A slicing apparatus for a substrate ingot

Abstract

The utility model discloses a kind of slicing device of substrate crystal bar, including crystal bar feeding device, cutting device and cutting adjustment device;The crystal bar feeding device is used to drive crystal bar to do lifting motion;The cutting device includes oppositely arranged wire wheel, cutting line around being equipped between the wire wheel, wire rod and first driving part, two wire rods are spaced apart between two wire wheels along horizontal direction, and contact with the side of cutting line deviating from the crystal bar feeding device, first driving part is connected with the wire wheel, to drive the wire wheel rotation;Cutting adjustment device includes first driving assembly and adjusting rod, the adjusting rod and the side of cutting line towards the crystal bar feeding device contact, to form the erection structure of triangle with the wire rod cooperation, the first driving assembly is used to drive the adjusting rod moves, to adjust the inclination angle of the cutting line at the erection structure.

Description

Technical Field

[0001] This utility model relates to the field of crystal rod slicing technology, and in particular to a slicing device for substrate crystal rods. Background Technology

[0002] Indium phosphide (InP) substrates, due to their excellent electronic and optoelectronic properties, have shown broad market prospects in radio frequency (RF) device applications in fields such as high-frequency high-power devices, fiber optic communication, wireless transmission, and radio astronomy. RF devices fabricated on InP substrates have demonstrated superior performance in key applications such as satellite communication and radar systems, exhibiting significant competitive advantages, particularly in RF front-ends and wide-bandwidth analog / mixed-signal circuits. They are suitable for demanding applications such as high-speed data processing and high-precision broadband A / D conversion. Furthermore, InP-based devices, such as low-noise amplifiers, functional modules, and receivers, have been widely used in millimeter-wave radar, active and passive millimeter-wave imaging, and satellite communication systems. In the high-frequency bandwidth range above 100 GHz, InP-based RF devices demonstrate significant technological advantages in backhaul networks and point-to-point wireless communication systems. However, in the fabrication process of InP substrates, conventional ingot dicing processes typically begin from the bottom of the ingot, resulting in low dicing efficiency. Utility Model Content

[0003] The technical problem to be solved by this utility model is that conventional crystal rod cutting processes usually start from the bottom of the crystal rod, which results in low cutting efficiency.

[0004] To solve the above-mentioned technical problems, this utility model provides a substrate crystal rod slicing device, including a crystal rod feeding device, a cutting device, and a cutting adjustment device;

[0005] The crystal rod feeding device is used to drive the crystal rod to move up and down;

[0006] The cutting device includes guide wheels arranged opposite each other, a cutting line wound between the guide wheels, guide rods, and a first driving member. The two guide rods are arranged horizontally between the two guide wheels and contact the side of the cutting line away from the crystal rod feeding device. The first driving member is connected to the guide wheels to drive the guide wheels to rotate.

[0007] The cutting adjustment device includes a first driving component and an adjusting rod. The adjusting rod contacts the side of the cutting line facing the crystal rod feeding device to form a triangular support structure with the guide rod. The first driving component is used to drive the adjusting rod to move so as to adjust the tilt angle of the cutting line at the support structure.

[0008] Furthermore, the cutting lines are multiple and spaced apart along the axial direction of the guide wheel.

[0009] Furthermore, the first drive assembly includes a second drive member, a first slider, a first mounting bracket, a first lead screw, and a support base. The second drive member and the first lead screw are mounted on the first mounting bracket, and one end of the second drive member is connected to one end of the first lead screw. The other end of the first lead screw is rotatably mounted on the first mounting bracket. The first slider is slidably mounted on the first mounting bracket and is drivenly connected to the first lead screw. The support base is connected to the first slider and forms a clearance space. The adjusting rod is mounted on the support base.

[0010] Furthermore, the support base has a first support plate and two second support plates integrally formed with the first support plate. The two second support plates are perpendicular to the first support plate and are disposed opposite to each other at both ends of the first support plate. The two ends of the adjusting rod are respectively connected to the corresponding second support plates, and the gap between the second support plates forms the clearance space.

[0011] Furthermore, the cutting adjustment device also includes a second drive assembly, which includes a third drive member, a second slider, a second mounting bracket, and a second lead screw. The third drive member and the second lead screw are mounted on the second mounting bracket, and one end of the third drive member is connected to one end of the second lead screw. The other end of the second lead screw is rotatably mounted on the second mounting bracket. The second slider is slidably mounted on the second mounting bracket and is drivenly connected to the second lead screw. The first drive assembly is connected to the second slider.

[0012] Furthermore, the cutting device also includes a support frame, the guide wheel and the guide rod are rotatably mounted on the support frame, and the first driving member is mounted on the support frame.

[0013] Furthermore, the ingot feeding device includes a third driving component and a connecting component. The third driving component is connected to the connecting component to drive the connecting component to perform lifting and lowering movements. The connecting component is connected to the ingot.

[0014] Furthermore, the third drive assembly includes a fourth drive member, a third slider, a third mounting bracket, and a third lead screw. The fourth drive member and the third lead screw are mounted on the third mounting bracket, and one end of the fourth drive member is connected to one end of the third lead screw. The other end of the third lead screw is rotatably mounted on the third mounting bracket. The third slider is slidably mounted on the third mounting bracket and is drivenly connected to the third lead screw. The connecting assembly is connected to the third slider.

[0015] Furthermore, the connecting assembly includes a first connecting plate, a second connecting plate, and a locking member. The first connecting plate is connected to the third driving assembly, the second connecting plate is connected to the first connecting plate through the locking member, and the crystal rod is connected to the second connecting plate.

[0016] Furthermore, the third drive component has two sets, and the two sets of the third drive component are spaced apart in the horizontal direction.

[0017] Compared with the prior art, the slicing device for substrate crystal rods according to this embodiment of the utility model has the following advantages:

[0018] In the initial cutting stage of this embodiment, the crystal rod slowly descends under the drive of the crystal rod feeding device, contacting the high-speed cutting wire. At this time, the two sides of the cutting wire contact the crystal rod, forming a symmetrical cut, and begin to cut into the surface of the crystal rod. When the cutting wire has cut into the crystal rod to a certain depth on both sides, the first driving component is activated, driving the adjusting rod to move. At this time, the movement of the adjusting rod changes the tension distribution of the cutting wire in the triangular support structure formed by the guide rod and the adjusting rod, making the tilt angle of the cutting wire on the side closer to the support structure larger and the tilt angle on the other side smaller. As the crystal rod continues to descend, the cutting wire can cut the crystal rod at a lateral tilt. When it cuts to the cut mark on the other side, the entire crystal rod is sliced. In this embodiment, the angle of the cutting wire can be adjusted while cutting, realizing the method of cutting the two sides first and then the middle, improving cutting efficiency. Attached Figure Description

[0019] The present application will be further described in detail below with reference to the accompanying drawings and preferred embodiments. However, those skilled in the art will appreciate that these drawings are drawn only for the purpose of explaining the preferred embodiments and therefore should not be construed as limiting the scope of the present application. Furthermore, unless specifically indicated, the drawings are intended only to conceptually represent the composition or structure of the described objects and may contain exaggerated representations, and the drawings are not necessarily drawn to scale.

[0020] Figure 1 This is a schematic diagram of the first state of the substrate crystal rod slicing device provided in this embodiment of the present invention;

[0021] Figure 2 This is a front view of the first state of the substrate crystal rod slicing device provided in this embodiment of the present invention;

[0022] Figure 3 This is a schematic diagram of the second state of the substrate crystal rod slicing device provided in this embodiment of the present invention;

[0023] Figure 4 This is a front view of the second state of the substrate ingot slicing apparatus provided in this embodiment of the present invention;

[0024] In the diagram, 1. Crystal rod feeding device; 11. Third drive assembly; 111. Fourth drive component; 112. Third slider; 113. Third mounting bracket; 114. Third lead screw; 12. Connecting assembly; 121. First connecting plate; 122. Second connecting plate; 2. Cutting device; 21. Guide wheel; 22. Cutting wire; 23. Guide rod; 24. First drive component; 25. Support frame; 3. Cutting adjustment device; 31. First drive assembly; 311. First slider; 312. First mounting bracket; 313. First lead screw; 314. Support seat; 3141. First support plate; 3142. Second support plate; 32. Adjusting rod; 33. Second drive assembly; 331. Third drive component; 332. Second slider; 333. Second mounting bracket; 334. Second lead screw; 4. Crystal rod. Detailed Implementation

[0025] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0026] like Figures 1 to 4 As shown, this utility model provides a substrate ingot slicing device, including an ingot feeding device 1, a cutting device 2, and a cutting adjustment device 3. The ingot feeding device 1 is used to drive the ingot 4 to move up and down. The cutting device 2 includes guide wheels 21 arranged opposite each other, a cutting line 22 wound between the guide wheels 21, a guide rod 23, and a first driving member 24. The two guide rods 23 are arranged horizontally between the two guide wheels 21 and contact the side of the cutting line 22 away from the ingot feeding device 1, which plays the role of supporting and positioning the cutting line 22. The first driving member 24 is connected to the guide wheels 21 to drive the guide wheels 21 to rotate. The cutting adjustment device 3 includes a first driving component 31 and an adjusting rod 32. The adjusting rod 32 contacts the side of the cutting line 22 facing the ingot feeding device 1 to form a triangular support structure with the guide rod 23. The first driving component 31 is used to drive the adjusting rod 32 to move, which can drive the adjusting rod 32 to move in the horizontal or inclined direction to adjust the inclination angle of the cutting line 22 at the support structure.

[0027] Based on the above structure, during the initial cutting stage (such as...) Figure 2As shown, the crystal rod 4 slowly descends under the drive of the crystal rod feeding device 1, contacting the high-speed cutting wire 22. At this time, the two sides of the cutting wire 22 contact the crystal rod 4, forming a symmetrical cut, and begin to cut into the surface of the crystal rod 4. When the cutting wire 22 has cut into the two sides of the crystal rod 4 to a certain depth, the first driving component 31 is activated, driving the adjusting rod 32 to move. At this time, the movement of the adjusting rod 32 changes the tension distribution of the cutting wire 22 in the triangular support structure formed by the guide rod 23 and the adjusting rod 32, making the tilt angle of the cutting wire 22 on one side of the support structure larger and the tilt angle on the other side smaller (e.g., ...). Figure 4 As shown, as the crystal rod 4 continues to descend, the cutting length of the cutting line 22 on the side with a smaller tilt angle that contacts the crystal rod 4 increases, allowing for a tilted cut from the side of the crystal rod 4. When the cut reaches the other side, the entire crystal rod 4 is sliced. In this embodiment, the angle of the cutting line 22 can be adjusted during cutting, allowing for a method of cutting both sides first and then the middle, thus improving cutting efficiency.

[0028] Understandably, in this embodiment, the cutting wire 22 is a diamond wire, and the first driving component 24 is a motor.

[0029] Furthermore, the cutting lines 22 are multiple and spaced apart along the axis of the guide wheel 21. In this embodiment, by setting multiple cutting lines 22, a crystal rod 4 can be cut simultaneously, realizing the cutting of multiple thin slices at once, which greatly improves production efficiency. In addition, all cutting lines 22 are driven synchronously by the same set of guide wheels 21, with consistent tension and speed, which can ensure that each slice of material is of uniform thickness and has high precision.

[0030] Furthermore, the first drive assembly 31 includes a second drive member, a first slider 311, a first mounting bracket 312, a first lead screw 313, and a support base 314. The second drive member and the first lead screw 313 are mounted on the first mounting bracket 312, and one end of the second drive member is connected to one end of the first lead screw 313 to transmit rotational motion to the first lead screw 313. The other end of the first lead screw 313 is rotatably mounted on the first mounting bracket 312 to achieve support at both ends and ensure smooth rotation. The first slider 311 is slidably mounted on the first mounting bracket 314. 12, and is connected to the first lead screw 313 for transmission, so that when the first lead screw 313 rotates, the first slider 311 cannot rotate with the first lead screw 313, but can only make linear reciprocating motion along the axis of the first lead screw 313 to achieve linear displacement. The support seat 314 is connected to the first slider 311, and the support seat 314 forms a clearance space to provide sufficient space for the cutting line 22 and prevent interference during the movement. The adjusting rod 32 is installed on the support seat 314, and changes the local tension and tilt angle of the cutting line 22 by changing its position.

[0031] Based on the above structure, the second driving component is activated, causing the first lead screw 313 to rotate. The rotation of the first lead screw 313 drives the first slider 311, which is connected to it, to move linearly along the mounting frame. The first slider 311 drives the support base 314 connected to it to move synchronously, causing the adjusting rod 32 located on the support base 314 to move and change position, thereby changing the local tension and tilt angle of the cutting wire 22, and realizing the dynamic adjustment of the tilt angle of the cutting wire 22 at the erection structure. In this embodiment, the second driving component is a motor.

[0032] Understandably, the first mounting bracket 312 in this embodiment is provided with a slide rail for the first slider 311 to be slidably mounted.

[0033] Furthermore, the support base 314 has a first support plate 3141 and two second support plates 3142 integrally formed with the first support plate 3141. The two second support plates 3142 are perpendicular to the first support plate 3141 and are disposed opposite to each other at both ends of the first support plate 3141. The two ends of the adjusting rod 32 are respectively connected to the corresponding second support plates 3142, and the gap between the second support plates 3142 forms a clearance space.

[0034] In this embodiment, the gap between the two second support plates 3142 roughly forms a U-shaped open area to avoid the cutting line 22, providing sufficient passage space for the high-speed moving cutting line 22, preventing the support base 314 from physically contacting or rubbing against the cutting line 22 during movement, preventing mechanical collisions, and ensuring the safe operation of the equipment.

[0035] Furthermore, the cutting adjustment device 3 also includes a second drive assembly 33, which includes a third drive member 331, a second slider 332, a second mounting bracket 333, and a second lead screw 334. The third drive member 331 and the second lead screw 334 are mounted on the second mounting bracket 333, and one end of the third drive member 331 is connected to one end of the second lead screw 334 to transmit rotational motion to the second lead screw 334. The other end of the second lead screw 334 is rotatably mounted on the second mounting bracket 333 to achieve two-end support and ensure smooth rotation. The second slider 332 is slidably mounted on the second mounting bracket 333 and is connected to the second lead screw 334 for transmission. When the second lead screw 334 rotates, the second slider 332 cannot rotate with the second lead screw 334, but can only make linear reciprocating motion along the axis of the second lead screw 334 to achieve linear displacement. The first drive assembly 31 is connected to the second slider 332 so that when the second slider 332 rises and falls, it drives the entire first drive assembly 31 to move up and down together.

[0036] Based on the above structure, the third driving component 331 is activated, driving the second lead screw 334 to rotate. The second lead screw 334 drives the second slider 332, which is connected to it, to move vertically up and down along the second mounting bracket 333. The second slider 332 drives the entire first driving assembly 31 connected to it to move up and down synchronously, so that the adjusting rod 32 in the first driving assembly 31 changes its height position accordingly. This can be coordinated with the movement of the first driving assembly 31 to realize dynamic adjustment of the cutting according to the feed depth of the crystal rod 4 during the cutting process. In this embodiment, the third driving component 331 is a motor.

[0037] Understandably, the second mounting bracket 333 in this embodiment is provided with a slide rail for the second slider 332 to be slidably mounted.

[0038] Furthermore, the cutting device 2 also includes a support frame 25, with the guide wheel 21 and the guide rod 23 rotatably mounted on the support frame 25, and the first driving member 24 mounted on the support frame 25.

[0039] The support frame 25 in this embodiment is used to fix and support other components. It can be made of metal to give it sufficient strength and rigidity to ensure the stable operation of the entire device.

[0040] Furthermore, the ingot feeding device 1 includes a third driving component 11 and a connecting component 12. The third driving component 11 is connected to the connecting component 12 to drive the connecting component 12 to perform lifting and lowering movements. The connecting component 12 is connected to the ingot 4. In this embodiment, the lifting and lowering of the connecting component 12 is adjusted by the third driving component 11 to drive the lifting and lowering of the ingot 4, and the cutting of the ingot 4 is achieved through cooperation with the cutting line 22.

[0041] Furthermore, the third drive assembly 11 includes a fourth drive member 111, a third slider 112, a third mounting bracket 113, and a third lead screw 114. The fourth drive member 111 and the third lead screw 114 are mounted on the third mounting bracket 113, and one end of the fourth drive member 111 is connected to one end of the third lead screw 114 to transmit rotational motion to the third lead screw 114. The other end of the third lead screw 114 is rotatably mounted on the third mounting bracket 113 to achieve two-end support and ensure smooth rotation. The third slider 112 is slidably mounted on the third mounting bracket 113 and is connected to the third lead screw 114 for transmission. When the third lead screw 114 rotates, the third slider 112 cannot rotate with the third lead screw 114 and can only make linear reciprocating motion along the axis of the third lead screw 114 to achieve linear displacement. The connecting assembly 12 is connected to the third slider 112 so that when the third slider 112 rises and falls, it drives the connecting assembly 12 and the crystal rod 4 to move up and down together.

[0042] Based on the above structure, the fourth driving component 111 is activated, driving the third lead screw 114 to rotate. The third lead screw 114 drives the third slider 112, which is connected to it, to move vertically up and down along the third mounting bracket 113. The third slider 112 drives the entire connecting assembly 12 and the crystal rod 4 connected to it to move up and down synchronously, so that the crystal rod 4 can be raised and lowered during the cutting process. In this embodiment, the fourth driving component 111 is a motor.

[0043] Understandably, the third mounting bracket 113 in this embodiment is provided with a slide rail for the third slider 112 to be slidably mounted.

[0044] Furthermore, the connecting assembly 12 includes a first connecting plate 121, a second connecting plate 122, and a locking member. The first connecting plate 121 is connected to the third driving assembly 11, the second connecting plate 122 is connected to the first connecting plate 121 through the locking member, and the crystal rod 4 is connected to the second connecting plate 122.

[0045] In this embodiment, the first connecting plate 121 is connected to the third driving assembly 11, and the second connecting plate 122 is connected to the crystal rod 4. Both are detachable for easy individual maintenance or replacement. Understandably, this embodiment includes a fixture for connection between the crystal rod 4 and the second connecting plate 122. A threaded hole adapted to a locking member can be opened on one side of the fixture to allow for detachable connection between the fixture and the second connecting plate 122. Specifically, the locking member passes through the first connecting plate 121 and the second connecting plate 122 sequentially before connecting to the fixture. During disassembly, the locking member is loosened, allowing the second connecting plate 122 and the crystal rod 4 to be removed and replaced with a new crystal rod 4.

[0046] Furthermore, the third drive assembly 11 has two sets, and the two sets of third drive assemblies 11 are spaced apart in the horizontal direction.

[0047] This embodiment uses two sets of symmetrically or spaced-apart drive components to distribute the load, avoid excessive force on a single point, and make the equipment run more smoothly. At the same time, the two drive components can work together to provide greater driving force or achieve more precise position control.

[0048] In summary, this embodiment of the invention provides a slicing device for a substrate crystal rod. During the initial cutting stage, the crystal rod 4 slowly descends under the drive of the crystal rod feeding device 1, contacting the high-speed cutting wire 22. At this point, the cutting wire 22 contacts the crystal rod 4 on both sides, forming a symmetrical cut and beginning to cut into the surface of the crystal rod 4. When the cutting wire 22 has cut into both sides of the crystal rod 4 to a certain depth, the first driving component 31 is activated, driving the adjusting rod 32 to move. The movement of the adjusting rod 32 changes the tension distribution of the cutting wire 22 in the triangular support structure formed by the guide rod 23 and the adjusting rod 32, causing the tilt angle of the cutting wire 22 closer to the support structure to increase, and the tilt angle on the other side to decrease. As the crystal rod 4 continues to descend, the cutting wire 22 can be tilted laterally to cut the crystal rod 4. When it reaches the cut mark on the other side, the entire crystal rod 4 is sliced. In this embodiment, the angle of the cutting wire 22 can be adjusted while cutting, achieving a method of cutting the sides first and then the middle, improving cutting efficiency.

[0049] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present utility model, and these improvements and substitutions should also be considered within the protection scope of the present utility model.

Claims

1. A slicing apparatus for a substrate crystal rod, characterized in that, This includes a crystal rod feeding device, a cutting device, and a cutting adjustment device; The crystal rod feeding device is used to drive the crystal rod to move up and down; The cutting device includes guide wheels arranged opposite each other, a cutting line wound between the guide wheels, guide rods, and a first driving member. The two guide rods are arranged horizontally between the two guide wheels and contact the side of the cutting line away from the crystal rod feeding device. The first driving member is connected to the guide wheels to drive the guide wheels to rotate. The cutting adjustment device includes a first driving component and an adjusting rod. The adjusting rod contacts the side of the cutting line facing the crystal rod feeding device to form a triangular support structure with the guide rod. The first driving component is used to drive the adjusting rod to move so as to adjust the tilt angle of the cutting line at the support structure.

2. The substrate ingot slicing apparatus according to claim 1, characterized in that, The cutting lines are multiple and spaced apart along the axial direction of the guide wheel.

3. The substrate ingot slicing apparatus according to claim 2, characterized in that, The first driving assembly includes a second driving member, a first slider, a first mounting bracket, a first lead screw, and a support base. The second driving member and the first lead screw are mounted on the first mounting bracket, and one end of the second driving member is connected to one end of the first lead screw. The other end of the first lead screw is rotatably mounted on the first mounting bracket. The first slider is slidably mounted on the first mounting bracket and is drivenly connected to the first lead screw. The support base is connected to the first slider and forms a clearance space. The adjusting rod is mounted on the support base.

4. The substrate ingot slicing apparatus according to claim 3, characterized in that, The support base has a first support plate and two second support plates integrally formed with the first support plate. The two second support plates are perpendicular to the first support plate and are disposed opposite to each other at both ends of the first support plate. The two ends of the adjusting rod are respectively connected to the corresponding second support plates, and the gap between the second support plates forms the clearance space.

5. The substrate ingot slicing apparatus according to claim 1 or 3, characterized in that, The cutting adjustment device further includes a second drive assembly, which includes a third drive member, a second slider, a second mounting bracket, and a second lead screw. The third drive member and the second lead screw are mounted on the second mounting bracket, and one end of the third drive member is connected to one end of the second lead screw. The other end of the second lead screw is rotatably mounted on the second mounting bracket. The second slider is slidably mounted on the second mounting bracket and is connected to the second lead screw in a transmission connection. The first drive assembly is connected to the second slider.

6. The substrate ingot slicing apparatus according to claim 1, characterized in that, The cutting device further includes a support frame, the guide wheel and the guide rod are rotatably mounted on the support frame, and the first driving component is mounted on the support frame.

7. The substrate ingot slicing apparatus according to claim 1, characterized in that, The ingot feeding device includes a third driving component and a connecting component. The third driving component is connected to the connecting component to drive the connecting component to perform lifting and lowering movements. The connecting component is connected to the ingot.

8. The substrate ingot slicing apparatus according to claim 7, characterized in that, The third drive assembly includes a fourth drive member, a third slider, a third mounting bracket, and a third lead screw. The fourth drive member and the third lead screw are mounted on the third mounting bracket, and one end of the fourth drive member is connected to one end of the third lead screw. The other end of the third lead screw is rotatably mounted on the third mounting bracket. The third slider is slidably mounted on the third mounting bracket and is drivenly connected to the third lead screw. The connecting assembly is connected to the third slider.

9. The substrate ingot slicing apparatus according to claim 7, characterized in that, The connecting assembly includes a first connecting plate, a second connecting plate, and a locking member. The first connecting plate is connected to the third driving assembly, the second connecting plate is connected to the first connecting plate through the locking member, and the crystal rod is connected to the second connecting plate.

10. The substrate ingot slicing apparatus according to claim 7 or 8, characterized in that, The third drive component has two sets, and the two sets of the third drive component are spaced apart in the horizontal direction.

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