Wafer carrier device

Abstract

The utility model belongs to semiconductor detection technical field discloses a kind of wafer bearing device, driving element can lift wafer to the support surface formed by at least two flexible support parts, so that the space that wafer is formed between the position and bearing platform, which is entered by wafer pick-and-place manipulator, improve the security and reliability of wafer pick-and-place operation, greatly reduce the difficulty of wafer pick-and-place operation.Driving element can lift wafer to arbitrary height within its driving stroke, to match different specifications and operation form wafer pick-and-place manipulator.Driving element can also drive wafer to abut with the support surface formed by at least two flexible support parts, so that at least two flexible support parts support wafer together, compared with rigid bearing platform in prior art, the support consistency of flexible support part to wafer is strong, reduce the degree of self deformation of wafer after being placed on flexible support part, improve the detection accuracy and detection precision of subsequent wafer geometric appearance parameters.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor testing technology, and in particular to a wafer carrier device. Background Technology

[0002] A wafer is a silicon chip used to fabricate silicon semiconductor circuits. Wafers possess various geometric parameters such as thickness, bow height, buckling, and warpage. These parameters significantly affect the yield of semiconductor products in processes such as packaging, deposition, and bonding. Before wafers are put into actual production, their parameters typically need to be tested. Some wafer testing is performed on a rigid support platform; however, the support provided by the rigid platform is uneven across different areas of the wafer, which can easily lead to wafer deformation and affect the accuracy of wafer testing.

[0003] To improve wafer inspection accuracy, some technologies employ flexible support platforms to flexibly support the wafers. This involves placing multiple transparent meshes on the platform to support the wafer, ensuring consistent support across different areas and mitigating potential deformation. However, the transparent meshes often deform under the weight of the wafer, and the varying heights at which the meshes fall under the wafer's gravity can lead to interference between the robot and other meshes or rigid collisions with the wafer. This makes wafer handling under flexible support platforms more difficult and less reliable.

[0004] Therefore, there is an urgent need to propose a wafer carrier device to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to provide a wafer carrier device that can reduce the difficulty of wafer handling and improve the reliability and accuracy of wafer handling.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] This utility model proposes a wafer carrier device, comprising: a carrier assembly including a carrier platform and at least two flexible support members, the carrier platform having a hollow receiving groove, each flexible support member having both ends connected to the carrier platform, and at least two flexible support members being spaced apart in the hollow receiving groove and forming a support surface, the support surface being configured to carry the wafer; and a lifting assembly, the lifting assembly being disposed below the carrier platform and located around the support surface, the lifting assembly including a driving member and a lifting buffer member; the driving member being able to drive the lifting buffer member to rise, thereby lifting the wafer to detach from the support surface; and the driving member being able to drive the lifting buffer member to fall, thereby lowering the wafer to abut against the support surface.

[0008] Optionally, the lifting buffer includes a guide portion and a support buffer portion fixedly connected. The guide portion has an inclined surface located on the side of the support buffer portion, through which the wafer can slide to the support buffer portion, which is used to support the wafer.

[0009] Alternatively, the angle between the inclined plane and the horizontal plane can be between 50° and 70°.

[0010] Optionally, the wafer carrier device also includes a tensioning and adjusting mechanism, which includes at least two adjusting components and at least two fixed mounting components. The carrier platform has a first mounting slot corresponding to each adjusting component and a second mounting slot corresponding to each fixed mounting component. The first end of the flexible support is installed in the first mounting slot through the adjusting components, and the second end is installed in the second mounting slot through the fixed mounting components. The adjusting components include an adjusting screw and an adjusting nut. The adjusting screw is slidably disposed in the first mounting slot and connected to the first end of the flexible support. The adjusting nut is threadedly connected to the adjusting screw and abuts against the outer wall of the carrier platform. Rotating the adjusting nut can drive the adjusting screw to slide in the first mounting slot to tension the flexible support.

[0011] Optionally, the tensioning adjustment mechanism also includes an elastic element and a measuring element. One end of the elastic element is set on the fixed mounting component, and the other end is connected to the second end of the flexible support component. The measuring element is used to measure the deformation data of the elastic element.

[0012] Alternatively, the measuring element may be a gauge for measuring the amount of expansion and contraction of the elastic element or a scale line set on the side of the elastic element.

[0013] Optionally, the tensioning adjustment mechanism also includes a locking nut, which is threaded onto the adjusting screw and can be rotated to press against the adjusting nut.

[0014] Optionally, the wafer carrier device also includes an angle adjustment element and at least two support columns, both of which are disposed below the carrier stage and are used to support the carrier stage; the angle adjustment element is detachably clamped between the carrier stage and the support columns, and is used to adjust the tilt angle of the carrier stage relative to the top surface of the support columns.

[0015] Alternatively, the angle adjustment element can be a wedge block with an inclined surface or a cylinder capable of lifting the support platform.

[0016] Optionally, an angle sensor is installed on the support platform to detect the tilt angle of the support platform relative to the top surface of the support column.

[0017] The beneficial effects of this utility model are:

[0018] This invention proposes a wafer carrier device. A driving component can elevate a lifting buffer to lift the wafer, detaching it from the support surface formed by at least two flexible supports. This creates space between the wafer and the carrier platform, allowing a wafer handling robot to access the area. This avoids interference between the robot and the flexible supports during wafer handling, preventing interruptions or wafer drops. It also avoids rigid collisions caused by limited space in existing wafer handling robots. In short, the driving component enhances the safety and reliability of wafer handling operations, significantly reducing their complexity. Furthermore, the driving component can lift the wafer to any height within its stroke to accommodate different sizes and operating methods of wafer handling robots, enhancing the synergy between the wafer carrier device and various wafer handling robots, such as vacuum suction robots or clamping robots. The driving component can also drive the lifting buffer to descend, causing the wafer to come into contact with the support surface formed by at least two flexible supports. This allows the flexible supports to jointly support the wafer. Compared to the rigid support stage used in existing technologies, the flexible supports provide stronger consistency in wafer support, reducing the wafer's deformation after placement. This improves the accuracy of wafer geometry parameter testing and enhances wafer inspection precision. The lifting buffer, instead of the driving component, contacts the wafer directly. Compared to the driving shaft of the driving component directly contacting the wafer surface rigidly, the lifting buffer reduces structural damage to the wafer during the lifting process, ensuring the safety and reliability of wafer inspection results. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of the wafer carrier device described in this embodiment of the utility model. Figure 1 ;

[0020] Figure 2 This is a schematic diagram of the lifting assembly described in an embodiment of the present invention;

[0021] Figure 3 This is a schematic diagram of the structure of the wafer carrier device described in this embodiment of the utility model. Figure 2 ;

[0022] Figure 4 This is a schematic diagram of the structure of the wafer carrier device described in this embodiment of the utility model. Figure 3 ;

[0023] Figure 5 yes Figure 4 Enlarged view of the structure at point A in the middle;

[0024] Figure 6 This is a partial structural schematic diagram of the tensioning and adjusting mechanism described in an embodiment of the present invention;

[0025] Figure 7 This is a schematic diagram of the structure of the wafer carrier device described in this embodiment of the utility model. Figure 4 ;

[0026] Figure 8 This is a schematic diagram of the structure of the wafer carrier device described in this embodiment of the utility model. Figure 5 .

[0027] In the picture:

[0028] 1. Bearing component; 11. Bearing platform; 111. Hollow receiving groove; 112. First mounting groove; 113. Second mounting groove; 12. Flexible support component; 13. Support column; 14. Bearing seat; 2. Lifting component; 21. Driving component; 22. Lifting buffer component; 221. Guide part; 222. Bearing buffer part; 3. Elastic component; 4. Tensioning adjustment mechanism; 41. Adjustment component; 411. Adjusting screw; 412. Adjusting nut; 42. Fixed mounting component; 43. Locking nut; 5. Measuring component; 6. Angle adjustment component. Detailed Implementation

[0029] The embodiments of this utility model are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar parts or parts having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0030] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection or a detachable connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium; or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0031] In the description of this utility model, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0032] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0033] like Figures 1-8 As shown, this embodiment provides a wafer carrier device, including a carrier component 1 and a lifting component 2. The carrier component 1 includes a carrier platform 11 and at least two flexible support members 12. The carrier platform 11 has a hollow receiving groove 111. Both ends of each flexible support member 12 are connected to the carrier platform 11. The at least two flexible support members 12 are spaced apart in the hollow receiving groove 111 and form a support surface, which is configured to carry the wafer. The lifting component 2 is disposed below the carrier platform 11 and located around the support surface. The lifting component 2 includes a driving member 21 and a lifting buffer member 22. The driving member 21 can drive the lifting buffer member 22 to rise, thereby lifting the wafer to detach from the support surface. The driving member 21 can also drive the lifting buffer member 22 to fall, thereby lowering the wafer to abut against the support surface. It is understood that in this embodiment, when the wafer is in contact with at least two flexible support members 12, the at least two flexible support members 12 provide stable support for the wafer, and the wafer is in a state to be tested; when the wafer is not in contact with at least two flexible support members 12, the drive member 21 and the lifting buffer member 22 provide temporary support for the wafer, and the wafer is in a state to be picked up.

[0034] In this embodiment, the drive component 21 can drive the lifting buffer component 22 to rise, thereby lifting the wafer to a position detached from the support surface formed by at least two flexible support components 12. This creates a space between the wafer location and the carrier platform 11, allowing the wafer pick-and-place robot to enter. This avoids interference between the wafer pick-and-place robot and the flexible support components 12 during wafer pick-and-placement, preventing interruptions or wafer drops during the process. It also avoids the rigid collisions caused to the wafer by the limited pick-and-placement space in existing technologies. In other words, the drive component 21 improves the safety and reliability of wafer pick-and-placement operations and significantly reduces the difficulty of these operations. Furthermore, the drive component 21 can lift the wafer to any height within its drive stroke to match wafer pick-and-placement robots of different specifications and operating methods, enhancing the operational synergy between the wafer carrier device and various wafer pick-and-placement robots such as vacuum suction robots or clamping robots. The driving component 21 can also drive the lifting buffer 22 to descend, causing the wafer to descend until it abuts against the support surface formed by at least two flexible supports 12. This allows the at least two flexible supports 12 to jointly support the wafer. Compared to the rigid support stage 11 in the prior art, the flexible supports 12 provide stronger consistency in supporting the wafer, reducing the degree of deformation of the wafer after it is placed on the flexible supports 12. This improves the accuracy of the wafer's geometric morphology parameter detection results and enhances the wafer's detection precision. The lifting buffer 22 replaces the driving component 21 in contact with the wafer. Compared to the driving shaft of the driving component 21 directly and rigidly contacting the wafer surface, the lifting buffer 22 reduces the degree of structural damage to the wafer during the lifting process, ensuring the safety and reliability of the wafer detection results.

[0035] Specifically, the wafer carrier is equipped with at least two spaced-apart drive members 21. Each drive member 21 has a lifting buffer 22 mounted on its drive shaft. Both drive members 21 can simultaneously engage the lifting buffer 22 with the wafer and lift it synchronously. Compared to using a single drive member 21, using at least two drive members 21 reduces the risk of structural deformation due to localized stress concentration, ensuring the wafer's structural stability and reducing the driving requirements of a single drive member 21. The spaced arrangement of at least two drive members 21 reduces interference with the wafer handling robot, improving the ease of wafer handling operations.

[0036] For example, the drive component 21 can be a cylinder, which offers high adjustment precision and fast adjustment response. Alternatively, the drive component 21 can be a linear motor, with its drive shaft connected to the wafer, resulting in low adjustment cost and ease of adjustment. The specific structure and working principle of the drive component 21 are prior art and will not be described further here.

[0037] Furthermore, such as Figure 1 and Figure 2As shown, the carrier component 1 may also include a carrier seat 14, which is disposed below the carrier platform 11. The driving components 21 are disposed on the carrier seat 14 in a corresponding manner. The carrier seat 14 provides stable support for the driving process of the driving components 21, ensuring the stability of the height adjustment of the wafer by the driving components 21.

[0038] Specifically, such as Figure 2 and Figure 3 As shown, the lifting buffer 22 includes a guide portion 221 and a support buffer portion 222 fixedly connected. The guide portion 221 has an inclined surface located on the side of the support buffer portion 222, through which the wafer can slide to the support buffer portion 222. The support buffer portion 222 is used to support the wafer. The inclined surface of the guide portion 221 enhances the safety and reliability of the wafer handling process, reducing the risk of poor wafer stability and wafer drop caused by improper placement by the wafer handling robot. The support buffer portion 222 reduces the impact on the wafer when the drive component 21 drives the wafer to lift and lower, minimizing structural damage and deformation, and ensuring the accuracy of subsequent wafer inspection results.

[0039] Optionally, the angle between the inclined surface and the horizontal plane is between 50° and 70°, which improves the guiding effectiveness and guiding response speed of the wafer movement direction, and also reduces the structural wear caused by excessive wafer sliding speed when the angle is too large, thus ensuring the sliding stability and reliability of the wafer. For example, in this embodiment, the inclined surface of the guide portion 221 forms an angle of 60° with the horizontal plane.

[0040] In this embodiment, as Figures 4-6As shown, the wafer carrier device also includes a tension adjustment mechanism 4. The tension adjustment mechanism 4 includes at least two adjustment components 41 and at least two fixed mounting parts 42. The carrier platform 11 has a first mounting groove 112 corresponding to each adjustment component 41 and a second mounting groove 113 corresponding to each fixed mounting part 42. The first end of the flexible support 12 is installed in the first mounting groove 112 through the adjustment component 41, and the second end is installed in the second mounting groove 113 through the fixed mounting part 42. The adjustment component 41 includes an adjustment screw 411 and an adjustment nut 412. The adjustment screw 411 is slidably disposed in the first mounting groove 112 and connected to the first end of the flexible support 12. The adjustment nut 412 is threadedly connected to the adjustment screw 411 and abuts against the outer wall surface of the carrier platform 11. Rotating the adjustment nut 412 can drive the adjustment screw 411 to slide in the first mounting groove 112 to tension the flexible support 12. Tensioning the flexible support 12 only requires rotating the adjusting nut 412, making the tensioning process simple and easy to implement, thus reducing the difficulty of tensioning the flexible support 12. It is understood that the fixed mounting member 42 is fixedly disposed in the second mounting groove 113 and connected to the second end of the flexible support 12. In this embodiment, the flexible support 12 is a wire. The first mounting groove 112 has a first clearance hole at the end near the second mounting groove 113, and the second mounting groove 113 has a second clearance hole at the end near the first mounting groove 112. The first end of the flexible support 12 along its length is tied to the adjusting screw 411 via the first clearance hole, and the second end is connected to the fixed mounting member 42 via the second clearance hole.

[0041] Specifically, such as Figures 4-7 As shown, the tensioning adjustment mechanism 4 also includes a locking nut 43, which is threadedly connected to the adjusting screw 411. The locking nut 43 can rotate to press against the adjusting nut 412. Setting the locking nut 43 to press against the adjusting nut 412 avoids the risk of the adjusting nut 412 loosening after the flexible support 12 is tensioned in place, ensuring the tensioning accuracy of the flexible support 12. This ensures the consistency of the wafer support effect of at least two flexible supports 12, improving the inspection accuracy of subsequent wafer inspection operations.

[0042] Furthermore, the tensioning adjustment mechanism 4 also includes an elastic element 3 and a measuring element 5. One end of the elastic element 3 is mounted on the fixed mounting component 42, and the other end is connected to the second end of the flexible support component 12. The measuring element 5 is used to measure the deformation data of the elastic element 3. The elastic element 3 avoids the risk of breakage caused by over-tensioning of the flexible support component 12, extends the service life of the flexible support component 12, and ensures the tensioning safety of the flexible support component 12. The measuring element 5 enables real-time measurement of the deformation data of the elastic element 3, thereby achieving real-time monitoring of the tensioning degree of each flexible support component 12. The measurement data from the measuring element 5 ensures the consistency of the wafer support effect of each flexible support component 12, improving the wafer bearing stability and uniformity. The elastic element 3 and the measuring element 5 also enhance the versatility and stability of the wafer bearing device for supporting wafers of different specifications and shapes.

[0043] For example, the measuring element 5 is a measuring tool used to measure the extension and contraction of the elastic element 3, such as a vernier caliper or tape measure, which has low measurement cost and high measurement flexibility. The measuring element 5 can also be a scale line set on the side of the elastic element 3, which has high measurement accuracy and less restriction on the measurement space, and occupies a small area on the support platform 11.

[0044] In other embodiments, the measuring element 5 can also be a tension sensor disposed on the flexible support 12, which can directly feed back the tension value borne by the flexible support 12, with high measurement accuracy and strong real-time performance.

[0045] Optionally, such as Figure 8 As shown, the wafer carrier device also includes an angle adjustment component 6 and at least two support columns 13. The at least two support columns 13 are both disposed below the carrier stage 11 and serve to support the carrier stage 11. The angle adjustment component 6 is detachably clamped between the carrier stage 11 and the support columns 13, and is used to adjust the tilt angle of the carrier stage 11 relative to the top surface of the support columns 13. The angle adjustment component 6 enables flexible angle adjustment of the carrier stage 11, enhancing the versatility of the wafer carrier device for wafer inspection operations with varying shapes and inspection requirements. The at least two support columns 13 support the carrier stage 11, enhancing the structural stability of the wafer carrier device and its stability in supporting the wafer.

[0046] In one embodiment, the angle adjusting member 6 is a wedge-shaped block with an inclined surface at an angle to the horizontal plane. The inclined surface allows for adjustment of the fixed tilt angle of the support platform 11. At least two wedge-shaped blocks can be sandwiched between the support platform 11 and the support column 13. Adjacent wedge-shaped blocks can be connected by detachable connection methods such as plugging or bonding. By raising the height of the support platform 11, the angle of the support platform 11 relative to the support column 13 can be adjusted, resulting in low adjustment cost and high convenience.

[0047] In another embodiment, the angle adjustment component 6 is a cylinder capable of lifting the support platform 11. The cylinder is located on the top surface of the support column 13 and its output end is connected to the support platform 11. By means of the lifting effect of the cylinder on the support platform 11, the angle between the support platform 11 and the top surface of the support column 13 can be flexibly adjusted, with high adjustment accuracy and strong versatility.

[0048] Specifically, an angle sensor is installed on the support platform 11 to detect the tilt angle of the support platform 11 relative to the top surface of the support column 13. Compared to manually observing whether the tilt angle is correct, the angle sensor improves the real-time performance and accuracy of the tilt angle detection of the support platform 11, enhances the adjustment accuracy of the tilt angle of the support platform 11, and ensures the accuracy of subsequent wafer inspection results. The specific structure and working principle of the angle sensor in this embodiment are prior art and will not be described in detail here.

[0049] In this embodiment, each support column 13 is rotatably equipped with a lockable roller at its bottom. The rollers improve the ease of transporting the wafer carrier and reduce the difficulty for inspection personnel in transporting the wafer carrier. The lockable rollers enhance the structural stability and positional accuracy of the wafer carrier during the wafer inspection and handling processes, ensuring the accuracy of wafer inspection and the safety of wafer handling operations.

[0050] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A wafer carrier device, characterized in that, include: The support assembly (1) includes a support platform (11) and at least two flexible support members (12). The support platform (11) has a hollow receiving groove (111). Both ends of each flexible support member (12) are connected to the support platform (11). At least two flexible support members (12) are spaced apart in the hollow receiving groove (111) and form a support surface. The support surface is configured to support the wafer. The lifting assembly (2) is located below the support platform (11) and around the support surface. The lifting assembly (2) includes a driving member (21) and a lifting buffer member (22). The driving member (21) can drive the lifting buffer member (22) to rise, thereby lifting the wafer to detach from the support surface. The driving member (21) can also drive the lifting buffer member (22) to fall, thereby lowering the wafer to abut against the support surface.

2. The wafer carrier device according to claim 1, characterized in that, The lifting buffer (22) includes a guide (221) and a support buffer (222) fixedly connected. The guide (221) has an inclined surface located on the side of the support buffer (222). The wafer can slide to the support buffer (222) via the inclined surface. The support buffer (222) is used to support the wafer.

3. The wafer carrier device according to claim 2, characterized in that, The angle between the inclined plane and the horizontal plane is between 50° and 70°.

4. The wafer carrier device according to claim 1, characterized in that, The wafer carrier device further includes a tension adjustment mechanism (4), which includes at least two adjustment components (41) and at least two fixed mounting parts (42). The carrier platform (11) has a first mounting slot (112) corresponding to each of the adjustment components (41) and a second mounting slot (113) corresponding to each of the fixed mounting parts (42). The first end of the flexible support (12) is installed in the first mounting slot (112) through the adjustment components (41), and the second end is installed in the second mounting slot (113) through the fixed mounting parts (42). The adjustment assembly (41) includes an adjustment screw (411) and an adjustment nut (412). The adjustment screw (411) is slidably disposed in the first mounting groove (112) and connected to the first end of the flexible support (12). The adjustment nut (412) is threadedly connected to the adjustment screw (411) and abuts against the outer wall of the support platform (11). Rotating the adjustment nut (412) can drive the adjustment screw (411) to slide in the first mounting groove (112) to tension the flexible support (12).

5. The wafer carrier device according to claim 4, characterized in that, The tensioning adjustment mechanism (4) further includes an elastic element (3) and a measuring element (5). One end of the elastic element (3) is disposed on the fixed mounting component (42), and the other end is connected to the second end of the flexible support component (12). The measuring element (5) is used to measure the deformation data of the elastic element (3).

6. The wafer carrier device according to claim 5, characterized in that, The measuring element (5) is a measuring tool used to measure the expansion and contraction of the elastic element (3) or a scale line set on the side of the elastic element (3).

7. The wafer carrier device according to claim 4, characterized in that, The tension adjustment mechanism (4) further includes a locking nut (43), which is threaded to the adjusting screw (411) and can rotate to press against the adjusting nut (412).

8. The wafer carrier device according to any one of claims 1-7, characterized in that, The wafer carrier device further includes an angle adjustment member (6) and at least two support columns (13). The at least two support columns (13) are disposed below the carrier platform (11) and are used to support the carrier platform (11). The angle adjustment member (6) is detachably clamped between the carrier platform (11) and the support column (13). The angle adjustment member (6) is used to adjust the tilt angle of the carrier platform (11) relative to the top surface of the support column (13).

9. The wafer carrier device according to claim 8, characterized in that, The angle adjustment component (6) is a wedge block with an inclined surface or a cylinder capable of lifting the support platform (11).

10. The wafer carrier device according to claim 8, characterized in that, An angle sensor is provided on the support platform (11), and the angle sensor is used to detect the tilt angle of the support platform (11) relative to the top surface of the support column (13).

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