted in this utility model is as follows: A welding fixture for a semiconductor system includes a base plate assembly on which a copper plate assembly is disposed; In the height direction, it also includes a pressure plate assembly disposed on the copper plate assembly. The pressure plate assembly includes a first pressure plate and a second pressure plate arranged symmetrically along the length direction. The first pressure plate and the second pressure plate together form a cavity for accommodating the copper plate assembly. In the height direction, a pin clamp is also disposed above the copper plate assembly, the pin clamp being used to limit the signal pins on the copper plate assembly; It also includes a pressure head assembly that passes through the pin clamp and abuts against the upper surface of the copper plate assembly.

[0007] As a further improvement to the above technical solution: In one embodiment, the base plate assembly includes a base plate body having honeycomb holes.

[0008] In one embodiment, the copper plate assembly includes a copper plate body, a copper plate column extending downward in the height direction of the copper plate body, the copper plate column engaging with the honeycomb holes of the base plate assembly; a copper-clad substrate is disposed on the upper surface of the copper plate body in the height direction, and solder is present between the copper plate body and the copper-clad substrate; a chip, signal pins, and aluminum wires are disposed on the copper-clad substrate.

[0009] In one embodiment, a first positioning hole is provided at each of the four corners of the edge of the copper plate body.

[0010] In one embodiment, the pin clamp includes a clamp body, and a first guide post extends downward in the height direction at the four corners of the edge of the clamp body, the first guide post cooperating with the first positioning hole.

[0011] In one embodiment, the fixture body has a plurality of second positioning holes and through holes, the through holes being located directly above the copper-clad substrate in the height direction, and the second positioning holes being located on the outer periphery of the through holes; the fixture body also has a plurality of signal pin limiting holes, the signal pin limiting holes cooperating with the signal pins.

[0012] In one embodiment, the pressure head assembly includes a pressure head body, the pressure head body having a second guide post extending downward in the height direction, the second guide post engaging with the second positioning hole in the height direction.

[0013] In one embodiment, the pressure head body further includes a pressure column extending downward in the height direction, which passes through the through hole and contacts the upper surface of the copper-clad substrate.

[0014] In one embodiment, a handle is provided on each side of the base plate body of the base plate assembly.

[0015] In one embodiment, the handle has a ring-shaped arch structure.

[0016] The beneficial effects of this utility model are as follows: This invention features a compact structure. Through the layered design of the base plate assembly, pressure plate assembly, pin clamp, and pressure head assembly, a unified spatial positioning reference is constructed. All components to be soldered, such as the copper base plate, copper-clad substrate, chip, and signal pins, are orderly constrained in their correct positions. This effectively avoids the problems of inconsistent references and large cumulative errors caused by the use of multiple independent clamps in traditional methods, thus structurally ensuring the alignment accuracy before soldering.

[0017] This utility model also has the following advantages: This invention employs a pressure plate assembly to form a receiving cavity, enabling rapid placement and restraint of the copper plate assembly. The pin clamp, through its downward guide post engaging with the positioning holes on the copper plate, accurately positions and limits all signal pins in one operation, significantly reducing adjustment and clamping time and improving production efficiency. Furthermore, in practical applications, in related technologies, heat during welding causes metal components to expand; the cavity formed by the pressure plate assembly in this application restricts the horizontal movement of the copper plate. Secondly, after the pressure head assembly passes through the pin clamp, its downward pressing post directly applies pressure to the upper surface of the copper-clad substrate, firmly pressing it against the bottom copper plate. This pressure ensures that even under thermal expansion, the copper-clad substrate and the copper plate maintain close contact, preventing incomplete soldering and welding misalignment caused by displacement.

[0018] The pin clamp of this utility model has signal pin limiting holes that correspond one-to-one with the signal pins. These holes not only ensure the perpendicularity of the signal pins, but also provide all-round protection for the small and fragile signal pins during handling and welding, preventing them from bending or being damaged by bumps, thus ensuring the yield of the product. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0020] Figure 2 This is a schematic diagram of the mating structure of the base plate assembly and the pressure plate assembly of this utility model.

[0021] Figure 3 This is a schematic diagram of the copper plate assembly of this utility model.

[0022] Figure 4 This is a schematic diagram of the pin clamp of this utility model.

[0023] Figure 5 This is a schematic diagram of the pressure head assembly of this utility model.

[0024] Among them: 100, base plate assembly; 200, copper plate assembly; 300, pressure plate assembly; 400, pin clamp; 500, pressure head assembly; 600, handle; 110. Base plate main body; 120. Honeycomb holes; 210. Copper plate body; 220. Copper plate column; 230. Copper-clad substrate; 240. Chip; 250. Signal pin; 260. Aluminum wire; 270. First positioning hole; 310. First pressure plate; 320. Second pressure plate; 410. Fixture body; 420. First guide post; 430. Second positioning hole; 440. Through hole; 450. Signal pin limiting hole; 510. Pressure head body; 520. Second guide column; 530. Pressing column. Detailed Implementation

[0025] The specific embodiments of this utility model are described below with reference to the accompanying drawings.

[0026] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this utility model.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0028] When using the terms “including,” “having,” and “comprising” as described herein, another component may be added unless explicitly qualifying terms such as “only,” “consisting of,” etc. are used. Unless otherwise stated, singular terms may include plural forms and should not be construed as having a quantity of one.

[0029] It should be understood that although the terms "first," "second," etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the scope of this invention, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0030] Furthermore, the accompanying drawings are not drawn to a 1:1 scale, and the relative dimensions of the components are shown in the drawings only as examples and not necessarily to actual scale.

[0031] like Figures 1-5 The accompanying drawing shows a schematic diagram of the structural state of a welding fixture for a semiconductor system according to an embodiment of the present invention; for ease of description, the drawing only shows the structure related to the embodiment of the present invention.

[0032] This application provides a welding fixture for a semiconductor system, including a base plate assembly 100, a copper plate assembly 200 disposed on the base plate assembly 100, a pressure plate assembly 300 located above the copper plate assembly 200, a pin clamp 400 disposed above the copper plate assembly 200, and a pressure head assembly 500 passing through the pin clamp 400; in addition, a handle 600 is provided on each side of the base plate assembly 100 for easy handling and operation.

[0033] Please see Figure 2 In some embodiments, the base plate assembly 100 includes a base plate body 110, which is typically a rectangular plate structure made of a rigid material to provide stable support. Multiple honeycomb holes 120 are formed on the base plate body 110, distributed in an array, which not only reduces the overall weight but also provides a positioning interface. The base plate assembly 100 serves as the base of the fixture and engages with the copper plate assembly 200 through the honeycomb holes 120.

[0034] Please see Figure 3 As shown, in some embodiments, the copper plate assembly 200 includes a copper plate body 210, and the copper plate body 210 extends downward in the height direction with a plurality of copper plate pillars 220. The copper plate pillars 220 are inserted into the honeycomb holes 120 of the base plate assembly 100 in a one-to-one correspondence, ensuring that the copper plate assembly 200 cannot move in the horizontal plane and achieving precise alignment. A copper-clad substrate 230 is provided on the upper surface of the copper plate body 210. Solder is provided between the copper plate body 210 and the copper-clad substrate 230, and semiconductor components such as chip 240, signal pin 250 and aluminum wire 260 are integrated on the copper-clad substrate 230. Signal pins 250 are vertically arranged on copper-clad substrate 230; First positioning holes 270 are provided at the four corners of the edge of the copper plate body 210. These holes are used to cooperate with the pin clamp 400 to provide a positioning reference in the vertical direction.

[0035] Continue to refer to Figures 1-2 In some embodiments, the pressure plate assembly 300 is located above the copper plate assembly 200 and includes a first pressure plate 310 and a second pressure plate 320 arranged symmetrically along the length direction. The first pressure plate 310 and the second pressure plate 320 are fixed to the base plate assembly 100 by bolts or snap-fit ​​structures, and the two together form a cavity for accommodating the copper plate assembly 200; This cavity restricts the horizontal displacement of the copper plate assembly 200, especially preventing component misalignment under welding heat. The design of the pressure plate assembly 300 allows for quick assembly and disassembly, improving operational efficiency.

[0036] like Figure 4As shown, in some embodiments, the pin clamp 400 includes a clamp body 410, which is typically a plate-like structure covering the copper plate assembly 200. At the four corners of the clamp body 410, a first guide post 420 extends downward in the height direction. The first guide post 420 precisely engages with the first positioning hole 270 on the copper plate body 210 to ensure that the pin clamp 400 is aligned with the copper plate assembly 200 during installation. The fixture body 410 is provided with a plurality of second positioning holes 430 and through holes 440. The through holes 440 are located directly above the copper-clad substrate 230 in the height direction, allowing the pressure head assembly 500 to pass through. The second positioning hole 430 is distributed on the outer periphery of the through hole 440 and is used to cooperate with the pressure head assembly 500. In addition, the fixture body 410 is also provided with a plurality of signal pin limiting holes 450, which are inserted into the signal pins 250 one by one to limit the perpendicularity and position of the signal pins 250 and prevent them from bending or being damaged during the welding process.

[0037] like Figure 5 As shown, in some embodiments, the pressure head assembly 500 includes a pressure head body 510, and the pressure head body 510 has a second guide post 520 extending downward in the height direction. The second guide post 520 engages with the second positioning hole 430 on the pin clamp 400 to ensure that the pressure head assembly 500 remains vertically aligned during descent. The pressure head body 510 also includes a pressing column 530 extending downward in the height direction. After passing through the through hole 440 of the pin clamp 400, the pressing column 530 directly contacts the upper surface of the copper-clad substrate 230. During welding, external pressure is applied to the pressure head body 510, and the pressure column 530 presses the copper-clad substrate 230 tightly onto the copper plate body 210, eliminating gaps and resisting thermal deformation to ensure welding quality.

[0038] In one specific embodiment, a handle 600 is provided on each side of the base plate body 110. The handle 600 has a ring-shaped arch structure, which facilitates the operator to grip and move the clamp. The handle 600 is fixed to the base plate body 110 by welding or bolting, which enhances the ergonomics and improves the safety of clamping and handling.

[0039] In practical applications, the copper plate assembly 200 is first installed in the honeycomb holes 120 of the base plate assembly 100 through the copper plate column 220 to achieve initial positioning; Subsequently, the first pressure plate 310 and the second pressure plate 320 of the pressure plate assembly 300 are closed and fixed to form a receiving cavity to confine the copper plate assembly 200. Next, the pin clamp 400 is installed by engaging the first guide post 420 with the first positioning hole 270, so that the signal pin 250 is inserted into the signal pin limiting hole 450; Finally, the second guide post 520 of the pressure head assembly 500 is aligned with the second positioning hole 430 and inserted, and the pressing post 530 passes through the through hole 440 to press the copper-clad substrate 230. This invention has a reasonable structure, and the entire assembly process does not require complex adjustments. It achieves coordinated positioning of multiple components, effectively improving clamping efficiency and welding reliability. It solves the problems of poor positioning coordination and easy thermal displacement of traditional welding fixtures, and is particularly suitable for high-precision welding processes of semiconductor systems.

[0040] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0041] The embodiments described above merely illustrate the implementation of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A welding fixture for semiconductor systems, characterized in that: Includes a base plate assembly (100), on which a copper plate assembly (200) is disposed; In the height direction, it also includes a pressure plate assembly (300) disposed on the copper plate assembly (200), the pressure plate assembly (300) including a first pressure plate (310) and a second pressure plate (320) symmetrically arranged along the length direction, the first pressure plate (310) and the second pressure plate (320) together form a cavity for accommodating the copper plate assembly (200); In the height direction, a pin clamp (400) is also disposed above the copper plate assembly (200), the pin clamp (400) being used to limit the signal pins (250) on the copper plate assembly (200); It also includes a pressure head assembly (500) that passes through the pin clamp (400) and abuts against the upper surface of the copper plate assembly (200).

2. The welding fixture for semiconductor systems according to claim 1, characterized in that: The base plate assembly (100) includes a base plate body (110), on which honeycomb holes (120) are formed.

3. The welding fixture for semiconductor systems according to claim 1, characterized in that: The copper plate assembly (200) includes a copper plate body (210), and a copper plate column (220) extends downward in the height direction of the copper plate body (210). The copper plate column (220) cooperates with the honeycomb holes (120) of the base plate assembly (100). The copper plate body (210) has a copper-clad substrate (230) on its upper surface in the height direction, and solder is provided between the copper plate body (210) and the copper-clad substrate (230); The copper-clad substrate (230) is provided with a chip (240), a signal pin (250) and an aluminum wire (260).

4. The welding fixture for semiconductor systems according to claim 3, characterized in that: The copper plate body (210) has a first positioning hole (270) at each of the four corners of its edge.

5. The welding fixture for semiconductor systems according to claim 4, characterized in that: The pin clamp (400) includes a clamp body (410), and a first guide post (420) extends downward in the height direction at the four corners of the edge of the clamp body (410). The first guide post (420) cooperates with the first positioning hole (270).

6. The welding fixture for semiconductor systems according to claim 5, characterized in that: The fixture body (410) is provided with a plurality of second positioning holes (430) and through holes (440). The through holes (440) are located directly above the copper-clad substrate (230) in the height direction, and the second positioning holes (430) are located on the outer periphery of the through holes (440). The fixture body (410) is also provided with a plurality of signal needle limiting holes (450), which cooperate with the signal needle (250).

7. The welding fixture for semiconductor systems according to claim 6, characterized in that: The pressure head assembly (500) includes a pressure head body (510), and the pressure head body (510) has a second guide post (520) extending downward in the height direction. The second guide post (520) and the second positioning hole (430) are engaged in the height direction.

8. The welding fixture for semiconductor systems according to claim 7, characterized in that: The pressure head body (510) also includes a pressure column (530) extending downward in the height direction, which passes through the through hole (440) and contacts the upper surface of the copper-clad substrate (230).

9. The welding fixture for semiconductor systems according to claim 1, characterized in that: The base plate assembly (100) has a handle (600) on each side of the base plate body (110).

10. The welding fixture for semiconductor systems according to claim 9, characterized in that: The handle (600) has a ring-shaped arch structure.

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