Wafer polishing apparatus and wafer processing equipment

Abstract

The utility model relates to wafer processing technical field discloses a kind of wafer polishing device and wafer processing equipment.The wafer polishing device includes support, mounting table and polishing component, mounting table is rotatably arranged on support around its own axis, and mounting table is used to support wafer;Polishing component is movably arranged in the upper of mounting table along vertical direction and can be contacted with wafer on mounting table, to adjust the polishing pressure to wafer, and polishing component can rotate around the axis of mounting table relative to mounting table.This wafer processing equipment includes above-mentioned wafer polishing device.The wafer polishing device and wafer processing equipment can adjust the polishing pressure to wafer, improve the precision of wafer polishing, and operation is simple, significantly reduce the operation difficulty of wafer polishing, improve the efficiency of wafer polishing.

Description

Technical Field

[0001] This utility model belongs to the field of wafer processing technology, and in particular relates to a wafer polishing device and wafer processing equipment. Background Technology

[0002] Traditional wafer fabrication processes typically employ a process of grinding before dicing, where the back side of the wafer is first ground to reduce its thickness, and then dicing is performed once the target thickness is achieved. However, this process has significant drawbacks: because the wafer has already been thinned during dicing, the thinner wafer is highly susceptible to problems such as uneven dicing, breakage, and edge chipping during the dicing process, which directly leads to a significant decrease in wafer yield.

[0003] To address this issue, a DBG (Dicing Before Grinding) process has been proposed, which effectively solves the challenges of thin wafer processing, significantly reducing the risk of wafer breakage and edge chipping during the grinding process, and thus significantly improving chip yield. The core of this process lies in first halving the wafer and then polishing the back side to reduce its thickness and allow it to naturally separate into individual chips. However, when polishing the back side of the wafer using the DBG process, because the front side has already been halved and formed into independent chip structures, and the adhesive tape used to fix the wafer is relatively soft and lacks sufficient support, localized depressions or bulges appear on the back side, creating significant height differences. Furthermore, existing grinding mechanisms generally lack dynamic adjustment capabilities for the polishing pressure on the wafer, failing to adapt the polishing amount to different parts of the wafer according to the back side morphology. This not only significantly reduces wafer polishing accuracy and affects wafer yield but also greatly increases the operational difficulty of the wafer polishing process.

[0004] Therefore, there is an urgent need for a wafer polishing device and wafer processing equipment to solve the above problems. Utility Model Content

[0005] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a wafer polishing device and wafer processing equipment, which can adjust the polishing pressure on the wafer, improve the precision of wafer polishing, and is simple to operate, significantly reducing the difficulty of wafer polishing and improving the efficiency of wafer polishing.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] On the one hand, a wafer polishing apparatus is provided, comprising:

[0008] Support;

[0009] The mounting stage is rotatably mounted on the support around its own axis and is used to support the wafer.

[0010] The polishing assembly is movably disposed above the mounting stage in a vertical direction and can abut against the wafer on the mounting stage to adjust the polishing pressure on the wafer, and the polishing assembly can rotate relative to the mounting stage about the axis of the mounting stage.

[0011] Optionally, the polishing assembly includes a polishing element and a polishing pad. The polishing element is movably disposed above the mounting stage in a vertical direction and can rotate relative to the mounting stage about the axis of the mounting stage. The polishing pad is adsorbed and disposed at the lower end of the polishing element and is configured to polish the wafer.

[0012] Optionally, the wafer polishing apparatus also includes a feed table and a mounting arm. The feed table is movably mounted on a support and can store multiple polishing pads. The mounting arm is movably mounted on the support and has a polishing position above the mounting table and a replacement position above the feed table. At the replacement position, the polishing pad can be attracted to the polishing pad on the feed table.

[0013] Optionally, the feeding platform is provided with multiple limiting members arranged at intervals along its circumference. The polishing pad can be limited and set on the limiting members. When changing positions, the polishing part can be located above any limiting member and adsorb the polishing pad on the corresponding limiting member.

[0014] Optionally, a second rotary drive is provided on the support. The output end of the second rotary drive is connected to the feeding table and is used to drive the feeding table to rotate around its own axis. The feeding table drives multiple limiting members to move along its circumference.

[0015] Optionally, multiple polishing pads can be stacked on each limiting member. The feeding table is provided with connection holes corresponding to the multiple limiting members. The connection holes are located on one side of the corresponding limiting member. A first linear drive is provided on the support. The output end of the first linear drive can pass through any connection hole and connect with the polishing pad on the corresponding limiting member to drive the multiple polishing pads on the corresponding limiting member to move vertically.

[0016] Optionally, a mounting rod is movably mounted on the support, and a mounting arm is located at the top of the mounting rod to drive the mounting rod to move. The mounting arm can move the polished part between the polishing position and the replacement position.

[0017] Optionally, the wafer polishing apparatus further includes a second linear drive unit disposed on the support, the output end of the second linear drive unit being connected to the polishing assembly for driving the polishing assembly to move vertically.

[0018] Optionally, the wafer polishing apparatus may also include a third rotary drive unit disposed on the support, the output end of the third rotary drive unit being connected to the polishing assembly for driving the polishing assembly to rotate.

[0019] On the other hand, a wafer processing apparatus is provided, including a storage device, a conveying device, and the aforementioned wafer polishing apparatus. The conveying device is disposed between the storage device and the wafer polishing apparatus and is configured to convey unpolished wafers from the storage device to the mounting stage of the wafer polishing apparatus and to convey polished wafers from the mounting stage to the storage device.

[0020] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0021] This invention provides a wafer polishing apparatus and wafer processing equipment. The polishing component can contact the wafer, so that the polishing pressure of the polishing component on the wafer surface changes when the polishing component moves vertically. That is, when the polishing component moves downward, the polishing pressure on the wafer surface increases; when the polishing component moves upward, the polishing pressure on the wafer surface decreases. Thus, by controlling the vertical movement of the polishing component, the polishing pressure on the wafer can be adjusted, allowing the polishing component to adaptively adjust the polishing amount on different parts of the wafer according to the unevenness of the wafer surface, which helps to improve the precision of wafer polishing. During the polishing process, the polishing pressure can be adjusted simply by driving the polishing component to move vertically, making the operation simple and quick, significantly reducing the difficulty of wafer polishing and improving the efficiency of wafer polishing. During the polishing process, the mounting stage can drive the wafer to rotate, allowing the polishing component to polish any part of the wafer along its circumference. At the same time, the polishing component can also rotate relative to the mounting stage. The relative rotation between the wafer and the polishing component helps the polishing component polish the wafer, further improving the efficiency of wafer polishing. Attached Figure Description

[0022] Figure 1 A schematic diagram of the wafer polishing apparatus provided by this utility model;

[0023] Figure 2 for Figure 1 Enlarged view of point A in the middle;

[0024] Figure 3 A schematic diagram of the mounting platform for the wafer polishing device provided by this utility model.

[0025] in:

[0026] 100. Wafer; 101. Inner circumference; 102. Outer ring;

[0027] 1. Support;

[0028] 2. Mounting platform; 21. Connecting ring;

[0029] 3. Polishing components; 31. Polishing parts; 32. Polishing pads;

[0030] 4. Feeding platform; 41. Limiting components;

[0031] 5. Mounting arm; 52. Third rotary drive component;

[0032] 6. First linear drive component;

[0033] 7. Install the rod;

[0034] 8. Cleaning parts;

[0035] 9. Test items. Detailed Implementation

[0036] It should be understood that in the description of this utility model, the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0037] It should be noted that, in the description of this utility model, unless otherwise explicitly specified and limited, the terms "set," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0038] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0039] Example 1

[0040] like Figures 1 to 3 As shown, this embodiment provides a wafer polishing apparatus that can adjust the polishing pressure on the wafer 100, thereby improving the polishing accuracy of the wafer 100. Moreover, it is simple to operate, significantly reducing the operational difficulty of polishing the wafer 100 and improving the polishing efficiency of the wafer 100.

[0041] See Figure 1 and Figure 2The wafer polishing apparatus includes a support 1, a mounting stage 2, and a polishing assembly 3. The mounting stage 2 is rotatably mounted on the support 1 about its own axis and is used to support the wafer 100. The polishing assembly 3 is movably mounted above the mounting stage 2 in the vertical direction and can abut against the wafer 100 on the mounting stage 2 to adjust the polishing pressure on the wafer 100. The polishing assembly 3 can rotate relative to the mounting stage 2 about its axis.

[0042] The wafer polishing apparatus provided in this embodiment allows the polishing component 3 to contact the wafer 100. Therefore, when the polishing component 3 moves vertically, the polishing pressure on the surface of the wafer 100 changes. Specifically, when the polishing component 3 moves downward, the polishing pressure on the surface of the wafer 100 increases; when the polishing component 3 moves upward, the polishing pressure on the surface of the wafer 100 decreases. Thus, by controlling the vertical movement of the polishing component 3, the polishing pressure on the wafer 100 can be dynamically adjusted. This allows the polishing component 3 to adaptively adjust the amount of polishing applied to different parts of the wafer 100 according to the unevenness of the wafer surface, helping to improve the polishing accuracy of the wafer 100. During the polishing process, the polishing pressure can be adjusted simply by driving the polishing component 3 vertically, making the operation simple and quick, significantly reducing the operational difficulty of wafer 100 polishing, and improving the efficiency of wafer 100 polishing. During the polishing process, the mounting stage 2 can rotate the wafer 100, allowing the polishing assembly 3 to polish any part of the wafer 100 along its circumference. At the same time, the polishing assembly 3 can also rotate relative to the mounting stage 2. The relative rotation between the wafer 100 and the polishing assembly 3 helps the polishing assembly 3 polish the wafer 100, further improving the polishing efficiency of the wafer 100.

[0043] In this embodiment, a first rotation drive is provided on the support 1, and the output end of the first rotation drive is connected to the mounting platform 2 to drive the mounting platform 2 to rotate.

[0044] For example, the first rotary drive is a motor.

[0045] Optionally, see Figure 1 and Figure 2The polishing assembly 3 includes a polishing element 31 and a polishing pad 32. The polishing element 31 is movably disposed above the mounting stage 2 in a vertical direction and can rotate relative to the mounting stage 2 about its axis. The polishing pad 32 is adsorbed and disposed at the lower end of the polishing element 31 and is configured to polish the wafer 100. This arrangement allows the polishing pad 32 to be adsorbed below the polishing element 31 during the polishing process. The polishing element 31 drives the polishing pad 32 to rotate and move vertically, thus polishing the wafer 100. During the polishing process, the polishing pad 32 will frequently rub against the surface of the wafer 100, causing gradual wear of the surface structure of the polishing pad 32. This wear will change the surface roughness and porosity of the polishing pad 32, affecting the polishing effect on the wafer 100. Therefore, the polishing pad 32 needs to be replaced periodically. At this time, the polishing pad 32 can be detached from the polishing element 31 for replacement.

[0046] For example, the polishing part 31 is made of a polishing head, and the polishing pad 32 is vacuum-adsorbed onto the polishing head.

[0047] Optionally, see Figure 1 and Figure 2 The wafer polishing apparatus also includes a feed platform 4 and a mounting arm 5. The feed platform 4 is movably mounted on the support 1 and can store multiple polishing pads 32. The mounting arm 5 is movably mounted on the support 1, and the polishing part 31 is mounted on the mounting arm 5. The mounting arm 5 has a polishing position above the mounting platform 2 and a replacement position above the feed platform 4. At the replacement position, the polishing part 31 can adsorb the polishing pads 32 on the feed platform 4. During the polishing process, the mounting arm 5 is located above the mounting platform 2, and the polishing pads 32 are adsorbed and mounted on the lower end of the polishing part 31 to polish the wafer 100. When the polishing pads 32 adsorbed on the polishing part 31 can no longer be used, the mounting arm 5 can be driven to move the polishing part 31 from the polishing position to the replacement position. When changing positions, the old polishing pads 32 on the polishing part 31 are desorbed from the polishing part 31, and the polishing part 31 is controlled to adsorb the polishing pads 32 stored on the feed platform 4, thus completing the replacement of the polishing pads 32. The operation is convenient and quick.

[0048] See Figure 1 and Figure 2 The feeding table 4 is provided with multiple limiting members 41 arranged at intervals along its circumference. The polishing pad 32 can be limited and positioned on the limiting members 41. In the replacement position, the polishing part 31 can be located above any limiting member 41 and adsorb the polishing pad 32 on the corresponding limiting member 41. This arrangement allows the feeding table 4 to store multiple polishing pads 32 while the polishing pads 32 are stably limited on the feeding table 4 and will not move. Therefore, when the mounting arm 5 moves the polishing part 31 to the replacement position, the polishing part 31 can accurately adsorb the polishing pad 32 on the feeding table 4, improving the convenience and speed of polishing pad 32 replacement.

[0049] In this embodiment, a second rotary drive is provided on the support 1. The output end of the second rotary drive is connected to the feeding platform 4, which drives the feeding platform 4 to rotate around its own axis. The feeding platform 4 drives multiple limiting members 41 to move circumferentially. This arrangement allows the polishing pad 32 on the limiting member 41 located below the polishing part 31 to be moved below the polishing part 31 after the polishing pad 32 has been used. By rotating the feeding platform 4, the other limiting members 41 can be moved to the bottom of the polishing part 31, so that the polishing part 31 can adhere to the polishing pad 32.

[0050] For example, the second rotary drive is a motor.

[0051] In this embodiment, see Figure 1 and Figure 2 Each limiting member 41 can accommodate multiple polishing pads 32. The feeding table 4 is provided with connection holes corresponding to each of the limiting members 41. The connection holes are located on one side of the corresponding limiting member 41. The support 1 is provided with a first linear drive 6. The output end of the first linear drive 6 can pass through any connection hole and connect with the polishing pad 32 on the corresponding limiting member 41 to drive the multiple polishing pads 32 on the corresponding limiting member 41 to move vertically. When multiple polishing pads 32 are stacked on the limiting member 41, the polishing member 31 can only adsorb the uppermost polishing pad 32 on the limiting member 41 at a time. Therefore, when the number of polishing pads 32 on the limiting member 41 decreases, the distance between the uppermost polishing pad 32 on the limiting member 41 and the polishing member 31 will increase, making the adsorption effect of the polishing member 31 on the uppermost polishing pad 32 weaker, and the uppermost polishing pad 32 cannot be adsorbed by the polishing member 31. At this time, by controlling the first linear drive 6, the several polishing pads 32 stacked on the limiting member 41 can be driven to move upward, so as to reduce the distance between the uppermost polishing pad 32 and the polishing part 31, and ensure that the polishing part 31 can be smoothly adsorbed with the uppermost polishing pad 32 on the limiting member 41.

[0052] For example, the first linear drive 6 employs a cylinder.

[0053] In this embodiment, see Figure 1 The limiting member 41 includes a limiting rod, and the polishing pad 32 is provided with a through hole. The limiting rod passes through the through hole to limit the position of the polishing pad 32 on the feeding table 4.

[0054] In other embodiments, the limiting member 41 is provided with a limiting groove, and the polishing pad 32 is located in the limiting groove. The groove wall can constrain the movement of the polishing pad 32, thereby limiting the polishing pad 32 on the feeding table 4.

[0055] Optionally, see Figure 1 and Figure 2A mounting rod 7 is movably mounted on the support 1, and a mounting arm 5 is located at the top of the mounting rod 7. The mounting rod 7 is moved, and the mounting arm 5 can move the polishing part 31 between the polishing position and the replacement position to facilitate the replacement of the polishing pad 32.

[0056] In this embodiment, the mounting rod 7 extends vertically, and the mounting arm 5 extends horizontally. The mounting rod 7 is rotatably mounted on the support 1 around its axis. By driving the mounting rod 7 to rotate, the mounting rod 7 can move the mounting arm 5 between the feeding table 4 and the mounting table 2, thereby switching the position of the mounting arm 5.

[0057] In other embodiments, the support 1 is provided with a sliding groove, and the bottom of the mounting rod 7 slides in the sliding groove. The position of the mounting arm 5 can be switched by driving the mounting rod 7 to slide.

[0058] Optionally, see Figure 1 and Figure 2 The wafer polishing apparatus also includes a second linear drive (not shown in the figure) disposed on the support 1. The output end of the second linear drive is connected to the polishing assembly 3 and is used to drive the polishing assembly 3 to move vertically, so as to realize the adjustment of the polishing pressure of the polishing assembly 3 on the wafer 100 and to facilitate operation.

[0059] In this embodiment, see Figure 2 The second linear drive is mounted on the support 1, and its output end is connected to the mounting rod 7 to drive the mounting rod 7 to move the polishing assembly 3 vertically through the mounting arm 5.

[0060] For example, the second linear drive is a cylinder.

[0061] Optionally, the wafer polishing apparatus further includes a third rotary drive 52 disposed on the support 1. The output end of the third rotary drive 52 is connected to the polishing assembly 3 and is used to drive the polishing assembly 3 to rotate so as to polish the wafer 100 by the polishing assembly 3, and is easy to operate.

[0062] For example, the third rotary drive 52 is a motor.

[0063] Optionally, see Figure 2 and Figure 3The wafer 100 includes an inner circular body 101 and an outer ring body 102 connected together. The mounting stage 2 is provided with a circular boss, an annular groove, and a connecting ring 21. The annular groove extends circumferentially along the circular boss. The connecting ring 21 is detachably disposed within the annular groove. The outer ring body 102 can be bonded to the connecting ring 21, and the inner circular body 101 can be adsorbed onto the circular boss. This arrangement ensures that after the wafer 100 is mounted on the mounting stage 2, the surface of the inner circular body 101 is higher than the surface of the outer ring body 102, facilitating polishing of the wafer 100 by the polishing assembly 3. When the connecting ring 21 separates from the annular groove and the circular boss desorbs the inner circular body 101, the wafer 100 can be removed from the mounting stage 2; when the connecting ring 21 connects to the annular groove and the inner circular body 101 is adsorbed onto the circular boss, the wafer 100 can be stably mounted on the mounting stage 2.

[0064] For example, the connecting ring 21 is made of iron, and the outer ring body 102 is bonded to the connecting ring 21 by a blue film.

[0065] Optionally, see Figure 1 and Figure 2 The wafer polishing apparatus also includes a cleaning component 8 disposed on the support 1. The cleaning component 8 is located on one side of the mounting stage 2 and is configured to spray liquid and blow air onto the wafer 100. During the polishing process, the friction between the wafer 100 and the polishing assembly 3 generates a certain amount of heat. Spraying liquid onto the wafer 100 helps to reduce the surface temperature of the wafer 100, preventing deformation or damage to the wafer 100 due to overheating, and ensuring the stability and quality of the polishing process. Moreover, spraying liquid also helps to wash away contaminants on the surface of the wafer 100, keeping the surface of the wafer 100 clean. Blowing air onto the wafer 100 helps to remove residual moisture on the surface of the wafer 100, preventing moisture from corroding or contaminating the wafer 100 and maintaining the condition of the wafer 100 surface.

[0066] For example, the cleaning component 8 includes a water tank, a water pipe, a water nozzle, an air blowing component, an air pipe, and an air blowing nozzle. The water tank is mounted on the support 1. The water nozzle is connected to the water tank through the water pipe. Liquid in the water tank can be sprayed out from the water nozzle through the water pipe. The air blowing component is mounted on the support 1. The air blowing nozzle is connected to the air blowing component through the air pipe. When the air blowing component is turned on, the gas blown out by the air blowing component can be blown to the wafer 100 through the air blowing component.

[0067] Optionally, see Figure 1 The wafer polishing apparatus also includes a detection element 9 disposed on the support 1, which is configured to detect the polishing amount of the outer ring 102. During the polishing process of the wafer 100, the stress at the outer ring 102 is relatively concentrated, which is prone to defects. The setting of the detection element 9 helps to control the yield rate of the wafer 100 after polishing.

[0068] In this embodiment, the detection element 9 is an edge scanning interferometer, which can accurately measure the surface morphology, roughness, and three-dimensional contour of the wafer 100; in other embodiments, the detection element 9 is a laser profilometer, which can acquire the irregular morphology of the surface of the wafer 100, providing an important basis for polishing quality evaluation.

[0069] Example 2

[0070] This embodiment provides a wafer processing equipment, including a storage device, a conveying device, and a wafer polishing device as described in Embodiment 1. The conveying device is disposed between the storage device and the wafer polishing device and is configured to convey unpolished wafers 100 from the storage device to the mounting stage 2 of the wafer polishing device and to convey polished wafers 100 from the mounting stage 2 to the storage device.

[0071] For example, the storage device is a wafer storage box, and the conveying device is a robotic arm.

[0072] The above description is only a specific embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Those skilled in the art should understand that any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present utility model fall within the protection and disclosure scope of the present utility model.

Claims

1. A wafer polishing apparatus, characterized in that, include: Support (1); Mounting platform (2) is rotatably mounted on the support (1) about its own axis. The mounting platform (2) is used to support the wafer (100). The polishing assembly (3) is movably disposed above the mounting platform (2) in the vertical direction and can abut against the wafer (100) on the mounting platform (2) to adjust the polishing pressure on the wafer (100), and the polishing assembly (3) can rotate relative to the mounting platform (2) about the axis of the mounting platform (2). The polishing assembly (3) includes a polishing element (31) and a polishing pad (32). The polishing element (31) is movably disposed above the mounting platform (2) in the vertical direction and can rotate relative to the mounting platform (2) about the axis of the mounting platform (2). The polishing pad (32) is adsorbed and disposed at the lower end of the polishing element (31) and is configured to polish the wafer (100).

2. The wafer polishing apparatus according to claim 1, characterized in that, The wafer polishing apparatus further includes a feed table (4) and a mounting arm (5). The feed table (4) is movably disposed on the support (1). The feed table (4) can store a plurality of polishing pads (32). The mounting arm (5) is movably disposed on the support (1). The polishing component (31) is disposed on the mounting arm (5). The mounting arm (5) has a polishing position above the mounting table (2) and a replacement position above the feed table (4). At the replacement position, the polishing component (31) can adsorb the polishing pads (32) on the feed table (4).

3. The wafer polishing apparatus according to claim 2, characterized in that, The feeding platform (4) is provided with a plurality of limiting members (41) arranged at intervals along its circumference. The polishing pad (32) can be limited and set on the limiting member (41). In the changing position, the polishing part (31) can be located above any of the limiting members (41) and adsorb the polishing pad (32) on the corresponding limiting member (41).

4. The wafer polishing apparatus according to claim 3, characterized in that, The support (1) is provided with a second rotary drive component. The output end of the second rotary drive component is connected to the feeding platform (4) and is used to drive the feeding platform (4) to rotate around its own axis. The feeding platform (4) drives multiple limiting components (41) to move along its circumference.

5. The wafer polishing apparatus according to claim 3, characterized in that, Multiple polishing pads (32) can be stacked on each of the limiting members (41). The feeding table (4) is provided with connecting holes corresponding to the multiple limiting members (41) one by one. The connecting holes are located on one side of the corresponding limiting member (41). A first linear drive member (6) is provided on the support (1). The output end of the first linear drive member (6) can pass through any of the connecting holes and connect with the polishing pads (32) on the corresponding limiting member (41) to drive the multiple polishing pads (32) on the corresponding limiting member (41) to move vertically.

6. The wafer polishing apparatus according to claim 2, characterized in that, An installation rod (7) is movably provided on the support (1), and an installation arm (5) is provided at the top of the installation rod (7) to drive the installation rod (7) to move. The installation arm (5) can drive the polishing part (31) to move between the polishing position and the replacement position.

7. The wafer polishing apparatus according to any one of claims 1-6, characterized in that, The wafer polishing apparatus further includes a second linear drive unit disposed on the support (1), the output end of the second linear drive unit being connected to the polishing assembly (3) for driving the polishing assembly (3) to move vertically.

8. The wafer polishing apparatus according to any one of claims 1-6, characterized in that, The wafer polishing apparatus further includes a third rotary drive (52) disposed on the support (1), the output end of the third rotary drive (52) being connected to the polishing assembly (3) for driving the polishing assembly (3) to rotate.

9. Wafer processing equipment, characterized in that, The device includes a storage device, a conveying device, and a wafer polishing apparatus as described in any one of claims 1-8, wherein the conveying device is disposed between the storage device and the wafer polishing apparatus and is configured to convey an unpolished wafer (100) from the storage device to the mounting stage (2) of the wafer polishing apparatus and to convey a polished wafer (100) from the mounting stage (2) to the storage device.

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