Grinding disc and grinding device
Patent Information
- Application Number
- CN202522400251.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-12
- Publication Date
- 2026-10-27
- Estimated Expiration
- 2035-11-12
AI Technical Summary
[0003]研磨时会产生颗粒物，其产生的颗粒主要是来自研浆中的研磨颗粒以及从晶圆表面上被研磨去除的材料颗粒，而晶圆表面研磨脱落的颗粒容易过多堆积在研磨表面，导致晶圆表面出现刮痕以及造成晶圆隐裂等问题，影响研磨精度和质量
本实用新型实施例提供的研磨盘和研磨装置，其将承载盘体和研磨盘体依次层叠设置在法兰盘体内，并能够跟随法兰盘体同步转动。其中，研磨盘体和承载盘体间隔设置并形成有延伸至法兰盘体的溢流腔，研磨盘体远离承载盘体的一侧表面用于与晶圆接触研磨，并设置由多个研磨孔，多个研磨孔贯穿研磨盘体，并连通至溢流腔。相较于现有技术，本实用新型实施例提供的研磨盘和研磨装置，在实际研磨时，研磨盘体能够直接对晶圆进行研磨，研磨过程中产生的颗粒物可以随着研磨孔流动至溢流腔，及时排出研磨颗粒，由溢流腔进行暂存，并在离心力的作用下流动至边缘排出。因此，本实用新型实施例提供的研磨盘和研磨装置，能够及时排出研磨颗粒，降低出现刮痕和晶圆隐裂的风险，保证研磨质量和精度。
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Figure CN224896831U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of grinding technology, and more specifically, to a grinding disc and a grinding device. Background Technology
[0002] During the wafer packaging process, chemical mechanical polishing (CMP) is required on the wafer. This involves adding chemical agents and abrasive particles to the wafer surface, and then rotating the polishing pad relative to the wafer surface in a pressing and rotating manner. This rotational motion achieves planarization of the wafer surface, thus achieving the purpose of polishing.
[0003] Grinding produces particles, mainly from grinding particles in the slurry and material particles removed from the wafer surface. Particles that fall off the wafer surface during grinding can easily accumulate excessively on the grinding surface, leading to scratches and microcracks, thus affecting grinding accuracy and quality. Utility Model Content
[0004] The purpose of this invention is to provide a grinding disc and grinding device that can discharge grinding particles in a timely manner, reduce the risk of scratches and wafer microcracks, and ensure grinding quality and precision.
[0005] The embodiments of this utility model are implemented as follows: In one aspect, this utility model embodiment provides a grinding disc, comprising: Flange body; The bearing disc and the grinding disc are stacked sequentially inside the flange body and can rotate synchronously with the flange body. The grinding disc and the support disc are spaced apart and form an overflow cavity extending to the flange. The side surface of the grinding disc away from the support disc is used to contact the wafer and is provided with a plurality of grinding holes. The plurality of grinding holes penetrate the grinding disc and are connected to the overflow cavity.
[0006] In an optional embodiment, a plurality of roller shafts are provided on the inner side of the flange body, and a plurality of first notches are provided on the bearing disc body, the plurality of first notches being adapted to the plurality of roller shafts so that the bearing disc body is embedded between the plurality of roller shafts. A plurality of second notches are provided on the grinding disc body, the plurality of second notches being adapted to the plurality of roller shafts so that the grinding disc body is embedded between the plurality of roller shafts.
[0007] In an optional embodiment, the flange body is annular, each roller shaft is cylindrical, and the plurality of roller shafts are evenly distributed on the inner sidewall of the flange body.
[0008] In an optional embodiment, the inner sidewalls of the grinding disc and the flange are spaced apart and formed with a drain gap, which communicates with the overflow cavity.
[0009] In an optional embodiment, the cross-section of the grinding hole is polygonal star-shaped.
[0010] In an optional embodiment, a mandrel is further provided at the center of one side surface of the bearing disc near the grinding disc, and the mandrel is connected to the grinding disc so that the grinding disc is spaced apart from the bearing disc.
[0011] In an optional embodiment, the mandrel is a telescopic shaft used to move the grinding disc closer to or away from the support disc.
[0012] In an optional embodiment, a plurality of grinding cams are provided on one side of the bearing disc that is engaged with the overflow cavity. The plurality of grinding cams protrude toward the grinding disc and surround the mandrel, and each grinding cam is spaced apart from the grinding disc.
[0013] In an optional embodiment, the grinding cam has a polygonal star-shaped cross-section.
[0014] On the other hand, this utility model embodiment provides a grinding device, including a machine base and the aforementioned grinding disc. The grinding disc includes a flange body, a support disc body, and a grinding disc body. The support disc body and the grinding disc body are stacked sequentially within the flange body and can rotate synchronously with the flange body. The grinding disc body and the support disc body are spaced apart and form an overflow cavity extending to the flange body. The surface of the grinding disc body away from the support disc body is used to contact the wafer and has multiple grinding holes that penetrate the grinding disc body and connect to the overflow cavity. The machine base is equipped with a lifting and rotating component, and the flange body is mounted on the lifting and rotating component.
[0015] The beneficial effects of this utility model embodiment include: The grinding disc and grinding device provided in this embodiment of the invention consist of a support disc and a grinding disc stacked sequentially within a flange body, and the grinding disc rotates synchronously with the flange body. The grinding disc and the support disc are spaced apart and form an overflow cavity extending into the flange body. The surface of the grinding disc away from the support disc is used for contact grinding of the wafer and is provided with multiple grinding holes that penetrate the grinding disc and connect to the overflow cavity. Compared to the prior art, the grinding disc and grinding device provided in this embodiment of the invention allow the grinding disc to directly grind the wafer during actual grinding. Particles generated during the grinding process can flow through the grinding holes to the overflow cavity, where they are temporarily stored and then flow to the edge for discharge under centrifugal force. Therefore, the grinding disc and grinding device provided in this embodiment of the invention can promptly discharge grinding particles, reducing the risk of scratches and wafer microcracks, and ensuring grinding quality and precision. Attached Figure Description
[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0017] Figure 1 This is a schematic diagram of the overall structure of the grinding disc provided in an embodiment of the present utility model; Figure 2 An exploded view of the grinding disc provided in an embodiment of this utility model; Figure 3 for Figure 2 Schematic diagram of the structure of the bearing disc and the grinding disc; Figure 4 A cross-sectional view of the overall structure of the grinding disc provided in an embodiment of this utility model.
[0018] icon: 100-Grinding disc; 110-Flange body; 111-Roller shaft; 130-Bearing disc body; 131-Overflow chamber; 133-First notch; 135-Mandrel; 137-Grinding cam; 150-Grinding disc body; 151-Grinding hole; 153-Second notch; 155-Drainage gap. Detailed Implementation
[0019] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0020] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.
[0021] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0022] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0023] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0024] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0025] As disclosed in the background section, existing CMP processes generate particulate matter during grinding. These particles primarily originate from abrasive particles in the slurry and material particles removed from the wafer surface during grinding. Excessive accumulation of particles from the wafer surface during grinding can lead to scratches and microcracks, affecting grinding accuracy and quality. Furthermore, as the grinding depth increases, the wear on the grinding disc increases, necessitating the replacement of grinding discs with different abrasive particles to control the grinding depth.
[0026] To address the aforementioned problems, this utility model provides a novel grinding disc and grinding device. It should be noted that, unless otherwise specified, the features in the embodiments of this utility model can be combined with each other.
[0027] See Figures 1 to 4 This utility model provides a grinding disc 100 that can discharge grinding particles in a timely manner, reducing the risk of scratches and wafer microcracks, and ensuring grinding quality and precision.
[0028] The grinding disc 100 provided in the embodiment of this utility model includes a flange body 110, a support disc body 130, and a grinding disc body 150. The support disc body 130 and the grinding disc body 150 are stacked sequentially inside the flange body 110 and can rotate synchronously with the flange body 110. The grinding disc body 150 and the support disc body 130 are spaced apart and form an overflow cavity 131 extending to the flange body 110. The side surface of the grinding disc body 150 away from the support disc body 130 is used to contact the wafer and is provided with a plurality of grinding holes 151. The plurality of grinding holes 151 penetrate the grinding disc body 150 and are connected to the overflow cavity 131.
[0029] During actual grinding, the grinding disc 150 can directly grind the wafer. Particles generated during grinding can flow through the grinding holes 151 to the overflow chamber 131, where they are promptly discharged. The overflow chamber 131 temporarily stores the particles, which then flow to the edge under centrifugal force and are discharged. Therefore, the grinding disc 100 and grinding device provided in this embodiment can promptly discharge grinding particles, reducing the risk of scratches and wafer microcracks, and ensuring grinding quality and precision.
[0030] In some embodiments, a plurality of roller shafts 111 are provided on the inner side of the flange body 110, and a plurality of first notches 133 are provided on the bearing disc body 130. The plurality of first notches 133 are adapted to the plurality of roller shafts 111 so that the bearing disc body 130 is embedded between the plurality of roller shafts 111. A plurality of second notches 153 are provided on the grinding disc body 150, and the plurality of second notches 153 are adapted to the plurality of roller shafts 111 so that the grinding disc body 150 is embedded between the plurality of roller shafts 111. Specifically, the grinding disc body 150 is parallel to the bearing disc body 130, and the gap between the grinding disc body 150 and the bearing disc body 130 can form an overflow cavity 131. The overflow cavity 131 can collect the grinding particles and residual liquid collected in the grinding hole 151 and discharge them toward the edge area under the action of centrifugal force. Furthermore, the simultaneous engagement of multiple roller shafts 111 with multiple first notches 133 and second notches 153 enables both the bearing disc 130 and the grinding disc 150 to rotate synchronously with the flange body 110.
[0031] In some embodiments, the flange body 110 is annular, each roller shaft 111 is cylindrical, and the plurality of roller shafts 111 are evenly distributed on the inner sidewall of the flange body 110. Specifically, the annular structure of the flange body 110 and the even distribution of the plurality of roller shafts 111 enable more uniform force distribution on the bearing disc 130 and the grinding disc 150. Furthermore, both the first notch 133 and the second notch 153 are semi-circular, allowing the roller shafts 111 to be fitted with both the first notch 133 and the second notch 153, ensuring effective transmission.
[0032] In some embodiments, the inner sidewalls of the grinding disc 150 and the flange 110 are provided with and form drain gaps 155, which communicate with the overflow cavity 131. Specifically, a drain gap 155 is formed between the edge of the grinding disc 150 and the flange 110, and this drain gap 155 directly communicates with the overflow cavity 131. During the actual grinding process, grinding particles and residual liquid can be discharged from the grinding hole 151 to the overflow cavity 131, and under the action of centrifugal force, flow from the overflow cavity 131 toward the edge towards the drain gap 155, and are discharged from the drain gap 155. Since the drain gap 155 is located in the edge area of the grinding disc 150, it will not affect the normal grinding of the grinding disc 150, thus ensuring the grinding effect.
[0033] It should be noted that conventional polishing slurry can be used for polishing here, and diamond particles can be added to the polishing slurry to achieve the polishing effect.
[0034] In some embodiments, the cross-section of the grinding hole 151 is polygonal star-shaped. Specifically, the inner wall of the grinding hole 151 is designed with multiple teeth, thereby making its cross-section polygonal star-shaped. For example, the inner wall of the grinding hole 151 can be designed with a 9-tooth shape, and the included angle between adjacent teeth can form a cutting edge structure, thereby agitating the chips and grinding the residue.
[0035] In some embodiments, a mandrel 135 is further provided at the center of one side surface of the support disc 130 near the grinding disc 150. The mandrel 135 is connected to the grinding disc 150 so that the grinding disc 150 and the support disc 130 are spaced apart. Specifically, the mandrel 135 protrudes toward the grinding disc 150 and is connected to the center of the grinding disc 150, thereby creating a certain gap between the grinding disc 150 and the support disc 130. This gap forms an overflow cavity 131, which allows the grinding fluid to be discharged.
[0036] In some embodiments, the mandrel 135 is a telescopic shaft used to move the grinding disc 150 closer to or away from the support disc 130. Specifically, the mandrel 135 can be divided into an inner shaft and an outer cylinder. The outer cylinder is fixedly disposed at the center of the support disc 130, and the inner shaft is movably disposed in the outer cylinder and connected to the center of the grinding disc 150. The inner shaft can be driven by a built-in micro-drive component, or the inner shaft can be extended out of the support disc 130 and connected to the drive structure on the machine tool to achieve transmission.
[0037] Furthermore, a plurality of grinding cams 137 are provided on the side of the bearing disc 130 that engages with the overflow cavity 131. The plurality of grinding cams 137 protrude toward the grinding disc 150 and surround the mandrel 135, and each grinding cam 137 is spaced apart from the grinding disc 150. Specifically, the plurality of grinding cams 137 can agitate the liquid in the overflow cavity 131, thereby accelerating the discharge of residual grinding liquid from the inside to the edge.
[0038] The grinding cam 137 has a polygonal star-shaped cross-section. Specifically, multiple grinding cams 137 correspond one-to-one with multiple grinding holes 151, and the cross-sectional shape of the grinding cam 137 is adapted to the cross-sectional shape of the grinding hole 151. Driven by the telescopic shaft, the grinding cam 137 can extend into or out of the grinding hole 151.
[0039] During rough grinding, the telescopic shaft retracts, and the grinding cam 137 disengages from the grinding hole 151. At this time, the grinding hole 151 serves as a drain, smoothly expelling residual liquid into the overflow chamber 131. During fine grinding, the telescopic shaft extends, and the grinding cam 137 fills the grinding hole 151, making the grinding cam 137 flush with the grinding disc 150, improving the surface flatness of the grinding disc 150, and achieving fine grinding of the wafer surface.
[0040] This utility model embodiment also provides a grinding apparatus, including a machine base and the aforementioned grinding disc 100. The grinding disc 100 includes a flange body 110, a support disc body 130, and a grinding disc body 150. The support disc body 130 and the grinding disc body 150 are stacked sequentially within the flange body 110 and can rotate synchronously with the flange body 110. The grinding disc body 150 and the support disc body 130 are spaced apart and form an overflow cavity 131 extending to the flange body 110. The side surface of the grinding disc body 150 away from the support disc body 130 is used for contacting the wafer and is provided with multiple grinding holes 151. The multiple grinding holes 151 penetrate the grinding disc body 150 and communicate with the overflow cavity 131. The machine base is provided with a lifting and rotating component, and the flange body 110 is mounted on the lifting and rotating component.
[0041] In some embodiments, the top side of the flange body 110 is also provided with a mounting hole, and is fixedly mounted on the lifting and rotating component of the machine tool through the mounting hole.
[0042] In summary, the grinding disc 100 and grinding device provided in this embodiment of the present invention have a bearing disc 130 and a grinding disc 150 stacked sequentially within a flange body 110, and can rotate synchronously with the flange body 110. The grinding disc 150 and the bearing disc 130 are spaced apart and form an overflow cavity 131 extending to the flange body 110. The surface of the grinding disc 150 away from the bearing disc 130 is used for contact grinding with the wafer, and is provided with multiple grinding holes 151 that penetrate the grinding disc 150 and connect to the overflow cavity 131. Compared with the prior art, the grinding disc 100 and grinding device provided in this embodiment of the present invention allow the grinding disc 150 to directly grind the wafer during actual grinding. Particles generated during the grinding process can flow through the grinding holes 151 to the overflow cavity 131, where they are promptly discharged, temporarily stored, and then flow to the edge for discharge under centrifugal force. Therefore, the grinding disc 100 and grinding device provided in this embodiment of the present invention can discharge grinding particles in a timely manner, reduce the risk of scratches and wafer microcracks, and ensure grinding quality and precision.
[0043] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. A grinding disc, characterized in that, include: Flange body; The bearing disc and the grinding disc are stacked sequentially inside the flange body and can rotate synchronously with the flange body. The grinding disc and the support disc are spaced apart and form an overflow cavity extending to the flange. The side surface of the grinding disc away from the support disc is used to contact the wafer and is provided with a plurality of grinding holes. The plurality of grinding holes penetrate the grinding disc and are connected to the overflow cavity.
2. The grinding disc according to claim 1, characterized in that, The flange body has multiple roller shafts on its inner side, and the bearing plate body has multiple first notches that are adapted to the multiple roller shafts so that the bearing plate body is embedded between the multiple roller shafts. The grinding plate body has multiple second notches that are adapted to the multiple roller shafts so that the grinding plate body is embedded between the multiple roller shafts.
3. The grinding disc according to claim 2, characterized in that, The flange body is annular, each roller shaft is cylindrical, and multiple roller shafts are evenly distributed on the inner wall of the flange body.
4. The grinding disc according to claim 2, characterized in that, The inner walls of the grinding disc and the flange are spaced apart and form a drain gap, which is connected to the overflow cavity.
5. The grinding disc according to claim 1, characterized in that, The cross-section of the grinding hole is polygonal star-shaped.
6. The grinding disc according to claim 1, characterized in that, A mandrel is also provided at the center of the side surface of the bearing disc near the grinding disc, and the mandrel is connected to the grinding disc so that the grinding disc is spaced apart from the bearing disc.
7. The grinding disc according to claim 6, characterized in that, The spindle is a telescopic shaft used to move the grinding disc closer to or away from the support disc.
8. The grinding disc according to claim 6, characterized in that, The side of the bearing disc that is connected to the overflow cavity is also provided with a plurality of grinding cams. The plurality of grinding cams protrude toward the grinding disc and surround the mandrel, and each grinding cam is spaced apart from the grinding disc.
9. The grinding disc according to claim 8, characterized in that, The grinding cam has a polygonal star-shaped cross-section.
10. A grinding apparatus, characterized in that, The machine includes a machine base and a grinding disc as described in any one of claims 1-9, wherein the machine base is provided with a lifting and rotating component, and the flange body is disposed on the lifting and rotating component.