A stamping die for a circuit board

Abstract

The utility model provides a kind of stamping die for circuit board production, it is related to circuit board production technical field, including fixed base, the upper end of fixed base is provided with buffer protection mechanism, buffer protection mechanism includes guide rod, the lower end of multiple guide rods is rectangular array distribution and the upper end of fixed base is fixedly connected, the outside of multiple guide rods is slidably sleeved with lifting platform, in buffer protection mechanism, guide rod, hydraulic damper and buffer spring cooperation, provide stable buffer for stamping operation, reduce impact force, protect lower mould and circuit board, blanking through-hole of lower mould, collection box design, it is convenient for waste centralized cleaning, servo motor cylinder, torsional spring, swing block etc. are cooperated in quick fixing mechanism, two sides of circuit board are clamped and pressed from above in one action, simplify operation procedure, solve traditional fixed step complicated, poor synchronism problem, improve fixing efficiency and stability, to improve the effect of circuit board stamping efficiency.

Description

Technical Field

[0001] This utility model relates to the field of circuit board manufacturing technology, and in particular to a stamping die for circuit board manufacturing. Background Technology

[0002] Stamping dies are special process equipment used in cold stamping to process materials into parts. Stamping is a pressure processing method that uses dies mounted on a press to apply pressure to materials at room temperature, causing them to separate or undergo plastic deformation, thereby obtaining the desired parts. Circuit boards, also known as printed circuit boards, require stamping dies to punch holes during their production. Circuit boards need to be fixed before stamping to prevent shaking during the process, but current fixing devices involve many steps and are cumbersome to operate, which seriously affects the stamping efficiency of circuit boards.

[0003] For example, a stamping die for circuit board production disclosed in Chinese patent literature (publication number: CN220279858U) uses a positioning seat to install the main body of the device on both sides of the stamping die body. Then, by rotating the adjusting screw one clockwise to engage with the mounting cylinder, the limiting frame is pushed to move closer to both sides of the stamping die body. Similarly, by rotating the adjusting screw two clockwise, the positioning plate is pushed down to position the circuit board, thereby improving the stamping efficiency and thus improving the utilization efficiency of the stamping die.

[0004] However, when fixing the circuit board, it is necessary to first rotate the first adjusting screw to push the limit frame to initially clamp the two sides of the circuit board, and then rotate the second adjusting screw to drive the positioning plate to press and fix the upper part of the circuit board. The operation steps are cumbersome, and there are two adjusting screws that need to be rotated synchronously, which makes the operation difficult and seriously affects the stamping efficiency of the circuit board. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies, such as the cumbersome operation and serious impact on stamping efficiency when fixing circuit boards.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A stamping die for circuit board production includes a fixed base, and a buffer protection mechanism is provided at the upper end of the fixed base;

[0008] The buffer protection mechanism includes guide rods, the lower ends of which are arranged in a rectangular array and fixedly connected to the upper end of the fixed base. A lifting platform is slidably sleeved on the outside of each of the guide rods. A hydraulic damping rod arranged in a rectangular array is fixedly installed on the upper end of the fixed base. One end of each of the hydraulic damping rods is fixedly connected to the lower end of the lifting platform. A buffer spring arranged in a rectangular array is fixedly connected to the upper end of the fixed base. One end of each of the buffer springs is fixedly connected to the lower end of the lifting platform. A lower mold is fixedly connected to the upper end of the lifting platform.

[0009] The upper end of the lower mold is provided with a quick-fixing mechanism.

[0010] Preferably, a top plate is fixedly connected to the upper end of each of the multiple guide rods, and a stamping cylinder is fixedly installed on the upper end of the top plate. One end of the piston rod of the stamping cylinder passes through the top plate and is fixedly connected to the upper mold.

[0011] Preferably, a collection box is movably inserted into the front of the lower mold, and the upper end of the lower mold has material discharge through holes arranged in a linear array.

[0012] Preferably, the quick fixing mechanism includes guide rails, the lower ends of two guide rails are symmetrically distributed and fixedly connected to the upper end of the lower mold, and movable sleeves are slidably sleeved on the outside of the guide rails. Four movable sleeves are symmetrically distributed in groups of two, and a movable frame is fixedly connected to the upper end of each group of movable sleeves.

[0013] Preferably, rotating rods are rotatably connected to the inner walls of both sides of the movable frame via bearings, and swing blocks are fixedly sleeved on the outside of the rotating rods. Symmetrically distributed torsion springs are fixedly connected to the inner walls of both sides of the movable frame, and the opposite ends of the two torsion springs are fixedly connected to the front and back of the swing blocks, respectively.

[0014] Preferably, an arc-shaped pressure block is fixedly connected to one side of the swing block, an L-shaped clamping plate is fixedly connected to the lower end of the moving frame, the lower end of the L-shaped clamping plate contacts the upper end of the lower mold, and symmetrically distributed support blocks are fixedly connected to the upper end of the lifting platform.

[0015] Preferably, a first support is fixedly installed on one side of the support block, and a servo electric cylinder is hinged to the inner wall of the first support via a pin. One end of the piston rod of the servo electric cylinder is hinged to a second support via a pin, and one side of the second support is fixedly connected to the other side of the swing block.

[0016] Compared with the prior art, the beneficial effects of this utility model are:

[0017] In this invention, the guide rod, hydraulic damping rod, and buffer spring in the buffer protection mechanism work together to provide stable buffering for the stamping operation, reduce impact force, and protect the lower die and circuit board. The material discharge through hole and collection box design of the lower die facilitates the centralized cleaning of waste materials. The quick fixing mechanism, through the coordinated action of servo electric cylinder, torsion spring, swing block, etc., realizes the clamping of the circuit board on both sides and the pressing from above in one action, simplifying the operation process and solving the problems of cumbersome fixing steps and poor synchronization in traditional methods, thereby improving fixing efficiency and stability and thus improving the stamping efficiency of the circuit board. Attached Figure Description

[0018] Figure 1 A schematic diagram of the main structure of a stamping die for circuit board production provided by this utility model;

[0019] Figure 2 A perspective view of the upper die structure of a stamping die for circuit board production provided by this utility model;

[0020] Figure 3 A perspective view of a fixed base structure for a stamping die used in circuit board production provided by this utility model;

[0021] Figure 4 A three-dimensional view of the lifting platform structure of a stamping die for circuit board production provided by this utility model.

[0022] Figure 5 A perspective view of a movable frame structure for a stamping die used in circuit board production, provided by this utility model.

[0023] Legend: 1. Fixed base; 2. Guide rod; 21. Lifting platform; 22. Hydraulic damping rod; 23. Buffer spring; 24. Lower mold; 25. Top plate; 26. Stamping cylinder; 27. Upper mold; 28. Collection box; 29. ​​Material discharge through hole; 3. Guide rail; 31. Moving sleeve; 32. Moving frame; 33. Rotating rod; 34. Swing block; 35. Torsion spring; 36. Arc-shaped pressure block; 37. L-shaped clamping plate; 38. Support block; 39. First support; 310. Servo electric cylinder; 311. Second support. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0025] To facilitate understanding of this utility model, a more comprehensive description of this utility model will be provided below with reference to relevant embodiments, and several embodiments of this utility model will be given. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of this utility model more thorough and complete.

[0026] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0028] Example

[0029] like Figures 1-5 As shown, this utility model provides a technical solution: a stamping die for circuit board production, including a fixed base 1, which achieves stable stamping of circuit boards through the cooperation of a buffer protection mechanism and a quick fixing mechanism, and is adapted to the needs of high-efficiency production.

[0030] The guide rods 2 arranged in a rectangular array on the upper end of the fixed base 1 provide a precise guide track for the sliding of the lifting platform 21. The lifting platform 21 is slidably sleeved on the outside of the guide rods 2 and can move vertically along the guide rods 2.

[0031] During the stamping process, the guide rod 2 ensures that the lifting platform 21 always maintains a vertical movement state, preventing it from tilting or shifting, thereby providing a stable support foundation for the lower die 24 and the circuit board, and ensuring the stability and accuracy of the stamping operation.

[0032] The upper end of the fixed base 1 is fixedly installed with hydraulic damping rods 22 arranged in a rectangular array and buffer springs 23 fixedly connected. One end of each is connected to the lower end of the lifting platform 21. When the stamping operation is performed, the upper mold 27 applies pressure to the circuit board. This pressure is transmitted through the circuit board to the lower mold 24 and the lifting platform 21, and then acts on the hydraulic damping rods 22 and buffer springs 23.

[0033] The hydraulic damping rod 22 utilizes its damping characteristics to slowly absorb and release the impact force generated by stamping, avoiding excessive instantaneous impact force that could cause hard damage to the mold and circuit board. The buffer spring 23 buffers the impact force through its own elastic deformation, further reducing vibration during the stamping process. The two work together to effectively protect the lower mold 24 and the circuit board, extend the service life of the mold, and ensure the quality stability of the circuit board during the stamping process.

[0034] The collection box 28 that is movably inserted into the front of the lower mold 24, and the blanking through holes 29 that are linearly distributed at the top, constitute a waste collection system. During the stamping operation, the punches of the upper mold 27 punch the circuit board, and the waste generated will fall naturally into the collection box 28 through the blanking through holes 29.

[0035] This design allows for centralized collection of waste materials, preventing them from scattering around the mold and facilitating subsequent centralized cleaning. It maintains a clean working environment, reduces the risk of equipment failure due to waste accumulation, and also improves production continuity by eliminating the need for frequent shutdowns to clean up waste materials, thus increasing overall production efficiency.

[0036] The guide rails 3, which are symmetrically distributed on the upper end of the lower mold 24, provide a track for the sliding of the movable sleeve 31. The movable sleeve 31 is slidably sleeved on the outside of the guide rail 3. The four movable sleeves 31 are symmetrically distributed in groups of two. The upper end of each group of movable sleeves 31 is fixedly connected to a movable frame 32.

[0037] When the servo electric cylinder 310 is started, it can push the movable sleeve 31 to move along the guide rail 3, thereby driving the movable frame 32 to move. The cooperation between the guide rail 3 and the movable sleeve 31 ensures the linearity and stability of the movement of the movable frame 32, providing basic moving support for the fixation of the circuit board.

[0038] The inner walls of both sides of the movable frame 32 are rotatably connected to rotating rods 33 via bearings. Swing blocks 34 are fixedly sleeved on the outside of the rotating rods 33. Symmetrically distributed torsion springs 35 are fixedly connected to the inner walls of both sides of the movable frame 32. The opposite ends of the two torsion springs 35 are fixedly connected to the front and back of the swing block 34, respectively.

[0039] The torsion spring 35 has a certain initial torque, which can keep the swing block 34 in a relatively stable position in the initial state. When the servo electric cylinder 310 pushes the moving frame 32 to move, the torque of the torsion spring 35 interacts with the friction between the moving sleeve 31 and the guide rail 3 to realize the initial movement and positioning of the moving frame 32.

[0040] An arc-shaped pressure block 36 is fixedly connected to one side of the swing block 34, and an L-shaped clamping plate 37 is fixedly connected to the lower end of the moving frame 32. The L-shaped clamping plate 37 can clamp the circuit board from both sides to achieve initial horizontal fixation.

[0041] Driven by the swing block 34, the arc-shaped pressure block 36 can move upwards on the circuit board to press the upper end of the circuit board and fix it vertically. This method of fixing from both sides and the top at the same time can constrain the displacement of the circuit board in all directions, prevent the circuit board from shaking or shifting during the stamping process, and ensure the accuracy and quality of the stamping.

[0042] The symmetrically distributed support blocks 38 fixedly connected to the upper end of the lifting platform 21 provide a foundation for the installation of the first support 39. The inner wall of the first support 39 is hinged to a servo electric cylinder 310 by a pin. One end of the piston rod of the servo electric cylinder 310 is hinged to a second support 311 by a pin. One side of the second support 311 is fixedly connected to the other side of the swing block 34.

[0043] The servo electric cylinder 310 serves as a power source, providing stable thrust. Through the hinged connection between the first support 39 and the second support 311, the thrust of the servo electric cylinder 310 can be effectively transmitted to the swing block 34, enabling the swing of the swing block 34 and the movement of the moving frame 32. This power transmission method allows for the linkage between the servo electric cylinder 310 and the torsion spring 35, completing the clamping of both sides of the circuit board and the pressing of the top in a single action. This simplifies the fixing process, solves the problem of poor synchronization in traditional fixing methods, and greatly improves fixing efficiency and stability.

[0044] The working process of this utility model:

[0045] Step 1: Place the circuit board to be stamped stably on the upper end of the lower mold 24, ensuring that the circuit board is within the stamping area of ​​the mold. Start the servo electric cylinder 310, and the piston rod extends. Because the initial torque of the torsion spring 35 is greater than the friction between the guide rail 3 and the moving sleeve 31, it pushes the two sets of moving frames 32 to move closer to each other along the guide rail 3. The L-shaped clamping plate 37 at the lower end of the moving frame 32 moves with the moving frame 32 and fits against the sides of the circuit board to achieve initial clamping and limiting, quickly constraining the horizontal displacement of the circuit board. The piston rod of the servo electric cylinder 310 continues to extend, and the thrust overcomes the torque of the torsion spring 35, driving the rotating rod 33 to rotate, causing the swing block 34 to swing around the rotating rod 33. The arc-shaped pressure block 36 on one side of the swing block 34 moves upward to the circuit board. Using the end silicone protective sleeve, it gently and stably presses the upper part of the circuit board to complete the all-round fixation and prevent the circuit board from shaking or shifting during stamping.

[0046] Step 2: After fixing, start the stamping cylinder 26 at the top of the top plate 25. The piston rod extends and drives the upper mold 27 to move downward. The punch of the upper mold 27 accurately acts on the circuit board to perform the punching operation. The waste material generated by the stamping falls naturally into the collection box 28 that is movable and plugged in on the front through the material drop hole 29 at the top of the lower mold 24, which is convenient for subsequent centralized cleaning and keeps the working environment clean. After the stamping is completed, the piston rod of the stamping cylinder 26 retracts, the upper mold 27 is reset, and the piston rod of the servo electric cylinder 310 is started to retract, which drives the moving frame 32, swing block 34 and other components to reset. The L-shaped clamping plate 37 and the arc-shaped pressure block 36 loosen the circuit board, and the stamped circuit board can be manually removed.

[0047] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A stamping die for circuit board production, comprising a fixed base (1), characterized in that: The upper end of the fixed base (1) is provided with a buffer protection mechanism; The buffer protection mechanism includes guide rods (2), the lower ends of multiple guide rods (2) are arranged in a rectangular array and fixedly connected to the upper end of the fixed base (1), and a lifting platform (21) is slidably sleeved on the outside of multiple guide rods (2). A hydraulic damping rod (22) arranged in a rectangular array is fixedly installed on the upper end of the fixed base (1). One end of multiple hydraulic damping rods (22) is fixedly connected to the lower end of the lifting platform (21). A buffer spring (23) arranged in a rectangular array is fixedly connected to the upper end of the fixed base (1). One end of multiple buffer springs (23) is fixedly connected to the lower end of the lifting platform (21). A lower mold (24) is fixedly connected to the upper end of the lifting platform (21). The upper end of the lower mold (24) is provided with a quick fixing mechanism.

2. The stamping die for circuit board production according to claim 1, characterized in that: The upper ends of the multiple guide rods (2) are fixedly connected to a top plate (25), and a stamping cylinder (26) is fixedly installed on the upper end of the top plate (25). One end of the piston rod of the stamping cylinder (26) passes through the top plate (25) and is fixedly connected to an upper mold (27).

3. The stamping die for circuit board production according to claim 1, characterized in that: A collection box (28) is movably inserted into the front of the lower mold (24), and a material dropping through hole (29) is provided at the upper end of the lower mold (24) in a linear array.

4. The stamping die for circuit board production according to claim 1, characterized in that: The quick-fixing mechanism includes guide rails (3), the lower ends of two guide rails (3) are symmetrically distributed and fixedly connected to the upper end of the lower mold (24), and a movable sleeve (31) is slidably sleeved on the outside of the guide rails (3). The four movable sleeves (31) are symmetrically distributed in groups of two, and a movable frame (32) is fixedly connected to the upper end of each group of movable sleeves (31).

5. A stamping die for circuit board production according to claim 4, characterized in that: The inner walls of both sides of the movable frame (32) are rotatably connected to rotating rods (33) via bearings. A swing block (34) is fixedly sleeved on the outside of the rotating rod (33). Symmetrically distributed torsion springs (35) are fixedly connected to the inner walls of both sides of the movable frame (32). The opposite ends of the two torsion springs (35) are fixedly connected to the front and back of the swing block (34) respectively.

6. A stamping die for circuit board production according to claim 5, characterized in that: An arc-shaped pressure block (36) is fixedly connected to one side of the swing block (34), an L-shaped clamping plate (37) is fixedly connected to the lower end of the moving frame (32), the lower end of the L-shaped clamping plate (37) contacts the upper end of the lower mold (24), and a symmetrically distributed support block (38) is fixedly connected to the upper end of the lifting platform (21).

7. A stamping die for circuit board production according to claim 6, characterized in that: A first support (39) is fixedly installed on one side of the support block (38). A servo electric cylinder (310) is hinged to the inner wall of the first support (39) by a pin. A second support (311) is hinged to one end of the piston rod of the servo electric cylinder (310) by a pin. One side of the second support (311) is fixedly connected to the other side of the swing block (34).

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