Semiconductor wafer slicing small multi-wire saw

Abstract

The utility model discloses a semiconductor wafer small -size multi -wire cutting machine relates to the related technical field of semiconductor production, the utility model discloses a support storehouse, the air pipe, the fixed plate, the vibration subassembly and the cutting line, the inside bottom symmetry of support storehouse is fixed with triangle support strip, and one end of support storehouse is fixed with the air pipe through, and the end fixed communication of air pipe setting in support storehouse has the suction storehouse, and the top of support storehouse is provided with the fixed plate, and the fixed plate bottom is fixed with connecting plate no.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing technology, and in particular relates to a small multi-wire dicing machine for semiconductor slicing. Background Technology

[0002] Semiconductor slicing miniature multi-wire dicing machines are key equipment used to precisely diced semiconductor ingots into ultra-thin wafers. Their core technology lies in using high-speed diamond wires for grinding-like dicing. The trend towards miniaturization in this equipment primarily serves R&D laboratories, specialty material production, and startups, aiming to meet the dicing needs of small-sized ingots, small batches, and diverse product types with lower costs and a smaller footprint. Compared to large industrial machines, miniature machines maintain high cutting accuracy, uniformity, and low surface damage while placing greater emphasis on modularity, ease of operation, and flexibility. However, semiconductor slicing miniature multi-wire dicing machines still have the following drawbacks in practical use: Semiconductor slicing small multi-wire dicing machines typically fix the ingots with only simple mechanical clamps or support structures. During the dicing process, due to the high-speed reciprocating vibration of the dicing wire and the feed pressure, the ingot is prone to slight displacement or shaking. This unstable fixing method can lead to inaccurate alignment of the dicing wire, uneven dicing surface, and even chipping of the wafer, uneven thickness or overall breakage, which seriously affects the dicing quality and yield. Secondly, after the semiconductor slicing small multi-wire dicing machine finishes cutting, the ingot is cut into multiple independent wafers. At this time, these wafers are arranged side by side, but they maintain their relative positions only through weak friction or residual debris. When the cutting wire is withdrawn upward or the equipment vibrates, adjacent wafers are very likely to undergo lateral displacement, tilting or even tilting and collision, resulting in edge chipping or overall breakage. Utility Model Content

[0003] The purpose of this invention is to provide a small multi-wire dicing machine for semiconductor slicing. By setting up a support chamber, an air extraction pipe, a fixing plate, a vibration component, and a dicing wire, it solves the problems of unstable ingot position, easy displacement, and easy contact and damage between wafers after dicing in a small multi-wire dicing machine for semiconductor slicing.

[0004] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution: This utility model relates to a small multi-wire semiconductor slicing machine, comprising a support chamber, an air extraction pipe, a fixed plate, a vibration assembly, and cutting wires. Triangular support bars are symmetrically fixed to the bottom of the support chamber. An air extraction pipe is fixedly connected to one end of the support chamber. An adsorption chamber is fixedly connected to the end of the air extraction pipe located inside the support chamber. A flexible ring is fixed to the edge of the adsorption chamber away from the air extraction pipe. A fixed plate is positioned above the support chamber. A connecting plate one and a connecting plate two are fixedly fixed to the bottom of the fixed plate. The connecting plate one and the connecting plate two are symmetrically arranged at the bottom of the fixed plate. A vibration assembly is positioned at the bottom of the connecting plate one, and the vibration assembly includes a front connecting plate. Movable plates are fixed at equal intervals at the bottom of the connecting plate two. A connecting post two is movably connected through each of the movable plates. One end of each connecting post 2 is fixed with a cutting line. The end of each cutting line away from the connecting post is fixed with a connecting post 1. The end of each connecting post 1 away from the cutting line is fixed to the side of the front connecting plate near the cutting line. The support chamber provides stable support for the crystal ingot through the triangular support strip at the bottom of the inner chamber. The air extraction pipe is connected to the adsorption chamber inside the support chamber. The flexible ring at the edge of the adsorption chamber adheres to the end of the crystal ingot during air extraction, thereby fixing the position of the crystal ingot. The fixing plate above the support chamber is symmetrically arranged through the bottom connecting plate 1 and connecting plate 2. The bottom of the connecting plate 1 is equipped with a vibration component. The front connecting plate of the vibration component is connected to the cutting line through the connecting post 1. The bottom movable plate of the connecting plate 2 is movably connected with the connecting post 2. One end of the connecting post 2 is fixed with the cutting line, so that the cutting line is installed below the fixing plate.

[0005] Furthermore, a support frame is fixed to the bottom of the support chamber, and the support chamber and the triangular support bar are vertically provided with cutting slits corresponding to each cutting line position. A partition is fixed to the bottom of the fixing plate corresponding to each cutting line position. The bottom of the support chamber is fixed to the working plane by the support frame. Cutting slits are provided on the support chamber and the triangular support bar corresponding to the cutting line positions to accommodate the cutting line for cutting. The partition at the bottom of the fixing plate is inserted into the ingot gap during cutting to prevent the cut wafer from being skewed or damaged by collision.

[0006] Furthermore, a connector is fixedly connected to the end of the extraction pipe away from the adsorption chamber. A switch valve is fixed around the extraction pipe between the connector and the support chamber. The outer end of the extraction pipe is connected to an extraction device through the connector. A switch valve is provided on the extraction pipe between the connector and the support chamber to control the opening and closing of the extraction pipe, thereby realizing the adsorption or release of the crystal ingot.

[0007] Furthermore, a mounting bracket is fixed to the top of the fixed plate, and the vibration assembly also includes a back plate and a linear vibration motor. A back plate is fixed to the bottom of the first connecting plate, and linear vibration motors are fixed at equal intervals on the side of the back plate near the support chamber. The top of the fixed plate is connected to the lifting device through the mounting bracket. The vibration assembly also includes a back plate and a linear vibration motor. The back plate is fixed to the bottom of the first connecting plate, and the linear vibration motors are fixed at equal intervals on the back plate to drive the front connecting plate to vibrate.

[0008] Furthermore, the telescopic ends of all the linear vibration motors are fixed together on the side of the front connecting plate away from the cutting line. The cutting line is set above the support chamber. The telescopic ends of all the linear vibration motors are fixed together on one side of the front connecting plate, so that the front connecting plate generates horizontal vibration under the drive of the linear vibration motors, which drives the cutting line to perform vibration cutting above the support chamber.

[0009] Furthermore, a fixing plate is fixed to the end of the connecting post two away from the cutting line, and a compression spring is fixed to the end of the fixing plate near the connecting post two. The fixing plate is connected to the compression spring, which is used to provide tension force when the cutting line moves to maintain the stability of the cutting line.

[0010] Furthermore, the compression spring is disposed on the outside of the second connecting column. The end of the compression spring away from the fixed plate is fixed to the side of the movable plate away from the cutting line. The compression spring is sleeved on the outside of the second connecting column, with one end fixed to the fixed plate and the other end fixed to the side of the movable plate away from the cutting line. By adjusting the extension and retraction of the compression spring, the appropriate tension of the cutting line is maintained during the vibration cutting process.

[0011] This utility model has the following beneficial effects: This invention solves the problem of unstable ingot position and easy displacement during the cutting of semiconductor slicing by setting up a support chamber and an air extraction pipe. During operation, the ingot is placed in the support chamber and initially supported and positioned by triangular support bars. After moving the ingot so that its end fits against the flexible ring of the adsorption chamber, the air is extracted by connecting a negative pressure device through the air extraction pipe and opening the switch valve. This allows the end of the ingot to be firmly adsorbed onto the flexible ring. The flexible ring ensures both airtightness and adaptability to the slight unevenness of the ingot surface, achieving uniform adsorption. This method stably confines the ingot in the support chamber, with almost no displacement during the cutting process, ensuring cutting accuracy and wafer integrity.

[0012] This invention solves the problem of wafers easily colliding and being damaged after cutting by a small multi-wire semiconductor dicing machine by setting up a support chamber, a fixing plate, a vibration component, and a cutting line. A moving partition is fixed above the cutting line so that it enters the cutting kerf synchronously during cutting. These partitions continuously play the roles of isolation, limiting, and support during and after cutting and before the cutting line is withdrawn, thereby fundamentally solving the technical problem of wafers colliding and being damaged due to loss of restraint after cutting, and significantly improving the cutting yield and operational stability. Attached Figure Description

[0013] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 A three-dimensional view of the assembly structure of a small multi-wire semiconductor dicing machine; Figure 2 This is a three-dimensional view of the structure of the support compartment after it has been cut open. Figure 3 This is a three-dimensional structural diagram of the extraction pipe; Figure 4 This is a three-dimensional structural diagram of the fixed plate; Figure 5 This is a three-dimensional structural diagram of the vibration assembly; Figure 6 This is a three-dimensional view of the cutting line structure.

[0015] Figure label: 1. Support chamber; 101. Triangular support bar; 102. Cutting seam; 103. Support frame; 2. Suction pipe; 201. Switch valve; 202. Adsorption chamber; 203. Flexible ring; 204. Connector; 3. Fixing plate; 301. Mounting frame; 302. Connecting plate one; 303. Connecting plate two; 304. Partition; 4. Vibration assembly; 401. Back plate; 402. Linear vibration motor; 403. Front connecting plate; 5. Cutting line; 501. Connecting column one; 502. Connecting column two; 503. Fixing plate; 504. Compression spring; 505. Movable plate. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model. Specific Implementation Example 1

[0017] Please see Figure 1-3 This utility model is a small multi-wire dicing machine for semiconductor slicing, including a support chamber 1, an air extraction pipe 2, a fixing plate 3, a vibration assembly 4, and dicing wires 5. Triangular support bars 101 are symmetrically fixed to the inner bottom of the support chamber 1. During operation, the triangular support bars 101 support the semiconductor ingot, stably supporting the ingot within the support chamber 1. An air extraction pipe 2 is fixed through one end of the support chamber 1. During air extraction, the air extraction pipe 2 draws air out of the adsorption chamber 202, causing the corresponding end of the ingot to be adsorbed and thus confining the ingot within the support chamber 1. The suction pipe 2 is positioned so that its end is fixedly connected to the adsorption chamber 202 inside the support chamber 1. A flexible ring 203 is fixed at the edge of the adsorption chamber 202 away from the suction pipe 2. Through the cooperation of the flexible ring 203 on the adsorption chamber 202, the position of the crystal ingot within the support chamber 1 is limited and determined when it is adsorbed onto the crystal ingot. A fixing plate 3 is set above the support chamber 1. The fixing plate 3 connects the connecting plate 1 302 and the connecting plate 2 303 together, so that the fixing plate 3 drives the connecting plate 1 302 and the connecting plate 2 303 to rise and fall during the lifting and lowering process. The bottom of the fixing plate 3 is fixed with Connecting plate 1 302 and connecting plate 2 303 are symmetrically arranged at the bottom of fixed plate 3. A cutting line 5 is connected above support chamber 1. A vibration assembly 4 is installed at the bottom of connecting plate 1 302. During operation, the vibration assembly 4 drives the cutting line 5 to vibrate horizontally, cutting the ingot. The vibration assembly 4 includes a front connecting plate 403. Movable plates 505 are fixed at equal intervals at the bottom of connecting plate 2 303. Connecting plate 2 303 is movably connected to connecting column 2 502 via the movable plates 505. Each movable plate 505... Each part is connected by a connecting post 2 502, which is connected to a compression spring 504. During the movement of the cutting line 5, the material vibrates. One end of each connecting post 2 502 is fixed with the cutting line 5. During operation, the cutting line 5 moves downward while vibrating in a straight line. After contacting the ingot, it cuts the ingot. The end of each cutting line 5 away from the connecting post is fixed with a connecting post 1 501. The end of each connecting post 1 501 away from the cutting line 5 is fixed to the side of the front connecting plate 403 near the cutting line 5, so that the cutting line 5 is stably set below the fixed plate 3.

[0018] Specifically, a support frame 103 is fixed at the bottom of the support chamber 1. The support chamber 1 and the triangular support bar 101 are vertically provided with cutting slits 102 corresponding to the position of each cutting line 5. A partition 304 is fixed at the bottom of the fixing plate 3 corresponding to the position of each cutting line 5. The support chamber 1 is supported on the working plane by the support frame 103. The cutting line 5 is accommodated by the cutting slit 102. The partition 304 is used to limit the spacing of the crystal ingot after the cutting line 5, so as to prevent the wafer from being skewed and damaged during the crystal ingot cutting.

[0019] Furthermore, a connector 204 is fixedly connected to the end of the extraction pipe 2 away from the adsorption chamber 202. A switch valve 201 is fixed around the extraction pipe 2 between the connector 204 and the support chamber 1. The end of the connector 204 away from the extraction pipe 2 is connected to the extraction equipment to extract the air from the extraction pipe 2. The switch valve 201 controls the opening and closing of the connector 204 and the adsorption chamber 202.

[0020] The operation process of this embodiment is as follows: During operation, the crystal ingot is placed directly into the support chamber 1. The crystal ingot is supported by the triangular support bar 101 in the support chamber 1. Then, the crystal ingot is moved in the support chamber 1 until it abuts against the adsorption chamber 202 and the flexible ring 203 therein. After connecting the connector 204 to the negative pressure equipment, the switch valve 201 is opened. The flexible ring 203 on the adsorption chamber 202 cooperates and adheres to the end of the crystal ingot for adsorption. Then, the switch valve 201 is closed to stabilize the crystal ingot in the support chamber 1, preventing displacement during cutting and improving stability during operation. After cutting is completed, the switch valve 201 is opened to release the crystal ingot and complete the cutting work. Specific Implementation Example 2

[0021] Please see Figure 1 , 2 4, 5, 6. Based on the specific embodiment one, the top of the fixed plate 3 is fixed with a mounting bracket 301, the vibration assembly 4 also includes a back plate 401 and a linear vibration motor 402, the bottom of the connecting plate 302 is fixed with a back plate 401, and the back plate 401 is fixed with linear vibration motors 402 at equal intervals on the side of the back plate 401 near the support chamber 1. The fixed plate 3 is connected to the lifting equipment through the mounting bracket 301, and the back plate 401 connects the linear vibration motor 402 to the connecting plate 302, and the front connecting plate 403 is driven to vibrate through the linear vibration motor 402.

[0022] Specifically, the telescopic ends of all linear vibration motors 402 are fixed together on the side of the front connecting plate 403 away from the cutting line 5. The cutting line 5 is set above the support chamber 1. The linear vibration motors 402 drive the front connecting plate 403 to vibrate. Through the cutting line 5 set above the support chamber 1, the cutting work is carried out with the vibration.

[0023] Furthermore, a fixing plate 503 is fixed to the end of the connecting post 502 away from the cutting line 5, and a compression spring 504 is fixed to the end of the fixing plate 503 near the connecting post 502. The connecting post 502 is connected to the compression spring 504 through the fixing plate 503, and the tension of the cutting line 5 is maintained by the compression spring 504.

[0024] Furthermore, the compression spring 504 is located on the outside of the connecting column 502. The end of the compression spring 504 away from the fixed plate 503 is fixed to the side of the movable plate 505 away from the cutting line 5. When the compression spring 504 is working, it is pulled by the fixed plate 503, which drives the cutting line 5 to maintain a suitable tension.

[0025] The operation process of this embodiment is as follows: During operation, after the crystal ingot is supported and set in the support chamber 1, the linear vibration motor 402 is started. The linear vibration motor 402 drives the connecting column 1 501 to vibrate linearly, which drives the cutting line 5 to move back and forth linearly. At the same time, the cutting line 5 drives the connecting column 2 502 to vibrate linearly. Through the cooperation of the compression spring 504, the cutting line 5 is kept taut. The fixing plate 3 is connected to the lifting feed device through the mounting bracket 301, so that the cutting line 5 descends into the cutting slit 102 on the support chamber 1 and the triangular support bar 101. With vibration, the crystal ingot in the support chamber 1 is cut into wafers. During the cutting process, the partition plate 304 enters the gap formed after the crystal ingot is cut. When the lifting device above the fixing plate 3 is started, the external mounting plate and the like can be inserted into the cutting slit 102 on the support chamber 1 to prevent the crystal ingot after complete cutting from scattering and colliding and breaking.

[0026] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0027] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A small multi-wire semiconductor slicing machine, comprising a support chamber (1), an air extraction pipe (2), a fixing plate (3), a vibration assembly (4), and a cutting wire (5), characterized in that: The bottom of the support chamber (1) is symmetrically fixed with triangular support bars (101). One end of the support chamber (1) is fixed with an air extraction pipe (2). The end of the air extraction pipe (2) inside the support chamber (1) is fixedly connected to an adsorption chamber (202). A flexible ring (203) is fixed at the edge of the adsorption chamber (202) away from the air extraction pipe (2). A fixing plate (3) is provided above the support chamber (1). A connecting plate one (302) and a connecting plate two (303) are fixed at the bottom of the fixing plate (3). The connecting plate one (302) and the connecting plate two (303) are symmetrically arranged at the bottom of the fixing plate (3). The bottom of the first connecting plate (302) is provided with a vibration component (4), the vibration component (4) includes a front connecting plate (403), and the bottom of the second connecting plate (303) is fixed with movable plates (505) at equal intervals. Each movable plate (505) is connected to a second connecting column (502) through it. One end of each second connecting column (502) is fixed with a cutting line (5). The end of each cutting line (5) away from the connecting column is fixed with a first connecting column (501). The end of each first connecting column (501) away from the cutting line (5) is fixed on the side of the front connecting plate (403) near the cutting line (5).

2. The semiconductor slicing miniature multi-wire cutting machine according to claim 1, characterized in that: The bottom of the support chamber (1) is fixed with a support frame (103). The support chamber (1) and the triangular support bar (101) are vertically provided with cutting slits (102) corresponding to each cutting line (5). The bottom of the fixing plate (3) is fixed with a partition (304) corresponding to each cutting line (5).

3. The semiconductor slicing miniature multi-wire cutting machine according to claim 1, characterized in that: The end of the extraction pipe (2) away from the adsorption chamber (202) is fixedly connected to a connector (204), and a switch valve (201) is fixed around the extraction pipe (2) between the connector (204) and the support chamber (1).

4. The semiconductor slicing miniature multi-wire cutting machine according to claim 1, characterized in that: The top of the fixed plate (3) is fixed with a mounting bracket (301), the vibration assembly (4) also includes a back plate (401) and a linear vibration motor (402), the bottom of the connecting plate (302) is fixed with a back plate (401), and the back plate (401) is fixed with linear vibration motors (402) at equal intervals on the side of the back plate (401) near the support chamber (1).

5. The semiconductor slicing miniature multi-wire cutting machine according to claim 4, characterized in that: The telescopic ends of all the linear vibration motors (402) are fixed together on the side of the front connecting plate (403) away from the cutting line (5), which is located above the support chamber (1).

6. The semiconductor slicing miniature multi-wire cutting machine according to claim 1, characterized in that: A fixing plate (503) is fixed at the end of the connecting post 2 (502) away from the cutting line (5), and a compression spring (504) is fixed at the end of the fixing plate (503) close to the connecting post 2 (502).

7. The semiconductor slicing miniature multi-wire cutting machine according to claim 6, characterized in that: The compression spring (504) is located on the outside of the connecting column 2 (502), and the end of the compression spring (504) away from the fixed plate (503) is fixed to the side of the movable plate (505) away from the cutting line (5).

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