An apparatus for chamfering a substrate

Abstract

The utility model discloses a device for base sheet chamfer processing, include: main frame, moving mechanism, tool structure, rotating mechanism and chamfer polishing structure, chamfer polishing structure includes installation mechanism, limiting mechanism and adjusting mechanism, installation mechanism includes mounting panel, the first motor of fixed on mounting panel and installation component, adjusting mechanism is located below mounting panel and is close to the side arrangement of first motor, limiting mechanism is located below mounting panel and is close to the side arrangement of installation component, adjusting mechanism is linked with mounting panel transmission, is used for driving mounting panel to rotate in vertical plane around articulated point to installation mechanism and limiting mechanism abuts, to make installation mechanism be located in working condition, tool structure includes grinding disc and polishing disc, and rotating mechanism can drive chamfer polishing structure horizontal rotation to the base sheet on installation component and grinding disc and polishing disc one corresponding. The utility model can realize to the chamfer of quartz piece, and to the polishing of the formed chamfer.

Description

Technical Field

[0001] This utility model relates to the field of quartz processing technology, specifically to a device for chamfering substrates. Background Technology

[0002] Quartz has a very low coefficient of thermal expansion, resulting in minimal dimensional change with temperature variations. This gives it excellent resistance to thermal shock, allowing it to withstand rapid temperature changes without easily breaking. With a Mohs hardness of approximately 7, it is considered a relatively hard material, resistant to scratches and wear. Furthermore, its high melting point ensures stable physical properties and structure over a wide temperature range. Combined with its piezoelectric effect, this makes it widely used in hemispherical resonator gyroscopes, such as in the fabrication of hemispherical resonator oscillators and the creation of spherical or planar electrodes to excite their oscillation. To meet the clamping requirements before product processing or the assembly requirements of the final product, chamfering is typically required on the cylindrical quartz body or quartz sheet. In addition, to meet the surface roughness requirements of high-precision parts manufacturing, the chamfered edges also need to be polished.

[0003] Currently, conventional grinding tools and triaxial machining equipment are generally used to chamfer quartz plates. After chamfering, a polishing tool made of fine and soft material is used to polish the chamfer. This process is not only cumbersome and time-consuming, but also makes it difficult to ensure the coaxiality of the quartz plate and the chamfer. Utility Model Content

[0004] In view of the problems in the background art, this utility model proposes a device for substrate chamfering processing that can chamfer quartz sheets and polish the formed chamfer.

[0005] The present invention adopts the following technical solution: An apparatus for chamfering substrates, comprising: The system includes a main frame, a moving mechanism and a tool structure mounted on the main frame, a rotating mechanism mounted on the moving mechanism, and a chamfering and polishing structure mounted on the rotating mechanism. The chamfering and polishing structure includes a mounting mechanism, a limiting mechanism, and an adjusting mechanism. The mounting mechanism includes a mounting plate, a first motor fixed to the mounting plate, and a mounting assembly. The mounting plate is hinged to a rotating mechanism, and the substrate is fixed to the mounting assembly. The first motor is connected to the mounting assembly for driving the substrate to rotate axially via the mounting assembly. Both the adjustment mechanism and the limiting mechanism are located below the mounting plate, and are respectively located on both sides of the mounting plate hinge point along the length of the mounting plate. The adjustment mechanism is arranged on the side closer to the first motor, and the limiting mechanism is arranged on the side closer to the mounting assembly. The adjustment mechanism is connected to the mounting plate drive and is used to drive the mounting plate to rotate around the hinge point in the vertical plane until the mounting mechanism abuts against the limiting mechanism, so that the mounting mechanism is in the working state. The tool structure includes a grinding wheel and a polishing disc, both of which can rotate horizontally relative to the main frame. The rotation mechanism can drive the chamfering polishing structure to rotate horizontally until the substrate on the mounting assembly corresponds to one of the grinding wheel and polishing disc. The moving mechanism is used to drive the rotation mechanism and the chamfering polishing structure to move so that the edge of the substrate abuts against the grinding wheel or polishing disc at a suitable machining position.

[0006] Optionally, the moving mechanism includes a horizontal moving mechanism and a vertical moving mechanism. The horizontal moving mechanism is mounted on the main frame, the vertical moving mechanism is slidably mounted on the horizontal moving mechanism, and the rotating mechanism is mounted on the vertical moving mechanism. The horizontal moving mechanism is used to drive the vertical moving mechanism, the rotating mechanism, and the chamfering and polishing structure to move horizontally so that the substrate moves to a position suitable for processing with the grinding wheel or polishing disc. The vertical moving mechanism is used to drive the rotating mechanism and the chamfering and polishing structure to move up and down so that the edge of the substrate abuts or dismounts from the position suitable for processing with the grinding wheel or polishing disc.

[0007] Optionally, the horizontal moving mechanism includes a horizontal slide rail, a horizontal slide table, and a first driving mechanism. The horizontal slide rail and the first driving mechanism are fixed on the main frame, the horizontal slide table is slidably mounted on the horizontal slide rail, the vertical moving mechanism is fixed on the horizontal slide table, and the first driving mechanism is connected to the horizontal slide table for driving the horizontal slide table to move horizontally along the horizontal slide rail.

[0008] Optionally, the vertical moving mechanism includes a spur gear seat, a vertical slide table, a first gear, and a second driving mechanism. The spur gear seat is fixed on the horizontal slide table, and a vertical slide rail is provided on its wall facing the rotating mechanism. A spur gear segment is provided on the vertical slide rail, and the first gear is meshed and connected to the spur gear segment. The vertical slide table slides on the vertical slide rail and is fixedly connected to the first gear. The second driving mechanism is connected to the first gear and is used to drive the first gear to rotate, thereby driving the vertical slide table to move up and down along the vertical slide rail. A support plate is provided at one end of the vertical slide table facing away from the spur gear seat, and the rotating mechanism is mounted on the support plate.

[0009] Optionally, the rotating mechanism includes a fixed shaft, a sleeve, an arc-shaped toothed segment, a second gear, and a second motor. The fixed shaft is fixed to a support plate, the sleeve is sleeved on the fixed shaft and rotatably connected to the fixed shaft, a support platform is provided at the upper end of the sleeve, and a mounting plate is hinged to the support platform through a main hinge seat. An adjustment mechanism is provided between the support platform and the mounting plate, and a limiting mechanism is provided on the side wall of the sleeve facing away from the vertical slide table. The second motor is fixed to the support plate and is driven by the second gear. The arc-shaped toothed segment is coaxially arranged with the sleeve and fixed to the sleeve. The arc-shaped toothed segment is meshed with the second gear and driven by the second motor. The second motor is used to drive the second gear to rotate, thereby driving the sleeve to rotate.

[0010] Optionally, two stops are provided on the horizontal slide table. The two stops are respectively located on both sides of the rotating mechanism along the width direction of the horizontal slide table, and are used to stop and limit the rotation angle of the chamfering and polishing structure.

[0011] Optionally, the adjustment mechanism is a drive cylinder, one end of which is hinged to the mounting plate and the other end of which is hinged to the support platform.

[0012] Optionally, the limiting mechanism includes a mounting frame and a support member disposed on the mounting frame. The mounting frame is fixed to the side wall of the sleeve facing away from the vertical slide table. One end of the support member in the length direction is used to abut against the mounting plate, and its length is adjustable relative to the main frame.

[0013] Optionally, the support can be a stop screw threaded to the main frame, or a micrometer fixed to the main frame.

[0014] Optionally, the mounting mechanism also includes an inclined slide, which has a groove. The mounting plate is disposed in the groove and can slide along the axial direction of the mounting mechanism. A detachable connection structure is provided between the inclined slide and the mounting plate to fix the two together.

[0015] Optionally, the mounting assembly includes a rotating shaft, a mounting sleeve, and a mounting base. The mounting sleeve is fixed to the mounting plate, and the rotating sleeve is disposed on the mounting sleeve and is rotatably connected to the mounting sleeve in a sealed manner. Both ends of the rotating shaft extend out of the mounting sleeve, one end is connected to the motor drive, and the other end is fixed to the mounting base. There is an air extraction channel between the rotating shaft, the mounting sleeve, and the mounting base. One end of the air extraction channel is connected to a vacuum pump. A quartz plate can seal the other end of the air extraction channel so that it is adsorbed onto the mounting base after the vacuum pump evacuates the air extraction channel.

[0016] Optionally, the rotating shaft has an axially arranged central hole, the mounting sleeve has a first vent hole on its side wall that communicates with the inner cavity of the mounting sleeve, the rotating shaft has a second vent hole on its side wall that communicates with the central hole, and the mounting base has an air passage that communicates with the central hole. The first air hole, the inner cavity of the mounting bushing, the second air hole, the center hole of the rotating shaft, and the air passage of the mounting base are connected to form the air extraction channel.

[0017] Optionally, the rotating shaft and the mounting sleeve are rotatably connected by a ball bearing, and oil seals are provided on both sides of the ball bearing in the axial direction to ensure that the rotating shaft and the mounting sleeve are rotatably connected in a sealed manner.

[0018] Optionally, one end of the rotating shaft mounting base has a slot, one end of the mounting base is locked in the slot and fixed to the rotating shaft by a locking screw, and the other end of the mounting base facing the quartz plate has an adsorption groove, the quartz plate can close the adsorption groove, the locking screw has a first air distribution channel, one end of the first air distribution channel is connected to the central hole, and the other end is connected to the adsorption groove through a second air distribution channel opened on the mounting base. The locking screw has a first air distribution channel, the second air distribution channel opened on the mounting base, and the adsorption groove are connected to form the air channel of the mounting base.

[0019] Optionally, a third motor is installed on the main frame. The grinding wheel and polishing disc are both connected to the third motor via a belt drive mechanism. The third motor is used to drive the grinding wheel and polishing disc to rotate horizontally in the circumferential direction via the belt drive mechanism.

[0020] Compared with the prior art, the advantages of this utility model are: This utility model discloses a device for chamfering substrates, employing a dual-grinding-disc structure. One grinding disc is used to chamfer the quartz wafer, while the other is used to polish the chamfered quartz wafer, achieving dual functionality in one machine. Furthermore, a single motor can drive both grinding discs to rotate via two belts, resulting in a compact structure. A rotating mechanism further rotates the chamfering and polishing structure between the two grinding discs, allowing for selection of which disc to perform chamfering or polishing. In addition, since the grinding wheel is made of hard material, the downward pressure is reduced by adjusting the air nozzle of the drive cylinder during chamfering, thereby reducing the impact force of the grinding wheel on the quartz disc to avoid defects such as cracks and chipping. Since the polishing disc is made of soft material, the downward pressure is increased by adjusting the air nozzle of the drive cylinder during polishing, thereby enabling the polishing disc to polish the chamfer of the quartz disc. Attached Figure Description

[0021] To facilitate understanding of this invention, it will be described in more detail with reference to the specific embodiments shown in the accompanying drawings. These drawings depict only typical embodiments of this invention and should not be considered as limiting the scope of protection of this invention.

[0022] Figure 1 This is a three-dimensional structural diagram of the device for substrate chamfering according to an embodiment of the present invention.

[0023] Figure 2 This is an exploded structural diagram of the apparatus for substrate chamfering according to an embodiment of the present invention.

[0024] Figure 3 This is an exploded view of the apparatus for substrate chamfering according to an embodiment of the present invention.

[0025] Figure 4 This is a front view structural diagram of the apparatus for substrate chamfering according to an embodiment of the present invention.

[0026] Figure 5 This is a rear view structural diagram of the apparatus for substrate chamfering according to an embodiment of the present invention.

[0027] Figure 6 This is a partial cross-sectional structural diagram of the device for substrate chamfering according to an embodiment of the present invention.

[0028] Figure label: 1. Mounting mechanism; 11. Slide table; 12. Mounting plate; 13. First motor; 14. Fixing frame; 15. Coupling; 151. Axial through groove; 152. Slot; 16. End cover; 17. Mounting bushing; 171. First air hole; 172. Inner cavity; 18. Mounting seat; 181. Adsorption groove; 182. Second air distribution channel; 2. Hinge seat; 20. Outer oil seal; 21. Ball bearing; 22. Inner oil seal; 23. Rotating shaft; 231. Second air hole; 232. Center hole; 233. Slot; 24. Locking screw; 241. First air distribution channel; 25. Hinge bushing; 26. Dust cover; 27. Hinge bearing; 28. Fixing plate; 29. ​​Mandrel; 3. Limiting mechanism; 31. Mounting frame; 32. 4. Support component; 5. Adjustment mechanism; 6. Upper hinge seat; 7. Lower hinge seat; 8. Drive cylinder; 9. Tool structure; 10. Grinding wheel; 11. Polishing disc; 12. Third motor; 13. Belt drive mechanism; 14. Main frame; 15. Rotation mechanism; 16. Fixed shaft; 17. Sleeve; 18. Arc tooth segment; 19. Second gear; 10. Second motor; 11. Support platform; 12. Stop; 13. Horizontal moving mechanism; 14. Horizontal slide rail; 15. Horizontal slide table; 16. First drive mechanism; 17. Vertical moving mechanism; 18. Straight tooth seat; 19. Vertical slide table; 10. First gear; 11. Second drive mechanism; 12. Vertical slide rail; 13. Straight tooth segment; 14. Support plate; 15. Quartz plate. Detailed Implementation

[0029] The embodiments of the present invention are described below with reference to the accompanying drawings, so that those skilled in the art can better understand and implement the present invention. However, the listed embodiments are not intended to limit the present invention. In the absence of conflict, the following embodiments and the technical features in the embodiments can be combined with each other, wherein the same components are indicated by the same reference numerals.

[0030] like Figures 1-6 As shown, this embodiment provides an apparatus for substrate chamfering, comprising: The main frame 6, the moving mechanism and the tool structure 5 mounted on the main frame 6, the rotating mechanism 7 mounted on the moving mechanism, and the chamfering and polishing structure mounted on the rotating mechanism 7, the chamfering and polishing structure including the mounting mechanism 1, the limiting mechanism 3, and the adjusting mechanism 4. The mounting mechanism 1 includes a mounting plate 12, a first motor 13 fixed to the mounting plate 12, and a mounting assembly. The mounting plate 12 is hinged to the rotating mechanism 7, and the substrate is fixed to the mounting assembly. The first motor 13 is connected to the mounting assembly for driving the substrate to rotate axially via the mounting assembly. The adjusting mechanism 4 and the limiting mechanism 3 are both located below the mounting plate 12, and are respectively located on both sides of the hinge point of the mounting plate 12 along the length of the mounting plate 12. The adjusting mechanism 4 is arranged on the side closer to the first motor 13, and the limiting mechanism 3 is arranged on the side closer to the mounting assembly. The adjustment mechanism 4 is connected to the mounting plate 12 in a transmission, and is used to drive the mounting plate 12 to rotate around the hinge point in the vertical plane until the mounting mechanism 1 abuts against the limiting mechanism 3, so that the mounting mechanism 1 is in the working state. The tool structure 5 includes a grinding wheel 51 and a polishing disc 52. Both the grinding wheel 51 and the polishing disc 52 can rotate horizontally relative to the main frame 6. The rotating mechanism 7 can drive the chamfering polishing structure to rotate horizontally until the substrate on the mounting assembly corresponds to one of the grinding wheel 51 and the polishing disc 52. The moving mechanism is used to drive the rotating mechanism 7 and the chamfering polishing structure to move so that the edge of the substrate abuts against the grinding wheel 51 or the polishing disc 52 at a suitable processing position.

[0031] This utility model discloses a device for substrate chamfering, employing a dual-grinding-disc structure. One grinding disc is used to chamfer the quartz wafer, while the other is used to polish the chamfered quartz wafer, achieving dual functionality in one machine. Furthermore, a single motor can drive both grinding discs to rotate via two pulleys, resulting in a compact structure. A rotating mechanism further rotates the chamfering and polishing structure between the two grinding discs, allowing for selection of the grinding disc for either chamfering or polishing. In addition, since the grinding wheel is made of hard material, the downward pressure is reduced by adjusting the air nozzle of the drive cylinder during chamfering, thereby reducing the impact force of the grinding wheel on the quartz disc to avoid defects such as cracks and chipping. Since the polishing disc is made of soft material, the downward pressure is increased by adjusting the air nozzle of the drive cylinder during polishing, thereby enabling the polishing disc to polish the chamfer of the quartz disc.

[0032] In this embodiment, the moving mechanism includes a horizontal moving mechanism 8 and a vertical moving mechanism 9. The horizontal moving mechanism 8 is mounted on the main frame 6, and the vertical moving mechanism 9 is slidably mounted on the horizontal moving mechanism 8. The rotating mechanism 7 is mounted on the vertical moving mechanism 9. The horizontal moving mechanism 8 is used to drive the vertical moving mechanism 9, the rotating mechanism 7, and the chamfering and polishing structure to move horizontally so that the substrate moves to a position that corresponds to the grinding wheel 51 or the polishing wheel 52 for suitable processing. The vertical moving mechanism 9 is used to drive the rotating mechanism 7 and the chamfering and polishing structure to move up and down so that the edge of the substrate abuts or dismounts from the position that is suitable for processing with the grinding wheel 51 or the polishing wheel 52.

[0033] In this embodiment, the horizontal moving mechanism 8 includes a horizontal slide rail 81, a horizontal slide table 82, and a first driving mechanism 83. The horizontal slide rail 81 and the first driving mechanism 83 are fixed on the main frame 6. The horizontal slide table 82 is slidably mounted on the horizontal slide rail 81. The vertical moving mechanism 9 is fixed on the horizontal slide table 82. The first driving mechanism 83 is connected to the horizontal slide table 82 for driving the horizontal slide table 82 to move horizontally along the horizontal slide rail 81.

[0034] In this embodiment, the vertical moving mechanism 9 includes a spur gear seat 91, a vertical slide 92, a first gear 93, and a second driving mechanism 94. The spur gear seat 91 is fixed on the horizontal slide 82, and a vertical slide rail 95 is provided on its wall facing the rotating mechanism 7. A spur gear segment 96 is provided on the vertical slide rail 95. The first gear 93 is meshed and connected to the spur gear segment 96. The vertical slide 92 is slidably mounted on the vertical slide rail 95 and is fixedly connected to the first gear 93. The second driving mechanism 94 is connected to the first gear 93 and is used to drive the first gear 93 to rotate, thereby driving the vertical slide 92 to move up and down along the vertical slide rail 95. A support plate 97 is provided at one end of the vertical slide 92 facing away from the spur gear seat 91, and the rotating mechanism 7 is mounted on the support plate 97.

[0035] In this embodiment, the rotating mechanism 7 includes a fixed shaft 71, a sleeve 72, an arc-shaped tooth segment 73, a second gear 74, and a second motor 75. The fixed shaft 71 is fixed on the support plate 97. The sleeve 72 is sleeved on the fixed shaft 71 and rotatably connected to the fixed shaft 71. A support platform 76 is provided at the upper end of the sleeve 72. The mounting plate 12 is hinged to the support platform 76 through the main hinge seat 2. The adjusting mechanism 4 is provided between the support platform 76 and the mounting plate 12. The limiting mechanism 3 is provided on the side wall of the sleeve 72 facing away from the vertical slide table 92. The second motor 75 is fixed on the support plate 97 and is driven by the second gear 74. The arc-shaped tooth segment 73 is coaxially arranged with the sleeve 72 and fixed on the sleeve 72. The arc-shaped tooth segment 73 is meshed with the second gear 74 and is driven by the second motor 75 to drive the second gear 74 to rotate, thereby driving the sleeve 72 to rotate.

[0036] In this embodiment, two stop members 77 are provided on the horizontal slide table 82. The two stop members 77 are respectively located on both sides of the rotating mechanism 7 along the width direction of the horizontal slide table 82, and are used to stop and limit the rotation angle of the chamfered polishing structure.

[0037] In this embodiment, the adjustment mechanism 4 is a drive cylinder 43. One end of the drive cylinder 43 is hinged to the mounting plate 12, and the other end of the drive cylinder 43 is hinged to the support platform 76.

[0038] In this embodiment, the limiting mechanism 3 includes a mounting frame 31 and a support member 32 disposed on the mounting frame 31. The mounting frame 31 is fixed to the side wall of the sleeve 72 facing away from the vertical slide table 92. One end of the support member 32 in the length direction is used to abut against the mounting plate 12, and its length is adjustable relative to the main frame 6.

[0039] By first adjusting the length of the support member of the limiting mechanism 3, and then driving the installation mechanism 1 to abut against the support member through the adjusting mechanism 4, the tilt angle of the chamfer can be controlled, and polishing of chamfers at different angles can be achieved. The amount of polishing can also be controlled.

[0040] In this embodiment, the support is a stop screw that is threadedly connected to the main frame 6, or a micrometer fixed to the main frame 6.

[0041] In this embodiment, the installation mechanism 1 further includes an inclined slide 11, which has a groove. The installation plate 12 is disposed in the groove and can slide along the axial direction of the installation mechanism 1. A detachable connection structure is provided between the inclined slide 11 and the installation plate 12 to fix the two together.

[0042] By adjusting the relative position of the inclined slide and the mounting plate 12, the distance between the mounting mechanism 1 and the grinding wheel 51 or polishing disc 52 can be roughly adjusted so that the substrate is positioned in a suitable chamfering or polishing position. After the position is adjusted, the two are fixed by fasteners.

[0043] In this embodiment, the mounting assembly includes a rotating shaft 23, a mounting sleeve 17, and a mounting base 18. The mounting sleeve 17 is fixed on the mounting plate 12. The rotating shaft 23 is sleeved on the mounting sleeve 17 and is rotatably connected to the mounting sleeve 17 in a sealed manner. Both ends of the rotating shaft 23 extend out of the mounting sleeve 17. One end is connected to the motor 13 for transmission, and the other end is fixed to the mounting base 18. There is a vacuum channel between the rotating shaft 23, the mounting sleeve 17, and the mounting base 18. One end of the vacuum channel is connected to a vacuum pump. A quartz plate can seal the other end of the vacuum channel so that it can be adsorbed onto the mounting base 18 after the vacuum pump evacuates the vacuum channel.

[0044] Motor 13 is fixed to mounting plate 12 by bracket 14. Motor shaft 13 is fixed to one end of rotating shaft 23 via coupling 15. Coupling 15 has an axial through groove and a circumferential 1 / 4 groove on its side wall. The axial through groove communicates with its center hole, and the circumferential 1 / 4 groove communicates with the axial through groove. The purpose of the axial through groove is to increase the elasticity and tightening force of the coupling, and the circumferential 1 / 4 groove is to adjust the tightening effect when the two connecting shafts are not concentric. If the rotating shaft 23 and the rotating shaft of motor 13 are misaligned, the tightening force of the screws can be increased or decreased by adjusting the part closer to the first motor 13 (or the part closer to the rotating shaft 23).

[0045] In this embodiment, the rotating shaft 23 has an axially arranged central hole 232, the mounting sleeve 17 has a first vent 171 on its side wall, the first vent 171 communicating with the inner cavity 172 of the mounting sleeve 17, the rotating shaft 23 has a second vent 231 on its side wall, the second vent 231 communicating with the central hole 232 of the rotating shaft 23, and the mounting base 18 has an air passage communicating with the central hole 232. The first vent 171, the inner cavity 172 of the mounting sleeve 17, the second vent 231, the center hole 232 of the rotating shaft 23, and the air passage of the mounting base 18 are connected to form an air extraction channel.

[0046] In this embodiment, the rotating shaft 23 and the mounting sleeve 17 are rotatably connected by a ball bearing 21. Oil seals are provided on both sides of the ball bearing 21 in the axial direction so that the rotating shaft 23 and the mounting sleeve 17 are rotatably connected in a sealed manner.

[0047] An oil seal is located between the rotating shaft 23 and the mounting sleeve 17, and includes an outer oil seal 20 and an inner oil seal 22. An end cover 16 is also provided at the connection end of the rotating shaft 23 and the motor 13, and the outer oil seal 20 at this end is located between the end cover 16 and the mounting sleeve 17.

[0048] In this embodiment, a slot is provided at one end of the mounting base 18 for fixing the rotating shaft 23. One end of the mounting base 18 is locked in the slot and fixed to the rotating shaft 23 by a locking screw 24. An adsorption groove 181 is provided at the other end of the mounting base facing the quartz plate. The quartz plate can close the adsorption groove 181. A first air distribution channel 241 is provided on the locking screw 24. One end of the first air distribution channel 241 is connected to the central hole 232, and the other end is connected to the adsorption groove 181 through a second air distribution channel 182 provided on the mounting base 18. The first air distribution channel 241 provided on the locking screw 24, the second air distribution channel 182 provided on the mounting base 18, and the adsorption groove 181 are connected to form the air passage of the mounting base 18.

[0049] In this embodiment, a third motor 53 is installed on the main frame 6. The grinding wheel 51 and the polishing disc 52 are both connected to the third motor 53 through a belt drive mechanism 54. The third motor 53 is used to drive the grinding wheel 51 and the polishing disc 52 to rotate horizontally in the circumferential direction through the belt drive mechanism 54.

[0050] The steps for using the chamfering and polishing device in this embodiment are as follows: Step 1: The rotating mechanism 7 drives the chamfering and polishing structure to rotate until the substrate on the mounting assembly corresponds to the grinding wheel 51; Step 2: By adjusting the relative positions of the slide table 11 and the connecting plate 12, the mounting mechanism 1 is positioned so that the substrate can be close to the grinding wheel 51 at a suitable chamfering position after it is in the working state. The slide table 11 and the connecting plate 12 are then fixed with fasteners. Step 3: Vacuum the air extraction channel through the first air hole 171, and put the quartz plate 8 into the mounting base 18 so that the quartz plate 8 can be adsorbed onto the mounting base 18 under negative pressure. Step 4: Activate the adjustment mechanism 4 to allow the mounting structure 1 to move towards the main frame 6 under the drive of the hinge seat 2 until the mounting structure 1 contacts the limiting mechanism 3. Step 5: Start the moving mechanism and fine-tune the substrate to the chamfered position of the grinding wheel 51, so that the edge of the substrate abuts against the chamfered position of the grinding wheel 51; Step 6: Start the first motor 13 to make the substrate 10 rotate under the drive of the first motor 13; simultaneously start the rotation of the grinding wheel to grind the edge of the substrate 10 to form a chamfer. During the polishing process, adjust the air nozzle of the drive cylinder to reduce the downward pressure, thereby reducing the impact force of the grinding wheel on the quartz plate to avoid defects such as cracks and chipping. Step 7: After the chamfering is completed, refer to steps 1-6 to polish the chamfer of the substrate. During the polishing process, adjust the air nozzle of the drive cylinder to provide a certain downward pressure to achieve the polishing of the chamfer of the quartz plate by the polishing disc.

[0051] The embodiments described above are merely preferred embodiments of this utility model. The terms "in one embodiment," "in another embodiment," "in yet another embodiment," or "in still another embodiment" used in this specification all refer to one or more of the same or different embodiments according to this disclosure. Ordinary variations and substitutions made by those skilled in the art within the scope of this utility model's technical solution should be included within the protection scope of this utility model.

Claims

1. An apparatus for chamfering substrates, characterized in that, include: The main frame (6), the moving mechanism and the tool structure (5) provided on the main frame (6), the rotating mechanism (7) provided on the moving mechanism, and the chamfering and polishing structure provided on the rotating mechanism (7), the chamfering and polishing structure including the mounting mechanism (1), the limiting mechanism (3) and the adjusting mechanism (4). The mounting mechanism (1) includes a mounting plate (12), a first motor (13) fixed on the mounting plate (12), and a mounting assembly. The mounting plate (12) is hinged to the rotating mechanism (7), and the substrate is fixed on the mounting assembly. The first motor (13) is connected to the mounting assembly for driving the substrate to rotate axially through the mounting assembly. The adjusting mechanism (4) and the limiting mechanism (3) are both located below the mounting plate (12) and are respectively located on both sides of the hinge point of the mounting plate (12) along the length of the mounting plate (12). The adjusting mechanism (4) is arranged on the side closer to the first motor (13), and the limiting mechanism (3) is arranged on the side closer to the mounting assembly. The adjustment mechanism (4) is connected to the mounting plate (12) for driving the mounting plate (12) to rotate around the hinge point in the vertical plane until the mounting mechanism (1) abuts against the limiting mechanism (3) so that the mounting mechanism (1) is in the working state; The tool structure (5) includes a grinding wheel (51) and a polishing disc (52). Both the grinding wheel (51) and the polishing disc (52) can rotate horizontally relative to the main frame (6). The rotating mechanism (7) can drive the chamfering polishing structure to rotate horizontally until the substrate on the mounting assembly corresponds to one of the grinding wheel (51) and the polishing disc (52). The moving mechanism is used to drive the rotating mechanism (7) and the chamfering polishing structure to move so that the edge of the substrate abuts against the grinding wheel (51) or the polishing disc (52) at a suitable processing position.

2. The apparatus for substrate chamfering according to claim 1, characterized in that, The moving mechanism includes a horizontal moving mechanism (8) and a vertical moving mechanism (9). The horizontal moving mechanism (8) is mounted on the main frame (6), and the vertical moving mechanism (9) is slidably mounted on the horizontal moving mechanism (8). The rotating mechanism (7) is mounted on the vertical moving mechanism (9). The horizontal moving mechanism (8) is used to drive the vertical moving mechanism (9), the rotating mechanism (7) and the chamfering polishing structure to move horizontally so that the substrate moves to a position that corresponds to the appropriate processing position of the grinding wheel (51) or the polishing wheel (52). The vertical moving mechanism (9) is used to drive the rotating mechanism (7) and the chamfering polishing structure to move up and down so that the edge of the substrate abuts or dismounts from the appropriate processing position of the grinding wheel (51) or the polishing wheel (52).

3. The apparatus for substrate chamfering according to claim 2, characterized in that, The horizontal moving mechanism (8) includes a horizontal slide rail (81), a horizontal slide table (82), and a first drive mechanism (83). The horizontal slide rail (81) and the first drive mechanism (83) are fixed on the main frame (6). The horizontal slide table (82) slides on the horizontal slide rail (81). The vertical moving mechanism (9) is fixed on the horizontal slide table (82). The first drive mechanism (83) is connected to the horizontal slide table (82) for driving the horizontal slide table (82) to move horizontally along the horizontal slide rail (81).

4. The apparatus for substrate chamfering according to claim 3, characterized in that, The vertical moving mechanism (9) includes a spur gear seat (91), a vertical slide (92), a first gear (93), and a second driving mechanism (94). The spur gear seat (91) is fixed on the horizontal slide (82), and a vertical slide rail (95) is provided on the wall facing the rotating mechanism (7). A spur gear section (96) is provided on the vertical slide rail (95). The first gear (93) is meshed with the spur gear section (96) for transmission. The vertical slide (92) is slidably mounted on the vertical slide rail (95) and fixedly connected to the first gear (93). The second driving mechanism (94) is connected to the first gear (93) for transmission and is used to drive the first gear (93) to rotate so as to drive the vertical slide (92) to move up and down along the vertical slide rail (95). A support plate (97) is provided at one end of the vertical slide (92) facing away from the spur gear seat (91), and the rotating mechanism (7) is mounted on the support plate (97).

5. The apparatus for substrate chamfering according to claim 4, characterized in that, The rotating mechanism (7) includes a fixed shaft (71), a sleeve (72), an arc-shaped toothed segment (73), a second gear (74), and a second motor (75). The fixed shaft (71) is fixed on the support plate (97). The sleeve (72) is sleeved on the fixed shaft (71) and rotatably connected to the fixed shaft (71). A support platform (76) is provided at the upper end of the sleeve (72). The mounting plate (12) and the support platform (76) are hinged together through the main hinge seat (2). The adjusting mechanism (4) is located on the support platform (76) and... Between the mounting plates (12), the limiting mechanism (3) is located on the side wall of the sleeve (72) facing away from the vertical slide (92); the second motor (75) is fixed on the support plate (97) and is connected to the second gear (74) for transmission. The arc tooth segment (73) is arranged coaxially with the sleeve (72) and fixed on the sleeve (72). The arc tooth segment (73) is connected to the second gear (74) for transmission. The second motor (75) is used to drive the second gear (74) to rotate, so as to drive the sleeve (72) to rotate.

6. The apparatus for substrate chamfering according to claim 5, characterized in that, Two stops (77) are provided on the horizontal slide (82). The two stops (77) are located on both sides of the rotating mechanism (7) along the width direction of the horizontal slide (82) to stop and limit the rotation angle of the chamfered polishing structure.

7. The apparatus for substrate chamfering according to any one of claims 1-6, characterized in that, The adjustment mechanism (4) is a drive cylinder (43). One end of the drive cylinder (43) is hinged to the mounting plate (12), and the other end of the drive cylinder (43) is hinged to the support platform (76).

8. The apparatus for substrate chamfering according to any one of claims 1-6, characterized in that, The limiting mechanism (3) includes a mounting frame (31) and a support member (32) provided on the mounting frame (31). The mounting frame (31) is fixed to the side wall of the sleeve (72) facing away from the vertical slide (92). One end of the support member (32) in the length direction is used to abut against the mounting plate (12), and its length is adjustable relative to the main frame (6).

9. The apparatus for substrate chamfering according to claim 8, characterized in that, The support is a stop screw that is threaded to the main frame (6), or a micrometer fixed to the main frame (6).

10. The apparatus for substrate chamfering according to any one of claims 1-6, characterized in that, The mounting mechanism (1) also includes an inclined slide (11), which has a groove. The mounting plate (12) is located in the groove and can slide along the axial direction of the mounting mechanism (1). A detachable connection structure is provided between the inclined slide (11) and the mounting plate (12) to fix the two together.

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