Multi-channel cooling liquid supply device for silicon wafer polishing

Abstract

The utility model relates to the technical field of silicon wafer processing, concretely to a silicon wafer polishing multi-channel cooling liquid supply device, which comprises a base, the top of the base is provided with two supports, the top of the two supports is jointly supported by a liquid storage tank, the top of the base is provided with a pump body, the input end of the pump body is communicated with the liquid storage tank through a liquid suction pipe, and the output end of the pump body is provided with a liquid delivery pipe; the utility model further comprises a mounting seat mounted on a silicon wafer polishing machine, the right side of the mounting seat is provided with a supporting vertical plate, the right side of the supporting vertical plate is provided with a liquid delivery pipe, the input end of the liquid delivery pipe is communicated with the liquid delivery pipe, the output end of the liquid delivery pipe is connected with a shunt pipe, the outer wall of the shunt pipe is provided with a plurality of liquid outlet branch pipes, and the liquid outlet branch pipes are provided with third control valves. The silicon wafer polishing multi-channel cooling liquid supply device is combined with the shunt pipe and a plurality of independently controlled liquid outlet branch pipes, the cooling liquid flow and the coverage area of each channel can be flexibly adjusted, the distribution of the cooling liquid on the surface of the silicon wafer is ensured to be uniform, local overheating or insufficient cooling is avoided, and the polishing quality is significantly improved.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer processing technology, specifically to a multi-channel coolant supply device for silicon wafer polishing. Background Technology

[0002] Polishing silicon wafers is a crucial step in semiconductor manufacturing. Polishing not only removes minute imperfections from the wafer surface, improving its flatness and smoothness, but also provides a good foundation for subsequent processes such as photolithography and etching. Because polishing requires applying pressure and friction, the silicon wafer generates heat, causing its temperature to rise. If not properly controlled, excessively high temperatures can damage the silicon material, increase surface defects, and even affect the performance and yield of the final product. Therefore, an effective cooling mechanism is particularly important during polishing.

[0003] Currently, the most commonly used cooling methods in the industry are spray-type and immersion-type coolant supply. However, traditional coolant supply devices usually only have a single cooling channel. This design leads to uneven distribution of coolant, which may cause overheating or insufficient cooling in certain areas of the silicon wafer, thus affecting the polishing effect.

[0004] With the continuous advancement of semiconductor technology, the requirements for the quality and efficiency of silicon wafer polishing are also increasing. Therefore, there is an urgent need for a multi-channel coolant supply device for silicon wafer polishing, which can realize multi-channel coolant supply to improve cooling efficiency, ensure uniform coolant distribution, and thus optimize the polishing process. Utility Model Content

[0005] The purpose of this invention is to provide a multi-channel coolant supply device for silicon wafer polishing, so as to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A multi-channel coolant supply device for silicon wafer polishing includes a base for providing overall support and fixing other components. The top of the base has two symmetrically arranged supports for stably supporting a coolant tank. The tops of the two supports jointly support the coolant tank, which serves as the basic container for storing coolant and providing circulating cooling. A refrigeration device can be installed inside the tank to assist in cooling the coolant and prevent its temperature from rising after prolonged operation. For example, a semiconductor cooling module can be fixedly installed at the bottom of the tank. The semiconductor cooling module directly cools the coolant by attaching its cold end to the bottom of the tank, maintaining its temperature stability. The hot end of the semiconductor cooling module is equipped with heat dissipation fins and a cooling fan to accelerate heat dissipation and ensure cooling efficiency.

[0008] A removable filter collection box is located inside the liquid storage tank and near the top. The filter collection box is used to filter impurities in the return coolant and extend the service life of the coolant. A return hose for recovering coolant is located at the top of the liquid storage tank. The return hose is used to recover the polished coolant back into the liquid storage tank for recycling. A pump body is located at the top of the base. The pump body is used to provide power for coolant delivery. The input end of the pump body is connected to the liquid storage tank through a liquid extraction pipe. The liquid extraction pipe is used to draw coolant from the liquid storage tank to the pump body. The output end of the pump body is equipped with a liquid delivery pipe. The liquid delivery pipe is used to output the pressurized coolant.

[0009] It also includes a mounting base for installation on a silicon wafer polishing machine. The mounting base is bolted to the worktable of the silicon wafer polishing machine. A support vertical plate is provided on the right side of the mounting base to fix the infusion tube and maintain its stability. An infusion tube runs through the right side of the support vertical plate, delivering coolant from the delivery tube to the distribution tube. The inlet end of the infusion tube is connected to the delivery tube, and the outlet end of the infusion tube is connected to the distribution tube. The distribution tube distributes coolant to multiple outlet branches to achieve multi-channel supply. Multiple outlet branches are provided on the outer wall of the distribution tube, allowing independent control of the cooling in each channel. The coolant flow rate is controlled by at least five outlet branches, with at least three open during use to cover the silicon wafer surface. Under normal conditions, the middle, foremost, and rearmost outlet branches are open. Each outlet branch is equipped with a third control valve to regulate the on / off state and flow rate of each outlet branch. The output end of each outlet branch is equipped with a metal gooseneck tube, which is used to flexibly adjust the nozzle angle to adapt to the silicon wafer polishing area, allowing the coolant to flow towards the silicon wafer during the polishing process. The output end of the metal gooseneck tube is equipped with a coolant nozzle, which sprays the coolant evenly onto the silicon wafer surface.

[0010] Preferably, the top of the liquid storage tank is provided with a capped injection pipe for replenishing coolant. The capped design prevents contaminants from entering. The bottom of the liquid storage tank is provided with a drain pipe for draining residual liquid in the liquid storage tank. The drain pipe is provided with a first control valve for controlling the opening and closing of the drain pipe.

[0011] Preferably, U-shaped support side plates are provided on both the left and right sides of the inner wall of the liquid storage tank and near the top. The filter collection box is located between the two U-shaped support side plates, which are used to support the left and right sides of the filter collection box to keep it in a horizontal position.

[0012] Preferably, an operating port is provided on the front side and near the top of the liquid storage tank for the filter collection box to pass through. The operating port is used for the installation, disassembly and maintenance of the filter collection box. A sealing rubber frame is adhered to the inner wall of the operating port. The inner wall of the sealing rubber frame is tightly fitted to the outer side of the filter collection box. The sealing rubber frame is used to fill the gap between the operating port and the filter collection box to prevent coolant leakage.

[0013] Preferably, a connecting rod is provided on the rear side of the inner wall of the liquid storage tank, and a connecting pipe is provided between the front and rear sides of the inner wall of the filter collection box. The connecting rod is sleeved in the connecting pipe, which is used to allow the connecting rod to pass through in order to achieve axial positioning of the filter collection box.

[0014] Preferably, the front side of the filter collection box is provided with a sealing cover, and the center of the front side of the sealing cover is provided with an installation hole for the clamping bolt to pass through and fix the sealing cover. The installation hole is connected to the clamping bolt. The front end of the connecting rod is provided with a threaded groove for the clamping bolt to be threaded. The clamping bolt is used to lock the sealing cover and the connecting rod to prevent the filter collection box from shifting. Handles are provided on the front side of the sealing cover and near the left and right sides to facilitate the disassembly and assembly of the filter collection box by the operator.

[0015] Preferably, the outer wall of the liquid delivery pipe is provided with a pressure reducing pipe, which is used to divert the excessively high pressure coolant in the liquid delivery pipe to stabilize the system pressure. The pressure reducing pipe is provided with a second control valve for controlling the opening and closing of the pressure reducing pipe and the flow rate. The output end of the pressure reducing pipe passes through the right side of the liquid storage tank to the inside of the liquid storage tank. The output end of the pressure reducing pipe is located near the bottom of the filter collection box. Part of the coolant in the liquid delivery pipe is returned to the liquid storage tank through the pressure reducing pipe to reduce the liquid delivery pressure of the liquid delivery pipe.

[0016] When the pump body has a fixed flow rate, if the number of outlet branches used is reduced, the pressure reducing pipe can be opened to disperse the flow pressure of the outlet branches and prevent water pressure from affecting the adjusted position of the metal gooseneck tube.

[0017] Preferably, the top of the liquid storage tank is equipped with a controller that is powered by an external power source. The pump body is electrically connected to the controller via a wire, and the controller is used to control the start and stop of the pump body and its operating parameters.

[0018] Compared with the prior art, the beneficial effects of this utility model are:

[0019] 1. This multi-channel coolant supply device for silicon wafer polishing, through the combination of a distribution pipe and multiple independently controlled outlet branches, can flexibly adjust the coolant flow rate and coverage area of ​​each channel, ensuring uniform distribution of coolant on the silicon wafer surface, avoiding local overheating or insufficient cooling, and significantly improving polishing quality.

[0020] 2. This multi-channel coolant supply device for silicon wafer polishing combines a metal gooseneck tube with a coolant nozzle, allowing for free adjustment of the nozzle's direction and height to meet the polishing needs of silicon wafers of different sizes. This ensures that the coolant accurately covers the target area, reducing waste.

[0021] 3. The multi-channel coolant supply device for silicon wafer polishing has a removable filter collection box in the storage tank, which effectively filters impurities in the return coolant and extends the service life of the coolant.

[0022] 4. This multi-channel coolant supply device for silicon wafer polishing, in conjunction with a pressure reducing pipe and a second control valve, balances the system pressure in real time. When reducing the number of outlet branch pipes used, it diverts excess pressure, avoids affecting the positioning accuracy of the metal gooseneck pipe due to water pressure fluctuations, and ensures spraying stability.

[0023] 5. The multi-channel coolant supply device for silicon wafer polishing features a filter collection box that can be quickly disassembled and assembled through the design of the operating port and sealing cover. Combined with the fixing structure of the U-shaped support side plate and clamping bolts, it ensures both sealing performance and ease of cleaning and maintenance, reducing downtime. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0025] Figure 2 This is one of the partial structural schematic diagrams of this utility model;

[0026] Figure 3 This is a schematic diagram of the assembly structure of the liquid storage tank and the filter collection box in this utility model;

[0027] Figure 4 This is the second partial structural schematic diagram of the present utility model;

[0028] In the diagram: 1. Base; 10. Bracket; 2. Liquid storage tank; 20. Injection pipe; 21. Return hose; 22. Operating port; 23. Sealing rubber frame; 24. Drain pipe; 25. First control valve; 26. U-shaped support side plate; 27. Connecting rod; 270. Threaded groove; 3. Pump body; 30. Suction pipe; 31. Delivery pipe; 32. Pressure reducing pipe; 33. Second control valve; 4. Infusion pipe; 5. Mounting base; 50. Support vertical plate; 6. Diverter pipe; 60. Outlet branch pipe; 61. Third control valve; 7. Metal gooseneck pipe; 70. Coolant nozzle; 8. Filter collection box; 80. Connecting pipe; 81. Sealing cap; 810. Mounting hole; 82. Clamping bolt; 9. Controller. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0031] Please see Figures 1-4 This utility model provides a technical solution:

[0032] A multi-channel coolant supply device for silicon wafer polishing includes a base 1, which provides overall support for the device and fixes other components. The top of the base 1 is provided with two symmetrically arranged supports 10, which are used to stably support the storage tank 2. The tops of the two supports 10 jointly support the storage tank 2. The storage tank 2 is a basic container for storing coolant and providing circulating cooling. A refrigeration device can be installed in the storage tank 2 to assist in cooling the coolant and prevent the coolant temperature from rising after long-term operation. For example, a semiconductor refrigeration module can be fixedly installed at the bottom of the storage tank 2. The semiconductor refrigeration module is used to directly cool the coolant by attaching its cold end to the bottom of the storage tank 2 to maintain its temperature stability. The hot end of the semiconductor refrigeration module is provided with heat dissipation fins and a cooling fan. The heat dissipation fins and cooling fan are used to accelerate the heat dissipation of the hot end and ensure cooling efficiency.

[0033] A removable filter collection box 8 is provided inside the liquid storage tank 2 and near the top. The filter collection box 8 is used to filter impurities in the return coolant and extend the service life of the coolant. The top of the liquid storage tank 2 is provided with a return hose 21 for recovering the coolant. The return hose 21 is used to recover the polished coolant back into the liquid storage tank 2 for recycling. The top of the base 1 is provided with a pump body 3. The pump body 3 is used to provide power for coolant delivery. The input end of the pump body 3 is connected to the liquid storage tank 2 through a liquid extraction pipe 30. The liquid extraction pipe 30 is used to draw coolant from the liquid storage tank 2 to the pump body 3. The output end of the pump body 3 is provided with a liquid delivery pipe 31. The liquid delivery pipe 31 is used to output the pressurized coolant.

[0034] It also includes a mounting base 5 installed on a silicon wafer polishing machine. The mounting base 5 is bolted to the worktable of the silicon wafer polishing machine. A support vertical plate 50 is provided on the right side of the mounting base 5. The support vertical plate 50 is used to fix the liquid delivery pipe 4 and maintain its stability. The liquid delivery pipe 4 is inserted through the right side of the support vertical plate 50. The liquid delivery pipe 4 is used to transport coolant from the liquid delivery pipe 31 to the distribution pipe 6. The input end of the liquid delivery pipe 4 is connected to the liquid delivery pipe 31, and the output end of the liquid delivery pipe 4 is connected to the distribution pipe 6. The distribution pipe 6 is used to distribute coolant to multiple outlet branches 60 to achieve multi-channel supply. Multiple outlet branches 60 are provided on the outer wall of the distribution pipe 6. The outlet branches 60 are used to independently control each channel. The coolant flow rate is controlled by at least five outlet branch pipes 60, with at least three open during use to cover the silicon wafer surface. Under normal conditions, the middle, foremost, and rearmost outlet branch pipes 60 are open. Each outlet branch pipe 60 is equipped with a third control valve 61, which is used to adjust the opening and closing of each outlet branch pipe 60 and the flow rate. The output end of each outlet branch pipe 60 is equipped with a metal gooseneck tube 7, which is used to flexibly adjust the nozzle angle to adapt to the silicon wafer polishing area, so that the coolant flows toward the silicon wafer during the polishing process. The output end of the metal gooseneck tube 7 is equipped with a coolant nozzle 70, which sprays the coolant evenly onto the silicon wafer surface.

[0035] In this embodiment, the top of the liquid storage tank 2 is provided with a capped injection pipe 20, which is used to replenish coolant. The capped design prevents contaminants from entering. The bottom of the liquid storage tank 2 is provided with a drain pipe 24, which is used to drain residual liquid in the liquid storage tank 2. A first control valve 25 is provided on the drain pipe 24, which is used to control the opening and closing of the drain pipe 24.

[0036] Specifically, U-shaped support side plates 26 are provided on the left and right sides of the inner wall of the liquid storage tank 2 near the top. The filter collection box 8 is located between the two U-shaped support side plates 26. The U-shaped support side plates 26 are used to support the left and right sides of the filter collection box 8 to keep it in a horizontal position.

[0037] Furthermore, an operation port 22 is provided on the front side and near the top of the liquid storage tank 2 for the filter collection box 8 to pass through. The operation port 22 is used for the installation, disassembly and maintenance of the filter collection box 8. A sealing rubber frame 23 is bonded to the inner wall of the operation port 22. The inner wall of the sealing rubber frame 23 is tightly fitted to the outer side of the filter collection box 8. The sealing rubber frame 23 is used to fill the gap between the operation port 22 and the filter collection box 8 to prevent coolant leakage.

[0038] Furthermore, a connecting rod 27 is provided on the rear side of the inner wall of the liquid storage tank 2, and a connecting pipe 80 is provided between the front and rear sides of the inner wall of the filter collection box 8. The connecting rod 27 is sleeved in the connecting pipe 80, and the connecting pipe 80 is used for the connecting rod 27 to pass through to achieve axial positioning of the filter collection box 8.

[0039] Furthermore, a sealing cover 81 is provided on the front side of the filter collection box 8. A mounting hole 810 is provided in the middle of the front side of the sealing cover 81. The mounting hole 810 is used for the clamping bolt 82 to pass through and fix the sealing cover 81. The mounting hole 810 is connected to the clamping bolt 82. A threaded groove 270 is provided at the front end of the connecting rod 27 for the clamping bolt 82 to be threaded. The clamping bolt 82 is used to lock the sealing cover 81 and the connecting rod 27 to prevent the filter collection box 8 from shifting. Handles are provided on the front side of the sealing cover 81 and near the left and right sides to facilitate the disassembly and assembly of the filter collection box 8 by the staff.

[0040] Furthermore, the outer wall of the liquid delivery pipe 31 is provided with a pressure reducing pipe 32. The pressure reducing pipe 32 is used to divert the excessively high pressure coolant in the liquid delivery pipe 31 to stabilize the system pressure. The pressure reducing pipe 32 is provided with a second control valve 33, which is used to control the opening and closing of the pressure reducing pipe 32 and the flow rate. The output end of the pressure reducing pipe 32 passes through the right side of the liquid storage tank 2 to the inside of the liquid storage tank 2. The output end of the pressure reducing pipe 32 is located near the bottom of the filter collection box 8. Through the pressure reducing pipe 32, part of the coolant in the liquid delivery pipe 31 is returned to the liquid storage tank 2 to reduce the liquid delivery pressure of the liquid delivery pipe 4.

[0041] When the flow rate of the pump body 3 is fixed, if the number of outlet branch pipes 60 used is reduced, the pressure reducing pipe 32 can be opened to disperse the flow pressure of the outlet branch pipes 60 and avoid the water pressure affecting the adjusted position of the metal gooseneck pipe 7.

[0042] Furthermore, the top of the liquid storage tank 2 is equipped with a controller 9, which is powered by an external power source. The pump body 3 is electrically connected to the controller 9 via wires. The controller 9 is used to control the start and stop of the pump body 3 and its operating parameters.

[0043] It should be noted that the pump body 3 and controller 9 in this utility model are all general standard parts or parts known to those skilled in the art. Their structure and principle can be known to those skilled in the art through technical manuals or conventional experimental methods. The specific connection means should refer to the working order between the electrical components in the above working principle to complete the electrical connection. The detailed connection means are well known in the art. The above mainly introduces the working principle and process, and will not explain the electrical control.

[0044] In this embodiment, the multi-channel coolant supply device for silicon wafer polishing is used by first fixing the mounting base 5 to the workbench of the silicon wafer polishing machine with bolts. The removable filter collection box 8 inside the storage tank 2 is then inserted through the operating port 22 between the two U-shaped support side plates 26. The connecting pipe 80 of the filter collection box 8 is then fitted onto the connecting rod 27 on the rear side of the inner wall of the storage tank 2. Next, the clamping bolt 82 is screwed into the threaded groove 270 at the front end of the connecting rod 27 through the mounting hole 810 of the sealing cover 81. The sealing cover 81 is then locked, ensuring that the sealing rubber frame 23 fits tightly against the filter collection box 8. When replenishing coolant, the cover plate of the injection pipe 20 at the top of the storage tank 2 is opened, and coolant is injected until the liquid level is below the bottom of the filter collection box 8. The controller 9 is then activated to control the pump 3 to draw coolant from the storage tank 2 through the extraction pipe 30. The coolant is delivered to the delivery pipe 4 via the delivery pipe 31 and then enters the distribution pipe 6. It flows through at least three outlet branches 60 on the outer wall of the distribution pipe 6 (usually the middle, the frontmost, and the rearmost outlet branches 60 are open) and the flow rate is controlled by the third control valve 61. After the angle is adjusted by the metal gooseneck tube 7, the coolant is evenly sprayed onto the silicon wafer surface by the coolant nozzle 70. When the number of outlet branches 60 is reduced, the second control valve 33 on the pressure reducing pipe 32 on the outer wall of the delivery pipe 31 is opened to return some coolant to the storage tank 2 to stabilize the pressure of the delivery pipe 4 and prevent the metal gooseneck tube 7 from shifting due to water pressure. During maintenance, waste liquid is discharged through the first control valve 25 on the drain pipe 24. The filter collection box 8 is disassembled and cleaned regularly. After polishing, the pump body 3 and all control valves are closed to complete the operation.

[0045] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A multi-channel coolant supply device for silicon wafer polishing, comprising a base (1), characterized in that: The base (1) has two symmetrically arranged supports (10) on its top, and the top of the two supports (10) together support a liquid storage tank (2). A detachable filter collection box (8) is provided inside the liquid storage tank (2) and near the top. A return hose (21) for recovering coolant is provided on the top of the liquid storage tank (2). A pump body (3) is provided on the top of the base (1). The input end of the pump body (3) is connected to the liquid storage tank (2) through a liquid extraction pipe (30). The output end of the pump body (3) is provided with a liquid delivery pipe (31). It also includes a device installed on a silicon wafer polishing machine. The mounting base (5) has a support vertical plate (50) on its right side. A liquid infusion pipe (4) is provided through the support vertical plate (50) on its right side. The inlet end of the liquid infusion pipe (4) is connected to the liquid delivery pipe (31). The outlet end of the liquid infusion pipe (4) is connected to a diversion pipe (6). The outer wall of the diversion pipe (6) is provided with multiple outlet branches (60). A third control valve (61) is provided on the outlet branch (60). A metal gooseneck pipe (7) is provided at the outlet end of the outlet branch (60). A coolant nozzle (70) is provided at the outlet end of the metal gooseneck pipe (7).

2. The multi-channel coolant supply device for silicon wafer polishing according to claim 1, characterized in that: The top of the liquid storage tank (2) is provided with a capped injection pipe (20), and the bottom of the liquid storage tank (2) is provided with a drain pipe (24). The drain pipe (24) is provided with a first control valve (25).

3. The multi-channel coolant supply device for silicon wafer polishing according to claim 1, characterized in that: The liquid storage tank (2) has U-shaped support side plates (26) on both the left and right sides of the inner wall and near the top. The filter collection box (8) is located between the two U-shaped support side plates (26).

4. The multi-channel coolant supply device for silicon wafer polishing according to claim 1, characterized in that: The liquid storage tank (2) has an operation port (22) on the front side and near the top for the filter collection box (8) to pass through. The inner wall of the operation port (22) is bonded with a sealing rubber frame (23), and the inner wall of the sealing rubber frame (23) is tightly fitted to the outer side of the filter collection box (8).

5. The multi-channel coolant supply device for silicon wafer polishing according to claim 1, characterized in that: A connecting rod (27) is provided on the rear side of the inner wall of the liquid storage tank (2), and a connecting pipe (80) is provided between the front and rear sides of the inner wall of the filter collection box (8). The connecting rod (27) is sleeved in the connecting pipe (80).

6. The multi-channel coolant supply device for silicon wafer polishing according to claim 5, characterized in that: The filter collection box (8) is provided with a sealing cover (81) on the front side. The sealing cover (81) has a mounting hole (810) in the middle of the front side. The mounting hole (810) is connected to a clamping bolt (82). The front end of the connecting rod (27) has a threaded groove (270) for the clamping bolt (82) to be threaded.

7. The multi-channel coolant supply device for silicon wafer polishing according to claim 1, characterized in that: The outer wall of the liquid delivery pipe (31) is provided with a pressure reducing pipe (32), and a second control valve (33) is provided on the pressure reducing pipe (32). The output end of the pressure reducing pipe (32) passes through the right side of the liquid storage tank (2) to the inside of the liquid storage tank (2). The output end of the pressure reducing pipe (32) is located near the bottom of the filter collection box (8).

8. The multi-channel coolant supply device for silicon wafer polishing according to claim 1, characterized in that: The top of the liquid storage tank (2) is equipped with a controller (9), and the pump body (3) is electrically connected to the controller (9) via a wire.

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